Dell OptiPlex FX160 User manual

TECHNICAL GUIDEBOOK
TM
TM
DELL
OPTIPLEX FX160

O V E R V I E W 3
FX160 Tiny Desktop Computer View 4
M A R K E T I N G S Y S T E M C O N F I G U R A TI O N S
Operating System 6
Chipset, Processor, Memory 7
Flash Storage, Drives and Removable Storage 8
System Board Connectors, Graphics/Video Controller 8
External Ports/Connectors 9
Communications—Network Adapter ( NIC ) , Modem 9
Audio and Speakers, Keyboard and Mouse 9
Mounting Brackets/Stands 10
Security, Service & Support, Software 10
D E T A I L E D E N G I N E E R I N G S P E C I F I C A T IO N S
System Dimensions ( Physical ) 11
System Board Connector Maximum Allowable Dimensions 11
System Level Environmental and Operating Conditions 11
Power 12
Audio 12
Communications—Integrated LAN 13
Communications—Wireless LAN 14
Graphics/Video Controller 15
Hard Drives 15
Optical Drive 16
BIOS Defaults 16
Optimal System Placement 17
TABLE OF CONTENTS

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
3
DELL™OPTIPLEX™FX160
The desktop computing landscape is evolving. As organizations and their workforces become increasingly
distributed and mobile, an explosion of new end-user devices has exacerbated the challenges being faced by IT
departments. These challenges include ensuring data and device security regardless of location, managing data
and applications consistently across the organization, and providing support for the myriad of emerging
devices and applications. Traditional computing has addressed the key customer pain points in a limited
fashion.
Dell’s new desktop computing vision — Flexible Computing —delivers validated solutions (hardware, software, and
services) that augment Dell’s traditional desktop offerings and enable IT departments to navigate their increasingly
complex environment. Understanding that often the optimal flexible computing approach is a combination
of solutions, Dell developed the new OptiPlex FX160 flexible computing node that is optimized for two of Dell’s Flexible
Computing Solutions: On-Demand Desktop Streaming or Virtual Remote Desktop. In doing so, customers can now
confidently invest in a client device that supports the right solution for today with the flexibility to support the needs of
tomorrow. For more information about Dell Flexible Computing Solutions, please visit: www.dell.com/fcs.
OPTIPLEX MEANS BUSINESS
The OptiPlex FX160 delivers essential performance and flexibility to help keep your business running:
 Planning support with up to a 36-month lifecycle, stable images, and managed transitions
 The FX160 is designed to support either a VRD or ODDS operating environment which best meets the customer's
needs
OPTIPLEX SECURITY
The OptiPlex FX160 ensures data and system security independent of location to help protect your critical data:
 Data is centrally located in the data center, which reduces data security risks from user theft or mismanagement and
alleviates business continuity concerns such as distributed data and or data loss
 Defends your systems against hackers and worms, Trojan horses, viruses, and other malicious code attacks with
Symantec™ Endpoint Protection for Windows®XP Embedded
 Protects against unauthorized access to your critical data with optional SmartCard keyboards
 Security lock slot provides physical system protection (supporting Kensington-style locks)
 Optional Cable Security Kit, made of hardened steel, is designed to secure commonly-used keyboard, mouse, and
other PS2 or USB devices from theft
OPTIPLEX IS EASY TO OWN
The OptiPlex FX160 is engineered for flexibility to meet your changing needs:
 Designed for single-application workloads, the OptiPlex FX160 features new Intel®Atom™ processors along with
Dell Flash storage (NVRAM) options for flexible high-end thin client usage models
 Image deployment solution is provided through a free download from Altiris®
 Altiris Deployment Solution enables the ability to push images out to embedded devices and is only available on
select models with Windows XP Embedded operating systems or Linux Embedded operating systems in thin client
environments
 USB image transfer utility available to flash NVRAM for desk-side deployments
 Centralized image management helps simplify complexities around client deployments with plug and play
installations
 Integrated power supply and optional mounting options make the FX160 an easy choice when it comes to
maximizing desktop real estate

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
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FRONT VIEW
1 Power Button 6 Microphone Connector
2 Side Cover 7 Diagnostic Lights
(see your Service Manual
for information about light
codes)
3 USB 2.0 Connectors (2) 8 Wi-Fi Indicator
4 Stand 9 Hard Drive Indicator
5 Headphone Connector 10 Network Activity Indicator
BACK VIEW
1 Wireless Antenna
(Optional)
6 PS/2 Keyboard Connector
2 Serial Connector 7 Power Connector
3 DVI Connector 8 PS/2 Mouse Connector
4 VGA Connector 9 Network Connector (RJ-45)
5 USB 2.0 Connectors (4)
F R O N T V I E W B A C K V I E W
OPTIPLEX FX160 TINY DESKTOP COMPUTER VIEW

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
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CONNECTORS
1Memory Connector (DIMM_1)
2Memory Connector (DIMM_2)
3Battery (BATTERY)
4SATA Data Cable Connector (SATA1)
5Setup Jumper (SETUP_LOCK)
6Audio Connector (AUDIOF1)
7USB Connector (USBF1)
8Front Panel Connector (FRONTPANEL)
9NVRAM Module Connector (SATA0)
10 Clear CMOS and Password Jumpers
(RTCRST and PSWD)
11 WLAN Connector (MINIA1)
12 Fan Connector (FAN_CPU)
13 12V Power Connector (PWR1)
14 SATA Hard-Drive Power Connector
(SATA PWR1)
S Y S T E M B O A R D C O N N E C T O R S

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
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MARKETING SYSTEM CONFIGURATIONS
N O T E : O f fe r i n g s m a y v a r y b y r e g i o n .
FLX models FLX-HD models
Windows Vista® operating system Windows Vista®
Business SP1
Windows XP® operating system (through downgrade right）Windows®XP
Professional SP3
Microsoft Diskless PC License Dell FLX OS License
DT Streaming License Citrix® Provision Server for Desktops
DT Subscription Advantage Citrix® 3-Year Provision Server for Desktops
Subscription Advantage
OS Media Support Optional Optional
OPERATING SYSTEM (ON WINDOWS XP EMBEDDED AND LINUX EMBEDDED MODELS ONLY)
N O T E : T h i n C l i e n t c u s t o m e r s c a n s e l e c t e i t h e r a M i c r o s o f t W i n d o w s X P E m b e d d e d o r N o v e l l SU S E
L i n u x E n t e rp r i s e T h i n C l i e nt ( S L E T C ) w i t h a n e m b e d d e d O p e r a t i n g S y s t e m p r e i n s t a l l e d o n N V R A M
f l a s h m e m o r y .
N O T E : C o n f i g u r a t i o n s w i t h e m b e d d e d o p e r a t i n g s y s t e m s r e q u i r e N V R A M f l a s h m e m o r y . H a rd
d r i v e i s o p t i o n a l a n d i s n o t r e q u i r e d.
N O T E : T h e L i n u x em b ed d e d o p e r a t i n g s y s t e m c o n f i gu r a t i o n d o e s n o t s u p p o r t t h e o p t i o n a l
i n t e g ra t e d D e l l 1 3 9 7 Wi r e le s s H a l f M i n i P C I e ( 8 0 2 . 1 1 b g ) C a r d .
N O T E : A l t i r i s D e p l o y m e n t S o l u t i o n i n c l u d e s S e r v e r - b a s e d i m a g e d e p l o y m e n t s o l u t i o n ( a f r e e
d o w n l o a d f r o m A l t i r is ) . F o r m o r e i n f o r m a t i o n o n A l t i r i s ® D e p l o y m e nt S o l u t i o n g o t o : h t t p : / /
w w w . d e l l. c om / f l e x i b l e co m p u t i n g
N O T E : A n o p t i o n a l e x t e r n a l o p t i c a l d r i v e i s r e q u i r e d t o a c c e s s C D / D V D m e d i a . T h e D e l l O S M e d i a
s h i p o n a D V D r e q u i ri n g a t l e a s t a D V D - R O M ( o r D V D r e a d a b l e d r i v e ) t o a c c e s s a p p l i c a t i o n f i l e s /
r e i n s t a l l O S .
XP Embedded models Linux Embedded models
Windows XP Embedded operating system Windows XP Embedded
Novell SUSE Linux operating system SUSE Linux Enterprise
Thin Client 10 (SLETC)
Browser Support Internet Explorer FireFox
Security Software License Symantec Endpoint
Protection
Image Management Altiris Deployment Solution
Other Support ICA / RDP
OS Media Support Optional Optional
OPERATING SYSTEM (ON FLX AND FLX-HD MODELS ONLY)
N O T E : O n - D e m a n d D e s k t o p S t r e a m in g ( O D D S ) c u s t o m e r s c a n s e l e c t e i t h er a F L X m o d e l ( w i t h n o
h a r d d r i v e ) w i t h a W i n d o w s D i s k l e s s P C o p e r a t i n g s y s t e m l i c e n s e o r a F L X - H D m o d e l ( w i t h h a r d
d r i v e ) w h i c h i n c l u d e s o n e o f t h e f o l l o w i n g o p e r a t i n g s y s t e m s p r e i n s t a l l e d ; W i n d o w s V i s t a
B u s i n e s s o r W i n d o w s X P P r o f e s s i o n a l t h r o u g h d o w n g r a d e r i g h t s .
N O T E : T h e M S F T D i s k l e s s P C l i c e n s e g u a r a n t e e s y o u t h e r i g h t t o s t r e a m a M i c r o s o f t ® W i n d o w s ®
O p e r a t i n g S y s t e m t o a d i s k l e s s c l i e n t f r o m t h e d a t a c e n t e r . N o t e - A d d i t i o n a l M i c r o s o f t l i c e n s i n g ,
s u c h a s S o f t w a r e A s s u r a n c e , m a y b e r e q u i r e d w i t h c e n t r a l i z a t i o n o f c l i e n t i m a g e s t o t h e d a t a
c e n t e r . P l e a s e c o n s u l t y o u r M i c r o s o f t L i c e n s i n g S p e c i a l i s t f o r m o r e d e t a i l s .
N O T E : T h e D e s k t o p S t r e a m i n g s o f t w a r e w i t h D e l l a n d C i t r i x ( C i t r i x P r o v is i o n i n g S e r v e r f o r
d e s k t o p s ) i s l i c e n s e d w i t h e a c h O p t i P l e x F X 1 6 0 F L X p u r c h a s e ( p e r s e a t ) .
N O T E : T h e D e s k t o p s o f t w a r e i s s u p p o r t e d w i t h 3 y e a r s o f S u b s c r i p t i o n A d v a n t a g e , w h i c h
p r o v i d e s t h e a v a i l a b i l i t y o f r e l e a s e s a n d u p d a t e s .
N O T E : A n o p t i o n a l e x t e r n a l o p t i c a l d r i v e i s r e q u i r e d t o a c c e s s C D / D V D m e d i a . T h e D e l l O S M e d i a
s h i p o n a D V D r e q u i ri n g a t l e a s t a D V D - R O M ( o r D V D r e a d a b l e d r i v e ) t o a c c e s s a p p l i c a t i o n f i l e s /
r e i n s t a l l O S .

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
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C H I P S E T
P R O C E S S O R
N O T E : P r o c e s s o r n u m b e r s a r e n o t a m e a s u r e o f p e r f o r m a n c e .
N O T E : P r o c e s s o r i s s o l d e r e d d o w n o n t h e m o t h e r b o a r d .
N O T E : I n t e l A t o m d u a l c o r e p r o c e s s o r r e q u i r e i n t e g r a t e d f a n .
SiSM671 Northbridge and SiS968 Southbridge
Non-volatile memory
BIOS Configuration FWH (firmware hub) 8Mbit flash IC located at U24 on motherboard
TPM 1.2 Security Device (Trusted Platform Module) Not supported
NIC EEPROM 1Mbit EEPROM device located at U32 on mother-
board
Micro-Controller for RMCP (Remote Management Control Protocol) RMCP Micro-Controller is located U14 on mother-
board. 1Kbyte flash and 64Byte EEPROM
Intel® Atom™ Dual Core Processor with Intel Enhanced Intel Speed Step Technology and Execute Disable Bit
Intel Atom 330 Processor (1.6GHz, 1MB L2 cache, 533MHz FSB) (Available Q4 2008)
Intel® Atom Single Core Processor with Intel Enhanced Intel Speed Step Technology and Execute Disable Bit
Intel Atom 230 Processor (1.6GHz, 512KB L2 cache, 533MHz FSB)
M E M O R Y
T h e c o m p u t e r s u p p o r t s a m a x i m u m o f 4 G B 1o f m e m o r y w h e n u s e d w i t h t w o 2 G B D I M M s .
N O T E : 5 1 2 M B D D R 2 N o n - E C C S D R A M i s o n l y s u p p o r t e d o n s e l ec t m o d e l s w i t h L i n u x E m b e d d ed
o p e r a t i n g s y s t e m s .
N O T E : W h e n 8 0 0 M H z m e m o r y i s i n s t a l l e d t h e c o m p u t er w i l l c o n t i n u e t o o p e r a t e t h e m e m o r y b u s
Type: DDR2 Synch DRAM Non-ECC Memory2800MHz
DIMM Slots 2 (Single Channel)
DIMM Capacities Up to 2GB
Minimum Memory 512MB on select models
Maximum Memory 4GB1
Configurations: (800MHz)
4GB1DDR2 Non-ECC SDRAM, (2 DIMM) X
2GB DDR2 Non-ECC SDRAM, (1DIMM) X
1GB DDR2 Non-ECC SDRAM, (1 DIMM) X
512MB DDR2 Non-ECC SDRAM, (1 DIMM) X (select models)
1Up to 1GB may not be available with 32-bit operating systems due to system resource requirements.
2Significant system memory may be used to support graphics, depending on system memory size and other factors.

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
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F L A S H S T O R A G E
O p t i P l e x F X 1 6 0 m o d e l s w i t h a n e m b e d d ed o p e r a t i n g s y s t e m r e q u i r e N V R A M f l a s h s t o r a g e
m o d u l e . T h e c o m p u t e r s u p p o r t s a m a x i m u m o f 2 G B o f N V R A M f l a s h s t o r a g e .
N O T E : 5 1 2 M B N V R A M f l a s h s t o r a g e i s o n l y s u p p o r t e d o n m o d e l s w i t h L i n u x E m b e d d e d o p e r a t i n g
s y s t e m s .
D R I V E S A N D R E M O V A B L E S T O R A G E
N O T E : H a r d d r i v e i s o n l y r e q u i r e d o n F L X - H D m o d e l s .
N O T E : A l l c o n f ig u r a t i o n s w i t h h a r d d r i v e s r e q u i r e i n t e g r a t e d f a n .
N O T E : A n o p t i o n a l e x t e r n a l o p t i c a l d r i v e i s r e q u i r e d t o a c c e s s C D / D V D m e d i a . T h e D e l l r e s o u r c e
a n d r e c o v e r y s o f t w a r e s h i p s o n a D V D r e q u i r i n g a t l e a s t a D V D - R O M ( o r D V D r e a d a b l e d r i v e ) t o
a c c e s s a p p l i c a t i o n f i l e s / r e i n s t a l l O S .
NVRAM configurations (Single Layer Cell)
2GB3 NVRAM X
1GB3NVRAM X
512MB3NVRAM X (select models)
3MB means 1 million bytes and GB means 1 billion bytes; total accessible capacity varies depending on operating environment.
Bays:
Hard Drives Supported (Internal 2.5”) 1
Interface:
SATA connector(s): number of 1
2.5” Hard Drive: Size, type, speed RPM,
80GB4, SATA, 7200 RPM X (select models)
Optical Drive: (optional external optical drive)
DVD-ROM (data only) 8x External USB Optional
S Y S T E M B O A R D C O N N E C T O R S
Half Mini-PCIe Slot(s): number of 1
Serial ATA (SATA) for hard drive: number of 1
Serial ATA (SATA) for NVRAM module: number of 1
SiS Mirage 3D Graphics2, 256MB Max Video Memory and
DirectX 9.0 Integrated on system board
VGA maximum resolution 1920x1200
DVI maximum resolution 1600x1200
Multi-display support Extended and clone modes
Shared Video memory 32MB, 64MB, 128MB (default), 256MB
G R A P H I C S / V I D E O C O N T R O L L E R
4GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and operating environment and will be less.
2Significant system memory may be used to support graphics, depending on system memory size and other factors.

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
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E X T E R N A L P O R T S / C O N N E C T O R S
N O T E : S e e c h a s s i s d i a g r a m s s e c t i o n f o r p o r t / c o n n e c t o r l o c a t i o n s
C O M M U N I C A T I O N S - N E T W O R K A D A P T E R ( N I C )
USB 2.0 6 (2 front, 4 rear)
Serial (native) One rear
PS/2 Two rear
Network Connector (RJ-45) One rear
Video:
VGA One rear
DVI-D One rear
Audio:
Microphone line-in One minijack front
Headphone/Speaker line-in One minijack front
AC Power One rear
Broadcom (BCM5764M) Gigabit LAN 10/100/1000 (WOL, PXE) Integrated on system board
Dell Wireless 1397 Half Mini PCIe (802.11bg) Card Optional (factory installed only)
C O M M U N I C A T I O N S - W I R E L E S S
N O T E : D e l l W i r e l e s s 1 3 9 7 i s a v a i l a b l e o n s e l ec t m o d e l s w i t h s u p p o r t i n g o p e r a t i n g s y s t e m s .
ADI 1984A High Definition Audio Codec Integrated on system board
Dell AX210 (USB powered) Speakers Optional
Dell A510/AX510PA Flat Panel Sound Bar Optional
A U D I O A N D S P E A K E R S
K E Y B O A R D A N D M O U S E
Dell USB Entry Keyboard Optional
Dell USB QuietKey Keyboard Optional
Dell USB QuietKey Keyboard with Palmrest Optional
Dell Multimedia Pro Keyboard Optional
Dell Smart Card USB Keyboard Optional
Dell Optical USB Mouse with scroll Optional
Dell Laser Mouse Optional
Dell Logo Mouse Pad Optional

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
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S E C U R I T Y
S E R V I C E A N D S U P P O R T
N O T E : F o r m o r e d e t a i l s o n D e l l S e r v i c e P l a n s p l e a s e t o g o t o w w w . d e l l . co m / s e r v i c e /
s e r v i c e _ p l a n s /
S O F T W A R E
N O T E : S o f t w a r e i s n o t a v a i l a b l e o n a l l m o d e l s . F o r m o r e d e t a i l s o n D e l l S o f t w a r e p l e a s e t o g o
t o w w w . d e l l . c om / o p t i p l ex
M O U N T I N G B R A C K E T S / S T A N D S
Dell OptiPlex Z Stand Standard
Dell Monitor Mount OptiPlex FX160* (Available Post Launch)
Dell Wall/Under-desk Mount OptiPlex FX160 Optional
Chassis lock slot Standard
Cable Security Kit (lock required and sold separately) Optional
3-Year Next Business Day On-site Service after Remote Diagnosis5and
Limited Hardware Warranty6(3-3-3)
Select Windows XP Embedded or Linux Embedded
models
3-Year Dell ProSupport for IT Select FLX and FLX-HD models
Additional Dell ProSupport Services Optional
5Remote Diagnosis is determination by online/phone technician of cause of issue; may involve customer access to inside of system and multiple or
extended sessions. If issue is covered by Limited Hardware Warranty and not resolved remotely, technician and/or part will be dispatched, usually
within 1 business day following completion of Remote Diagnosis. Availability varies. Other conditions apply.
6For copy of Ltd Hardware Warranty, write Dell USA LP, Attn: Warranties, One Dell Way, Round Rock, TX 78682 or see www.dell.com/warranty.
Dell Client Manager Available via www.dell.com (select models)
Norton™ Internet Security 90 Day Trial or optional subscription (select models)
McAfee® Security Center 90 Day Trial or optional subscription (select models)
*Designed for select Dell monitors only

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
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DETAILED ENGINEERING SPECIFICATIONS
S Y S T E M D I M E N S I O N S ( P H Y S I C A L )
N O T E : S y s t e m W e i g h t * a n d S h i p p i n g W e i g h t * i s b a s e d o n a t y p i c a l c o n f i g u r a t i o n a n d m a y v a r y
b a s e d o n t h e c o m p u t er c o n f i g u r a t i o n a n d i f t h e s t a n d i s i n c l u d ed . A t y p i c a l c o n f i g u r a t i o n
i n c l u d e s: i n t e g r a t e d g r a p h i c s a n d N V R A M m o d u l e .
Chassis Volume liters 2.4lL without stand and side cover
3.3L with stand and side cover
Chassis Weight* pounds/kilograms 4.0-4.6 / 1.81-2.09
Chassis Dimensions: (HxWxD)
Height inches/centimeters 9.02 / 22.9 without stand 10.6 / 26.9 with stand
Width inches/centimeters 2.13 / 5.4 with side cover 1.85 / 4.7 without side cover
Depth inches/centimeters 8.86 / 22.5 without antenna 9.92 / 25.2 with antenna
Shipping Weight* pounds/kilograms includes packaging materials 11 / 5
Packaging Parameters (HxWxD)
Height inches/centimeters 20.00 / 50.8
Width inches/centimeters 13.75 / 34.9
Depth inches/centimeters 9.13 / 23.2
S Y S T E M L E V E L E N V I R O N M E N T A L A N D O P E R A T I N G C O N DI T I O N S
Temperature
Operating 10° to 35°C (50° to 95°F)
Non-Operating -40° to 65°C (–40° to 149°F)
Relative Humidity
Operating (Noncondensing) 20 to 80 %*
(*Max Wet bulb temperature= 29 °C)
Non-Operating (Noncondensing) 5 to 95 %+
(+Max Wet bulb temperature= 38 °C)
Maximum vibration
Operating 5 to 350 Hz at 0.0002 G2/Hz
Non-Operating 5 to 500 Hz at 0.001 to 0.01 G2/Hz
Maximum Shock
Operating 40 G +/- 5% with pulse duration of 2 msec +/- 10%
(equivalent to 51 cm/sec[20 in/sec])
Non-Operating 105 G +/- 5% with pulse duration of 2 msec +/- 10%
(equivalent to 127 cm/sec[50 in/sec])
Maximum Altitude
Operating –15.2 to 3048 m (–50 to 10,000 ft)
Non-Operating –15.2 to 10,668 m (–50 to 35,000 ft)

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I N T E G R A T E D P O W E R S U P P L Y
Power Supply Wattage 50W
AC input Voltage Range 90-264V (APFC)
AC input current 0.8-0.4A(APFC)
AC input Frequency 47~63Hz
AC holdup time >16ms
Minimum Efficiency (Active PFC, Energy Star® Compliant)
85% (20% of max load)
87% (50% of max load)
85% (100% of max load)
DC parameters
+12.0v output 4.2A
Max total power 50W
BTUs/h (based on PSU max wattage) 41 BTUs/h
3.3v CMOS battery (type and estimated battery life) CR2032, 7 years
RTC accuracy (time of day) 4 second/24 hours
Power Supply Fan (size and type) NA
Compliance: (add all that apply)
Energy Star compliant Energy Star 4.0 compliant for select models
Blue Angel Compliant NA
1W requirement Yes
UL/cUL, CE, CCC, Nemko, TUV, BSMI Yes
A U D I O
INTEGRATED ADI 1984A HIGH DEFINITION AUDIO CODEC
High Definition Stereo support Yes
Number of channels 2
Number of Bits / Audio resolution 16,20 and 24
Sampling rate (recording/playback) Up to 192KHz
Signal to Noise Ratio 96dB
Wavetable voices
Analog Audio Yes
Dolby Digital NA
THX NA
Digital out (S/PDIF) NA

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C O M M U N I C A T I O N S - I N T E G R A T E D L A N
Integrated Broadcom 5764M Gigabit LAN
Connector Type RJ-45
Data Rates supported 10/100/1000Mb/s
Controller Details
Controller bus architecture (example PCIe 1.0a x1) PCIe V1.1 x 1
Integrated memory Yes (RX -48K Bytes, TX –8K Bytes)
Data transfer mode (example Bus-Master DMA) DMA
IEEE standards compliance (example 802.1P) IEEE 802.3, IEEE 802.3u, IEEE 802.3ab,
IEEE 802.3p
Hardware Certifications (example FCC, B, GS mark…) IEEE compliant
Boot ROM Support Yes
Network Transfer Mode (example Full Duplex, Half Duplex)
Network Transfer Rate (example 10BASE-T (half-duplex) 10 Mbps)
10BASE-T (half-duplex) 10 Mbps*
10BASE-T (full-duplex) 20 Mbps*
100BASE-TX (half-duplex) 100 Mbps*
100BASE-TX (full-duplex) 200 Mbps*
1000BASE-T (full-duplex) 2000 Mbps*
* This is maximum Network Transfer Rate. Actual Aver-
age Network Transfer Rate may vary per Ethernet net-
work and the system configurations.
Manageability (examples WOL, PXE..) WoL, PXE
Management Capabilities Alerting (examples ASF 2.0 AMT…) ASF2.0 support for Power ON/OFF, Reset
A U D I O ( C O N T . )
INTEGRATED ADI 1984A HIGH DEFINITION AUDIO CODEC
Audio Jack Impedance
Microphone (input impedance) 23K ohms typical
Line-In NA
Line-Out NA
Headphone (external load impedance) 32 ohms min
Internal Speaker Power Rating NA

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
14
C O M M U N I C A T I O N S - W I R E L E S S L A N
N O T E : T h e c u r r e n t d r a w v a l u e s w e r e m e a s u r e d o v e r a 1 - s e c o n d i n t e r v a l . T h e m a x i m u m t r a n s m i t
a n d r e c e i v e v a l u e s w e r e m e a s u r e d w h i l e t r a n s f e r r i n g a c o n t i n u o u s U D P d a t a s t r e a m a t t h e
h i g h e s t r a t e s e t t i n g o f 2 7 0 M b p s .
Form Factor PCI Express Half Mini Card ECN, March 16, 2006
Temperature and Humidity Limitations
Operating Temperature 0–75°C
Operating humidity 95% maximum (no condensation allowed)
Storage temperature –40 to +80°C
Storage humidity 95% maximum (no condensation allowed)
Power Characteristics*
Current draw, Power Save mode 80mW
Current draw, Receive mode 500mW
Current draw, Transmit mode 800mW
Power supply 3.3V
Networking Characteristics
Compatibility IEEE 802.11g standard for wireless LAN (OFDM)
IEEE 802.11b standard for wireless LAN (DSSS)
Network Operating System Microsoft Windows Networking
Host Operating System
Microsoft Vista
Microsoft Windows XP
Microsoft Windows XP Embedded
NDIS6 miniport driver
Medium access protocol CSMA/CA (collision avoidance) with acknowledgment
(ACK)
Data rate (Mbps)
IEEE 802.11b: 1,2,5.5,11
IEEE 802.11g: 1,2,5.5,6,9,11,12,18,24,36,48,54
NOTE: The Dell wireless WLAN card uses an
automatic transmit rate select mechanism
Radio Characteristics
Frequency band IEEE 802.11b: 2.4 GHz (2400-2500 MHz)
IEEE 802.11g: 2.4 GHz (2400-2500 MHz)
Modulation technique
IEEE 802.11b: direct sequence spread spectrum
(DSSS)
CCK for high and medium transmit rate
DQPSK for standard transmit rate
DBPSK for low transmit rate
IEEE 802.11g: orthogonal frequency division
multiplexing (OFDM)
52 subcarriers with BPSK, QPSK, 16-QAM or 64-QAM
Forward error correction convolution coding rate: 1/2,
2/3, 3/4
Spreading IEEE 802.11b: 11-chip Barker sequence
Bit error rate (BER) Better than 10–5
Nominal output power IEEE 802.11b: 19 dBm
IEEE 802.11g: 15 dBm
DELL WIRELESS 1397 HALF MINI-CARD

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
15
G R A P H I C S / V I D E O C O N T R O L L E R
N O TE: V G A m a xi m u m r e qu i re d a n d t e st e d r e so l ut io n i s 1 92 0 x1 2 00 .
N O TE : M a xi m u m r e s ol u ti o n m a y v a ry b a se d o n o pe r at i ng sy s te m a nd m on i to r s u p po r t.
2Significant system memory may be used to support graphics, depending on system memory size and other factors.
H A R D D R I V E S
INTEGRATED SIS MIRAGE 3 GRAPHICS2
Bus Type (example integrated or PCIe x16) Integrated
GPU core clock 350 MHz Integrated 24 bit RAMDAC
Frame Buffer Memory (onboard and shared) Size and Speed Up to 256MB of shared system memory2
Maximum power consumption 4.5 W
Overlay Planes Yes
Maximum Color Depth 32 bit
Maximum Vertical Refresh Rate 75 Hz
Multiple Display Support Yes
Operating Systems Graphics/ Video API Support OpenGL 1.5/DirectX 9.02
Supported Resolutions and Max Refresh Rates (Hz)
(Note: Analog and/or digital)
VGA supports up to 2048x1536@75Hz
DVI supports up to 1600x1200@60Hz
External connectors VGA & DVI
2.5” 80GB4SATA 7200 RPM HDD
Capacity (bytes) 80,026,361,856
Dimensions inches (W x D x H) 5.87 x 4 x 1
Interface type and Maximum speed Up to 3Gb/s
Internal buffer size (range) 8 MB
Average Seek Time 8.5 ms
Rotational Speed 7200 rpm
Logical Blocks 156,301,488
Power Source
DC Power (Max) Idle 7.0W, Active 10.0W
DC Current 5V (.8A) and 12V (1.8A)
Environmental Operating Conditions (Non-Condensing):
Temperature Range 41°F to 140°F (50C to 600C)
Relative Humidity Range 20% to 80% non-condensing
Maximum Wet Bulb Temperature 84°F (290C)
Altitude Range -50 ft to 10000 ft
Environmental Non-Operating Conditions (Non-Condensing):
Temperature Range -40°F to 149°F (-400C to 650C)
Relative Humidity Range 10% to 90% non-condensing
Maximum Wet Bulb Temperature 100.4°F (380C)
Altitude Range -50 ft to 35000 ft
4For hard drives, GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and operating environment
and will be less.

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
16
O P T I C A L D R I V E S
EXTERNAL USB DVD-ROM
External Dimensions W x H x D 142mm x 24mm x 160mm
Weight (max) pounds/kilograms 0.43kg
Interface type USB 2.0
Disc Capacity 8cm and 12cm
Internal buffer size 198KB
Access Times (typical) 130ms (CD-ROM)/140ms (DVD-ROM)
Maximum Data Transfer Rates
Writes
Reads 24x
Environmental Operating Conditions (Non-Condensing):
Operating Temperature Range 5° to 50°C
Relative Humidity Range 10 to 90% (non-condensing)
Maximum Wet Bulb Temperature 29.4°C
Environmental Non-Operating Conditions (Non-Condensing):
Temperature Range -40° to 65°C
Relative Humidity Range 15 to 95% RH
Maximum Wet Bulb Temperature 29°C
Altitude Range -200~10600m
B I O S D E F A U L T S
BIOS address F0000h USB Controller On A/C recovery Off
BIOS chip
(NVRAM) 8Mb Selective USB Off Auto Power on Off
Setup Option Default Factory Value USB rear dual /next
to RJ45 On Auto Power time 12:00am
Drives SATA 0 On Rear Dual USB On Low power mode Off
Drives SATA 1 On Front Dual USB On Remote Wake Up Off
SATA Operation AHCI Multiple CPU Core On Suspend mode S3
Smart Reporting Off Hyper-threading On ASF Power
Management Disable
Integrated NIC On (without PXE) Limit CPUID Value Off Image Server Disable
Wireless LAN On HD Acoustic mode Bypass Fast Boot On
Integrated Audio On SATA 1 User
Password Disabled Numlock Key On
Video Memory Size 128 MB Password Changes Unlocked POST hot keys Setup & Boot Menu
Serial #1 Port Auto Execute Disable On Keyboard Errors Report

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
17
OPTIMAL SYSTEM
PLACEMENT
The orientation and location of your computer
installation can have affect on your system
performance.
S Y S T E M O R I E N T A T I O N
For optimal thermal and acoustic performance,
install the computer in the vertical orientation,
using the included stand, or the optional
mounting brackets (as shown below).
S Y S T E M S P A C I N G
The OptiPlex FX160 is designed to have high performance while operating with low
acoustics noise. This is made possible, in part, by the large amount of ventilation on
the system. To ensure that the system functions optimally, the ventilation should not
be blocked.
S T A N D
When using the system with the provided stand, please ensure that the system is
unobstructed on the vented surfaces. Dell recommends the following:
Top
Ensure there is at least 2 inches (50.8 mm) of clearance
above the system. This gap will allow higher temperature
air to exit the system easily.
Bottom (surface that stand attaches to)
Room temperature air enters the bottom of the system
through the stand, on the left side of the system (as
indicated by the arrow). Ensure this area is not
obstructed.
Right side (as shown in the drawing to the right)
Ensure that there is at least 1 inch (25.4 mm) clearance
for optimal system cooling.

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
18
OPTIMAL SYSTEM PLACE MENT (CONT.)
W A L L M O U N T
If the system is installed using the optional wall mount, ensure that none of the vents are
blocked on the system. The OptiPlex 160 has ventilation on four of the 6 surfaces. Space
the system so that there is adequate room for proper airflow, as defined by:
Top
Ensure there is at least 2 inches (50.8mm) between the top of the system and
the top of the ceiling, desk, or enclosure. This gap will allow heated air to exit the
system easily.
Bottom (surface that stand attaches to)
Ensure that there is at least 1 inch (25.4 mm) of clearance below the system.
This will allow room temperature air to enter the system for component cooling.
Right side (side opposite of mounting)
Ensure that there is at least 1 inch (25.4 mm) clearance for optimal system
cooling.
Left Side (surface that wall mount attaches to)
This gap is defined by the wall mount bracket.

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
19
OPTIMAL SYSTEM PLACE MENT (CONT.)
I N S T A L L I N G Y O U R C O M P U T E R I N A N E N C L O S U R E
Installing your computer in an enclosure can restrict the airflow and
impact your computer’s performance, possibly causing it to overheat.
Follow the guidelines below when installing your computer in an
enclosure.
CAUTION: Before installing your computer in an enclosure, read
the safety instructions that shipped with your computer.
NOTICE: The operating temperature specifications of the system reflect
the maximum ambient operating temperature. The room’s ambient
temperature needs to be a consideration when installing your system in
an enclosure. For example, if the ambient room temperature is at 25° C
(77° F), depending on your system’s specifications, you may only have
10° C (18° F) before you reach your system’s maximum operating
temperature.
Space the computer within the enclosure according to the system spacing previously defined in this document.
The enclosure should be designed so that the ambient air entering the system meets the operating temperature
requirements of the system. If the enclosure design is not adequate, the air inside the enclosure can get much hotter
than the room temperature if there is not adequate inlet and exhaust venting.
The enclosure design should be designed to minimize the temperature increase of the air entering the system by:
Implementing enclosure venting that allows at least 30% airflow (front and back)
Implementing enclosure ventilation that aligns well with the system ventilation to allow direct airflow into the system.
This is especially important at the exhaust of the system.
Ensuring that there is ventilation at the highest point of the enclosure (such as a gap between the door and top of the
enclosure) to allow hot air to escape.
NOTICE: Do not install your computer in an enclosure that does not allow airflow. Restricting the airflow impacts your
computer’s performance, possibly causing it to overheat.
REGULATORY COMPLIANC E AND ENVIRONMENTAL
Product related conformity assessment and regulatory authorizations including Product Safety, Electromagnetic Compatibility (EMC),
Ergonomics, and Communication Devices relevant to this product may be viewed at www.dell.com/regulatory_compliance. The
Regulatory Datasheet for this product is located at: http://www.dell.com/content/topics/global.aspx/about_dell/values/
regulatory_compliance/reg_compliance?~ck=ln&c=us&l=en&lnki=0&s=corp
Details of Dell's environmental stewardship program to conserve product energy consumption, reduce or eliminate materials for
disposal, prolong product life span and provide effective and convenient equipment recovery solutions may be viewed at
www.dell.com/environment. Product related conformity assessment, regulatory authorizations, and information encompassing
Environmental, Energy Consumption, Noise Emissions, Product Materials Information, Packaging, Batteries, and Recycling relevant
to this product may be viewed by clicking the Design for Environment link on the webpage.

DELL™ OPTIPLEX™ FX160 TECHNICAL GUIDEBOOK
20
ACOUSTIC NOISE EMISSION INFORMATION
O P T I P L E X F X 1 6 0
Component Typical Configuration High-end Configuration
CPU Intel Atom 230 Processor (1.6GHz, 512 L2
cache, 533MHz FSB)
Intel Atom 230 Processor (1.6GHz, 512 L2
cache, 533MHz FSB)
Memory2 1 GB DDRII 667MHz 4 GB4 DDRII 800MHz
HDD (#, capacity) NA 80 GB4 7200 RPM SATA
NVRAM (#,capacity) 1GB 2GB
WLAN NA 1510 Half Mini-card
Graphics Adapter Integrated Adapter Integrated Adapter
The Declared Noise Emission in accordance with ISO 9296 for the Dell OptiPlex 160 is as follows1,2:
(all values LWAd expressed in bels; 1 bel=10 decibels, re 10-12 Watts)
Operating Mode
Typical Configuration
Declared Sound Power (LWAd)
High-end Configuration
Declared Sound Power (LWAd)
Idle 1.842.7
HDD Operating NA 2.7
90% CPU 1.842.7
The Declared A-weighted Sound Pressure Level in decibels (re 2x10-5 Pa), at Operator, Bystander, and Desk Side Positions are
measured in accordance with ISO 7779 7.6.1, 7.6.2, and C.15.2 and declared in accordance with ISO 9296 for this product is as
follows1,3:
Operating Mode
Typical Configuration
Declared Sound Pressure (LpA)
High-end Configuration
Declared Sound Pressure (LpA)
Operator Position (LpA)Bystander Position (LpA)Operator Position (LpA)Bystander Position (LpA)
Idle 12” 11* 16 13
HDD Operating NA NA 16 13
90% CPU 12* 12* 16 14
1All tests are conducted according to ISO 7779 and declared according to ISO 9296 except 90% CPU. For this mode, the system
CPU was stressed at 90% utilization with no other peripheral device actively seeking. This test mode is not specified in ISO
7779, but was measured using the same microphone distances and measurement techniques defined for the other reported
operating modes.
2Declared Sound Power rounded to nearest tenth of a bel per ISO 9296 section 4.4.2
3Declared Sound Pressure rounded to nearest dB per ISO 9296 section 4.4.3.