Bachmann IPC1419 User manual

Operating instructions
IPC1419
Version: 05
Status: September 14, 2010
Translation of the original operating instructions

Copyright © 2010 by Bachmann electronic GmbH
All rights reserved.
All operating instructions, manuals, technical descriptions and software supplied by Bachmann electronic GmbH ("Bachmann") are
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Where a reference is made to products and/or services from third-parties in this manual, this is done only for the purpose of example or
is a mere recommendation from Bachmann electronic GmbH. Bachmann makes no guarantee in regard to the selection, specification
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Disclaimer:
We have carefully checked the contents of this document for consistency with the technical features and specifications of the described
hardware and/or software. Despite this check, some deviations cannot be entirely excluded, which is why we cannot guarantee full
consistency. However, the data in this document are regularly reviewed and corrections are included in subsequent editions of this
document. Suggestions for corrections and improvements are very welcome. Bachmann electronic GmbH reserves the right to make
changes to the technical specifications of the hard- and/or software or the documentation without advance notice.
Contact information:
Bachmann electronic GmbH
Kreuzäckerweg 33
6800 Feldkirch
Austria
Phone: [phone] / 34 97-0
Fax: [phone]
E-Mail: [email protected]
http://www.bachmann.info

Table of Contents
V05 / September 14, 2010 I
Table of Contents
1 Structure of safety and warning notices............................................................................... OI-1
2 Safety instructions .................................................................................................................. OI-3
2.1 General.............................................................................................................................................OI-3
2.2 Target group.....................................................................................................................................OI-3
2.3 Intended use.....................................................................................................................................OI-4
2.4 Electrical connection ........................................................................................................................OI-4
2.5 Operation..........................................................................................................................................OI-5
2.6 CE Directives....................................................................................................................................OI-5
2.7 ESD protection .................................................................................................................................OI-6
3 Device configuration, system description ............................................................................ OI-7
3.1 Type plate, customer label ...............................................................................................................OI-8
3.2 CPU module .....................................................................................................................................OI-9
3.2.1 Equipment ............................................................................................................................OI-9
3.2.2 Interfaces ...........................................................................................................................OI-10
3.2.3 CompactFlash card (CF card)............................................................................................OI-19
3.3 Rack unit ........................................................................................................................................OI-20
3.3.1 Versions .............................................................................................................................OI-20
3.4 Display module...............................................................................................................................OI-21
3.4.1 Technical data....................................................................................................................OI-21
3.5 Front panel module ........................................................................................................................OI-22
4 Installation ............................................................................................................................. OI-23
4.1 Transport, storage, unpacking .......................................................................................................OI-23
4.2 Installation notes ............................................................................................................................OI-24
4.3 Installing the device........................................................................................................................OI-25
4.4 Grounding measures......................................................................................................................OI-26
4.5 Cables ............................................................................................................................................OI-27
4.6 Shielding of signal cables...............................................................................................................OI-28
4.6.1 Connector wiring ...............................................................................................................OI-28
4.7 Potential equalization .....................................................................................................................OI-29
5 Getting started....................................................................................................................... OI-31
6 Operation and service........................................................................................................... OI-33
6.1 BIOS settings .................................................................................................................................OI-33
6.1.1 LCD setting ........................................................................................................................OI-33
6.2 Status indication .............................................................................................................................OI-34
6.2.1 CPU module.......................................................................................................................OI-34
6.3 Error messages and troubleshooting .............................................................................................OI-35
6.4 Care................................................................................................................................................OI-37
6.4.1 Foil or front panel ...............................................................................................................OI-37
6.5 Memory effect with TFT displays ...................................................................................................OI-38
6.6 Device behavior in the event of overtemperature ..........................................................................OI-39

Table of Contents
II V05 / September 14, 2010
6.7 Shut-down...................................................................................................................................... OI-40
7 Technical data and dimensional drawings .........................................................................OI-41
7.1 Interference resistance, UL approval ............................................................................................ OI-41
7.1.1 CE compliance .................................................................................................................. OI-41
7.1.2 UL approval ....................................................................................................................... OI-42
7.2 Technical data ............................................................................................................................... OI-43
7.3 Dimensional drawings ................................................................................................................... OI-46

D-BA-0000255.6.3
Operating instructions Structure of safety and warning notices
V05 / September 14, 2010 OI-1
1 Structure of safety and warning notices
This documentation contains safety and warning notices, indicating potential
dangers and possible personal injury or damage to hardware and software. These
warnings are structured as follows:
WARNING
Type and source of danger.
Potential consequence(s) if disregarded.
• Measure(s) to prevent danger.
Result of the measure(s).
Symbols and terms used
Pictogram Signal word Meaning Consequences if disregarded
Warning Hazardous situation Personal injury or significant material damage
Caution Material damage Damage to hardware and/or software
-Important note
-Useful tip
Product handling information.
Tab. 1: Symbols and terms used

D-BA-0000255.6.3
Structure of safety and warning notices Operating instructions
OI-2 V05 / September 14, 2010

D-BA-0000303.5.2
Operating instructions Safety instructions
V05 / September 14, 2010 OI-3
2 Safety instructions
The following basic safety instructions are intended to avoid personal injury and
material damage. The operator must ensure that the basic safety instructions are
adhered to.
Make sure that system and operating staff and any persons that work on the
device under their own responsibility have completely read and understood the
operating instructions.
In the event that something is unclear or if additional information is required, please
contact your technical service representative at Bachmann electronic GmbH.
2.1 General
Never install or operate damaged products. Please report any defects immediately
to the carrier.
Unapproved removal of required coverings, improper use, incorrect installation or
operation may result in severe personal injury or material damage.
Unauthorized opening and incorrect repairs may result in defective devices or
cause malfunctions that may cause danger to the user in connection with
connected peripheral devices.
2.2 Target group
All work for the installation, startup, troubleshooting and maintenance must be
performed by qualified technicians or Bachmann electronic GmbH authorized
personnel (IEC 60364 or CENELEC HD 384 or DIN VDE 0100 and IEC 60664 or
DIN VDE 0110 and national accident prevention regulations must be adhered to).
A qualified technician in the sense of these basic safety instructions is a person
who is familiar with the setup, installation, startup and operation of the product and
who has the proper qualifications to perform these tasks.
The user of the device must have read the operating instructions and be familiar
with all functions of the installed software that he has access to.
All work in the remaining areas of transport, storage, operation and waste disposal
must be performed by persons who have been trained accordingly.

D-BA-0000303.5.2
Safety instructions Operating instructions
OI-4 V05 / September 14, 2010
2.3 Intended use
The device was designed for installation in the front of switch cabinets of machine
and system technology.
The operator must ensure that
• the device is only used for its intended purpose.
• the device is only operated in proper and functional condition.
• the technical description is always available in its complete version and in
legible condition at the operating location of the device.
• only sufficiently qualified and authorized personnel will operate, maintain, and
repair the device.
• this personnel is regularly instructed with regard to issues of work safety and
environmental protection, and that this personnel is familiar with the technical
description and especially the safety instructions it contains.
When installing the machines, the startup of the devices (which means during
startup of proper operation) should not be performed until it is assured that the
machines comply with the regulations, the EC Directive 98/37/EC (from 01/2010
2006/42/EC) (Machine Directive) EN 60204 must be adhered to.
The technical specifications and information about conditions for connection are
stated on the type plate and in the documentation and must be observed without
fail.
Chapter 3.1 ''Type plate, customer label'', Page OI-8
2.4 Electrical connection
When working on energized devices, all applicable national accident prevention
regulations must be complied with.
The electrical installation must be performed according to the relevant regulations.
The documentation contains additional instructions.
The device and its components must be supplied and operated with safety extra-
low voltage (SELV) according to EN60950-1. It must be in compliance all
requirements of EN60950-1, especially the fire protection regulations.
The documentation contains instructions for EMC-compliant installation, EMV,
such as shielding, grounding, and installation of cables. The manufacturer of the
system or the machine is responsible for compliance with the limit values required
by EMV regulations.
Protective measures and protective equipment must comply with applicable
statutory regulations.
Required protective measures: The device must be grounded.
Chapter 4.4 ''Grounding measures'', Page OI-26

D-BA-0000303.5.2
Operating instructions Safety instructions
V05 / September 14, 2010 OI-5
2.5 Operation
The extinguishing of the operating LED and other status indicators does not
indicate that the device is disconnected from power and is de-energized.
2.6 CE Directives
Bachmann electronic GmbH calls attention to the fact that CE compliance has to
be verified again when working on assemblies or modules.

D-BA-0000303.5.2
Safety instructions Operating instructions
OI-6 V05 / September 14, 2010
2.7 ESD protection
ESD: Electrostatic Discharge
ESDS: Electrostatic Discharge Sensitive
ATTENTION
Electrostatic discharge.
Components may be destroyed.
• Consider protective measures for ESD.
Correctly assembled ESDS devices are protected against ESD
Unassembled ESDS devices, particularly the interior parts (e.g. the mother board),
can be damaged on contact due to ESD. During the handling of these ESDS
devices (e.g. during assembly), protective measures for ESD should be observed.
The damage may only be noticeable after a prolonged operational time.
Protective measures
• Wear protective clothing against ESD
• Ground your work area
• Use ESD packaging
Identification
Identification for electrostatically sensitive devices
Fig. 1: ESD identification

D-BA-0000304.14.5
Operating instructions Device configuration, system description
V05 / September 14, 2010 OI-7
3 Device configuration, system description
This system consists of an Industrial PC IPC1419.
The industrial PC has a modular design and consists of a base unit and optional
modules (rack units) that are stacked on top of each other.
The Rack unit connectsthe CPU module with the display module.
The implementation of knowledge from Bachmann electronic GmbH in this device
provides a high degree of reliability and flexibility with a variety of application
possibilities.
The device can be used in an individual control system but also in a machine
control network with the visualization of the production processes.
Fig. 2: Device configuration IPC1419
1) CPU module
2) Rack unit (Zero design)
3) Display module
4) Front panel

D-BA-0000304.14.5
Device configuration, system description Operating instructions
OI-8 V05 / September 14, 2010
3.1 Type plate, customer label
Type plate
The type plate contains most important product specifications of the device.
• Ord.Nr. (Ordering number)
Table 23 ''Device equipment / Order number IPC1419'', Page OI-43
• Model (Product name)
• Type (Equipment)
Table 23 ''Device equipment / Order number IPC1419'', Page OI-43
• Supply (Supply voltage; power consumption)
• SN (Serial number)
Fig. 3: Type plate example
Chapter 3.2.1 ''Equipment'', Page OI-9
Customer label
The customer label contains all the important data relating to the status of the
devices.
Fig. 4: Customer label example
1) Order number
2) Order code
3) Barcode with order number
4) Week of production
5) Design version
6) CE compliance

D-BA-0000304.14.5
Operating instructions Device configuration, system description
V05 / September 14, 2010 OI-9
3.2 CPU module
The CPU module is the base module of the device. It contains all important
hardware components (Processor, Chipset, RAM, etc.).
Additionally, the CPU module has an integrated power supply unit.
3.2.1 Equipment
Description Specification
2 = PentiumM 1.4GHzIPX142y
y = consecutive number
RAM 1 GB DDR (not exchangeable by customer)
Drives 1 x CF (TYPE I) 8 GB
1 x VGA
2 x Ethernet 10/100Mbit/s
4 x USB 2.0, of which 1x power USB
1 x LPT
1 x COM 1 RS232/422 (switchable, RS232C or reduced)
1 x COM 2 RS232C complete signal set
1 x PS/2 (keyboard and mouse via Y-adapter)
Interfaces
Mic, Line-In, Line-Out
Status LED PWR, HDD, DIAG
Tab. 2: Device equipment of IPC1419

D-BA-0000304.14.5
Device configuration, system description Operating instructions
OI-10 V05 / September 14, 2010
3.2.2 Interfaces
Fig. 5: Interfaces I
1) Status LED (PWR, HDD, DIAG) Table 18, Page OI-34
2) Hex rotary switches
3) VGA connector
4) Power supply fuse
Fig. 6: Interfaces II
1) Supply voltage
2) Parallel port (LPT)
3) Serial interfaces
4) USB interfaces
5) CF card slot
6) PS/2 interface
7) Power USB interface
8) Ethernet interfaces
9) Line-Out, Line-In, Mic

D-BA-0000304.14.5
Operating instructions Device configuration, system description
V05 / September 14, 2010 OI-11
3.2.2.1 Serial Interfaces
COM 1 – RS232 /422
The interface is designed as a complete RS232C interface and can be operated as
a RS232 with a reduced signal set or RS422. The interface is factory set as a
complete RS232.
The switch between "complete" and "reduced" is made by means of a DIP switches
(only possible by Bachmann electronic GmbH).
D-Sub 9 pin (male)
Pin Signal Description
1DCD Data Carrier Detect
2RxD Receive Data
3TxD Transmit Data
4DTR Data terminal ready
5GND Ground
6DSR Data Set Ready
7RTS Request to Send
8CTS Clear to Send
9RI Ring Indicator
Tab. 3: Pin assignment for RS232C
When operating the COM 1 with a reduced signal rate, the following pin
assignment is valid.
D-Sub 9 pin (male)
Pin Signal RS232 RS422 Description
1TxD+ -XTransmit Data +
2RxD X-Receive Data
3TxD X-Transmit Data
4TxD- -XTransmit Data -
5GND XXGround
6RxD+ -XReceive Data +
7RTS X-Request to Send
8CTS X-Clear to Send
9RxD- -XReceive Data -
Tab. 4: Pin assignment for reduced RS232/RS422

D-BA-0000304.14.5
Device configuration, system description Operating instructions
OI-12 V05 / September 14, 2010
COM 2 – RS232C
The serial interface COM 2 is provided as a complete RS232C.
D-Sub 9 pin (male)
Pin Signal Description
1DCD Data Carrier Detect
2RxD Receive Data
3TxD Transmit Data
4DTR Data terminal ready
5GND Ground
6DSR Data Set Ready
7RTS Request to Send
8CTS Clear to Send
9RI Ring Indicator
Tab. 5: Pin assignment for RS232C
3.2.2.2 USB 2.0
The design includes three external USB interfaces in compliance with USB
Specification 2.0, which can deliver a current of ≤500 mA at 5 V. They are
designed as USB-A connectors. The USB interfaces can be disconnected together
using an external switch.
Chapter 3.2.2.7 ''Power supply'', Page OI-15
The interfaces provide the option to upgrade the device with various hardware
components.
The interface is used to connect USB users with a current draw of ≤500 A that
cannot be operated using the standard USB interface.
USB
Pin Signal Description
1+5 VDC Supply voltage
2D - Data -
3D + Data +
4GND Ground
Tab. 6: Pin assignment for USB connector

D-BA-0000304.14.5
Operating instructions Device configuration, system description
V05 / September 14, 2010 OI-13
3.2.2.3 Power USB
The interface is used to connect USB users with a current draw of > 500 mA and a
power consumption of ≤8 watts that cannot be operated using the standard USB
interface.
In case of short circuit, the internal powerfail signal will be activated.
Power USB
Pin Signal Description
1D + Data -
2D - Data +
3+5 VDC +5 VDC / 800 mA
4GND Ground
5+3.3 VDC +3.3 VDC
6+5 VDC +5 VDC / 800 mA
7GND Ground
8KEY +5 VDC / 500 mA (switchable)
Tab. 7: Pin assignment for power USB socket
3.2.2.4 PS/2 interface (combined)
Both a keyboard and a mouse, can be connected to the PS/2 interface with a Y-
adapter. Without an adapter, only a PS/2 keyboard can be used.
The PS/2 interface can be turned off with an external switch.
PS/2
Pin Signal Description
1DATA_KEYBOARD Data Keyboard
2DATA_MOUSE Data Mouse
3GND Ground
4+5 VDC +5 VDC
5Clock Keyboard
6
CLK
Clock Mouse
Tab. 8: Pin assignment for PS/2

D-BA-0000304.14.5
Device configuration, system description Operating instructions
OI-14 V05 / September 14, 2010
3.2.2.5 Ethernet RJ45 (10/100Base-T)
RJ45
Pin Signal Description
1TxD+ Transmit Data +
2TxD- Transmit Data -
3RxD+ Receive Data +
4
5
n. c. not connected
6RxD- Receive Data -
7
8
n. c. not connected
Tab. 9: Pin assignment for Ethernet socket
LED Status Description
On Connected to the 100Mbit network
Yello
wOff Connected to the 10Mbit network or offline
On Network connection established (active link)
Flashing Data are sent or received.
Gree
n
Off Not connected to the network or offline
Tab. 10: Overview of status LEDs of the Ethernet interface
3.2.2.6 Hex rotary switches
The function of the Hex rotary switches is presently only available in connection
with VxWorks.
Hex rotary switches H/L
Switc
h
Description
HHigh Nibble
LLow Nibble
Tab. 11: Hex rotary switches H/L

D-BA-0000304.14.5
Operating instructions Device configuration, system description
V05 / September 14, 2010 OI-15
3.2.2.7 Power supply
The connector for the supply voltage must be tightened with a torque of
0.5 to 0.6 Nm (UL508: 5 to 7 in lbs).
A 6 pin connector is provided for the +24 VDC supply of the device.
3 poles are used for the supply voltage (+24 VDC, GND, functional ground), and
the remaining 3 poles are used for an external optional key button (NO contact
between Pin 6 and 5) and for a key switch (NO contact between Pin 4 and 5) for
optional suppression of the interfaces PS2, external USB, external drives,
touchscreen or front panel keyboard.
The input circuits of the voltages and keys/switches are protected against voltage
reversal.
Once the power supply plug has been removed, wait for ≥10 seconds before
refitting the plug.
Pin Signal Description
1+24 VDC +24 VDC
2GND Ground
3Shield (functional ground)
4PON Key switch
5GND Ground
6KEY External key button
Tab. 12: Pin assignment for supply voltage/key switch
Fig. 7: Pin assignment of external key button/key switch

D-BA-0000304.14.5
Device configuration, system description Operating instructions
OI-16 V05 / September 14, 2010
3.2.2.8 Power supply unit
NOTICE
Hardware damage and voiding of the device license
Improper replacement or bridging of fuse
• Use fuse type KFZ Fuse 15A/80V 19x19.7x5mm UL248.
Alternative fuse types may be requested at Bachmann electronic GmbH.
This converts the input voltage (24 VDC) into the voltages which are required for
the operation of the hardware components.
Table 25 ''Supply voltageIPC1419'', Page OI-43