Texas Instruments TMDS64DC01EVM User manual

User’s Guide
TMDS64DC01EVM and TMDS243DC01EVM User's Guide
Table of Contents
1 Introduction.............................................................................................................................................................................2
2 Revisions and Assembly Variants........................................................................................................................................ 3
3 System Description................................................................................................................................................................ 3
3.1 Key Features......................................................................................................................................................................4
3.2 Functional Block Diagram.................................................................................................................................................. 5
3.3 Interfaces and Major Component Description....................................................................................................................6
4 Known Issues........................................................................................................................................................................14
4.1 Issue 1: Voltage Spike Across the TX Line of the Transceiver.........................................................................................14
List of Figures
Figure 3-1. TMDS64DC01EVM System Architecture.................................................................................................................. 3
Figure 3-2. TMDS64DC01EVM Functional Block Diagram......................................................................................................... 5
Figure 3-3. Breakout Sectional Functional Block Diagram.......................................................................................................... 6
Figure 3-4. IO-Link Section Functional Block Diagram................................................................................................................7
Figure 3-5. Power Input..............................................................................................................................................................11
List of Tables
Table 1-1. TMDS64DC01EVM and TMDS243DC01EVM Feature Comparison..........................................................................2
Table 2-1. TMDS64DC01EVM and TMDS243DC01EVM PCB Design Revisions and Assembly Variants................................. 3
Table 3-1. TMDS64DC01EVM and TMDS243DC01EVM Key Features..................................................................................... 4
Table 3-2. Functionality Selected by J11 Header.........................................................................................................................6
Table 3-3. HSE Connector Signal Routing...................................................................................................................................9
Table 3-4. 150 Pin HSE Connector (SEAM-30-03.5-L-05-2-A-K-TR) ....................................................................................... 11
Table 3-5. 20 Pin ADC Connector 68683-310LF ...................................................................................................................... 13
Table 4-1. AM64x IO Link/Breakout Board Known Issues......................................................................................................... 14
Trademarks
All trademarks are the property of their respective owners.
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1 Introduction
The TMDS64DC01EVM (AM64x EVM IO-Link and High Speed Expansion Board) and TMDS243DC01EVM
(AM243x EVM High Speed Expansion Board) are add-on modules for the AM64x and AM243x EVMs. These
boards include two sections: namely an IO-Link section supporting eight (8) IO-Link ports and a general purpose
signal breakout section.
The AM64x version of this board enables both the IO-Link and general purpose breakout sections, while the
AM243x version of this board only supports the general purpose breakout functionality.
Table 1-1. TMDS64DC01EVM and TMDS243DC01EVM Feature Comparison
Feature TMDS64DC01EVM TMDS243DC01EVM
IO-Link section Yes No (not populated)
General purpose signal breakout section Yes Yes
The general purpose breakout section provides test points to all IO signals included on the High Speed
Expansion (HSE) connector from AM64x and AM243x EVM.
The IO-Link section enables development of PLC and Remote I/O IO-Link master applications by providing
eight M12 IO-Link connectors to help build a universal and scalable IO-Link master. IO-Link (International
Electrotechnical Commission [IEC] 61131-9) is an open standards protocol that addresses the need for
intelligent control of small devices such as sensors and actuators. This standard provides low-speed point-to-
point serial communication between a device and a master that normally serves as a gateway to a fieldbus
and PLC. The intelligent link established enables ease of communication for data exchange, configuration, and
diagnostics.
An unshielded three-wire cable as long as 20 meters, normally equipped with M12 connectors, establishes an
IO-Link connection. Data rates range up to 230 kbps with a nonsynchronous minimum cycle time of 400 μs,
+10%. Four operating modes support bidirectional input/output (I/O), digital input, digital output and deactivation.
Security mechanisms and deterministic data delivery are not specified. A profile known as the IO Device
Description (IODD) contains communication properties; device parameters; identification, process and diagnostic
data; and information specifically about the device and manufacturer.
The many advantages of an IO-Link system include standardized wiring, increased data availability, remote
monitoring and configuration, simple replacement of devices and advanced diagnostics. IO-Link permits factory
managers to receive sensor updates and plan for upcoming maintenance or replacement. Swapping out a
sensing or actuation unit that needs replacement and configuring a new one from the PLC through the IO-Link
master eliminates manual setup and reduces downtime. Switching production remotely from one configuration
to another without visiting the factory floor facilitates easier product customization. Factories can upgrade
production lines readily to IO-Link, since it is backwards-compatible with existing standard I/O installations and
cabling. Altogether, these capabilities result in reduced overall costs, more efficient processes, and greater
machine availability.
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2 Revisions and Assembly Variants
The various TMDS64DC01EVM and TMDS243DC01EVM PCB design revisions and assembly variants are
listed in the table below. Specific PCB revision is indicated in silkscreen on the PCB. Specific assembly variant is
indicated with additional sticker label.
Table 2-1. TMDS64DC01EVM and TMDS243DC01EVM PCB Design Revisions and Assembly Variants
PCB Revision Assembly Variant Revision and Assembly Variant Description
PROC102E1 0011First prototype, early release version of the AM64x EVM IO-Link and
High Speed Expansion Board. Implements both the breakout and IO-
Link sections of the board.
PROC102E1 002 First prototype, early release version of the AM243x EVM High Speed
Expansion Board. Implements only the breakout section of the board.
PROC102A 0011First production release of the AM64x EVM IO-Link and High Speed
Expansion Board. Implements both the breakout and IO-Link sections
of the board.
PROC102A 002 First production release of the AM243x EVM High Speed Expansion
Board. Implements only the breakout section of the board.
1. The TMDS64D01EVM E1 boards do not have a sticker indicating the '001' assembly variant.
3 System Description
This IO-Link board/Breakout board has a 150-pin HSE connector and 20-pin ADC connector to mate with
AM64x and AM243x evaluation board. Additionally, the AM64x version of this board has eight M12 connectors to
execute IO-Link functionality.
Figure 3-1. TMDS64DC01EVM System Architecture
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3.1 Key Features
Table 3-1. TMDS64DC01EVM and TMDS243DC01EVM Key Features
Feature TMDS64DC01EVM TMDS243DC01EVM
Eight M12 IO-Link ports with fault protection Yes No (not populated)
Sixteen individually addressable LEDs Yes No (not populated)
Access to all signals on the EVM’s HSE
connector on standard 0.1" header pins
Yes Yes
Signal routing of HSE connector signals
between Test Headers and IO-Link section
via user configurable FET switches
Yes Yes
Large prototyping area with 0.1" pitch holes Yes Yes
Precision current monitoring with onboard
INA253
Yes No (not populated)
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3.2 Functional Block Diagram
Figure 3-2 shows the functional block diagram of the IO-Link Breakout Board.
Figure 3-2. TMDS64DC01EVM Functional Block Diagram
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3.3 Interfaces and Major Component Description
The following sections provide an overview of the different interfaces and circuits on the TMDS64DC01EVM and
TMDS243DC01EVM.
3.3.1 Breakout Board Section
The general purpose Breakout board connects each pin of the High Speed Expansion (HSE) connector to eight,
2x10 test headers with 0.1” spacing between each pin. Additionally, the board features a circuit prototype area
with standard 0.1” hole spacing.
Signals from the HSE connector are connected to the Breakout board or IO-Link section using FET switches.
The FET switches are controlled using the J11 Header. Connecting the control signal of all the MUXes to ground
routes all signals from the HSE connector to the Breakout board, whereas connecting the control signal to
VCC3V3_IO_HSE routes all signals from the Mux to the IO-Link section.
Table 3-2. Functionality Selected by J11 Header
J11 Header Selection Functionality Supported Board
Short J11 pins 1 and 2 Selects IO-Link section TMDS64DC01EVM only
Short J11 pins 2 and 3 Selects Breakout board section TMDS64DC01EVM and TMDS243DC01EVM
Figure 3-3. Breakout Sectional Functional Block Diagram
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3.3.2 IO-Link Section Overview and Major Component Description
The IO-Link section of this board implements an IO-Link master using the TIOL111 device PHY and surrounding
components needed to build a complete IO-Link master design. Therefore, on the physical side in addition to the
TIOL111 device, a power supply for the ports, as well as a current sink is necessary. Also the hardware must be
able to drive the wake-up pulse.
On the other side it is necessary to have a hardware as well as frame handler that support all three
communication speeds. The TIOL111 device used as PHY here can handle all speeds (COM1, COM2, COM3).
The eight port frame handler is implemented on the PRU of the used AM64x.
To realize an eight-port master, this design consists of eight M12 connectors and eight TIOL111DMWR IO-Link
PHYs and associated LEDs. The IO-Link circuit is supported by two TPS4H160BQPWPRQ1 Quad channel
smart high-side switches for the L+ signals and a SN65HVS882 serializer to support the D signals. The D
signals are connected to a 10 pin header J21 for testing purpose. Both parts require a +24V which is supplied
by a power jack on the board. A TLC59282 16bit IO expander is also included to drive the 16 LEDs. The
SN65HVS882 and TLC59282 16bit IO expander are controlled by SOC_SPI1 interface from GP EVM Board.
SOC_SPI0. SOC_SPI1_CS0 is connected to the serializer and SOC_SPI1_CS1 is connected to the LED driver.
Figure 3-4. IO-Link Section Functional Block Diagram
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3.3.2.1 IO Link Transceiver TIOL111DMWR
The TIOL111DMWR family of transceivers implements the IO-Link interface for industrial bidirectional, point-to
point communication. There are eight IO Link PHYs used in our Board. Each PHY is connected to a M12
connector. The PRG0_PRU1 and GPMC signals are connected to the enable, RX ,TX and Fault signals of the
PHYs via Muxes. The L+ pin requires 24 V, which is provided via the DC Jack.
3.3.2.2 Smart Switch TPS4H160BQPWPRQ1
The TPS4H160-Q1 device is fully protected quad channel smart high-side switch with four integrated 160-mΩ
NMOS power FET. The PRG0_PRU1 and GPMC signals from HSE connector is connected to MUX which routes
the signals either to Test Header or to the TPS4H160-Q1. The selection is done using on board jumpers. The
OUT pins from the high side switch is connected to the L+ signals of the eight M12 Connectors. The OUT
pins are controlled by Enable signals coming from the Mux. SEL and SEH are two pins to multiplex the shared
current-sense function among the four channels. The current sense analog output is grounded via 768Ω and
is connected to the AM64x EVM board via the ADC connector 68683-310LF . A 3.33K resistor is connected to
ground from the current limit pin to set the current limit threshold to 0.6A.
3.3.2.3 Serializer SN65HVS882
The SN65HVS882 is an eight channel, digital-input serializer for high-channel density digital input modules
in industrial automation. In combination with galvanic isolators the device completes the interface between
the high voltage signals on the field-side and the low-voltage signals on the controller side. Input signals are
current-limited and then validated by internal debounce filters. Each digital input operates as a controlled current
sink limiting the input current to a maximum value of I LIM. The current limit is derived from the reference current
via I LIM = n × IREF, and IREF is determined by IREF = VREF/RLIM. Thus, changing the current limit requires
the change of RLIM to a different value via: RLIM = n × VREF/I LIM. While the device is specified for a current
limit of 3.6 mA, (via RLIM = 25 kΩ) The DI signals from the M12 connectors are connected to the input channels
of the serializer. The serializer is SPI compatible Upon a low-level at the load input, LD, the information of the
field inputs, IP0 to IP7 is latched into the shift register. Taking LD high again blocks the parallel inputs of the shift
register from the field inputs. A low-level at the clock-enable input, CE, enables the clock signal, CLK, to serially
shift the data to the serial output, SOP. Data is clocked at the rising edge of CLK. Thus, after eight consecutive
clock cycles all field input data have been clocked out of the shift register and the information of the serial input,
SIP, appears at the serial output, SOP.
3.3.2.4 INA253
The INA253 features a 2-mΩ, precision, current-sensing resistor and a 80-V common-mode, zero-drift topology,
precision, excellent common-mode rejection ratio (CMRR), and features enhanced pulse width modulation
(PWM) rejection current-sensing amplifier integrated into a single package. High precision measurements are
enabled through the matching of the shunt resistor value and the current-sensing amplifier gain providing a
highly-accurate, system-calibrated solution.
3.3.2.5 LED Driver TLC59282
The TLC59282 is a 16-channel, constant-current sink driver. Each channel can be individually controlled via a
simple serial communications protocol that is compatible with 3.3 V or 5 V CMOS logic levels, depending on the
operating VCC. Once the serial data buffer is loaded, a rising edge on LATCH transfers the data to the LEDx
outputs. The BLANK pin can be used to turn off all OUTn outputs during power-on and output data latching to
prevent unwanted image displays during these times. The constant-current value of all 16 channels is set by a
single external resistor.
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3.3.2.6 Signal Routing
The Signals routed to the Breakout Board section and IO Link section are described in Table 3-3.
Table 3-3. HSE Connector Signal Routing
HSE Connector MUX IO LINK Section Breakout Board Section Test Header
PRG0_PRU0GPO0 U2 RX_1 PRG0_PRU0GPO0_HDR J2
PRG0_PRU0GPO1 RX_2 PRG0_PRU0GPO1_HDR
PRG0_PRU0GPO2 RX_3 PRG0_PRU0GPO2_HDR
PRG0_PRU0GPO3 RX_4 PRG0_PRU0GPO3_HDR
PRG0_PRU0GPO4 RX_5 PRG0_PRU0GPO4_HDR
PRG0_PRU0GPO5 RX_6 PRG0_PRU0GPO5_HDR
PRG0_PRU0GPO6 RX_7 PRG0_PRU0GPO6_HDR
PRG0_PRU0GPO7 RX_8 PRG0_PRU0GPO7_HDR
PRG0_PRU0GPO8 U4 TX_1 PRG0_PRU0GPO8_HDR
PRG0_PRU0GPO11 TX_2 PRG0_PRU0GPO11_HDR
PRG0_PRU0GPO12 TX_3 PRG0_PRU0GPO12_HDR J3
PRG0_PRU0GPO13 TX_4 PRG0_PRU0GPO13_HDR
PRG0_PRU0GPO14 TX_5 PRG0_PRU0GPO14_HDR
PRG0_PRU0GPO15 TX_6 PRG0_PRU0GPO15_HDR
PRG0_PRU0GPO16 TX_7 PRG0_PRU0GPO16_HDR
PRG0_PRU0GPO17 TX_8 PRG0_PRU0GPO17_HDR
PRG0_PRU1GPO6 U9 EN_PHY_1 PRG0_PRU1GPO6_HDR J4
PRG0_PRU1GPO8 EN_PHY_2 PRG0_PRU1GPO8_HDR
PRG0_PRU1GPO11 EN_PHY_3 PRG0_PRU1GPO11_HDR J5
PRG0_PRU1GPO12 EN_PHY_4 PRG0_PRU1GPO12_HDR
PRG0_PRU1GPO13 EN_PHY_5 PRG0_PRU1GPO13_HDR
PRG0_PRU1GPO14 EN_PHY_6 PRG0_PRU1GPO14_HDR
PRG0_PRU1GPO15 EN_PHY_7 PRG0_PRU1GPO15_HDR
PRG0_PRU1GPO16 EN_PHY_8 PRG0_PRU1GPO16_HDR
PRG0_PRU1GPO2 U7 EN_L+5 PRG0_PRU1GPO2_HDR J4
PRG0_PRU0GPO18 EN_L+1 PRG0_PRU0GPO18_HDR
PRG0_PRU0GPO19 EN_L+2 PRG0_PRU0GPO19_HDR
PRG0_PRU1GPO4 EN_L+7 PRG0_PRU1GPO4_HDR
PRG0_PRU1GPO0 EN_L+3 PRG0_PRU1GPO0_HDR
PRG0_PRU1GPO1 EN_L+4 PRG0_PRU1GPO1_HDR
PRG0_PRU1GPO3 EN_L+6 PRG0_PRU1GPO3_HDR
PRG0_PRU1GPO5 EN_L+8 PRG0_PRU1GPO5_HDR
GPMC0_ADC0 U11 FAULT_1 GPMC0_ADC0_HDR J6
GPMC0_ADC1 FAULT_2 GPMC0_ADC1_HDR
GPMC0_ADC2 FAULT_3 GPMC0_ADC2_HDR
GPMC0_ADC3 FAULT_4 GPMC0_ADC3_HDR
GPMC0_ADC4 FAULT_5 GPMC0_ADC4_HDR
GPMC0_ADC5 FAULT_6 GPMC0_ADC5_HDR
GPMC0_ADC6 FAULT_7 GPMC0_ADC6_HDR
GPMC0_ADC7 FAULT_8 GPMC0_ADC7_HDR
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Table 3-3. HSE Connector Signal Routing (continued)
HSE Connector MUX IO LINK Section Breakout Board Section Test Header
HSE_GPIO0_36 U12 L_FAULT HSE_GPIO0_36_HDR J8
HSE_GPIO0_35 L_SEL HSE_GPIO0_35_HDR
HSE_GPIO0_37 LOAD_PULSE_SE HSE_GPIO0_37_HDR
HSE_GPIO0_34 L_SEH HSE_GPIO0_34_HDR
HSE_GPIO0_31 H_SEH HSE_GPIO0_31_HDR
HSE_GPIO0_32 H_SEL HSE_GPIO0_32_HDR
HSE_GPIO0_33 H_FAULT HSE_GPIO0_33_HDR
HSE_GPIO0_38 HSE_GPIO0_38
HSE_GPIO0_39 HSE_GPIO0_39
HSE_GPIO0_41 HSE_GPIO0_41
SOC_SPI1_MISO U17 SOC_SPI1_MISO_SE SOC_SPI1_MISO_HDR J9
SOC_SPI1_MOSI SOC_SPI1_MOSI_LED SOC_SPI1_MOSI_HDR
SOC_SPI1_CLK SOC_SPI1_CLK_SE/LED SOC_SPI1_CLK_HDR
SOC_SPI1_CS0 SOC_SPI1_CS0_SE SOC_SPI1_CS0_HDR
SOC_SPI1_CS1 LATCH SOC_SPI1_CS1_HDR
HSE_MCAN1_RX/
I2C3_SDA
HSE_MCAN1_RX/I2C3_SDA J3
HSE_MCAN1_TX/
I2C3_SCL
HSE_MCAN1_TX/I2C3_SCL
HSE_MCAN0_TX/
UART4_RXD
HSE_MCAN0_TX/UART4_RXD
HSE_MCAN0_RX/
UART4_TXD
HSE_MCAN0_RX/UART4_TXD
GPMC0_ADC[8:9] GPMC0_ADC[8:9] J6
GPMC0_ADC[10:15] GPMC0_ADC[10:15] J7
GPMC0_CSN2 GPMC0_CSN2
GPMC0_CSN3 GPMC0_CSN3
GPMC0_CSN1 GPMC0_CSN1
GPMC0_DIR GPMC0_DIR
PRG1_PRU1GPO18 PRG1_PRU1GPO18 J5
PRG1_PRU1GPO19 PRG1_PRU1GPO19
PRG0_MDIO0_MDIO PRG0_MDIO0_MDIO
PRG0_MDIO0_MDC PRG0_MDIO0_MDC
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