Bachmann IPC312 User manual

Operating instructions
IPC312
Version: 05
Status: September 07, 2010
Translation of the original operating instructions

Copyright © 2010 by Bachmann electronic GmbH
All rights reserved.
All operating instructions, manuals, technical descriptions and software supplied by Bachmann electronic GmbH ("Bachmann") are
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written consent has been obtained. All further rights in Bachmann-software are specified in the "End User Licence Agreement" (EULA).
Where a reference is made to products and/or services from third-parties in this manual, this is done only for the purpose of example or
is a mere recommendation from Bachmann electronic GmbH. Bachmann makes no guarantee in regard to the selection, specification
and/or usability of these goods and services. The naming and/or representation of trademarks which are not owned by Bachmann
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Disclaimer:
We have carefully checked the contents of this document for consistency with the technical features and specifications of the described
hardware and/or software. Despite this check, some deviations cannot be entirely excluded, which is why we cannot guarantee full
consistency. However, the data in this document are regularly reviewed and corrections are included in subsequent editions of this
document. Suggestions for corrections and improvements are very welcome. Bachmann electronic GmbH reserves the right to make
changes to the technical specifications of the hard- and/or software or the documentation without advance notice.
Contact information:
Bachmann electronic GmbH
Kreuzäckerweg 33
6800 Feldkirch
Austria
Phone: +43 (0) 55 22 / 34 97-0
Fax: +43 (0) 55 22 / 34 97-102
http://www.bachmann.info

Table of Contents
V05 / September 07, 2010 I
Table of Contents
1 Structure of safety and warning notices............................................................................... OI-1
2 Safety instructions .................................................................................................................. OI-3
2.1 General.............................................................................................................................................OI-3
2.2 Target group.....................................................................................................................................OI-3
2.3 Intended use.....................................................................................................................................OI-4
2.4 Electrical connection ........................................................................................................................OI-4
2.5 Operation..........................................................................................................................................OI-5
2.6 CE Directives....................................................................................................................................OI-5
2.7 ESD protection .................................................................................................................................OI-6
3 Device configuration, system description ............................................................................ OI-7
3.1 Type plate, customer label ...............................................................................................................OI-9
3.2 CPU module ...................................................................................................................................OI-10
3.2.1 Equipment ..........................................................................................................................OI-10
3.2.2 Interfaces ...........................................................................................................................OI-11
3.2.3 CompactFlash card (CF card)............................................................................................OI-16
3.3 Display module...............................................................................................................................OI-18
3.3.1 Technical data....................................................................................................................OI-18
3.4 Front panel module ........................................................................................................................OI-19
4 Installation ............................................................................................................................. OI-21
4.1 Transport, storage, unpacking .......................................................................................................OI-21
4.2 Installation notes ............................................................................................................................OI-22
4.3 Installing the device........................................................................................................................OI-23
4.4 Grounding measures......................................................................................................................OI-24
4.5 Cables ............................................................................................................................................OI-25
4.6 Shielding of signal cables...............................................................................................................OI-26
4.6.1 Connector wiring ...............................................................................................................OI-26
4.7 Potential equalization .....................................................................................................................OI-27
5 Getting started....................................................................................................................... OI-29
6 Operation and service........................................................................................................... OI-31
6.1 BIOS settings .................................................................................................................................OI-31
6.1.1 Default settings ..................................................................................................................OI-31
6.1.2 LCD setting ........................................................................................................................OI-32
6.2 Status indication .............................................................................................................................OI-33
6.3 Error messages and troubleshooting .............................................................................................OI-34
6.4 Care................................................................................................................................................OI-36
6.4.1 Foil or front panel ...............................................................................................................OI-36
6.5 Memory effect with TFT displays ...................................................................................................OI-37
6.6 Shut-down ......................................................................................................................................OI-38

Table of Contents
II V05 / September 07, 2010
7 Technical data and dimensional drawings .........................................................................OI-39
7.1 Interference resistance, UL approval ............................................................................................ OI-39
7.1.1 CE compliance .................................................................................................................. OI-39
7.1.2 UL approval ....................................................................................................................... OI-40
7.2 Technical data ............................................................................................................................... OI-41
7.3 Dimensional drawings ................................................................................................................... OI-44

D-BA-0000255.6.3
Operating instructions Structure of safety and warning notices
V05 / September 07, 2010 OI-1
1 Structure of safety and warning notices
This documentation contains safety and warning notices, indicating potential
dangers and possible personal injury or damage to hardware and software. These
warnings are structured as follows:
WARNING
Type and source of danger.
Potential consequence(s) if disregarded.
• Measure(s) to prevent danger.
Result of the measure(s).
Symbols and terms used
Pictogram Signal word Meaning Consequences if disregarded
Warning Hazardous situation Personal injury or significant material damage
Caution Material damage Damage to hardware and/or software
-Important note
-Useful tip
Product handling information.
Tab. 1: Symbols and terms used

D-BA-0000255.6.3
Structure of safety and warning notices Operating instructions
OI-2 V05 / September 07, 2010

D-BA-0000303.5.2
Operating instructions Safety instructions
V05 / September 07, 2010 OI-3
2 Safety instructions
The following basic safety instructions are intended to avoid personal injury and
material damage. The operator must ensure that the basic safety instructions are
adhered to.
Make sure that system and operating staff and any persons that work on the
device under their own responsibility have completely read and understood the
operating instructions.
In the event that something is unclear or if additional information is required, please
contact your technical service representative at Bachmann electronic GmbH.
2.1 General
Never install or operate damaged products. Please report any defects immediately
to the carrier.
Unapproved removal of required coverings, improper use, incorrect installation or
operation may result in severe personal injury or material damage.
Unauthorized opening and incorrect repairs may result in defective devices or
cause malfunctions that may cause danger to the user in connection with
connected peripheral devices.
2.2 Target group
All work for the installation, startup, troubleshooting and maintenance must be
performed by qualified technicians or Bachmann electronic GmbH authorized
personnel (IEC 60364 or CENELEC HD 384 or DIN VDE 0100 and IEC 60664 or
DIN VDE 0110 and national accident prevention regulations must be adhered to).
A qualified technician in the sense of these basic safety instructions is a person
who is familiar with the setup, installation, startup and operation of the product and
who has the proper qualifications to perform these tasks.
The user of the device must have read the operating instructions and be familiar
with all functions of the installed software that he has access to.
All work in the remaining areas of transport, storage, operation and waste disposal
must be performed by persons who have been trained accordingly.

D-BA-0000303.5.2
Safety instructions Operating instructions
OI-4 V05 / September 07, 2010
2.3 Intended use
The device was designed for installation in the front of switch cabinets of machine
and system technology.
The operator must ensure that
• the device is only used for its intended purpose.
• the device is only operated in proper and functional condition.
• the technical description is always available in its complete version and in
legible condition at the operating location of the device.
• only sufficiently qualified and authorized personnel will operate, maintain, and
repair the device.
• this personnel is regularly instructed with regard to issues of work safety and
environmental protection, and that this personnel is familiar with the technical
description and especially the safety instructions it contains.
When installing the machines, the startup of the devices (which means during
startup of proper operation) should not be performed until it is assured that the
machines comply with the regulations, the EC Directive 98/37/EC (from 01/2010
2006/42/EC) (Machine Directive) EN 60204 must be adhered to.
The technical specifications and information about conditions for connection are
stated on the type plate and in the documentation and must be observed without
fail.
Chapter 3.1 ''Type plate, customer label'', Page OI-9
2.4 Electrical connection
When working on energized devices, all applicable national accident prevention
regulations must be complied with.
The electrical installation must be performed according to the relevant regulations.
The documentation contains additional instructions.
The device and its components must be supplied and operated with safety extra-
low voltage (SELV) according to EN60950-1. It must be in compliance all
requirements of EN60950-1, especially the fire protection regulations.
The documentation contains instructions for EMC-compliant installation, EMV,
such as shielding, grounding, and installation of cables. The manufacturer of the
system or the machine is responsible for compliance with the limit values required
by EMV regulations.
Protective measures and protective equipment must comply with applicable
statutory regulations.
Required protective measures: The device must be grounded.
Chapter 4.4 ''Grounding measures'', Page OI-24

D-BA-0000303.5.2
Operating instructions Safety instructions
V05 / September 07, 2010 OI-5
2.5 Operation
The extinguishing of the operating LED and other status indicators does not
indicate that the device is disconnected from power and is de-energized.
2.6 CE Directives
Bachmann electronic GmbH calls attention to the fact that CE compliance has to
be verified again when working on assemblies or modules.

D-BA-0000303.5.2
Safety instructions Operating instructions
OI-6 V05 / September 07, 2010
2.7 ESD protection
ESD: Electrostatic Discharge
ESDS: Electrostatic Discharge Sensitive
ATTENTION
Electrostatic discharge.
Components may be destroyed.
• Consider protective measures for ESD.
Correctly assembled ESDS devices are protected against ESD
Unassembled ESDS devices, particularly the interior parts (e.g. the mother board),
can be damaged on contact due to ESD. During the handling of these ESDS
devices (e.g. during assembly), protective measures for ESD should be observed.
The damage may only be noticeable after a prolonged operational time.
Protective measures
• Wear protective clothing against ESD
• Ground your work area
• Use ESD packaging
Identification
Identification for electrostatically sensitive devices
Fig. 1: ESD identification

D-BA-0000304.14.5
Operating instructions Device configuration, system description
V05 / September 07, 2010 OI-7
3 Device configuration, system description
The implementation of knowledge from Bachmann electronic GmbH in this device
provides a high degree of reliability and flexibility with a variety of application
possibilities.
The device can be used in an individual control system but also in a machine
control network with the visualization of the production processes.
Fig. 2: Device configuration IPC312
1) Front panel
2) Display module
3) Tensioning clamp
4) CPU module

D-BA-0000304.14.5
Device configuration, system description Operating instructions
OI-8 V05 / September 07, 2010
Fig. 3: Device configuration IPC312
1) CF card slot
2) CPU module
3) Interfaces (COM 1, 2x USB, PS/2, 2x Ethernet, Hex rotary switches, supply voltage)
4) Display module

D-BA-0000304.14.5
Operating instructions Device configuration, system description
V05 / September 07, 2010 OI-9
3.1 Type plate, customer label
Type plate
The type plate contains most important product specifications of the device.
• Ord.Nr. (Ordering number)
Table 16 ''Device equipment / Order number IPC312'', Page OI-41
• Model (Product name)
• Type (Equipment)
Table 16 ''Device equipment / Order number IPC312'', Page OI-41
• Supply (Supply voltage; power consumption)
• SN (Serial number)
Fig. 4: Type plate example
Chapter 3.2.1 ''Equipment'', Page OI-10
Customer label
The customer label contains all the important data relating to the status of the
devices.
Fig. 5: Customer label example
1) Order number
2) Order code
3) Barcode with order number
4) Week of production
5) Design version
6) CE compliance

D-BA-0000304.14.5
Device configuration, system description Operating instructions
OI-10 V05 / September 07, 2010
3.2 CPU module
The CPU module is the base module of the device. It contains all important
hardware components (Processor, Chipset, RAM, etc.).
Additionally, the CPU module has an integrated power supply unit.
3.2.1 Equipment
Description Specification
Processor AMD Geode LX800
RAM 512 MB DDR SDRAM
Drives 1 x CF (TYPE I) 4 GB
2 x Ethernet 10/100Mbit/s
2 x USB 1.1
1 x COM 1 RS232C complete signal set
Interfaces
1 x PS/2 (keyboard and mouse via Y-adapter)
Status LED —
Tab. 2: Device equipment of IPC312
The motherboard uses part of the RAM for the graphic controller. The size of the
RAM to be used can be set up in BIOS (factory setting 16 MB).

D-BA-0000304.14.5
Operating instructions Device configuration, system description
V05 / September 07, 2010 OI-11
3.2.2 Interfaces
Fig. 6: Interfaces IPC3
1) Serial interface COM 1
2) USB interfaces
3) PS/2 interface
4) Ethernet interfaces
5) Hex rotary switches Chapter 3.2.2.5, Page OI-15
6) Supply voltage
7) Grounding screw

D-BA-0000304.14.5
Device configuration, system description Operating instructions
OI-12 V05 / September 07, 2010
3.2.2.1 Serial Interface
COM 1 – RS232
The interface is provided as a complete RS232C.
D-Sub 9 pin (male)
Pin Signal Description
1DCD Data Carrier Detect
2RxD Receive Data
3TxD Transmit Data
4DTR Data terminal ready
5GND Ground
6DSR Data Set Ready
7RTS Request to Send
8CTS Clear to Send
9RI Ring Indicator
Tab. 3: Pin assignment for RS232C

D-BA-0000304.14.5
Operating instructions Device configuration, system description
V05 / September 07, 2010 OI-13
3.2.2.2 USB 1.1
The interfaces provide the option to upgrade the device with various hardware
components.
The interface is used to connect USB users with a current draw of ≤500 A that
cannot be operated using the standard USB interface.
The connections of the device comply with the USB Specification 1.1
(Low Speed = 1.5 Mbit/s, Full Speed = 12 Mbit/s). Use only devices that comply
with USB Specification 1.1 and that will work with USB 1.1.
USB
Pin Signal Description
1+5 VDC +5 VDC
2D- Data -
3D+ Data +
4GND Ground
Tab. 4: Pin assignment for USB connector
3.2.2.3 PS/2 interface (combined)
Both a keyboard and a mouse, can be connected to the PS/2 interface with a Y-
adapter. Without an adapter, only a PS/2 keyboard can be used.
PS/2
Pin Signal Description
1DATA_KEYBOARD Data Keyboard
2DATA_MOUSE Data Mouse
3GND Ground
4+5 VDC +5 VDC
5Clock Keyboard
6
CLK
Clock Mouse
Tab. 5: Pin assignment for PS/2

D-BA-0000304.14.5
Device configuration, system description Operating instructions
OI-14 V05 / September 07, 2010
3.2.2.4 Ethernet RJ45 (10/100Base-T)
The device is equipped with two 10/100Mbit Ethernet connections. The ETH I
connection can also be used to boot from a PXE server using PXE V2.0.
RJ45
Pin Signal Description
1TxD+ Transmit Data +
2TxD- Transmit Data -
3RxD+ Receive Data +
4
5
n. c. not connected
6RxD- Receive Data -
7
8
n. c. not connected
Tab. 6: Pin assignment for Ethernet socket
LED Status Description
On Connected to the 100Mbit network
Yello
wOff Connected to the 10Mbit network or offline
On Network connection established (active link)
Flashing Data are sent or received.
Gree
n
Off Not connected to the network or offline
Tab. 7: Overview of status LEDs of the Ethernet interface

D-BA-0000304.14.5
Operating instructions Device configuration, system description
V05 / September 07, 2010 OI-15
3.2.2.5 Hex rotary switches
The function of the Hex rotary switches is presently only available in connection
with VxWorks.
Hex rotary switches H/L
Switch Description
HHigh Nibble
LLow Nibble
Tab. 8: Hex rotary switches H/L
3.2.2.6 Power supply
The connector for the supply voltage must be tightened with a torque of
0.5 to 0.6 Nm (UL508: 5 to 7 in lbs).
A 2 pin connector is provided for the +24 VDC supply of the device.
Pin Signal Description
1++24 VDC
2-Ground
Tab. 9: Pin assignment supply voltage
3.2.2.7 Power supply unit
This converts the input voltage (24 VDC) into the voltages which are required for
the operation of the hardware components.
Table 18 ''Supply voltageIPC312'', Page OI-41

D-BA-0000304.14.5
Device configuration, system description Operating instructions
OI-16 V05 / September 07, 2010
3.2.3 CompactFlash card (CF card)
ATTENTION
Do not format CF card using Windows
Device will not boot
• Use M-Manager or Device Manager to format CF card.
• Request newly formatted CF card from Bachmann electronic GmbH.
NOTICE
CF card under voltage removing
Data loss
• Switch off the device or disconnect from the supply voltage.
The CF card is already formatted and contains the necessary system software. A
change of this configuration by the customer is not needed.
The CF card is used for storage of the user specific software or data. It is available
with memory sizes from 512 MB to 4 GB.
The CF card and the CF card slot of the device are mechanically coded so that the
CF card cannot be inserted in the wrong way. The card can be used either in the
CF card drive of a PC/Laptop or directly in the device.
The CF card is operated in the "True IDE" mode and therefore behaves like a
standard hard disk. 3.3 V and also 5 V types may be used. The corresponding
input voltage is automatically selected by the device.
In the mounted condition the CF card is protected against electromagnetic and
mechanical influences by a protective cover.
Use only cards of Bachmann electronic GmbH or those which have been released.
Typical reading-/writing speed
File size 20 MB
Mode Reading performance Writing performance
PIO 4 3,603.7 kB/sec to 3,613.6 kB/sec 6,327 kB/sec to 6,402.3 kB/sec
UDMA 2 22,028.6 kB/sec to 22,237 kB/sec 12,727.5 kB/sec to 12,956.7 kB/sec
Tab. 10: Typical reading-/writing speed CF card
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