Compaq BL10e - HP ProLiant - 512 MB RAM Technical manual

ISS Technolo
g
y Update
Volume 6, Number 7
Keeping you informed of the latest ISS technology
Using HP Onboard Administrator as an alternative method for accessing power consumption information
for HP BladeSystem c-Class servers .........................................................................................................1
Using HP Lights-Out XML Scripting as an alternative method for accessing power consumption
information for HP BladeSystem p-Class servers......................................................................................4
Recovering memory that is invisible to the Microsoft® Windows® operating system ................................9
Basic power control for HP BladeSystem p-Class and c-Class servers .....................................................10
Cabling stacked HP 1/10G Virtual Connect Ethernet Modules.................................................................13
Adjustable fan speeds in the HP BladeSystem c7000 enclosure..............................................................16
ProLiant management tip of the month..................................................................................................18
Recently published industry standard server technology papers ............................................................20
Contact us .............................................................................................................................................20
Using HP Onboard Administrator as an alternative method for accessing power
consumption information for HP BladeSystem c-Class servers
HP Onboard Administrator Command Line Interface (CLI) commands can be used (and scripted) to view power consumption
information for HP BladeSystem c-Class server blades or the c-Class power enclosure.
How to make a request for server blade information
The HPONCFG command sends a Remote Insight Board Command Language (RIBCL) script to the specified BladeSystem
c-Class server blades. You can send the same RIBCL script to one or more of the server blades in the enclosure, such as in the
following examples:
•HPONCFG ALL returns power consumption information for all server blades in the enclosure.
•HPONCFG 1, 3, 5 returns power consumption information for server blades in Bays 1, 3, and 5.
•HPONCFG returns power consumption information for server blades in Bay 2 (Figure 1-1 shows the sample output).

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NOTE
The HPONCFG command is supported with Onboard Administrator Version 2.00 (or greater).
OA-12345678> HPONCFG ALL tftp://some/power/ribcl/script.xml
Figure 1-1. Sample output from HPONCFG ALL command

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How to make a request for power enclosure information
To return information about the power enclosure, use the SHOW POWER and SHOW ENCLOSURE STATUS commands.
The SHOW POWER command displays the current power configuration (Figure 1-2).
OA-12345678> SHOW POWER
Figure 1-2. Sample output from SHOW POWER command
The SHOW ENCLOSURE STATUS command displays the enclosure health, Onboard Administrator health, and unit
identification LED in the “Enclosure” section. The “Power Subsystem” section displays the power status and capacity
(Figure 1-3).
OA-12345678> SHOW ENCLOSURE STATUS

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Figure 1-3. Sample output from SHOW ENCLOSURE STATUS command
Using HP Lights-Out XML Scripting as an alternative method for accessing
power consumption information for HP BladeSystem p-Class servers
HP Systems Insight Manager (HP SIM) 5.1 or later is the easiest tool to use to acquire power consumption information for HP
BladeSystem p-Class servers. HP SIM allows you to determine power consumption levels from an individual power supply or
from a group of servers. However, if you choose to group information using scripts and analyze data using other methods, HP
Lights-Out XML Scripting is an alternative way to collect the same power consumption data that HP SIM can provide.
Using HP Lights-Out XML Scripting to gather power consumption information for HP BladeSystem p-Class servers requires
making two requests to iLO. One request identifies the power supplies in each HP BladeSystem p-Class Enclosure. The second
request obtains detailed power enclosure information. Each request must be executed in sequence to determine the
approximate power used by each power supply and the total power used in the rack.
NOTE
Both requests return information in an XML format as shown in Figures 2-1 and 2-2.

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How to make a request for power supply information
To return topology information about the respective enclosure where iLO is located:
1. Execute the first request:
http://<ilo_ip_address_or_dns_name>/xmldata?item=all
2. Once the request completes, examine the output to identify the power supplies in the topology:
•Look for a PROD_ID of 0x0003 or 0x0005 in the output (see the yellow highlight in Figure 2-1).
•Use the ICMB address located next to the PROD_ID as an input into the second request template (see the “How to make
a request for power enclosure information” section).
Figure 2-1. Sample output from the first request
<?xml version="1.0"?>
<RIMP>
<HSI>
<SPN>ProLiant BL35p G1</SPN>
<SBSN>M00SNC2146</SBSN>
<UUID />
</HSI>
<MP>
<ST>1</ST>
<PN>Integrated Lights-Out (iLO)</PN>
<FWRI>1.91</FWRI>
<BBLK>3; Oct 2 2006</BBLK>
<HWRI>ASIC: 2</HWRI>
<SN>ILOM00SNC2146</SN>
<UUID>ILO</UUID>
</MP>
<INFRA>
<RACK>TestMyRack</RACK>
<ENCL>CPQEnclosure222</ENCL>
<ICMB_ADDR>A6BB</ICMB_ADDR>
<ENCL_SN>SERIAL0004</ENCL_SN>
<UUID>07SERIAL0004</UUID>
<MAX_NUMBER_SLOTS_X>8</MAX_NUMBER_SLOTS_X>
<MAX_NUMBER_SLOTS_Y>2</MAX_NUMBER_SLOTS_Y>
<BLADE CNT="1">
<SLOT>2</SLOT>
<NUM_SLOTS_X>1</NUM_SLOTS_X>
<NUM_SLOTS_Y>1</NUM_SLOTS_Y>
<HMM>119</HMM>
<WMM>43</WMM>
<DMM>477</DMM>
<BSN>M00SNC2146</BSN>
<UUID />
</BLADE>
</INFRA>
<RK_TPLGY CNT="6">
<RUID>D232KJP3D008</RUID>
<ICMB ADDR="A6BB"MFG="232"PROD_ID="0x0007"SER="SERIAL0004"UUID="07SERIAL0004">
<LEFT ADDR="CCE1"SER="SERIAL0001"UUID="07SERIAL0001"/>
<RIGHT />
</ICMB>
<ICMB ADDR="54BC"MFG="232"PROD_ID="0x0003"SER="D303JTK5D103">
<LEFT ADDR="AA5E"SER="D242JTK7D021"/>
<RIGHT ADDR="CCE1"SER="SERIAL0001"UUID="07SERIAL0001"/>
</ICMB>
<ICMB ADDR="CEA"MFG="232"PROD_ID="0x0002"SER="D230JTK7D008">
<LEFT ADDR="4CBB"SER="D232KJP3D008"/>
<RIGHT ADDR="AA5E"SER="D242JTK7D021"/>

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</ICMB>
<ICMB ADDR="AA5E"MFG="232"PROD_ID="0x0002"SER="D242JTK7D021">
<LEFT ADDR="CEA"SER="D230JTK7D008"/>
<RIGHT ADDR="54BC"SER="D303JTK5D103"/>
</ICMB>
<ICMB ADDR="CCE1"MFG="232"PROD_ID="0x0007"SER="SERIAL0001"UUID="07SERIAL0001">
<LEFT ADDR="54BC"SER="D303JTK5D103"/>
<RIGHT ADDR="A6BB"SER="SERIAL0004"UUID="07SERIAL0004"/>
</ICMB>
<ICMB ADDR="4CBB"MFG="232"PROD_ID="0x0003"SER="D232KJP3D008">
<LEFT />
<RIGHT ADDR="CEA"SER="D230JTK7D008"/>
</ICMB>
</RK_TPLGY>
</RIMP>
How to make a request for power enclosure information
an gather power enclosure information byUsing the ICMB address information collected from the first request output, you c
executing a second request. A template for the second request is as follows:
http://<ilo_ip_address_or_dns_name>/xmldata?item=icmb&addr=<addr>
Th in the <powerComponent> tag (see the
er
Where <addr> is the ICMB address of the power enclosure to be viewed.
e data returned contains information about the current generated by each supply
yellow highlight in Figure 2-2). This value can be used to calculate power produced. The power supplies are 51.4 volt.
Figure 2-2 is an example of the second request output. This request examines the power enclosures for only the first pow
supply identified in Figure 2-1.
Figure 2-2. Sample output from the second request
<?xml version="1.0"?>
<RIMP>
<Enclosure>
<ENCL>D303JTK5D103</ENCL>
<ICMB_ADDR>54BC</ICMB_ADDR>
<ENCL_SN>D303JTK5D103</ENCL_SN>
<UUID>D303JTK5D103</UUID>
<FWRI>2.30</FWRI>
<HWRI>5</HWRI>
<MAX_NUMBER_SLOTS_X>6</MAX_NUMBER_SLOTS_X>
<MAX_NUMBER_SLOTS_Y>1</MAX_NUMBER_SLOTS_Y>
<pwrZone>4</pwrZone>
<uidStatus>On</uidStatus>
<Temperature>33</Temperature>
<TemperatureA>31</TemperatureA>
<TemperatureB>30</TemperatureB>
<RedundancyBits>0000</RedundancyBits>
<LoadBalWire>Not Present</LoadBalWire>
<PowerComponents>
<PowerComponent>
<Location>1</Location>
<FWRI>1.70</FWRI>
<acInput>Good</acInput>
<Current>14.973</Current>
<MaxCurrent>57.000</MaxCurrent>
<InputTemp>26</InputTemp>
<InputTempTrip>35</InputTempTrip>

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<InputTempFail>55</InputTempFail>
<OutputTemp>32</OutputTemp>
<OutputTempTrip>70</OutputTempTrip>
<OutputTempFail>75</OutputTempFail>
</PowerComponent>
<PowerComponent>
<Location>2</Location>
<FWRI>1.70</FWRI>
<acInput>Good</acInput>
<Current>12.708</Current>
<MaxCurrent>57.000</MaxCurrent>
<InputTemp>25</InputTemp>
<InputTempTrip>35</InputTempTrip>
<InputTempFail>55</InputTempFail>
<OutputTemp>35</OutputTemp>
<OutputTempTrip>70</OutputTempTrip>
<OutputTempFail>75</OutputTempFail>
</PowerComponent>
<PowerComponent />
<PowerComponent>
<Location>4</Location>
<FWRI>1.70</FWRI>
<acInput>Good</acInput>
<Current>5.353</Current>
<MaxCurrent>57.000</MaxCurrent>
<InputTemp>24</InputTemp>
<InputTempTrip>35</InputTempTrip>
<InputTempFail>55</InputTempFail>
<OutputTemp>30</OutputTemp>
<OutputTempTrip>70</OutputTempTrip>
<OutputTempFail>75</OutputTempFail>
</PowerComponent>
<PowerComponent>
<Location>5</Location>
<FWRI>1.70</FWRI>
<acInput>Good</acInput>
<Current>8.904</Current>
<MaxCurrent>57.000</MaxCurrent>
<InputTemp>24</InputTemp>
<InputTempTrip>35</InputTempTrip>
<InputTempFail>55</InputTempFail>
<OutputTemp>32</OutputTemp>
<OutputTempTrip>70</OutputTempTrip>
<OutputTempFail>75</OutputTempFail>
</PowerComponent>
<PowerComponent />
</PowerComponents>
</Enclosure>
</RIMP>

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How to use the data collected from the request output
With the value of electrical current being drawn by each power supply, you can determine the approximate power used by
each power supply with the following equation:
Pn= Vx In
Where (n) is the power supply number, (I) is the current, and (V) is always 51.4 volts.1Pnrepresents the total power
for supply (n).
For this scenario, the approximate power being used by each supply is provided in Table 2-1.
Table 2-1. Power supply information gathered from the sample request output in Figure 2-2
Location Current (I) Voltage Total power for supply (n)
1 14.973 amps 51.4 volts 769.612 watts
2 12.708 amps 51.4 volts 653.191 watts
4 5.353 amps 51.4 volts 275.144 watts
5 8.904 amps 51.4 volts 457.666 watts
With the power value from each power supply, you can approximate the total power for the entire rack with the following
equation:
Pt= P1+ P2+ xxx Pn
Where Ptequals approximate total power.
By entering the total power for each power supply from Table 2-1 into the equation above, you can determine that the total
power for the entire rack in this scenario is 2155.613 watts.
Additional resources
For additional information on the topics discussed in this article, visit the links in Table 2-2.
Table 2-2. Web resources
Resource URL
HP BladeSystem server information and resources www.hp.com/go/blades
HP Lights-Out product information and resources www.hp.com/go/ilo
HP Systems Insight Manager product information and resources www.hp.com/go/hpsim
1The power supply is rated for 51.4 volts.

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Recovering memory that is invisible to the Microsoft® Windows® operating
system
As memory usage requirements of servers increase, one common problem is that the Windows® operating system sees less
RAM than is actually present, such as seeing only 3.25 GB of RAM instead of 4 GB. In most cases, the loss of RAM is caused
by the PCI (peripheral component interconnect) memory space that is located just below 4 GB. This is commonly called the “PCI
memory hole.” The PCI memory hole ranges from .5 GB to 2.0 GB, but is often about .75 GB.
PCI memory is configured as “memory-mapped I/O,” which means it takes up standard memory address space to access
hardware I/O locations. That memory space then becomes unavailable for use with actual memory. Originally, this did not
cause issues because the amount of memory space taken was small and computers did not have that much memory. More
recently, the PCI memory hole has become more of an issue because of the increased memory requirements and also because
the PCI memory hole grew. The latest chipsets now have mechanisms available that allow the recovery of this memory space by
mapping it to other address locations above 4 GB. Older HP ProLiant servers may not have chipsets that allow the recovery of
RAM; as of 2007, all shipping ProLiant servers support this feature.
Table 3-1. Partial list of ProLiant servers with chipsets allowing the recovery of RAM
HP BladeSystem c-Class servers HP ProLiant DL servers HP ProLiant ML servers
ProLiant BL460c ProLiant DL140 G3 ProLiant ML110G4
ProLiant BL465c ProLiant DL145 G3 ProLiant ML115
ProLiant BL480c ProLiant DL320 G5 ProLiant ML150 G3
ProLiant BL680c G5 ProLiant DL320s ProLiant ML370 G5
ProLiant BL685c ProLiant DL360 G5 ProLiant ML310 G4
ProLiant BL20p G4 ProLiant DL365 ProLiant ML350 G5
ProLiant BL25p G2 ProLiant DL380 G5
ProLiant BL45p G2 ProLiant DL385 G2
ProLiant DL580 G5
ProLiant DL585 G2
To access this memory, the OS needs to be capable of working with memory addresses above 4 GB.
The way to access the rest of the RAM is to enable the PAE (Physical Address Extension). PAE is available in the following
operating systems:
•Microsoft Windows 2000 Advanced Server
•Microsoft Windows 2000 Datacenter Server
•Microsoft Windows Server 2003, Enterprise Edition
•Microsoft Windows Server 2003, Datacenter Edition
To enable PAE, the C:\boot.ini file needs to be edited. To edit this file, go to the control panel for the Windows OS.
1. Click Start, point to Settings, then click Control Panel.
2. In the Control Panel, double-click System.
3. Click the Advanced tab, then click Settings under Startup Recovery.

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4. Under System Startup, click Edit to display the C:\boot.ini command line. The current boot.ini command probably reads
something like the following:
multi(0)disk(0)rdisk(0)partition(1)\WINDOWS="Microsoft Server 2003 Enterprise" /noexecute=optin /fastdetect
5. Add the PAE command at the end so the command reads something like:
multi(0)disk(0)rdisk(0)partition(1)\WINDOWS="Microsoft Server 2003 Enterprise" /noexecute=optin /fastdetect /PAE
6. Click OK to apply the change.
After the system is rebooted, the new command should take effect and provide access to the full memory in RAM. For more
information about PAE, visit http://support.microsoft.com/kb/283037 that is part of the Microsoft website.
Basic power control for HP BladeSystem p-Class and c-Class servers
This article provides an overview of the power circuits for HP BladeSystem and explains the reasons for different design choices
made for p-Class and c-Class.
HP BladeSystem p-Class power structure
This solution was not integrated into a single mechanical enclosure as is found in c-Class. In its maximum configuration, the p-
Class power architecture provided for two power enclosures, two external bus bars, and five server enclosures. This
configuration is shown in Figure 4-1. Power is distributed to the attached server enclosures at -48 VDC through DC power
cables and bus bars.