Caen ELS HV-PANDA User manual

AMC HV-PANDA User’s Manual
3
HV-PANDA
HV Positive And Negative
Double-width AMC
User’s Manual
All Rights Reserved
© CAEN ELS s.r.l.
Rev. 1.1 –May 2018
AMC –ADVANCED MEZZANINE CARD

AMC HV-PANDA User’s Manual
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CAEN ELS s.r.l.
Via Vetraia, 11
55049 Viareggio (LU) –Italy
Mail: [e-mail]
Web: www.caenels.com

AMC HV-PANDA User’s Manual
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Table Of Contents
1. INTRODUCTION ........................................................................................... 8
1.1 AMC HV-PANDA OVERVIEW ................................................................... 8
1.2 DEVICE DESCRIPTION.................................................................................10
2. QUICK INTRODUCTION TO THE MTCA ENVIRONMENT ................13
2.1 GLOSSARY.................................................................................................13
3. SAFETY AND INSTALLATION ..................................................................15
3.1 GENERAL SAFETY INFORMATION................................................................15
3.2 INITIAL INSPECTION ...................................................................................15
3.3 INJURY PRECAUTIONS ................................................................................16
3.3.1 Caution.................................................................................................16
3.4 INPUT RATINGS..........................................................................................16
3.5 OUTPUT CONNECTORS ...............................................................................17
3.6 LIVE CIRCUITS...........................................................................................17
3.7 PART REPLACEMENT AND MODIFICATIONS.................................................17
3.8 INSTALLATION INSTRUCTIONS....................................................................17
3.8.1 Installation in a MTCA.4 chassis...........................................................17
3.8.2 Installation in a MTCA.0 chassis or ATCA carrier ................................19
3.9 GROUND CONNECTIONS.............................................................................19
4. CONTROLLING THE HV-PANDA .............................................................21
4.1 DIGITAL INTERFACE...................................................................................21
4.2 GRAPHICAL USER INTERFACE ....................................................................21
4.3 HV-PANDA CONSOLE ................................................................................22
5. ORDERING OPTIONS..................................................................................23
6. TECHNICAL SPECIFICATIONS................................................................24
6.1 ELECTRICAL SPECIFICATIONS.....................................................................24
7. MECHANICAL DIMENSIONS....................................................................26
8. APPENDIX A .................................................................................................27

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Document Revisions
Document Revision
Date
Comment
0.1
January 28th 2015
First Release
1.0
September 20th 2015
Sections added and
modifications
1.1
May 3rd 2018
Typo errors fixing

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Safety information - Warnings
CAEN ELS will repair or replace any product within the guarantee period if the
Guarantor declares that the product is defective due to workmanship or materials and
has not been caused by mishandling, negligence on behalf of the User, accident or any
abnormal conditions or operations.
Please read carefully the manual before operating any part of the instrument
WARNING
Do NOT open the boxes
CAEN ELS s.r.l. declines all responsibility for damages or injuries caused
by an improper use of the Modules due to negligence on behalf of the User. It is
strongly recommended to read thoroughly this User's Manual before any kind of
operation.
CAEN ELS s.r.l. reserves the right to change partially or entirely the contents of this
Manual at any time and without giving any notice.
Disposal of the Product
The product must never be dumped in the Municipal Waste. Please check your local
regulations for disposal of electronics products.

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Read over the instruction manual carefully before using the instrument.
The following precautions should be strictly observed before using the device:
WARNING
•Do not use this product in any manner not
specified by the manufacturer. The protective
features of this product may be impaired if it is
used in a manner not specified in this manual.
•Do not use the device if it is damaged. Before you
use the device, inspect the instrument for possible
cracks or breaks before each use.
•Do not operate the device around explosives gas,
vapor or dust.
•Always use the device with the cables provided.
•Turn off the device before establishing any
connection.
•Do not operatethe device with the cover removed
or loosened.
•Do not install substitute parts or perform any
unauthorized modification to the product.
•Return the productto the manufacturer for service
and repair to ensure that safety features are
maintained
CAUTION
•This instrument is designed for indoor use and in
area with low condensation.

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The following table shows the general environmental requirements for a correct
operation of the instrument:
Environmental Conditions
Requirements
Operating Temperature
0°C to 50°C
Operating Humidity
30% to 85% RH (non-condensing)
Storage Temperature
-10°C to 60°C
Storage Humidity
5% to 90% RH (non-condensing)

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1.Introduction
This chapter describes the general characteristics and main features of AMC
HV-PANDA Advanced Mezzanine Card.
1.1 AMC HV-PANDA Overview
The CAEN ELS AMC HV-PANDA is a standard Double-Width Full-Size
(Height) Advanced Mezzanine Card (AMC) board that hosts 4 High Voltage power
supply modules with paired floating ground returns. It is mechanically and electrically
compliant to the AMC.0 R2.0 standard with the modifications required by MTCA.4
Revision 1.0 (PICMG AMC.0 R2.0 “Advanced Mezzanine Card Base Specification”
and PICMG Specification MTCA.4 Revision 1.0 “MicroTCA Enhancements for Rear
I/O and Precision Timing”) and follows DESY (Deutsches Elektronen-Synchrotron)
recommendations for Rear Transition Modules (RTM) connections version D1.1.
The board hosts up to four (4) CAEN High Voltage (HV) modules which are
available in ranges from 500V up to 6kV, both positive and negative polarity, and
currents up to 3mA for a maximum output power of 7 Watts. Every pair of channels
shares a common ground return that is allowed to float up to ±120 V (factory limited to
±15 V for safety reasons).
Each channel has an independent dry interlock available through a connector on
the AMC front panel. The individual interlock inputs are referred to the AMC board
ground and can be factory configured to work with OC pins or active controllers that
are 5V TTL compatible. On the AMC front panel is also available a globaldryinterlock,
whose ground is allowed to float up to ±24 V, that acts on all 4 high voltage channels
simultaneously.
An auxiliary +12V power input connector is available on the front panel to
provide the required current to the HV channels when the AMC card is used in
conjunction with a power demanding RTM board.
Front panel LEDs provide information on board operational conditions and HV
channels status: voltage polarity, over-current , channel ON/OFF.
A metallic shield on Component Side 1 and two plastic covers on Component
Side 2 have the function of protect the user from inadvertent contact with the internal
electronics that could be floating up to ±120 V.
The AMC board transfers data on the MTCA backplane by means of a PCI
Express 1.0 x1 communication link on port 4 and a Gigabit Ethernet connection on port

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0. Ports 17 to 20 are fully populated with MLVDS transceivers to allow the user to
provide triggering signals for HV channels or RTM synchronization.
The micro-USB port onthe front panel provides a means to slowlycommunicate
with both FPGA and AMC Module Management Controller (MMC) and can be used
for debugging and monitoring purposes.

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1.2 Device Description
Both sides and the front view of the AMC HV-PANDA can be seen on the
following Figure 1, Figure 2 and Figure 3.
Figure 1: AMC HV-PANDA
Component side 1
Figure 2: AMC HV-PANDA
Component side 2
Figure 3: AMC HV-PANDA front view
The AMC HV-PANDA can be subdivided into the following building blocks:
•the HV channel;
•the HV digital and analog control logic and isolation section;
•the interlock management section;
•the digital section that communicates on the MTCA backplane;
•the Module Management section as required by AMC.0 R2.0 specification;
•the power supply part.

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The block diagram of the whole device can be seen on the Figure 4.
HV modules
pair
Communication
Isolation
HV channel
Digital
Control
Section
HV channel
Analog
Control
Section
HV channel
Digital
Control
HV channel
Analog
Control
Isolated
Power
Section
Isolated
Power
Section
Communication
Isolation
HV modules
pair
Isolated
Section
Interlocks
AMC Module Management Controller & Sensors
AMC Digital
Logic
DDR3
Memory
Flash
Memory
Interlock Manager
&
Digital Logic
Supervisor
Power Section
MTCA Backplane RTM Connector
Figure 4: AMC HV-PANDA block diagram
The HV modules are treated as mezzanine modules, they host the voltage
multiplication section and are responsible for providing all monitoring and control
signals to the analog and digital control electronics that resides on the AMC board. The
HV control logic reads relevant informations from the modules and takes immediate
actions according to informations provided by the AMC digital logic.
Different HV modules can be mounted on the AMC HV-PANDA board
according to the following table. Both positive and negative polarity are available.
Voltage / Current rating
Typical application example
6 kV / 1 mA
Micro-channel Plates, Drift Chambers
4 kV / 3 mA ( 9WMAX)
Photomultipliers, Drift Chambers, Silicon &
Germanium Detectors
500 V / 3 mA
Semiconductor devices, Diamond Detectors
Interlock signals act on the HV control logic as well as on the HV channel itself
to provide additional security. The same interlock information is provided to the
Interlock manager that informs the AMC Digital logic of the anomalous operational
state.
AMC Digital logic interfaces the board to the MTCA backplane. It
communicates with a CPU board inside the MTCA chassis using a PCI-e gen.1 x1

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interface and optionally a Gigabit Ethernet link. This sections conveys the user
instructions to the HV digital section and provides a feedback about the channels status.
The AMC board includes a Flash memory module that can also be used to store user
defined informations and a DDR3 memory (up to 4Gb) to accomodate a computation
demanding RTM board. The RTM is linked to the AMC Digital logic by means of two
multi-gigabit links and LVDS lines according to DESY D1.1 RTM connection
recommendations.
The Module Management Controller (MMC) is fully compliant with “PICMG
AMC.0 R2.0”specification with the additional requirements as per “PICMG
Specification MTCA.4 Rev.1.0”and all other relevant PICMG specifications. The HV-
PANDA board relies on DESY MMC code that is proven to provide excellent
interoperability capabilities when boards from different vendors are mixed in the same
MTCA chassis.
The Power Supply section converts the Payload Power coming fromthe MTCA
backplane (+12V) to the voltage levels required by the AMC ground referred digital
section (+3.3V, +2.5V, +1.8V, +1.5V and +1.1V), by the HV bulk power section
(±12V) and by the floating electronics (+5V, +7.5V and -5.5V).

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2.Quick Introduction to the
MTCA Environment
The following will be a brief introduction to the MTCA environment to provide
the user with the basic knowledge and terminology that will be used throughout the
following sections. If the user is already familiar with the MTCA system he can
proceed to the following chapter.
2.1 Glossary
AMC
Advanced Mezzanine Card, if not specified may refer to
both AMC.0 or AMC.4 boards.
CU
Cooling Unit, a separate entity in the MTCA system
responsible for cooling the boards in the chassis.
MCH
MicroTCA Carrier Hub. Is the board responsible for :
-managing the system boards by means of the
MCMC controller on the IPMB-x busses;
-providing connectivity options between AMCs on
multiple Ports;
-providing clock distribution.
PM
Power Module. Board responsible for providing Payload
and Management power to the other modules.
Slot
The location reserved for a module, whether it is an
AMC, MCH, PM or CU, that comprises the Connector
and the Card Guides.
MCMC
MicroTCA Carrier Management Controller is the required
management to interface to AMC MMC via IPMB-L bus
and to CU and PM EMMCs via IPMB-0.
MMC
Module Management Controller is the required
management to communicate with the MCMC and
provides information about operational status and
requirements of the AMC on which it resides.
IPMB
Intelligent Platform Management Bus, according to IPMI
specification and PICMG extensions.

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Hot-Swap Handle
Hand grip that provides user interface that initiates the
hot-swap sequence and allows module removal from the
chassis.
Module LEDs
Leds required by AMC.0 R2.0 standard. 3 Leds are
required:
-BLUE LED: indication of hot-swap and
communication status;
-LED 1: red color, provides indication of faults;
-LED 2: green color, indicates “in service” status.
Logic GND
The reference potential for logic signals and power levels
Shelf GND
The electrical potential of the MTCA chassis metal frame
Payload Power
12V power provided by the PM
Management Power
3.3V power for board management section
Additional terms are available in the “Glossary” section of the relevant PICMG
specification.

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3.Safety and Installation
Please read carefully this general safety and installation information before using
the product.
3.1 General Safety Information
This section contains the fundamental safety rules for the installation and
operation of the system. Read thoroughly this section before starting any procedure of
installation or operation of the product.
Safety Terms and Symbols on the Product
These terms may appear on the product:
•DANGER indicates an injury hazard immediately accessible as you read the
marking;
•WARNING indicates an injury hazard not immediately accessible as you read
the marking;
•CAUTION indicates a hazard to property including the product.
3.2 Initial Inspection
Prior to shipment this system was inspected and found free of mechanical or electrical
defects. Upon unpacking of the system, inspect for any damage, which may have
occurred in transit. The inspection should confirm that there is no exterior damage to
the system such as broken knobs or connectors and that the front panels are not
scratched or cracked.
Keep all packing material until the inspection has been completed. If damage is
detected, file a claim with carrier immediately and notify CAEN ELS d.o.o. service
personnel.

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3.3 Injury Precautions
This section contains the fundamental safety rules for the installation and
operation of the system in order to avoid injuries.
3.3.1 Caution
The following safetyprecautions must be observed during allphases ofoperation,
service and repair of this equipment. Failure to comply with the safety precautions or
warnings in this document violates safety standards of design, manufacture and
intended use of this equipment and may impair the built-in protections within.
CAEN ELS d.o.o. shall not be liable for user’s failure to comply with these
requirements.
To avoid electrical shock or fire hazard, do not apply a voltage to a load that is
outside the range specified for that load.
Do Not Operate Without Covers.
To avoid electric shock or fire hazard, do not operate this product with covers or
panels removed.
Do Not Operate in Wet/Damp Conditions.
To avoid electrical shock, do not operate this product in wet or damp conditions.
Do Not Operate in an Explosive Atmosphere.
To avoid injury or fire hazard, do not operate this product in an explosive
atmosphere.
Do Not Operate With Suspected Failures.
If you suspect there is damage to this product, have it inspected by qualified service
personnel.
3.4 Input Ratings
Do not use DC supply which exceeds the input voltage rating of this instrument.
MTCA standards requires a fixed DC voltage source of+12V for bulk power and +3.3V
for management power, refer to the relevant standard for further informations.
For safety reasons, the supply voltage fluctuations should not exceed above
voltage range.

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3.5 Output Connectors
Do not plug or unplug output SHV connectors when HV power modules are on
and the power units are regulating current on the electrical load.
3.6 Live Circuits
Operating personnel must not remove the AMC HV-PANDA front and rear covers
nor the HV modules. No internal adjustment or component replacement is allowed to
non-CAEN ELS d.o.o. personnel.
In order to avoid injuries, always disconnect power plugs, discharge circuits and
remove external voltage source before touching components (wait 5 minutes at least).
3.7 Part Replacement and Modifications
Parts substitutions and modifications are allowed by authorized CAENels d.o.o.
service personnel only.
3.8 Installation Instructions
The AMC HV-PANDA board shall be installed in a MTCA.4 compliant chassis
capable of housing an AMC double-width full-height module, it is possible to provide
a MTCA.0 compatible board if needed. The MicroTCA Carrier Hub (MCH) used shall
be able to support the PCI-e link on port 4 and optionally a Gigabit Ethernet link on
port 0.
Follow these instructions in order to correctly install the AMC HV-PANDA board
in a Double-width capable MTCA chassis or ATCA carrier board.
3.8.1 Installation in a MTCA.4 chassis
The HV-PANDA is an AMC (Advanced Mezzanine Card) specifically designed
to comply with all MTCA.4 (MicroTCA for physics) requirements and as such shall be
installed in a MTCA.4 compliant chassis. Many chassis variants are available from
different vendors with possibly different backplane arrangements for connections on
ports 2 and 3. CAEN ELS HV-PANDA does not rely on vendor specific
implementations of the backplane allowing the board to be mounted on a broad range
of chassis, the only mandatory requirement is the ability of the crate to host Double-
Width Full-Size AMC boards.
Locate an available free AMC slot in the MTCA sub-rack. Remove any Card Guide
Support Plate (CGSP) located on the immediate right of the AMC slot, if the slot is
designed to host Mid-size AMCs remove also any CGSP that might be placed at the left
of the slot to be used.
Make sure that the ESD contact on the card guide of the MTCA chassis sub-rack

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is in properly working conditions and that the AMC HV-PANDA ESD Strip is not
covered and that provides a clean surface for contact.
Pull the AMC module Hot-Swap Handle until it is in the unlocked position.
Insert the HV-PANDA board in the top and bottom card guides of the AMC slot
and slide the card fully in until the edge connector is fully mated to the MTCA
backplane connector (see Figures 2.1 and 2.2). If the board is correctly inserted into
the MTCA chassis the extended face plate of the AMC front panel shall be almost in
contact with the sub-rack retention interface and allow the front panel screws to be
locked to the chassis.
Do not force the AMC card in the chassis as this may result in damage to the board.
If difficulty arises in fully inserting the board into the chassis make sure it is correctly
inserted in both the card guides of the sub-rack, if so remove it from the slot and check
for any possible obstruction coming from the card guides or nearby struts.
Figure 2.1 : Insertion of the AMC card in the MTCA chassis
Hot-Swap
Handle
Card
Guide
Card Guide
Support
Plate
Sub-Rack
Retention
Interface

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Figure 2.2 : AMC fully inserted in the MTCA chassis
3.8.2 Installation in a MTCA.0 chassis or ATCA carrier
Please note that the AMC HV-PANDA has been designed to be fully compatible
with AMC.0 R2.0 specification and following modifications stated in MTCA.4 Rev. 1.0
specification. The addition of the RTM connector does not allow the AMC HV-PANDA
to fit in a MTCA.0 chassis or ATCA carrier board without removing the connector itself.
The ATCA carrier board shall support Double Cutaway Bays.
If the board needs to be used in a MTCA.0 chassis or ATCA carrier please contact
CAEN ELS d.o.o. personnel for further advices.
3.9 Ground Connections
For safety and performance reasons the MTCA standard requires the presence
of two separate ground connections, a Logic GND that is the reference potential for the
Payload Power and the Management Power and a Chassis GND that is connected to the
MTCA chassis and all the AMCs front panels. The AMC HV-PANDA board adds two
other reference voltage levels to this set, one for every pair of HV modules, that
represent the zero potential for the measurement of the high voltage output.
The two HV ground potentials are directly accessible on the outer shield of the
SHV and for safety reasons are not allowed to float more than ±15V (insulation
guaranteed by design can reach up to ±120V) respect to Logic GND by means of a
voltage suppressing electronic. Do not actively drive the ground level of the HV
channels as this may result in damage to the HV-PANDA board. A detailed sketch of
the grounding connections is depicted in Figure 5.

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The return current path is always established through the cable shield.
HV GNDs Logic GND Chassis GND
Figure 5: Grounding Connections