Cinterion BGS3 User manual


BGS3
Version: 01.000d
DocId: BGS3_HD_v01.000d
Hardware Interface Description

GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-
UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY
EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS
INFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUB-
JECT TO CHANGE AT CINTERION'S DISCRETION. CINTERION WIRELESS MODULES GMBH
GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANS-
FER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISAS-
SEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS
SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS
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EXTENT PERMITTED BY APPLICABLE LAW, CINTERION WIRELESS MODULES GMBH DISCLAIMS
ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD
OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM
IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOV-
ERNED AND CONSTRUED ACCORDING TO GERMAN LAW.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-
tents and communication thereof to others without express authorization are prohibited. Offenders will be
held liable for payment of damages. All rights created by patent grant or registration of a utility model or
design patent are reserved.
Copyright © 2010, Cinterion Wireless Modules GmbH
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BGS3 Hardware Interface Description
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Document Name: BGS3 Hardware Interface Description
Version: 01.000d
Date: 2010-03-26
DocId: BGS3_HD_v01.000d
Status Confidential / Released

BGS3 Hardware Interface Description
Contents
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Contents
0 Document History...................................................................................................... 8
1 Introduction...............................................................................................................10
1.1 Related Documents ......................................................................................... 10
1.2 Terms and Abbreviations ................................................................................. 10
1.3 Regulatory and Type Approval Information ..................................................... 14
1.3.1 Directives and Standards.................................................................... 14
1.3.2 SAR requirements specific to portable mobiles .................................. 16
1.3.3 Safety Precautions.............................................................................. 17
2 Product Concept.......................................................................................................18
2.1 Key Features at a Glance ................................................................................ 18
2.2 BGS3 System Overview .................................................................................. 20
2.3 Circuit Concept ................................................................................................ 21
3 Application Interface.................................................................................................22
3.1 Operating Modes ............................................................................................. 23
3.2 Power Supply................................................................................................... 24
3.2.1 Minimizing Power Losses ................................................................... 24
3.2.2 Measuring the Supply Voltage VBATT+ ............................................. 25
3.2.3 Monitoring Power Supply by AT Command ........................................ 25
3.3 Power Up / Power Down Scenarios................................................................. 26
3.3.1 Turn on BGS3 ..................................................................................... 26
3.3.1.1 Turn on BGS3 Using Ignition Line IGT ................................ 26
3.3.1.2 Configuring the IGT Line for Use as ON/OFF Switch.......... 29
3.3.1.3 Turn on BGS3 Using the VCHARGE Signal ....................... 29
3.3.1.4 Reset BGS3 via AT+CFUN Command................................ 30
3.3.1.5 Reset or Turn off BGS3 in Case of Emergency .................. 30
3.3.1.6 Using EMERG_OFF Signal to Reset Application(s) or
External Device(s)............................................................... 30
3.3.2 Signal States after Startup .................................................................. 31
3.3.3 Turn off BGS3 ..................................................................................... 32
3.3.3.1 Turn off BGS3 Using AT Command .................................... 32
3.3.4 Automatic Shutdown ........................................................................... 33
3.3.4.1 Thermal Shutdown .............................................................. 34
3.3.4.2 Deferred Shutdown at Extreme Temperature Conditions.... 35
3.3.4.3 Undervoltage Shutdown ...................................................... 35
3.3.4.4 Overvoltage Shutdown ........................................................ 36
3.4 Automatic GPRS Multislot Class Change ........................................................ 37
3.5 Charging Control.............................................................................................. 38
3.5.1 Hardware Requirements ..................................................................... 38
3.5.2 Software Requirements ...................................................................... 38
3.5.3 Battery Pack Requirements ................................................................ 39
3.5.4 Batteries Tested for Use with BGS3 ................................................... 40
3.5.5 Charger Requirements........................................................................ 41

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3.5.6 Implemented Charging Technique...................................................... 41
3.5.7 Operating Modes during Charging...................................................... 42
3.6 Power Saving................................................................................................... 44
3.6.1 Network Dependency of SLEEP Modes ............................................. 44
3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7....................... 45
3.6.3 Timing of the RTSx Signal in CYCLIC SLEEP Mode 9....................... 45
3.7 Summary of State Transitions (Except SLEEP Mode)..................................... 46
3.8 SIM Interface.................................................................................................... 47
3.9 Serial Interface ASC0 ...................................................................................... 48
3.10 Serial Interface ASC1 ...................................................................................... 50
3.11 Audio Interfaces ............................................................................................... 51
3.11.1 Speech Processing ............................................................................. 52
3.11.2 Microphone Circuit .............................................................................. 52
3.11.2.1 Single-ended Microphone Input .......................................... 53
3.11.2.2 Differential Microphone Input .............................................. 54
3.11.2.3 Line Input Configuration with OpAmp ................................. 55
3.11.3 Loudspeaker Circuit ............................................................................ 56
3.11.4 Digital Audio Interface (DAI) ............................................................... 56
3.11.4.1 Master Mode ....................................................................... 58
3.11.4.2 Slave Mode ......................................................................... 59
3.12 Control Signals................................................................................................. 61
3.12.1 Synchronization Signal ....................................................................... 61
3.12.2 Using the SYNC Line to Control a Status LED ................................... 62
3.12.3 Behavior of the RING0 Line (ASC0 Interface only)............................. 63
3.12.4 PWR_IND Signal ................................................................................ 63
4 Antenna Interface......................................................................................................64
4.1 Antenna Installation ......................................................................................... 64
4.2 RF Line Routing Design................................................................................... 65
5 Electrical, Reliability and Radio Characteristics....................................................68
5.1 Absolute Maximum Ratings ............................................................................. 68
5.2 Operating Temperatures.................................................................................. 69
5.3 Storage Conditions .......................................................................................... 70
5.4 Reliability Characteristics................................................................................. 71
5.5 Pad Assignment and Signal Description.......................................................... 72
5.6 Power Supply Ratings...................................................................................... 80
5.7 Electrical Characteristics of the Voiceband Part .............................................. 83
5.7.1 Setting Audio Parameters by AT Commands ..................................... 83
5.7.2 Audio Programming Model ................................................................. 84
5.7.3 Characteristics of Audio Modes .......................................................... 85
5.7.4 Voiceband Receive Path..................................................................... 86
5.7.5 Voiceband Transmit Path.................................................................... 88
5.8 Air Interface...................................................................................................... 89
5.9 Electrostatic Discharge .................................................................................... 90

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6 Mechanics, Mounting and Packaging.....................................................................91
6.1 Mechanical Dimensions of BGS3 .................................................................... 91
6.2 Mounting BGS3 onto the Application Platform................................................. 93
6.2.1 SMT PCB Assembly ........................................................................... 93
6.2.1.1 Land Pattern and Stencil ..................................................... 93
6.2.1.2 Board Level Characterization.............................................. 94
6.2.2 Moisture Sensitivity Level ................................................................... 95
6.2.3 Soldering Conditions and Temperature .............................................. 95
6.2.3.1 Reflow Profile ...................................................................... 95
6.2.3.2 Maximum Temperature and Duration.................................. 96
6.2.4 Durability and Mechanical Handling.................................................... 97
6.2.4.1 Storage Life ......................................................................... 97
6.2.4.2 Processing Life.................................................................... 97
6.2.4.3 Baking ................................................................................. 97
6.2.4.4 Electrostatic Discharge........................................................ 97
6.3 Packaging ........................................................................................................ 98
6.3.1 Tape and Reel .................................................................................... 98
6.3.1.1 Orientation........................................................................... 98
6.3.1.2 Barcode Label ..................................................................... 99
6.3.2 Shipping Materials ............................................................................ 100
6.3.2.1 Moisture Barrier Bag ......................................................... 100
6.3.2.2 Transportation Box ............................................................ 102
7 Sample Application.................................................................................................103
8 Reference Approval................................................................................................105
8.1 Reference Equipment for Type Approval....................................................... 105
8.2 Compliance with FCC and IC Rules and Regulations ................................... 106
9 Appendix..................................................................................................................108
9.1 List of Parts and Accessories......................................................................... 108

BGS3 Hardware Interface Description
Tab les
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Tables
Table 1: Directives ....................................................................................................... 14
Table 2: Standards of North American type approval .................................................. 14
Table 3: Standards of European type approval............................................................ 14
Table 4: Requirements of quality ................................................................................. 15
Table 5: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 15
Table 6: Toxic or hazardous substances or elements with defined concentration limits 16
Table 7: Overview of operating modes ........................................................................ 23
Table 8: Signal states................................................................................................... 31
Table 9: Temperature dependent behavior.................................................................. 34
Table 10: Specifications of battery packs suited for use with BGS3 .............................. 40
Table 11: AT commands available in Charge-only mode .............................................. 42
Table 12: Comparison Charge-only and Charge mode ................................................. 43
Table 13: State transitions of BGS3 (except SLEEP mode) .......................................... 46
Table 14: Signals of the SIM interface (SMT application interface) ............................... 47
Table 15: DCE-DTE wiring of ASC0 .............................................................................. 49
Table 16: DCE-DTE wiring of ASC1 .............................................................................. 50
Table 17: Configuration combinations for the PCM interface......................................... 57
Table 18: Overview of DAI signal functions ................................................................... 57
Table 19: Return loss in the active band........................................................................ 64
Table 20: Absolute maximum ratings............................................................................. 68
Table 21: Board / battery temperature ........................................................................... 69
Table 22: Ambient temperature according to IEC 60068-2 (without forced air circulation) . 69
Table 23: Charging temperature .................................................................................... 69
Table 24: Storage conditions ......................................................................................... 70
Table 25: Summary of reliability test conditions............................................................. 71
Table 26: Pad assignments............................................................................................ 73
Table 27: Signal description........................................................................................... 74
Table 28: Power supply ratings...................................................................................... 80
Table 29: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz . 81
Table 30: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz 82
Table 31: Audio parameters adjustable by AT commands ............................................ 83
Table 32: Voiceband characteristics (typical)................................................................. 85
Table 33: Voiceband receive path.................................................................................. 86
Table 34: Voiceband transmit path ................................................................................ 88
Table 35: Air interface.................................................................................................... 89
Table 36: Measured electrostatic values........................................................................ 90
Table 37: Reflow temperature ratings............................................................................ 96
Table 38: List of parts and accessories........................................................................ 108
Table 39: Molex sales contacts (subject to change) .................................................... 109
Table 40: Hirose sales contacts (subject to change) ................................................... 109

BGS3 Hardware Interface Description
Figures
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Figures
Figure 1: BGS3 system overview.................................................................................. 20
Figure 2: BGS3 block diagram ...................................................................................... 21
Figure 3: Power supply limits during transmit burst....................................................... 24
Figure 4: Position of reference points BATT+and GND ................................................ 25
Figure 5: Powerup with operating voltage at BATT+ applied before activating IGT...... 27
Figure 6: Powerup with IGT held low before switching on operating voltage at BATT+ 28
Figure 7: Timing of IGT if used as ON/OFF switch ....................................................... 29
Figure 8: Signal states during turn-off procedure.......................................................... 33
Figure 9: Battery pack circuit diagram........................................................................... 39
Figure 10: Power saving and paging............................................................................... 44
Figure 11: Timing of CTSx signal (if CFUN= 7)............................................................... 45
Figure 12: Timing of RTSx signal (if CFUN = 9).............................................................. 45
Figure 13: Serial interface ASC0..................................................................................... 48
Figure 14: Serial interface ASC1..................................................................................... 50
Figure 15: Audio block diagram....................................................................................... 51
Figure 16: Single ended microphone input...................................................................... 53
Figure 17: Differential microphone input ......................................................................... 54
Figure 18: Line input configuration with OpAmp ............................................................. 55
Figure 19: Differential loudspeaker configuration............................................................ 56
Figure 20: Master PCM interface Application.................................................................. 58
Figure 21: Short Frame PCM timing................................................................................ 58
Figure 22: Long Frame PCM timing ................................................................................ 59
Figure 23: Slave PCM interface application .................................................................... 60
Figure 24: Slave PCM Timing, Short Frame selected..................................................... 60
Figure 25: Slave PCM Timing, Long Frame selected...................................................... 60
Figure 26: SYNC signal during transmit burst................................................................. 61
Figure 27: LED Circuit (Example).................................................................................... 62
Figure 28: Incoming voice/fax/data call........................................................................... 63
Figure 29: URC transmission .......................................................................................... 63
Figure 30: Antenna pads................................................................................................. 64
Figure 31: 4 layer PCB stack for BGS3 interface board.................................................. 65
Figure 32: RF line on interface board. All dimensions are given in mm .......................... 67
Figure 33: Numbering plan for connecting pads (bottom view)....................................... 72
Figure 34: Audio programming model............................................................................. 84
Figure 35: BGS3– top view ............................................................................................. 91
Figure 36: Dimensions of BGS3 (all dimensions in mm)................................................. 92
Figure 37: Land pattern (bottom view) ............................................................................ 93
Figure 38: Recommended stencil design (bottom view) ................................................. 94
Figure 39: Reflow Profile................................................................................................. 95
Figure 40: Carrier tape .................................................................................................... 98
Figure 41: Reel direction ................................................................................................. 98
Figure 42: Barcode label on tape reel ............................................................................. 99
Figure 43: Moisture barrier bag (MBB) with imprint....................................................... 100
Figure 44: Moisture Sensitivity Label ............................................................................ 101
Figure 45: Humidity Indicator Card - HIC ...................................................................... 102
Figure 46: BGS3 sample application............................................................................. 104
Figure 47: Reference equipment for Type Approval ..................................................... 105

BGS3 Hardware Interface Description
0 Document History
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0 Document History
Preceding document: "BGS3 Hardware Interface Description" Version 01.000c
New document: "BGS3 Hardware Interface Description" Version 01.000d
Preceding document: "BGS3 Hardware Interface Description" Version 01.000b
New document: "BGS3 Hardware Interface Description" Version 01.000c
Preceding document: "BGS3 Hardware Interface Description" Version 01.000a
New document: "BGS3 Hardware Interface Description" Version 01.000b
Preceding document: "BGS3 Hardware Interface Description" Version 01.000
New document: "BGS3 Hardware Interface Description" Version 01.000a
Preceding document: "BGS3 Hardware Interface Description" Version 00.051
New document: "BGS3 Hardware Interface Description" Version 01.000
Chapter What is new
5.3, 5.4 Renamed all IEC 68-* standards to IEC 60068-*.
6.3.1.1 Revised Figure 41.
Chapter What is new
1.3 Updated version numbers for ETSI EN 301489-1/-7.
9.1 Added module variant CWM IMEI module L30960-N1570-A110.
Chapter What is new
3.3.1.1 Removed URC "Shutdown after Illegal Powerup".
3.3.2 Table 8: Changed values of PU = Pull up: typ. -200µA and max. -350µA
3.9 Added remark on bit rate tolerance for autobauding.
5.2 Table 22: Removed line on automatic shutdown.
Chapter What is new
9.1 Added module variant CWM IMEI module L30960-N1570-E100.
Chapter What is new
1.3 Updated version numbers for NAPRD and GCF standards.
3.3, 3.3.1.6,
5.5
Revised timing for EMERG_OFF signal throughout document.
4Slightly revised chapter.
5.2 Added remark on deferred shutdown during emergency calls.
5.5 Corrected Figure 33: Set pad 1 to “Do not use“.
Corrected VCHARGE properties: VImax = 7.00V

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New document: "BGS3 Hardware Interface Description" Version 00.051
Chapter What is new
-- Initial document setup.

BGS3 Hardware Interface Description
1 Introduction
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1 Introduction
This document1describes the hardware of the Cinterion BGS3 module that connects to the cel-
lular device application and the air interface. It helps you quickly retrieve interface specifica-
tions, electrical and mechanical details and information on the requirements to be considered
for integrating further components.
1.1 Related Documents
[1] BGS3 AT Command Set
[2] BGS3 Release Note
[3] Application Note 02: Audio Interface Design for GSM Applications
[4] Application Note 07: Rechargeable Lithium Batteries in GSM Applications
[5] Application Note 16: Updating Firmware
[6] Application Note 22: Using TTY / CTM Equipment
[7] Application Note 24: Application Developer’s Guide
[8] Application Note 26: Power Supply Design for Wireless Applications
[9] Application Note 48: SMT Module Integration
[10] Multiplexer User's Guide
[11] Multiplex Driver Developer’s Guide
[12] Multiplexer Driver Installation Guide
1.2 Terms and Abbreviations
1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-
mentation delivered with your Cinterion product.
Abbreviation Description
ADC Analog-to-digital converter
AGC Automatic Gain Control
ANSI American National Standards Institute
ARFCN Absolute Radio Frequency Channel Number
ARP Antenna Reference Point
ASC0 / ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of
BGS3
B Thermistor Constant
BER Bit Error Rate
BTS Base Transceiver Station
CB or CBM Cell Broadcast Message
CE Conformité Européene (European Conformity)
CHAP Challenge Handshake Authentication Protocol
CPU Central Processing Unit

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1.2 Terms and Abbreviations
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CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DAI Digital Audio Interface
dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
DCE Data Communication Equipment (typically modems, e.g. Cinterion GSM module)
DCS 1800 Digital Cellular System, also referred to as PCN
DRX Discontinuous Reception
DSB Development Support Box
DSP Digital Signal Processor
DSR Data Set Ready
DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM
application)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EIRP Equivalent Isotropic Radiated Power
EMC Electromagnetic Compatibility
ERP Effective Radiated Power
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPIO General Purpose Input/Output
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HiZ High Impedance
HR Half Rate
I/O Input/Output
IC Integrated Circuit
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
kbps kbits per second
Abbreviation Description

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1.2 Terms and Abbreviations
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LED Light Emitting Diode
Li-Ion / Li+ Lithium-Ion
Li battery Rechargeable Lithium Ion or Lithium Polymer battery
Mbps Mbits per second
MMI Man Machine Interface
MO Mobile Originated
MS Mobile Station (GSM module), also referred to as TE
MSISDN Mobile Station International ISDN number
MT Mobile Terminated
NTC Negative Temperature Coefficient
OEM Original Equipment Manufacturer
PA Power Amplifier
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCL Power Control Level
PCM Pulse Code Modulation
PCN Personal Communications Network, also referred to as DCS 1800
PCS Personal Communication System, also referred to as GSM 1900
PDU Protocol Data Unit
PLL Phase Locked Loop
PPP Point-to-point protocol
PSK Phase Shift Keying
PSU Power Supply Unit
PWM Pulse Width Modulation
R&TTE Radio and Telecommunication Terminal Equipment
RAM Random Access Memory
RF Radio Frequency
RMS Root Mean Square (value)
RoHS Restriction of the use of certain hazardous substances in electrical and electronic
equipment.
ROM Read-only Memory
RTC Real Time Clock
RTS Request to Send
Rx Receive Direction
SAR Specific Absorption Rate
SELV Safety Extra Low Voltage
SIM Subscriber Identification Module
Abbreviation Description

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1.2 Terms and Abbreviations
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SMD Surface Mount Device
SMS Short Message Service
SMT Surface Mount Technology
SRAM Static Random Access Memory
TA Terminal adapter (e.g. GSM module)
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
Tx Transmit Direction
UART Universal asynchronous receiver-transmitter
URC Unsolicited Result Code
USSD Unstructured Supplementary Service Data
VSWR Voltage Standing Wave Ratio
Abbreviation Description

BGS3 Hardware Interface Description
1.3 Regulatory and Type Approval Information
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1.3 Regulatory and Type Approval Information
1.3.1 Directives and Standards
BGS3 is designed to comply with the directives and standards listed below.
It is the responsibility of the application manufacturer to ensure compliance of the final product
with all provisions of the applicable directives and standards as well as with the technical spec-
ifications provided in the "BGS3 Hardware Interface Description".1
1. Manufacturers of applications which can be used in the US shall ensure that their applications have a
PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module.
Table 1: Directives
99/05/EC Directive of the European Parliament and of the council of 9 March 1999
on radio equipment and telecommunications terminal equipment and the
mutual recognition of their conformity (in short referred to as R&TTE Direc-
tive 1999/5/EC).
The product is labeled with the CE conformity mark
2002/95/EC Directive of the European Parliament and of the Council
of 27 January 2003 on the restriction of the use of certain
hazardous substances in electrical and electronic equip-
ment (RoHS)
Table 2: Standards of North American type approval
CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications,
PCS); US Equipment Authorization FCC
UL 60 950 Product Safety Certification (Safety requirements)
Not applicable to CWM IMEI module L30960-N1570-E100
(see Section 9.1).
NAPRD.03 V4.1 Overview of PCS Type certification review board Mobile Equipment Type
Certification and IMEI control
PCS Type Certification Review board (PTCRB)
RSS133 (Issue2) Canadian Standard
Table 3: Standards of European type approval
3GPP TS 51.010-1 Digital cellular telecommunications system (Phase 2); Mobile Station (MS)
conformance specification
ETSI EN 301 511 V9.0.2 Candidate Harmonized European Standard (Telecommunications series)
Global System for Mobile communications (GSM); Harmonized standard
for mobile stations in the GSM 900 and DCS 1800 bands covering essen-
tial requirements under article 3.2 of the R&TTE directive (1999/5/EC)
(GSM 13.11 version 7.0.1 Release 1998)
GCF-CC V3.31 Global Certification Forum - Certification Criteria
ETSI EN 301 489-1
V1.6.1
Candidate Harmonized European Standard (Telecommunications series)
Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-
tro Magnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 1: Common Technical Requirements

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ETSI EN 301 489-7
V1.3.1
Candidate Harmonized European Standard (Telecommunications series)
Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-
tro Magnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 7: Specific conditions for mobile and portable radio and
ancillary equipment of digital cellular radio telecommunications systems
(GSM and DCS)
IEC/EN 60950-1 (2001) Safety of information technology equipment (2000)
Table 4: Requirements of quality
IEC 60068 Environmental testing
DIN EN 60529 IP codes
Table 5: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Sub-
stances in Electronic Information Products” (2006-06).
SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic
Information Products” (2006-06).
According to the “Chinese Administration on the Control
of Pollution caused by Electronic Information Products”
(ACPEIP) the EPUP, i.e., Environmental Protection Use
Period, of this product is 20 years as per the symbol
shown here, unless otherwise marked. The EPUP is valid only as long as
the product is operated within the operating limits described in the Cinte-
rion Wireless Modules Hardware Interface Description.
Please see Table 6 for an overview of toxic or hazardous substances or
elements that might be contained in product parts in concentrations
above the limits defined by SJ/T 11363-2006.
Table 3: Standards of European type approval

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Table 6: Toxic or hazardous substances or elements with defined concentration limits
1.3.2 SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module
must be in accordance with the guidelines for human exposure to radio frequency energy. This
requires the Specific Absorption Rate (SAR) of portable BGS3 based applications to be evalu-
ated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use. For European and US
markets the relevant directives are mentioned below. It is the responsibility of the manufacturer
of the final product to verify whether or not further standards, recommendations or directives
are in force outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic
Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the
frequency range 30MHz - 6GHz
Products intended for sale on European markets
EN 50360 Product standard to demonstrate the compliance of mobile phones with
the basic restrictions related to human exposure to electromagnetic
fields (300MHz - 3GHz)

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1.3.3 Safety Precautions
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating BGS3. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and operating
personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-
ure to comply with these precautions violates safety standards of design, manufacture and in-
tended use of the product. Cinterion Wireless Modules assumes no liability for customer’s
failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of
mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-
lines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment and hear-
ing aids can be affected by interference from cellular terminals or mobiles placed close
to the device. If in doubt about potential danger, contact the physician or the manufac-
turer of the device to verify that the equipment is properly shielded. Pacemaker
patients are advised to keep their hand-held mobile away from the pacemaker, while
it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-
not be switched on inadvertently. The operation of wireless appliances in an aircraft is
forbidden to prevent interference with communications systems. Failure to observe
these instructions may lead to the suspension or denial of cellular services to the
offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any elec-
trical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. Remember that interference can occur if it is used close to TV sets,
radios, computers or inadequately shielded equipment. Follow any special regulations
and always switch off the cellular terminal or mobile wherever forbidden, or when you
suspect that it may cause interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-
ing a vehicle, unless it is securely mounted in a holder for speakerphone operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
Speakerphones must be installed by qualified personnel. Faulty installation or opera-
tion can constitute a safety hazard.
IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks.
Because of this, connection cannot be guaranteed at all times under all conditions.
Therefore, you should never rely solely upon any wireless device for essential com-
munications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be
switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate
those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellular termi-
nal or mobile.

BGS3 Hardware Interface Description
2 Product Concept
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2 Product Concept
2.1 Key Features at a Glance
Feature Implementation
General
Frequency bands Quad band: GSM 850/900/1800/1900MHz
GSM class Small MS
Output power (according
to Release 99)
Class 4 (+33dBm ±2dB) for EGSM850
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
The values stated above are maximum limits. According to Release 99, the
maximum output power in a multislot configuration may be lower. The nom-
inal reduction of maximum output power varies with the number of uplink
timeslots used and amounts to 3.0dB for 2Tx, 4.8dB for 3Tx and 6.0dB for
4Tx.
Power supply 3.2V to 4.5V
Ambient operating
temperature according to
IEC 60068-2
Normal operation: -30°C to +75°C
Restricted operation: +75°C to +85°C, -30°C to -40°C
Physical Dimensions: 29.6mm x 33.9mm x 3.2mm
Weight: approx. 5.5g
RoHS All hardware components fully compliant with EU RoHS Directive
GSM / GPRS features
Data transfer GPRS:
• Multislot Class 10
• Full PBCCH support
• Mobile Station Class B
• Coding Scheme 1 – 4
CSD:
• V.110, RLP, non-transparent
• 2.4, 4.8, 9.6, 14.4kbps
•USSD
PPP-stack for GPRS data transfer
SMS Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Storage: SIM card plus 25 SMS locations in mobile equipment
Transmission of SMS alternatively over CSD or GPRS. Preferred mode can
be user defined.
Fax Group 3; Class 1
Audio Speech codecs:
• Half rate HR (ETS 06.20)
• Full rate FR (ETS 06.10)
• Enhanced full rate EFR (ETS 06.50/06.60/06.80)
• Adaptive Multi Rate AMR
Speakerphone operation, echo cancellation, noise suppression, DTMF,
7 ringing tones

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2.1 Key Features at a Glance
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Software
AT commands Hayes 3GPP TS 27.007, TS 27.005, Cinterion
AT commands for RIL compatibility
MicrosoftTM compatibility RIL for Pocket PC and Smartphone
SIM Application Toolkit SAT Release 99
TCP/IP stack Access by AT commands
Firmware update Generic update from host application over ASC0 or ASC1.
Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface).
Land grid array (LGA) technology ensures high solder joint reliability and
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [9]. This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development equip-
ment.
2 serial interfaces ASC0:
• 8-wire modem interface with status and control lines, unbalanced, asyn-
chronous
• Adjustable baud rates: 300bps to 921,600bps
• Autobauding: 1,200bps to 460,800bps
• Supports RTS0/CTS0 hardware handshake and software XON/XOFF
flow control.
• Multiplex ability according to GSM 07.10 Multiplexer Protocol.
ASC1:
• 4-wire, unbalanced asynchronous interface
• Adjustable baud rates: 300bps to 921,600bps
• Supports RTS1/CTS1 hardware handshake and software XON/XOFF
flow control
Audio 2 analog interfaces
1 digital interfaces (PCM)
SIM interface Supported SIM cards: 3V, 1.8V
Antenna 50
Power on/off, Reset
Power on/off Switch-on by hardware signal IGT
Switch-off by AT command (AT^SMSO)
Automatic switch-off in case of critical temperature and voltage conditions.
Reset Orderly shutdown and reset by AT command
Emergency reset by hardware signals EMERG_OFF and IGT.
Special features
Charging Supports management of rechargeable Lithium Ion and Lithium Polymer
batteries
Real time clock Timer functions via AT commands
Phonebook SIM and phone
TTY/CTM support Integrated CTM modem
Feature Implementation

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2.2 BGS3 System Overview
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2.2 BGS3 System Overview
Figure 1: BGS3 system overview
User Application
Module
Application Interface
Headphones
or Headset
Charger
Charging
circuit
UART
SIM card
Antenna
Interface
ASC0
(Modem)
ASC1
SIM Charge Power
Supply
Analog
Audio
Audio
Codec
Digital
Audio