Avago AFBR-1012 Installation and operating instructions

AFBR-1012 and AFBR-2012
Fiber Optic Transmitter and Receiver for 50 Mbaud MOST£
Handling, Storage, Operating and Processing
Application Note 5420
Introduction
The AFBR-1012 transmitter and AFBR-2012 receiver are
packaged in 4-pin transfer molded, low cost package that
are ready for assembly into plastic ber optic connector
receptacles compliant with MOST£technology.
Two package options are available, one with short leads
(AFBR-1012S/-2012S) and one with long leads (AFBR-
1012L/-2012L).
Figure 1. Moisture warning label
Figure 2.Devices in antistatic tubes (50 devices in one tube)
Figure 3. Shipping tube prole
(For more information see shipping tube drawing)
Transmitter
AFBR-1012S
Receiver
AFBR-2012S
Transmitter
AFBR-1012L
Receiver
AFBR-2012L
Packing
The AFBR-1012 transmitter and AFBR-2012 receiver are
shipped in 500mm long antistatic coated tubes (see
Figures 2 and 3) which are put inside a moisture barrier
bag (MBB) together with desiccant and indicator acc.
JEDEC J-STD-33B, to keep the devices inside protected
against humidity in the environment. Labels as shown in
Figure 1 indicate moisture sensitivity.
23
6.2 6.2
4.5
3.3 0.6

2
Floor Life and maximum storage time
The moisture sensitivity classication is MSL2a according
to JEDEC J-STD-020D.
Unopened moisture barrier bagged devices can be stored
up to 12 months in an environment with a temperature
between 5° C and 50° C and a relative humidity (RH) not
exceeding 90%.
Unpacked devices can be kept in a production environ-
ment up to 4 weeks provided a temperature not exceed-
ing 30° C and a relative humidity (RH) not exceeding 60%.
For higher temperatures in the production environment
the oor life is shortened (see Table 1).
Table 1. MSL2a oor life[1]
Normal Accelerated Equivalent
4 weeks 5 days
≤ 30° C ≤ 60° C
60% RH 60% RH
[1] Max. storage time without humidity protection pack/ after opening
moisture barrier bag
Baking
When the devices are inserted and soldered into a MOST£
system up to four weeks after they have been taken out
of the moisture barrier bag, then the moisture level in
the mold material is low enough to ensure minimum
mechanical stress while soldering.
If the devices are kept on the production oor for more
than four weeks as described in the last paragraph, it is
advised to bake the devices before soldering.
Baking is done by removing the devices from the tube and
placing them in a shallow container so that the package
bodies do not touch each other. Then the devices are
placed in the bake oven, heating the devices to 100° C for
24 hours. After this procedure, the moisture content of
the devices is low and the moisture-induced stress during
soldering is reduced. As a general guideline baking is
recommended before every soldering attempt.
The baking procedure can be done as often as necessary.
Figure 4. Warning sign for an ESD protected area
Electrostatic Discharge (ESD) Protection
The devices are sensitive to electrostatic discharges and
therefore must be handled with care in an ESD protected
area, indicated with the sign as shown in Figure 4.
An ESD event may damage or degrade the device perfor-
mance.
The standard DIN 61340-5-1 has to be considered. The fol-
lowing ESD preventions should be applied. Any smaller
ESD prevention program might be unsuitable to prevent
ESD damages.
x ESD oors
x ESD tables, ESD work surfaces and ESD storage facilities
(e.g. trolleys and carts)
x ESD wrist straps/connectors for wrist straps
x ESD footwear and garments (cotton or special released
materials)
x ESD gloves or nger cots
x ESD chairs
x ESD tools (e.g. nippers)
x ESD preventions at equipment parts (Equipment parts
which may directly contact the device leads must be
made of dissipative materials, wherever possible. If
dissipative materials cannot be used for technical
reasons, metals must be used whose natural non-
conductive surface layer is suciently thin (breakdown
voltage <10 V). Conducting machine parts which may
contact the device leads directly must be connected to
ground without a series resistor. Electrical elds in the
neighborhood of the device must not exceed 104V/m.
x ESD packing materials

3
Shortening and Lead Bending
The leads of the devices can be bent once to a maximum
of 90°, not closer than 1 mm from the edge of the cut
lead wires between the leads. The minimum bend radius
is 0.25 mm. While applying the bending force on the leads,
a counter force must be in place to ensure no forces are
exerted onto the package. See Figure 6 for an overview.
Figure 6. Bending force and counter forces [mm)
Device Mounting
The devices are designed for through-hole mounting on a
PCB. The minimum distance from the package to the PCB
is mechanically dened with lead frame stops (leadframe
dambar). The lead frame stops are designed to ensure the
positioning of the optical axis 5.1 ±0.1 mm above the PCB
(see Figure 7).
Figure 7. Transmitter and receiver module on PCB [mm]
Figure 5. Applied force locations [mm]
ESD Classication
The devices passed the following ESD tests:
Human Body Model (HBM) with U = ±2 kV according JEDEC
standard JESD22-A114 (Electrostatic Discharge (ESD) Sen-
sitivity Testing Human Body Model (HBM))
Socket Device Model (SDM) with U = ±500 V accord-
ing Electrostatic Discharge Association standard ANSI/
EOS/ESD-DS5.3 (ESD Sensitivity Testing Charged Device
Model)
Handling
The devices must be handled with care. Above all it has to
be ensured that no force should aect on the device leads
without the precautions detailed under “Forces on Leads”
and “Shortening and Lead Bending”. The optical port has
to be kept clean at all events.
Forces on Leads
The devices passed the following mechanical lead tests ac-
cording to JEDEC standard JESD22-B105 (Lead Integrity):
x Lead-pull:themaximum pullonthe leadsis2.27±0.14 N,
for 30 seconds.
x Lead-bend: the maximum lead bending angle is 30°,
measured at the lead extremities for one cycle.
x Lead-torsion: the maximum torque to be applied is
14.5 ±1.4 N•mm at the lead, 3.05 mm from the package
at an angle of 30°, for one cycle.
See Figure 5 on the location of the lead forces.

4
Solderability/ Soldering Process
The leads of the devices are gold plated for good solderabil-
ity and are compliant with JEDEC standard JESD22-B102.
The recommended soldering method for the AFBR-1012
transmitter and AFBR-2012 receiver devices is wave sol-
dering (260° C/ 5sec.)
The preconditioning for the qualication tests “Tempera-
ture Shock (TS)” and “Temperature Humidity Bias (THB)”
was done by dip soldering with a solder temperature of
260° C for 5 seconds (distance to package: 3 mm) accord-
ing to JEDEC standard J-STD-020D.
The qualication test “Resistance to soldering heat - Stan-
dard soldering technique (RSH-ST)” was done by dip sol-
dering with a solder temperature of 260° C for 10 seconds
(distance to package: 3 mm) according to JEDEC standard
JESD22-B106D.
The devices are not adapted for reow soldering.
If SMD components are assembled on the same PCB the
AFBR-1012/-2012 devices shall be assembled afterwards.
They must not be subjected to reow solder stress.
Note: This Application Note describes only the FOT solder-
ing. The device maker must also consider the maximum
temperature of the connector or pigtail.
Hand Soldering/ Rework
Hand soldering or rework is not allowed during an auto-
motive production process.
If hand soldering is necessary the following guidelines
must be considered:
xHeating the devices to 100° C for 24 hours
xSoldering time below 350° C must be limited to less
than 3 seconds.
xDo not allow the lead temperature measured on the
lead close to the mold package to exceed 350° C.
Please note: Hand soldering and rework is a badly repro-
ducible process. Hand soldering may cause stresses in the
mold package, which aects optical performance and/or
reliability if the guidelines above are not observed.
Cleaning
The optical surface of the devices may get contaminat-
ed with dust and other contaminants during handling.
To regain optical performance of the device, the surface
must be cleaned.
While manually handling the devices, ESD protection
must be in place. To ensure solderability of the device, the
operator must wear nger cots.
Agents for cleaning or degreasing of the device are best
applied with a cotton bud on the optical surfaces. While
holding the device under a stereomicroscope, gently wipe
the dust or grease o. Dry compressed air is then used to
remove any residual.
Recommended chemicals:
xAlcohols like methyl, isopropyl, isobutyl
xAliphatics like hexane or heptane
xSoap solutions
xNaphtha
xDe-ionized water
Do not use chemicals like:
x(Partially) halogenated hydrocarbons
xKetones (eg. MEK)
xAcetone
xChloroform
xEthyl acetate
xPhenol
xMethylene chloride
xMethylene dichloride
xN-methylpyrrolidone
In general it is sucient to use simple cleaning agents like
alcohols or soap solutions. More aggressive chemicals like
halogenated hydrocarbons are needlessly demanding
on the environment and are hazardous to human health.
Therefore, these should be avoided if possible.
Guidelines for optimum heat transfer to PCB
The PCB should be designed for optimum heat transfer
from the device's interior via the leads to the PCB (especial-
ly important for the GND and RES leads of the AFBR-1012
transmitter and the GND lead of the AFBR-2012 receiver as
these leads lead to active subcomponents). The distance
of the device body to the solder joint on the PCB shall also
be minimized and the dimensions of the conductors on
the PCB shall be maximized. Convection airow around
the devices shall not be obstructed. Other heat generat-
ing devices shall not be placed near the devices.

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Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1832N - December 21, 2010
Eye safety
The transmitter device emits light with a wavelength of
650 nm (red). This product is designed to avoid damage to
the unprotected eye. To indicate the classication of the
light source, a label as depicted in gure 10 can be used.
However these labels are not mandatory on the product
according to IEC 60825 version 1.2 paragraph 1.1.
Figure 8. Temperature measurement point
Figure 9. LED source label
0.8
Temperature Measuring Point GND PIN
max. Temp. : Tcase max = 105° C
Maximum Temperature at FOT
The maximum abient temperature must not exceed 95° C.
To guarantee the reliability of the AFBR-1012 transmitter
and AFBR-2012 receiver the operation temperature has
to be determined at a dened measurement point at the
GND pin of the transmitter.
The maximum temperature at this particular measure-
ment point for an operating MOST transmitter must not
exceed Tcase,max = 105° C. This temperature value is veri-
ed by measurements during HTOL qualication test.
The receiver has a lower operation temperature than the
transmitter and therefore it is not necessary to consider
the receiver temperature.
The temperature measurement point is dened in the
center of the AFBR-1012 GND pin dambar as shown in
Figure 8.