BBK ABS551T User manual

SERVICE MANUAL
ABS551T

CONTENTS
1. SAFETY PRECAUTIONS 1
2. PREVENTION OF ELECTRO STATIC DISCHARGE(ESD)TO ELECTROSTATICALLY
SENSITIVE(ES)DEVICES 1
4. PREVERTION OF STATIC ELECTRICITY DISCHARGE 3
5. ASSEMBLING AND DISASSEMBLING THE MECHANISM UNIT 4
5.1 OPTICAL PICKUP UNIT EXPLOSED VIEW AND PART LIST 5
6. ELECTRICAL CONFIRMATION 9
6.1 VIDEO OUTPUT (LUMINANCE SIGNAL) CONFIRMATION 9
6.2 VIDEO OUTPUT(CHROMINANCE SIGNAL) CONFIRMATION 10
7. MPEG BOARD CHECK WAVEFORM 11
9. SCHEMATIC & PCB WIRING DIAGRAM 23
10. SPARE PARTS LIST 38
8.2 MT138912
8.3 AM29LV160D 15
8.4 HY57V641620HG 20
3. CONTROL BUTTON LOCATIONS AND EXPLANATIONS 2
5.2 MISCELLANEOUS 8

1.1 GENERAL GUIDELINES
1. When servicing, observe the original lead dress. if a short circuit is found, replace all parts which have
been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barrier, insulation papers
shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed
to shock hazards.
Some semiconductor(solid state)devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive(ES)Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques
should be used to help reduce the incidence of component damage caused by electro static discharge(ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain
off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially
availabel discharging ESD wrist strap, which should be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices,place the assembly on a conductive
surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static
(ESD protected)can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are
ready to install it.(Most replacement ES devices are packaged with leads electrically shorted together by
conductive foam, alminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch
the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity(ESD).
notice (1885x323x2 tiff)
1. SAFETY PREAUTIONS
2.PREVENTION OF ELECTRO STATIC DISCHARGE(ESD)TO 
ELECTROSTATICALLY SENSITIVE(ES)DEVICES
1

Front panel illustration
23
FUNCTION button
8
3VOL- button
5
7OPEN/CLOSE button
Glass
12
678
6IR sensor
PLAY/STOP button
9
BAND button
PREV button
10
TUNING<< button
NEXT button
11
TUNING>> button
1
9 10 11 12
4
5Display window
4VOL+ button
2Channel Switch Button
POWER button
1
Component video/Y Pb Pr out terminal
5
2
Video out terminal
3
4
Optical out terminal for
digital audio
7External audio in terminal 1
6
S-video
Rear panel illustration
Coaxial out terminal for digital audio
Front amplifying audio out terminal
8SCART Out jack
Side panel illustration
2
MIC jack
Headphone jack
AM antenna input terminal
Card reader port
3
4
5
FM antenna input terminal
9
9I-LINK out terminal
2
348
567
1
2
1
3
4
5
1
2

The laser diode in the traverse unit (optical pickup)may brake down due to static electricity of clothes or human
body.Use due caution to electrostatic breakdown when servicing and handling the laser diode.
4.1.Grounding for electrostatic breakdown prevention
Some devices such as the DVD player use the optical pickup(laser diode)and the optical pickup will be damaged
by static electricity in the working environment.Proceed servicing works under the working environment where
grounding works is completed.
4.1.1. Worktable grounding
1. Put a conductive material(sheet)or iron sheet on the area where the optical pickup is placed,and ground the
4.1.2.Human body grounding
1 Use the anti-static wrist strap to discharge the static electricity from your body.
4.1.3.Handling of optical pickup
1. To keep the good quality of the optical pickup maintenance parts during transportation and before
installation, the both ends of the laser diode are short-circuited.After replacing the parts with new ones,
remove the short circuit according to the correct procedure. (See this Technical Guide).
2. Do not use a tester to check the laser diode for the optical pickup .Failure to do so willdamage the laser
diode due to the power supply in the tester.
4.2. Handling precautions for Traverse Unit (Optical Pickup)
1. Do not give a considerable shock to the traverse unit(optical pickup)as it has an extremely high-precise
structure.
2. When replacing the optical pickup, install the flexible cable and cut is short land with a nipper. See the
optical pickup replacement procedure in this Technical Guide. Before replacing the traverse unit, remove
the short pin for preventingstatic electricity and install a new unit.Connect the connector as short times as
possible.
3. The flexible cable may be cut off if an excessive force is applied to it.Use caution when handling the cable.
4. The half-fixed resistor for laser power adjustment cannot be adjusted. Do not turn the resistor.
safety_3 (1577x409x2 tiff)
sheet.
3
4.PREVENTION OF STATIC ELECTRICITY DISCHARGE

5. Assembling and disassembling the mechanism unit
4

5.1 OPTICAL PICKUP UNIT EXPLOSED VIEW AND PART LIST

5.2 MISCELLANEOUS
5.2.1 Protection of the LD(Laser diode)
Short the parts of LD circuit pattern by soldering.
5.2.2 Cautions on assembly and adjustment
Make sure that the workbenches,jigs,tips,tips of soldering irons and measuring instruments are
grounded,and that personnel wear wrist straps for ground.
Open the LD shortlands quickly with a soldering ironafter a circuit isconnected.
Keep the power source of the pick-up protected from internal and external sources of electrical
noise.
Refrain from operation and storage in atmospheres containing corrosive gases (such as H2S,SO2,
NO2 and Cl2)or toxic gases or in locations containing substances(especially from the organic silicon,cyan,
formalin and phenol groups)which emit toxic gases.It is particularly important to ensure that none of the
above substances are present inside the unit.Otherwise,the motor may no longer run.
8

6.1. Video Output (Luminance Signal) Confirmation
DO this confirmation after replacing a P.C.B.
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohms.
2.Confirm that luminance signal(Y+S)level is 1000mVp-p±30mV
Measurement point
Video output terminal
Color bar 75%
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
DVDT-S15
or
DVDT-S01
Mode Disc
Measuring equipment,tools
200mV/dir,10 sec/dir 1000mVp-p±30mV
Confirmation value
6.Electrical Confirmation
9

Do the confirmation after replacing P.C.B.
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohme.
2.Confirm that the chrominance signal(C)level is 621 mVp-p±30mV
Measurement point
Video output terminal
Color bar 75%
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
DVDT-S15
or
DVDT-S01
Mode Disc
Measuring equipment,tools Confirmation value
Screwdriver,Oscilloscope
200mV/dir,10 sec/dir 621mVp-p±30mV
6.2 Video Output(Chrominance Signal) Confirmation

10

7.MPEG BOARD CHECK WAVEFORM
7.1 27MHz WAVEFORM 
DIAGRAM
7.2 IC TEA1523 PIN.8 WAVEFORM DIAGRAM
11

MT1389
Progressive-Scan DVD Player SOC
Specifications are subject to change without notice
MediaTek MT1389 is a DVD player system-on-chip (SOC) which incorporates advanced features like high
quality TV encoder and state-of-art de-interlace processing. The MT1389 enables consumer electronics
manufacturers to build high quality, cost-effective DVD players, portable DVD players or any other home
entertainment audio/video devices.
Based on MediaTek’s world-leading DVD player SOC architecture, the MT1389 is the 3rd generation of the DVD
player SOC. It integrates the MediaTek 2nd generation front-end analog RF amplifier and the Servo/MPEG AV
decoder.
The progressive scan of the MT1389 utilized a proprietary advanced motion-adaptive de-interlace algorithm to
achieve the best movie/video playback. It can easily detect 3:2/2:2 pull down source and restore the correct
original pictures. It also supports a patent-pending edge-preserving algorithm to remove the saw-tooth effect.
MT1389L
DVD
PUH
Module
FLASH
DRAM
CVBS, Y/C,
Component
SDPIF
Front-panel
Remote
Audio DAC
DVD Player System Diagram Using MT1389
Key Features
 RF/Servo/MPEG Integration
 High Performance Audio Processor
 Motion-Adaptive, Edge-Preserving De-interlace
 108MHz/12-bit, 6 CH TV Encoder
Applications
 Standard DVD Players
 Portable DVD Players
8.2 MT1389
12

MT1389
PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL, NO DISCLOSURE
General Feature List

Super Integration DVD player single chip
 High performance analog RF amplifier
 Servo controller and data channel processing
 MPEG-1/MPEG-2/JPEG video
 Dolby AC-3/DTS/DVD-Audio
 Unified memory architecture
 Versatile video scaling & quality
enhancement
 OSD & Sub-picture
 2-D graphic engine
 Built-in clock generator
 Built-in high quality TV encoder
 Built-in progressive video processor
 Audio effect post-processor
 Audio input port

High Performance Analog RF Amplifier
 Programmable fc
 Dual automatic laser power control
 Defect and blank detection
 RF level signal generator

Speed Performance on Servo/Channel Decoding
 DVD-ROM up to 4XS
 CD-ROM up to 24XS

Channel Data Processor
 Digital data slicer for small jitter capability
 Built-in high performance data PLL for
channel data demodulation
 EFM/EFM+ data demodulation
 Enhanced channel data frame sync protection
& DVD-ROM sector sync protection

Servo Control and Spindle Motor Control
 Programmable frequency error gain and
phase error gain of spindle PLL to control
spindle motor on CLV and CAV mode
 Built-in ADCs and DACs for digital servo
control
 Provide 2 general PWM
 Tray control can be PWM output or digital
output

Embedded Micro controller
 Built-in 8032 micro controller
 Built-in internal 373 and 8-bit programmable
lower address port
 1024-bytes on-chip RAM
 Up to 4M bytes FLASH-programming
interface
 Supports 5/3.3-Volt. FLASH interface
 Supports power-down mode
 Supports additional serial port

DVD-ROM/CD-ROM Decoding Logic
 High-speed ECC logic capable of correcting
one error per each P-codeword or
Q-codeword
 Automatic sector Mode and Form detection
 Automatic sector Header verification
 Decoder Error Notification Interrupt that
signals various decoder errors
 Provide error correction acceleration

Buffer Memory Controller
 Supports 16Mb/32Mb/64Mb/128Mb SDRAM
 Supports 16-bit SDRAM data bus
 Provide the self-refresh mode SDRAM
 Block-based sector addressing
 Support 3.3 Volt. DRAM Interface

Video Decode
 Decodes MPEG1 video and MPEG2 main level,
main profile video (720/480 and 720x576)
 Smooth digest view function with I, P and B
picture decoding
 Baseline, extended-sequential and
progressive JPEG image decoding
 Support CD-G titles

Video/OSD/SPU/HLI Processor
 Arbitrary ratio vertical/horizontal scaling of
video, from 0.25X to 256X
 65535/256/16/4/2-color bitmap format OSD,
 256/16 color RLC format OSD
 Automatic scrolling of OSD image
 Slide show transition as DVD-Audio
Specification

2-D Graphic Engine
 Support decode Text and Bitmap
 Support line, rectangle and gradient fill
 Support bitblt
 Chroma key copy operation
 Clip mask
13

MT1389
PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL, NO DISCLOSURE

Audio Effect Processing
 Dolby Digital (AC-3)/EX decoding
 DTS/DTS-ES decoding
 MLP decoding for DVD-Audio
 MPEG-1 layer 1/layer 2 audio decoding
 MPEG-2 layer1/layer2 2-channel audio
 High Definition Compatible Digital (HDCD)
 Windows Media Audio (WMA)
 Advanced Audio Coding (AAC)
 Dolby ProLogic II
 Concurrent multi-channel and downmix out
 IEC 60958/61937 output
- PCM / bit stream / mute mode
- Custom IEC latency up to 2 frames
 Pink noise and white noise generator
 Karaoke functions
- Microphone echo
- Microphone tone control
- Vocal mute/vocal assistant
- Key shift up to +/- 8 keys
- Chorus/Flanger/Harmony/Reverb
 Channel equalizer
 3D surround processing include virtual
surround and speaker separation

TV Encoder
 Six 108MHz/12bit DACs
 Support NTSC, PAL-BDGHINM, PAL-60
 Support 525p, 625p progressive TV format
 Automatically turn off unconnected channels
 Support PC monitor (VGA)
 Support Macrovision 7.1 L1, Macrovision
525P and 625P
 CGMS-A/WSS
 Closed Caption

Progressive Output
 Automatic detect film or video source
 3:2 pull down source detection
 Advanced Motion adaptive de-interlace
 Edge Preserving
 Minimum external memory requirement

Audio Input
 Line-in/SPDIF-in for versatile audio
processing

Outline
 256-pin LQFP package
 3.3/1.8-Volt. Dual operating voltages
14

This Data Sheet states AMD’s current technical specifications regarding the Product described herein. This Data
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. Publication# 22358 Rev: BAmendment/+3
Issue Date: November 10, 2000
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)
CMOS 3.0 Volt-only Boot Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
■Single power supply operation
— Full voltage range: 2.7 to 3.6 volt read and write
operations for battery-powered applications
— Regulated voltage range: 3.0 to 3.6 volt read and
write operations and for compatibility with high
performance 3.3 volt microprocessors
■Manufactured on 0.23 µm process technology
— Fully compatible with 0.32 µm Am29LV160B device
■High performance
— Access times as fast as 70 ns
■Ultra low power consumption (typical values at
5MHz)
— 200 nA Automatic Sleep mode current
— 200 nA standby mode current
— 9 mA read current
— 20 mA program/erase current
■Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
thirty-one 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and
thirty-one 32 Kword sectors (word mode)
— Supports full chip erase
— Sector Protection features:
A hardware method of locking a sector to prevent
any program or erase operations within that sector
Sectors can be locked in-system or via
programming equipment
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
■Unlock Bypass Program Command
— Reduces overall programming time when issuing
multiple program command sequences
■Top or bottom boot block configurations
available
■Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
■Minimum 1,000,000 write cycle guarantee
per sector
■20-year data retention at 125°C
— Reliable operation for the life of the system
■Package option
— 48-ball FBGA
— 48-pin TSOP
— 44-pin SO
■CFI (Common Flash Interface) compliant
— Provides device-specific information to the
system, allowing host software to easily
reconfigure for different Flash devices
■Compatibility with JEDEC standards
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write protection
■Data# Polling and toggle bits
— Providesasoftwaremethodofdetectingprogram
or erase operation completion
■Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting
program or erase cycle completion (not available
on 44-pin SO)
■Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
■Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
array data
15
8.3 Am29LV160D

Am29LV160D
PRODUCT SELECTOR GUIDE
Note: See “AC Characteristics” for full specifications.
BLOCK DIAGRAM
Family Part Number Am29LV160D
Speed Option Voltage Range: VCC = 2.7–3.6 V -70 -90 -120
Max access time, ns (tACC)7090120
Max CE# access time, ns (tCE)7090120
Max OE# access time, ns (tOE) 303550
Input/Output
Buffers
X-Decoder
Y-Decoder
Chip Enable
Output Enable
Logic
Erase Voltage
Generator
PGM Voltage
Generator
Timer
VCC Detector
State
Control
Command
Register
VCC
VSS
WE#
BYTE#
CE#
OE#
STB
STB
DQ0
– DQ15 (A-1)
Sector Switches
RY/BY#
RESET#
Data
Latch
Y-Gating
Cell Matrix
Address Latch
A0–A19
16

CONNECTION DIAGRAMS
A1
A15
A18
A14
A13
A12
A11
A10
A9
A8
A19
NC
WE#
RESET#
NC
NC
RY/BY#
A17
A7
A6
A5
A4
A3
A2
1
16
2
3
4
5
6
7
8
17
18
19
20
21
22
23
24
9
10
11
12
13
14
15
A16
DQ2
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
48
33
47
46
45
44
43
42
41
40
39
38
37
36
35
34
25
32
31
30
29
28
27
26
A1
A15
A18
A14
A13
A12
A11
A10
A9
A8
A19
NC
WE#
RESET#
NC
NC
RY/BY#
A17
A7
A6
A5
A4
A3
A2
1
16
2
3
4
5
6
7
8
17
18
19
20
21
22
23
24
9
10
11
12
13
14
15
A16
DQ2
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
48
33
47
46
45
44
43
42
41
40
39
38
37
36
35
34
25
32
31
30
29
28
27
26
Reverse TSOP
Standard TSOP
17

A
CONNECTION DIAGRAMS
Special Handling Instructions
Special handling is required for Flash Memory products
in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
RESET#
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
VSS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
WE#
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
SO
A1 B1 C1 D1 E1 F1 G1 H1
A2 B2 C2 D2 E2 F2 G2 H2
A3 B3 C3 D3 E3 F3 G3 H3
A4 B4 C4 D4 E4 F4 G4 H4
A5 B5 C5 D5 E5 F5 G5 H5
A6 B6 C6 D6 E6 F6 G6 H6
DQ15/A-1 VSS
BYTE#A16A15A14A12A13
DQ13 DQ6DQ14DQ7A11A10A8A9
VCC DQ4DQ12DQ5A19NCRESET#WE#
DQ11 DQ3DQ10DQ2NCA18NCRY/BY#
DQ9 DQ1DQ8DQ0A5A6A17A7
OE# VSS
CE#A0A1A2A4A3
FBGA
Top View, Balls Facing Down
18