b&t BW16-Kit User manual

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Specification
802.11 a/b/g/n Wi-Fi + BLE 5.0 Kit
BW16-Kit
Version: V1.0

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Disclaimer and copyright notice
The information in this article, including the URL address for reference, is subject to change
without notice.The Documentation is provided “as is” without any warranty, including any
warranties of merchantability, fitness for a particular purpose, or non-infringement, and any
warranties mentioned in the proposal, specification or sample. This document is not responsible
for any infringement of any patent rights arising out of the use of the information in this
document. No license, express or implied, by estoppel or otherwise, is hereby granted.
The test data obtained in this paper are all obtained by B&T laboratory , and the actual results
may be slightly different.The Wi-Fi alliance membership mark is owned by the WiFi alliance.
All trade mark names, trademarks and registered trademarks mentioned herein are the property
of their respective owners and are hereby declared.
The final interpretation right is owned by Shenzhen B&T Technology Co., Ltd.
Note
The contents of this manual may be changed due to the version upgrade of the product or other
reasons. Shenzhen B&T Technology Co., Ltd. reserves the right to modify the contents of this
manual without any notice. This manual is only used as a guide, and Shenzhen B&T
Technology Co., Ltd. makes every effort to provide accurate information in this manual, but
Shenzhen B&T Technology Co., Ltd. does not ensure that the contents of the manual are
completely true. All statements and information in this manual,and the recommendations do not
constitute for any warranty, express or implied.

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Document development / revision / revocation resume
Version
Date
Development/revision
Development
Approval
V1.0
2021.08.10
First Edition
Xiaochen Li
Xu Hong

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CONTENT
1.Product Overview............................................................................................................................................................5
Characteristics............................................................................................................................................................ 6
Application Solution...................................................................................................................................................6
Main parameters......................................................................................................................................................... 6
Block diagram............................................................................................................................................................ 7
2.Electrical characteristics..................................................................................................................................................7
RF performance.......................................................................................................................................................... 8
3.Appearance dimensions...................................................................................................................................................9
4.Pin definition................................................................................................................................................................... 9
5.Schematic diagram........................................................................................................................................................ 12
6.Design guidance............................................................................................................................................................ 12
Power supply............................................................................................................................................................ 12
GPIO port................................................................................................................................................................. 12
7.Reflow welding curve diagram..................................................................................................................................... 13
8. Package information.....................................................................................................................................................14
9. Contact us..................................................................................................................................................................... 14

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1.Product Overview
The BW16-Kit development board is a core development board designed by B&T for the BW16
module, which continues the classic design of the NodeMCU development board, leading all I/O to
the pin headers on both sides, on board RGB light, developers can also connect peripherals according to
their own needs.Standard pin headers on both sides make operation easier when using bread boards for
development and commissioning.
BW16 is a dual-frequency Wi-Fi + Bluetooth SoC module developed based on RTL8720DN.It
supports dual-frequency (2.4GHz or 5GHz) WLAN and low power Bluetooth 5.0; and integrates
ARMV8 (Cortex-M4F) high performance MCU, ARM V8M (Cortex-M0) low power MCU,
WLAN (802.11 a / b / g / n), MAC, Bluetooth and RF baseband, and provides a set of
configurable GPIO ports for the control of different peripherals.
BW16 also integrates internal storage and supports simple application development for full Wi-Fi
and BT5.0 protocol capabilities.

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Characteristics
Supports 802.11a/b/g/n 1x1,2.4GHz or 5GHz
Support for HT20/HT40 mode
Support low power beacons listening mode, low power reception mode, and low power hanging
mode
Built-in AES / DES / SHA hardware engine
Support for TrustZone-M, supports secure startup
The SWD debug port access protection and ban modes are supported
Support for BLE and BT5.0
Bluetooth supports high-power mode (7dBm, shares the same PA as Wi-Fi)
The Wi-Fi and the BT share the same antenna
Application Solution
Machine to machine interconnection（M2M）
Remote control
Main parameters
Model
BW16-Kit
Module package
SMD-16
Module size
24*16*3(±0.2)MM
Antenna
PCB antenna or IPEX
Frequency range
2400-2483.5MHz or 5180-5825MHz
Bluetooth
BLE 5.0
Bluetooth
frequency range
2.402GHz - 2.480GHz
Operating
temperature
-20 ℃ ~ 70 ℃
Store environment
-40 ℃ ~ 125 ℃ , < 90%RH
Power supply range
Module voltage 3.0V ~ 3.6V ，typical value 3.3V ，Micro USB 5V
power supply ,current >450mA
Support interface
UART/GPIO/ADC/PWM/IIC/SPI/SWD
Module
certification
RoHS、FCC、CE、SRRC

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Block diagram
2.Electrical characteristics
Tips：
The BW16 module are electrostatic sensitive devices (ESD) and require special ESD
precautions typically applied to ESD sensitive components. Proper ESD handling and packaging
procedures must be applied throughout the processing, handling, transportation and operation of
anyapplication that incorporates the BW18 module. Don’t touch the module by hand or solder with
non-anti-static soldering iron to avoid damage to the module.

深圳市博安通科技股份有限公司 中山市博安通通信技术有限公司
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Page 8of 14
Parameter condition
Min
Typical
Max
Unit
DC3.3V（With an internal pressure regulator
and integrate CMOSPA）
3.0
3.3
3.6
V
Digital I/O power supply voltage
1.76
1.8-3.3
3.3
mA
DC_IO_33 （3.3V I / O rated electric
current）
50
mA
Electrostatic protection（VESD）
2000
V
RF performance
Description
Typical value
Unit
Operating frequency
2400-2483.5 or
5180-5825
MHz
Output power
In 11a mode, the PA output power is
14±2
dBm
In 11n mode, the PA output power is
14±2
dBm
In 11g mode, the PA output power is
15±2
dBm
In 11b mode, the PA output power is
16±2
dBm
Bluetooth output power
7±2
dBm
Receiving sensitivity
CCK, 1 Mbps
＜＝-90
dBm
CCK, 11 Mbps
＜＝-85
dBm
6 Mbps (1/2 BPSK)
＜＝-88
dBm
54 Mbps (3/4 64-QAM)
＜＝-70
dBm
HT20 (MCS7)
＜＝-67
dBm
Bluetooth sensitivity
＜＝-92
dBm

深圳市博安通科技股份有限公司 中山市博安通通信技术有限公司
SHENZHEN B&T TECHNOLOGY Co., Ltd ZHONGSHAN B&T TECHNOLOGYCo., Ltd
Page 9of 14
3.Appearance dimensions
4.Pin definition
The BW16-Kit development board lead out 30 interfaces, refer to below the pin schematic
diagram, and the pin function definition table is the interface definition.

深圳市博安通科技股份有限公司 中山市博安通通信技术有限公司
SHENZHEN B&T TECHNOLOGY Co., Ltd ZHONGSHAN B&T TECHNOLOGYCo., Ltd
Page 10 of 14
Pin function definition table
NO.
Name
Function
1
PA15
SPI1_CS
2
PA27
SWD_DATA
3
NC
Not connect
4
PA26
LP_I2C_SDA/LP_PWM5
5
PA8/LOG_RX
UART_LOG_RXD
6
PA13
LP_PWM1/SPI1_MISO
7
PA14
SPI1_CLK
8
PA30
LP_PWM1
9
PA12
SPI1_MOSI/LP_PWM0
10
GND
Ground
11
3V3
3.3V power supply（VDD）；recommended greater than 500mA
12
EN
Chip enabling terminal
13
NC
Not connect
14
GND
Ground
15
Vin
5V power supply（VDD）
16
3V3
3.3V power supply（VDD）；maximum 450mA

深圳市博安通科技股份有限公司 中山市博安通通信技术有限公司
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Page 11 of 14
17
GND
Ground
18
PB1
LP_UART_TXD
19
PB2
LP_UART_RXD
20
PA7/LOG_TX
UART_LOG_TXD
21
NC
Not connect
22
PA25
LP_I2C_SCL/LP_PWM4
23
PB3
ADC/SWD_CLK
24
GND
Ground
25
3V3
3.3V power supply（VDD）；recommended greater than 500mA
26
NC
Not connect
27
NC
Not connect
28
NC
Not connect
29
NC
Not connect
30
NC
Not connect

深圳市博安通科技股份有限公司 中山市博安通通信技术有限公司
SHENZHEN B&T TECHNOLOGY Co., Ltd ZHONGSHAN B&T TECHNOLOGYCo., Ltd
Page 12 of 14
5.Schematic diagram
6.Design guidance
Power supply
The development board supports 3.3V or 5V voltage with peak current above 500mA
GPIO port
Some GPIO ports are lead out from the periphery of the module, if using the proposed resistance
of 10-100 ohms in series on the corresponding IO port. That can suppress the overshoot,
smoother on both sides.Help for both EMI and ESD.
The up and down of the special IO port, refer to the specification instructions, which affects the
start up configuration of the module.

深圳市博安通科技股份有限公司 中山市博安通通信技术有限公司
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Page 13 of 14
The IO port of the module is 3.3V, if the master control does not match the IO level of the
module, additional level conversion circuit is required
If the IO port is directly connected to the peripheral interface, or pin header, it is recommended
to reserve the ESD device at the IO line near the IPEX.
7.Reflow welding curve diagram
★Notice:
Adjust the balance time to ensure the rationalization treatment of gas when tin paste solves.If there
are too much gaps on the PCB board, increase the balance time.
Considering that the product is long placed in the welding area (temperature above 180℃), to
prevent components and bottom plate damage.
★Important features of the curve:
Rising speed =1~4 °C / sec, 25 °C to150 °C
Average preheating temperature is =140 °C to 150 °C, 60sec~90sec
Temperature fluctuation =225 °C to 250 °C, approximately 30sec

深圳市博安通科技股份有限公司 中山市博安通通信技术有限公司
SHENZHEN B&T TECHNOLOGY Co., Ltd ZHONGSHAN B&T TECHNOLOGYCo., Ltd
Page 14 of 14
Drop speed =2~6 °C / sec, to 183 °C, approximately 15sec
Total time = is about 300sec
8. Package information
The BW16-Kit development board is packaged for inserted pearl cotton with electrostatic bags.
9. Contact us
Official website：https://www.ai-thinker.com
http://www.tech-now.com
Develop DOCS：https://docs.ai-thinker.com
Official forum：http://bbs.ai-thinker.com
Sample purchase：https://ai-thinker.en.alibaba.com/
Business cooperation：[e-mail] ;[e-mail]
Technical support：suppo[email protected]om
Company address: 403,408~410, Building C, Gushu Huafeng Smart Innovation Port, Xixiang, Bao'an District,
Shenzhen
Tel.: [phone]