Celera Motion MicroE ChipEncoder Series User manual

125 Middlesex Turnpike | Bedford, MA 01730-1409 USA
©2022 Celera Motion
IM-ChipEncoder-Series-Rev. 2 Tel: [phone] | [e-mail]
ChipEncoder™
Series
Installation Manual and
Reference Guide

Introduction
IM-ChipEncoder-Series-Rev. 2 Page 1 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
Table of Contents
1.0 Introduction.......................................................................................................................................2
1.1 Overview .............................................................................................................................2
1.2 Precautions .........................................................................................................................2
1.3 Laser Safety Information.....................................................................................................2
1.4 Standards Compliance........................................................................................................3
1.5 Related Documentation.......................................................................................................3
1.6 Manual Revisions................................................................................................................3
1.7 Trademarks.........................................................................................................................3
1.8 Special Conventions Used..................................................................................................3
2.0 Before Installation.............................................................................................................................4
2.1 Power Recommendations...................................................................................................4
2.2 Installation Considerations..................................................................................................4
2.3 Handling Considerations.....................................................................................................4
2.4 Solder Paste Recommendation and Reflow Profile............................................................5
2.5 Application Notes ................................................................................................................6
2.6 Installation Flowchart...........................................................................................................7
3.0 System Overview .............................................................................................................................8
3.1 ChipEncoder Models...........................................................................................................8
3.2 Linear and Rotary Glass Scales..........................................................................................9
3.3 Evaluation PCB...................................................................................................................9
4.0 ChipEncoder Installation ................................................................................................................10
4.1 Mounting Orientation and Tolerances...............................................................................10
4.2 Mounting the ChipEncoder................................................................................................11
4.2.1 Linear Scale Installation.......................................................................................11
4.2.2 Rotary Scale Installation ......................................................................................12
4.3 Encoder Alignment............................................................................................................13
5.0 Linear Glass Scale Installation.......................................................................................................14
5.1 Before Installation..............................................................................................................14
5.1.1 Items Required for Linear Glass Scale Installation..............................................14
5.1.2 Flowchart for Linear Glass Scale Installation.......................................................14
5.2 Prepare Mounting Surface ................................................................................................15
5.3 Position the Scale..............................................................................................................15
5.4 Mounting the Scale............................................................................................................16
5.4.1 Epoxy Mounted Scale ..........................................................................................16
5.4.2 Adhesive Tape Mounted Scale ............................................................................17
6.0 Cleaning Scales .............................................................................................................................17
7.0 Appendix ........................................................................................................................................18
7.1 Specifications ....................................................................................................................18
7.2 Output Signals Descriptions..............................................................................................19
7.3 Linear and Glass Scales ...................................................................................................20
7.4 Electrical Schematics........................................................................................................22
7.5 Evaluation Board...............................................................................................................24
7.6 Recommended Signal Termination...................................................................................26
7.7 Customer Interface............................................................................................................26
7.8 RS-422 Compatibility.........................................................................................................26
7.9 Troubleshooting.................................................................................................................27
8.0 Order Guide....................................................................................................................................28
9.0 Contacting Celera Motion...............................................................................................................29

Introduction
IM-ChipEncoder-Series-Rev. 2 Page 2 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
1.0 Introduction
1.1 Overview
The ChipEncoder is an encoder system on a chip:
Small enough to mount directly on a printed circuit board
Designed for high-volume applications
Compatible with low-cost automated assembly processes
The instructions in this manual apply to the following ChipEncoders models:
Models CE300-4, CE300-40
Model CE40-GC
1.2 Precautions
1. Follow standard ESD precautions. Turn power to off before connecting the
sensor.
2. Do not touch electrical pins without static protection such as a grounded wrist
strap.
1.3 Laser Safety Information
This product is sold solely for use as a component (or replacement) in an electronic product; therefore, it
is not required to, and does not comply with U.S. FDA 21 CFR 1040.10 and 1040.11 which pertain to
complete laser products. The manufacturer of the complete system-level electronic product is
responsible for complying with 21 CFR 1040.10 and 1040.11.
MicroE Systems encoders contain an infrared laser diode or diodes. Emitted invisible laser radiation
levels have been measured to be within the CDRH Class 1 range, which is not considered hazardous;
however, to minimize exposure to the diverging beam, install the encoder sensor in its operational
configuration in close proximity to the encoder scale before applying power.
Invisible laser radiation: wavelength of 850 nm.
Maximum power of 2.4 mW CW.
Caution: The use of optical instruments with this product will increase eye hazard. Do not view
powered encoder directly with optical instruments (microscopes, eye loupes, or magnifiers).
All maintenance procedures such as cleaning must be performed with the MicroE encoder
turned off.
Do not insert any reflective surface into the beam path when the encoder is powered.
Do not attempt to service the MicroE encoder.

Introduction
IM-ChipEncoder-Series-Rev. 2 Page 3 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
1.4 Standards Compliance
ChipEncoders are RoHS and REACH compliant.
1.5 Related Documentation
ChipEncoders Series Data Sheet
ChipEncoders Series Interface Drawings
1.6 Manual Revisions
Version Date Notes
Rev. 2 04/21/2022 Changed stencil thickness. New values for Sin+. REACH
compliance.
1.7 Trademarks
ChipEncoder is a registered trademark of MicroE Systems®.
1.8 Special Conventions Used
The following symbols may be used in this document.
Symbol Description
Warning or caution: potential damage to parts.
Instructions show correct method.
Instructions show example of incorrect method.
See Section 2.2 Single click with the mouse on these highlighted
references to jump to specified places in instructions.

Before Installation
IM-ChipEncoder-Series-Rev. 2 Page 4 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
2.0 Before Installation
Review the items in this section prior to installing the ChipEncoder.
2.1 Power Recommendations
The ChipEncoder requires a 5.0 VDC power supply:
The ChipEncoders require a minimum of 4.5 VDC continuously.
When designing circuits and extension cables to use ChipEncoders, be sure to account for
voltage loss over distance and tolerances from the nominal supply voltage so that at least
4.5 VDC is available to the ChipEncoder under all operating conditions. The supply voltage can
be confirmed by measuring between the applicable 5 V and ground pads.
The input voltage should not exceed 5.5 VDC.
2.2 Installation Considerations
The ChipEncoder is a precision electronic instrument. It has been designed to function in a wide range
of applications and environments. To take full advantage of the encoder design, allow easy access to
the sensor for service and/or replacement.
For optimal performance and reliability:
DO follow standard ESD precautions while handling the sensor.
DO allow proper clearance for sensor head alignment.
DO follow setup and alignment instructions for the encoder system.
DO, where possible, install the scales in an inverted or vertical position to minimize
accumulation of dust.
DO NOT store sensors in an uncontrolled environment.
DO NOT electrically overstress the sensor (power supply ripple/noise).
DO NOT intentionally “hot swap” the sensor if the device is energized.
2.3 Handling Considerations
Note: Follow Electrostatic Discharge (ESD) precautions at all times. Prior to reflow soldering, pay
particular attention to preventing ESD damage as the damage threshold is 500 V.
When handling the ChipEncoder, do not allow the pickup device to touch anywhere in the “Keep Out
Zone.”Refer to the following illustrations. Scratches or 'digs' in the Keep Out Zone can affect
ChipEncoder performance.
Keep Out Zone
CE300
CE

Before Installation
IM-ChipEncoder-Series-Rev. 2 Page 5 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
2.4 Solder Paste Recommendation and Reflow Profile
The ChipEncoder can be soldered to a PCB using industry standard techniques. The diagram below
illustrates the recommended reflow temperature profile.
Lead-Free Solder Reflow
Use a temperature-controlled convection or IR reflow oven and SAC305 solder paste with no-clean flux
in either air or an inert atmosphere (N2). The temperature should be measured on the carrier board close
to the ChipEncoder parts and should not exceed 260°C.
The ChipEncoder has soldered devices under the cover. The rate of heating and cooling must be
controlled so that it does not exceed 5°C per second to avoid thermal stressing of the devices.
The ChipEncoder inputs and outputs are pre-tinned palladium silver pads with the typical spacing
between adjacent input/output pads of 0.2 mm (0.008 inches). The pads are pre-tinned with SAC305
solder alloy. Solder material with good slump characteristics should be chosen to ensure that solder
does not bridge or short during pre-heating in the reflow process.
Hand Soldering
Hand soldering can cause damage. Hand soldering guidelines:
CE300: Do not hand solder. Castellations are for electrical testing only.
CE: Hand solder only if necessary.
Reflow Solder
Temperature Profile

Before Installation
IM-ChipEncoder-Series-Rev. 2 Page 6 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
2.5 Application Notes
The printed circuit board (PCB) land pattern and assembly processes necessary to successfully
integrate the ChipEncoder are detailed as follows:
Use the publication IPC-7351 Generic Requirements for Surface Mount Design and Land
Pattern Standard (developed 2005 by IPC) as a guide for proper land pattern design for the
solder pads on the printed circuit board.
Due to the tight spacing between solder pads, it is recommended that solder mask be used
between the solder pads to prevent solder bridging and shorting to adjacent pads.
A 0.003 - 0.005inch thick stainless steel stencil is recommended for solder paste
application to the printed circuit board lands.
Machine placement and reflow soldering of the ChipEncoder is recommended.
Acetone is the recommended cleaner for the ChipEncoder.
PCB Requirements
The ChipEncoder electrical interface, land pattern, schematic of additional required passive components
and mechanical dimensions are found in the interface drawings, which are located on the following
webpage: http://www.microesystems.com/resource/product-documentation.

Before Installation
IM-ChipEncoder-Series-Rev. 2 Page 7 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
2.6 Installation Flowchart
The following flowchart lists the main steps in ChipEncoder installation.
Use Eval PCB
Design Interface
for Eval PCB
Perform Mechanical
Alignment
Perform PC Design
Section 4.3
Section 4.0
Confirm Alignment
(Optional)
Install
Complete
Install Encoder
Designing Own
PCB?
No
Yes
Install Scale
Section 5.0

System Overview
IM-ChipEncoder-Series-Rev. 2 Page 8 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
3.0 System Overview
This section identifies parts for the installation. Use the information in this section to design the
mounting scheme for the encoder.
3.1 ChipEncoder Models
Example of ChipEncoder Installed on a PCB
CE300-4, CE300-40 (7 mm x 11 mm) Top View
CE-40GC (6 mm x 6 mm) Top View
Ceramic
Substrate
Riser
Castellations (x24)
Beam Splitter
Date Code and
Serial Number
Beam Splitter
Ceramic
Substrate
Riser
ChipEncoder

System Overview
IM-ChipEncoder-Series-Rev. 2 Page 9 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
3.2 Linear and Rotary Glass Scales
The scales available for the ChipEncoder:
Linear Glass Scales
Rotary Glass Scales
Examples of scales (shown with ChipEncoder CE300)
3.3 Evaluation PCB
There are two alternatives for initially creating/designing a PCB to test with the ChipEncoder:
Design your own PCB and install the ChipEncoder to it
Purchase the Eval PCB and install the ChipEncoder to it (see Section 7.5 Evaluation Board
for more details). Once testing is successful, then a production PCB can be designed.
The ChipEncoder must be mechanically aligned to the scale. Alignment can be confirmed using an
Oscilloscope (see install procedure). See Section 8.0 Order Guide for details on ordering the Eval
PCB.
ChipEncoder Evaluation Board
U.S. Dime
Index
Linear Glass Scale
Rotary Glass Scale
Index
Evaluation PCB (CE300-4-PCB or CE300-40-PCB)
Evaluation PCB (CE-40GC-PCB)

ChipEncoder Installation
IM-ChipEncoder-Series-Rev. 2 Page 10 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
4.0 ChipEncoder Installation
4.1 Mounting Orientation and Tolerances
Refer to the following specifications when installing and aligning the ChipEncoder. See Section 7.2
Output Signals Descriptions in the Appendix for pad identification.
Orientation
Tolerances
Mounting with Linear Scales
Mounting with Rotary Scales
Axis
Alignment Tolerance
Axis
Alignment Tolerance
X
Direction of Motion
X
± 0.004" (0.10 mm)
Y
± 0.008" (0.20 mm)
Y
± 0.004" (0.10 mm)
Z
± 0.010" (0.25 mm)
Z
± 0.010" (0.25 mm)
X
± 1.5°
X
± 1.5°
Y
± 1.5°
Y
± 1.5°
Z
± 2.0°
Z
± 2.0°

Note: Tolerance for each axis is specified independently, assuming nominal alignment in other axes.
Alignment Axes

ChipEncoder Installation
IM-ChipEncoder-Series-Rev. 2 Page 11 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
4.2 Mounting the ChipEncoder
Refer to the ChipEncoder interface drawings for more details for installation.
4.2.1 Linear Scale Installation
Note: The linear glass scale must be installed before installing the ChipEncoder.
Note: The encoder may be powered during this procedure.
Perform the following steps to install the ChipEncoder.
Step
Action
1.
Install the ChipEncoder on a printed circuit board (PCB) to the electrical and mechanical
specifications listed in the ChipEncoder interface drawings, which are available on the MicroE
website: http://www.microesystems.com/resource/product-documentation.
Refer to Section 4.1 Mounting Orientation and Tolerances when installing the encoder to
the PCB.
2.
Attach the scale to the linear stage. Refer to the datum on the interface drawings for either
end or center index orientation.
3.
Attach the scale to the slide using adhesive. Follow the steps in Section 5.0 Linear Glass
Scale Installation for alternative methods. Be sure that the grating surface of the scale faces
the sensor.
Caution: Damage can result from the ChipEncoder contacting the grating.
4.
Apply power to encoder if not already powered on.
5.
ChipEncoder outputs can be viewed using a digital oscilloscope. See Section 7.2 Output
Signals Descriptions for the A, B, and Index Window signals. The ChipEncoder should not
require additional alignment as long as the PCB and mechanical components have been
fabricated and assembled according to the mechanical dimensions and tolerance specified in
the applicable interface drawings.
Go to Section 4.3 Encoder Alignment for additional details for alignment.
Linear Stage
Linear Scale
ChipEncoder
PCB
Slide

ChipEncoder Installation
IM-ChipEncoder-Series-Rev. 2 Page 12 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
4.2.2 Rotary Scale Installation
The rotary scale must be installed before installing the ChipEncoder.
Note: The encoder may be powered during this procedure.
Perform the following steps to install the ChipEncoder.
Step
Action
1.
Install the ChipEncoder on a printed circuit board (PCB) to the electrical and mechanical
specifications listed in the ChipEncoder interface drawings, which are available on the MicroE
website: http://www.microesystems.com/resource/product-documentation.
2.
Attach the hub/scale assembly to the rotary device. The reflective surface of the scale must
face the sensor. Refer to the datum on the interface drawings for either end or center index
orientation.
3.
Attach the scale to the slide using adhesive. Be sure that the grating surface of the scale
faces the sensor.
Caution: Damage can result from the ChipEncoder contacting the grating.
4.
Apply power to encoder if not already powered on.
5.
ChipEncoder outputs can be viewed using a digital oscilloscope. See Section 7.2 Output
Signals Descriptions for the A, B, and Index Window signals. The ChipEncoder should not
require additional alignment as long as the PCB and mechanical components have been
fabricated and assembled according to the mechanical dimensions and tolerance specified in
the applicable interface drawings.
Go to Section 4.3 Encoder Alignment for additional details for alignment.
6.
For alignment verification, see Technical Note TN-103: Alignment of Rotary Scales.
Rotary Scale
ChipEncoder
PCB

ChipEncoder Installation
IM-ChipEncoder-Series-Rev. 2 Page 13 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
4.3 Encoder Alignment
Optimal alignment of the CE300 (7 mm x 11 mm package) or CE (6 mm x 6 mm package) ChipEncoder
is achieved through adherence to MicroE System’s published interface drawings and can be verified
and fine-tuned using the Sin+ and IW+ signals:
Sin+ is available on pad 14 (7x11 mm) and on pad 3 (6x6 mm). Sin+ is a sinusoidal function
riding on a 1.7 V (approximate) offset.
IW+ is on pad 24 (7x11 mm) and pad 16 (6x6 mm). IW+ is an active-high TTL pulse which
occurs each time the index mark on the scale is passed.
Both signals must be present and within the following specification limits in order to ensure proper
encoder function:
Sin+ Range = 1.1 - 2.1 V pk-pk
IW+ = 40 um wide ±25%

Linear Glass Scale Installation
IM-ChipEncoder-Series-Rev. 2 Page 14 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
5.0 Linear Glass Scale Installation
Use the steps in this section to mount and install linear scales.
5.1 Before Installation
Review the information in this section prior to installing scales.
5.1.1 Items Required for Linear Glass Scale Installation
You will need the following items available for glass scales installation.
Item
Finger Cots or talc-free gloves
Acetone or isopropyl alcohol
Lint-free cotton cloths or wipes
Epoxy, non-conductive1
Stick and disposable surface for stirring epoxy1
Silicone adhesive1
Double-sided tape1
Note1: Not needed for every installation.
5.1.2 Flowchart for Linear Glass Scale Installation
The following flowchart lists the main steps in glass scale installation.
Section 5.2
Section 5.3
Section 5.4.1
Section 6.0
No
Adhesive Tape
Mounted Scale
Section 5.4.2
Yes
Prepare
Mounting Surface
Clean and Inspect
Scale
Epoxy Mounted
Scale
Install
Complete
Mount Scale Using
Epoxy?
Position the Scale

Linear Glass Scale Installation
IM-ChipEncoder-Series-Rev. 2 Page 15 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
5.2 Prepare Mounting Surface
Perform the following steps prior to mounting the glass scales.
Step
Action
1.
Inspect the mounting surface for any machining irregularities. MicroE Systems recommends a
surface finish of better than 3.2 micrometers Ra.
2.
MicroE Systems recommends a mounting surface flatness of 0.0001 inch/inch.
3.
Thoroughly clean the scale mounting surface and reference edge using a cotton swab or lint-
free cloth dampened with isopropyl alcohol or acetone. Remove all dust and particles.
5.3 Position the Scale
Note: Use talc-free gloves or finger cots to handle the scales.
'Benching' the scale means aligning the scale by using benching pins. Refer to the applicable interface
drawing for datum edges.
Refer to the following drawing for this procedure:
Step
Action
1.
Two benching pins are recommended on the long side of the scale and one at the end as shown
below. This is marked as Datum D on the interface drawing.
2.
Position the benching pins in from both ends. 20% of the overall scale length is the recommended
distance from the edge of the scale.
3.
Be sure the benching pins do not exceed the height of the scale (Z direction) to prevent
mechanical interference with the encoder.
Benching Pins
0.6L
0.2L
0.2L
L
End Benching
Pin
D

Linear Glass Scale Installation
IM-ChipEncoder-Series-Rev. 2 Page 16 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
5.4 Mounting the Scale
There are two different methods for attaching linear scales to a surface:
Permanently attach scale using epoxy and RTV silicone (recommended)
Permanently attach scale using double-sided tape
5.4.1 Epoxy Mounted Scale
Linear scale is permanently attached to the mounting surface using epoxy and silicone adhesive on the
back of the scale. This method is recommended for best encoder accuracy as it ensures the best
flatness.
Note: Use talc-free gloves or finger cots to handle the scales.
Refer to the following drawing for this procedure:
Step
Action
1.
Make sure that the mounting surface is dry and clean.
2.
Align the scale by placing the edges against the benching pins.
3.
Optionally, scale clamps1may be used to secure the scale while the adhesive cures. Avoid
damaging the top surface when using clamps.
4.
Apply a hard epoxy, such as Tra-Bond 2116, at the end of the scale at the end benching pin. Apply
100% Silicone RTV adhesive around the edges of the scale. This method allows thermal
expansion from the benched end of the scale.
Note: If an end benching pin is not used, then applying epoxy at the index mark is suggested.
Caution: Do not allow epoxy to seep under the scale; this will affect scale flatness and therefore
encoder accuracy.
5.
After the adhesive cures, remove the scale mounting clamps, or, if permanently installing the
clamps, make sure that the clamps do not interfere with the encoder or encoder mounting.
Note1: See Section 8.0 Order Guide for details on ordering clamps.
End Benching
Pin
Side view showing
optional scale clamp
and scale. Space
clamps every 75mm
on scales over
150mm in length.
Benching Pins
L
Mounting
Clamp
Mounting
Clamp
RTV around entire
outside edge of scale
Scale clamp
with adhesive
Hard epoxy at one
corner, this end only
Mounting
Clamp

Cleaning Scales
IM-ChipEncoder-Series-Rev. 2 Page 17 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
5.4.2 Adhesive Tape Mounted Scale
Linear scale is permanently attached to the mounting surface using double-sided adhesive tape on the
back of the scale.
Note: Use talc-free gloves or finger cots to handle the scales.
Refer to the following drawing for this procedure:
Step
Action
1.
Make sure that the mounting surface is dry and clean.
2.
Peel the cover paper off and place the scale above the final location.
3.
Align the scale by placing the edges against the benching pins.
4.
Gently place the scale on the mounting surface.
5.
When scale is in final position, firmly press down on the top of the scale to secure it.
6.0 Cleaning Scales
Step
Action
1.
General Particle Removal:
Blow off any contamination with nitrogen, clean air, or a similar gas.
2.
Contamination Removal:
Use a lint-free cleanroom wipe or cotton swab dampened with isopropyl alcohol or acetone to
wipe the surface clean. Handle the scale by the edges. Do not scrub the scale.
Benching Pins
L
End Benching
Pin

Appendix
IM-ChipEncoder-Series-Rev. 2 Page 18 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
7.0 Appendix
7.1 Specifications
System
Operating and Electrical Specifications
Scales
ChipEncoders are compatible with ChipEncoder Linear and
Rotary Glass scales.
Power Supply:
5 VDC ±0.5 VDC
Current Draw:
30 mA, unterminated outputs
Scale Pitch
40 µm
Temperature
System Resolution
CE300-4
CE300-40
CE-40GC
Operating:
Storage:
0°C to 70°C
-20°C to 85°C (CE300)
-20°C to 100°C (CE)
Linear Resolution:
10 µm
1 µm
1 µm
Max Lead-Free
Reflow
Temperature
260°C for<5 seconds
Rotary Resolution:
See Sec. 7.3 Linear and Glass Scales
Interpolation Depth:
X4
X40
X40
Humidity
Operating:
10% to 90% RH, non-condensing
Accuracy
Vibration
30 G @ 20 Hz; EN60068-2-6
Linear Glass:
±5 µm/m
Shock
300 G (0.40, half sine) CE300
100 G (11 ms, half sine) CE
Rotary Glass:
±2 arc-seconds1
Reliability (MTTF)
100,000 Hours
Sensor Size and Weight
Outputs
Signals: CMOS/TTL
Format: Digital –differential quadrature
Output impedance per channel = 60 ohms
Dimensions (mm)
Width
Length
Height
CE300:
CE:
7.0
6.1
11.0
6.1
3.1
3.9
Weight
CE300:
CE:
0.37 g
0.25 g
Note1: Excludes eccentricity
Output Signals

Appendix
IM-ChipEncoder-Series-Rev. 2 Page 19 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
7.2 Output Signals Descriptions
CE (6mm x 6mm ChipEncoder)
CE300 (7mm x 11mm ChipEncoder)
CE Output Signals
Pad
Function
Pad
Function
1
+5VD
11
No Connect
2
No Connect
12
CP+
3
SIN+
13
No Connect
4
AN
14
No Connect
5
+5VA
15
Index Window-
6
DC1
16
Index Window+
7
No Connect
17
A-
8
DC2
18
A+
9
GND
19
B-
10
CA
20
B+

CE300 Output Signals
Pad
Function
Pad
Function
1
Index Window-
13
AN
2
GND
14
SIN+
3
No Connect
15
No Connect
4
No Connect
16
No Connect
5
CP+
17
No Connect
6
+5VA
18
GND
7
No Connect
19
+5VD
8
GND
20
B+
9
DC2
21
B-
10
No Connect
22
A+
11
DC1
23
A-
12
No Connect
24
Index Window+

A+, B+, and Index Window+ Outputs from 40X Encoder
Description of signals:
Signal
Description
A+/A-
Digital quadrature outputs. Signals are RS-422 compatible square waves. Pulses are 90° out
of phase with B+/B- outputs.
B+/B-
Digital quadrature outputs. Signals are RS-422 compatible square waves. Pulses are 90° out
of phase with B+/B- outputs.
Index Window+/
Index Window-
The Index Window defines one particular fringe on the grating surface. The Index Window
signal is a TTL compatible pulse, and is approximately 40 um wide. Note that this signal is not
synchronized to the A or B signals.
PAD 1
PAD 8
PAD 13
PAD 11
PAD 20
PAD 1
PAD 6
PAD 16
Index+
A+
B+