CEL THine THC63LVDM83D User manual

THAN0184_Rev.1. 0_E
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THC63LVDM83D / THC63LVDF(R)84C Evaluation Kit
LVDS Single Link Evaluation Board
Parts Number: THEVAM83D, THEVAF(R)84C
1.General Description
THEVAM83D and, THEVAF(R)84C boards are
designed to support video data transmission
between the host and display. One high-speed lane
can carry up to 24bits data and 3bits of
synchronizing signals at a pixel clock frequency
from 8MHz to 160MHz.
Table 1 Clock Frequency
Type
Parts Number
TTL Clock Freq.
Tx THEVAM83D 8MHz to 160MHz
Rx THEVAF(R)84C 8MHz to 112MHz
2. Features
Compatible with TIA/EIA-644 LVDS Standard
7:1 LVDS Transmitter and Receiver
Single power supply
Power Down Mode
< THEVAM83D>
LVDS swing is reducible as 200mV by RS-pin
to reduce EMI and power consumption.
Input clock triggering edge is selectable by
R/F-pin
< THEVAF84C> Falling Edge Clock
< THEVAR84C> Rising Edge Clock
3. Overview
(a) THEVAM83D (Top Side) (b) THEVAF(R)84C (Top Side)
Figure 1 THEVAM83D and THEVAF(R)84C Top Side View
(a) THEVAM83D (Bottom Side) (b)THEVAF(R)84C (Bottom Side)
Figure 2 THEVAM83D and THEVAF(R)84C Bottom Side View
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4. Power Supply Set Up
This chapter shows power supply condition.
Caution: Please check if there is no power-GND short on below red trace before supplying any power.
3.3V Power Supply to Each Board
Each evaluation board require 3.3V power supply. Please use “CON1” connector typically.
3.3V Power Supply
Ground
(a)THEVAM83D (b) THEVAF(R)84C
Figure 3 Power Supply for Evaluation Board
Power Supply from / to Connector
3.3V power supply can be connected to Header1 and CON2 by using W1 and W2solder jumper.
THEVAM83D
W1: Connect the 3.3V power supply with pin#29 and 30 of CON2.
W2: Connect the 3.3V power supply with pin#1, 2 and 3 of Header1.
Figure 4 THEVAM83D Power Supply from / to Each Connector
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THEVAF(R)84C
W1: Connect the 3.3V power supply with pin#1, 2 and 3 of Header1.
W2: Connect the 3.3V power supply with pin#1 and 2 of CON2.
W2 W1
Figure 5 THEVAF(R)84C Power Supply from / to Each Connect
5. Function Setting
Setting pin of each boards are shown in yellow area of figure 6. HEADER is connected to IC’s setting pin.
Each setting pin’s high or low setting can set by connecting HEADER and high level or low level.
(a)THEVAM83D (b) THEVAF(R)84C
Figure 6 Position of Function Setting Pin
High setting
Low setting
Connected with
IC s setting pin
High side
Low side
Figure 7 High / Low Setting Description
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5. Function
This chapter shows function setting of THEVAM83D and THEVAF(R)84C.
Table 2 THEVAM83D Function Setting Description
Silk Symbol Function
RF RF
Input clock triggering edge select input for latching input
data
H: Rising edge L: Falling edge
RS RS
LVDS Swing Mode.
RS LVDS
Swing
Small Swing
Input Support
VCC 350mV N/A
0.6 to 1.4V 350mV RS=V
REF
GND 200mV N/A
V
REF
: is Input Reference Voltage
PWDN PWDN Power down input.
H: Normal operation L: Power down
Table 3 THEVAF(R)84C Function Setting Description
Silk Symbol Function
PWDN PWDN Power down input.
H: Normal Operation L: Power Down
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6. Schematic
Figure 8 THEVAM83D Schematic
1
2GND
VCC
13
13
13
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Figure 9 THEVAF(R)84C Schematic
1
2GND
VCC
13
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7. Bills of Materials
Table 4 THEVAM83D BOM
TYPE Value / Part No. Package SPEC Reference No. Qty.
Capacitor 10uF 2012 16V C1, C2, C3, C4 4
Capacitor 0.1uF 1005 16V C5, C6, C7, C12 4
Capacitor 0.01uF 1005 16V C8, C9, C10, C11 4
Connector 282836-2(NC) 5mm_pitch 2pin CON1 1
Connector 52271-3069(NC) 1mm_pitch 30pin CON2 1
Connector PCN10-48P-2.54DSA_LEFT(NC) 2.54mm_pitch 48pin Header1 1
Header 3HEAD(NC) 2.54mm_pitch --- Header2, Header3, Header4 3
IC THC63LVDM83D TSSOP56 --- IC1 1
Inductor MPZ1608R471A 1608 1.2A L1, L2, L3 3
LED0 SML-310MT 1608 GREEN D1 1
Table 5 THEVAF(R)84C BOM
TYPE Value / Part No. Package SPEC Reference No. Qty.
Capacitor 10uF 2012 16V C1, C2, C3, C4 4
Capacitor 0.1uF 1005 16V C5, C6, C7, C12 4
Capacitor 0.01uF 1005 16V C8, C9, C10, C11 4
Connector PCN10-48P-2.54DSA_RIGHT(N
C) 2.54mm_pitch 48pin Header1 1
Connector 52271-3069(NC) 1mm_pitch 30pin CON2 1
Connector 282836-2(NC) 5mm_pitch 2pin CON1 1
Header 3HEAD(NC) 2.54mm_pitch --- Header2 1
IC THC63LVDF(R)84C TSSOP56 --- IC1 1
Inductor MPZ1608R471A 1608 1.2A L1, L2, L3 3
LED0 SML-310MT 1608 GREEN D1 1
R2, R3, R4, R5, R8, R11, R13, R14,
R16, R17, R18, R19, R21, R24, R26,
R27, R29, R30, R31, R32, R33, R34,
R36, R38, R39, R40, R41, R42, R43
29
8
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8. Set items
Table 6 Set Items
TYPE Part No.
DC Connector 282836-2
FFC Connector for LVDS Link 52271-3069
FFC 30pin 1mm pitch for LVDS Link 98267-0475
Pin Header ---
It's possible to mount these parts on this board and use.
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9. Notices and Requests
Please kindly read, understand and accept this “Notes and Requests” before using this product.
For the Material:
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not always
apply to design of respective customers. THine Electronics, Inc. (“THine”) is not responsible for
possible errors and omissions in this material. Please note if the errors or omissions should be found in
this material, THine may not be able to correct them immediately.
3. This material contains THine’s copyright, know-how or other proprietary. Copying or disclosing of the
contents of this material to any third party without THine’s prior permission is strictly prohibited.
For the Product:
1. This product is solely designed for evaluation purpose, and other purposes including mass production
and distribution are not intended.
2. This product has been solely manufactured for electric design engineers but not for end-users.
3. This product is not radiation-tolerant product.
4. This product is presumed to be used for general electric device, not for applications which require
extremely high-reliability/safety (including medical device concerned with critical care, aerospace
device, or nuclear power control device). Also, when using this product for any device concerned with
control and/or safety of transportation mean, traffic signal device, or other various types of safety
device, such use must be after applying appropriate measures to the product.
5. This product has been designed with the utmost care to accomplish the purpose of evaluation of IC
products manufactured by THine Electronics, Inc., however, THine MAKES NO WARRANTIES OR
REPRESENTATIONS WITH REGARD TO ANY PERFORMANCE OR FUNCTION OF THIS
PRODUCT IN ANY CIRCUMSTANCE.
6. This product has been manufactured with the utmost care in quality control and product reliability,
however, there may be faults or defects with a low but fixed probability, as inevitable phenomenon
concerned with semiconductor manufacturing processes. Therefore, Customers are encouraged to have
sufficiently redundant or error-preventive design applied to the use of the product so as not to have
THine’s product cause any social or public damage. Replacement of the product is only available in
case of obvious defects of mount devices at the point of unpacking the product. Neither replacement
nor failure analysis of the product is available in any other case of defects with the product and/or the
product’s components.
7. Customers are asked, if required, to judge by themselves on whether this product falls under the
category of strategic goods under the Foreign Exchange and Foreign Trade Control Law.
8. Please Note that if infringement of any third party’s industrial ownership should occur by using this
product, THine will be exempted from any responsibility unless it directly relates to the production
process or functions of the product.
9. Developing, designing and manufacturing of Customers’ own products, equipments or system by using
of this product is strictly prohibited in any way.
THine Electronics, Inc.
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