Dell AW2521HF Manual

1 DELL AW2521HF/ AW2521HFL/ AW2521HFA/ AW2521HFLA
1. Disassembly Procedures
Note: The disassembly procedure for AW2521HF/ AW2521HFL/ AW2521HFA/ AW2521HFLA is the
same. The differe ce is o ly the appeara ce color. The actual color of AW2521HF/ AW2521HFA
is black, but AW2518HFL/ AW2521HFLA is Lu ar Light.
S1
Tur off the mo itor.
S2
Place the mo itor o a soft cloth or
cushio .
Carefully slide a d remove the I/O cover
from the mo itor
S3 Disco ect the cables from the mo itor
a d slide them out through the
cable-ma ageme t slot o the sta d
riser.
S4
Press a d hold the sta d release
butto .
S5
Lift the sta d up a d away from the
mo itor
S6
U lock 4 screws o Rear Cover
Use ha ds or scraper bar to
disassemble Rear Cover from mo itor
Notice the disassembly order:
Top Side=>Right/ Left Side=>Bottom Side
(Screw Torque: 8~10kgf)
S
Remove USB FFC Cable a d Audio
FFC cable from the I/F BD

2
D
ELL
AW2521HF
/ AW2521HFL
/ AW2521HFA/ AW2521HFLA
S8
Remove CTRL FFC Cable from I/F BD
Tear off a adhesive tape a d remove
the LED Driver BD wire from I/F BD
S9
Tear off all adhesive tapes from Rear
Cover
S10
U lock 2 USB screws to disassemble
USB BD from Rear Cover
(Screw Torque: 4.5±0.5Kg kgf)
S11
Disassemble “USB FFC cable” a d
“Audio FFC cable” from USB BD
S12
U plug wires from LED Driver BD
U lock 1 screw to disassemble LED
Driver BD from Rear Cover
Tear off “MYLAR HEAD LOGO from
LED Logo Le s
U plug wire from LED BD a d
disassemble LED BD from Rear Cover
(Screw Torque: 3.0-3.5kgf)

3 DELL AW2521HF/ AW2521HFL/ AW2521HFA/ AW2521HFLA
S13
Remove FFC cables from Rear Cover,
CTRL BD a d CTRL+KEY BD
U lock 6 screws to disassemble CTRL
BD a d CTRL+KEY BD from Rear
Cover
(Screw Torque: 2.0±0.5kgf)
S14
Tear off mylar a d all tapes from
Backlight Wire o Mai SHD
U plug Backlight Wire from SPS BD
S15
U plug “Power LENS FFC cable” from
I/F BD a d tear off “Power LENS FFC
cable” from the pa el
U plug EDP FFC Cable betwee pa el
a d I/F BD
S16
U lock 15 screws to disassemble
Middle Frame from Pa el
(Screw Torque: 4.0±0.5kgf)
S1
Take off Mai SHD from Pa el a d
disassemble Middle Frame from Pa el

4
D
ELL
AW2521HF
/ AW2521HFL
/ AW2521HFA/ AW2521HFLA
S18
Tear off a tape o backlight wire a d
u plug backlight wire from pa el
S19
U lock 2 screws to disassemble Power
Butto module from middle frame
(Screw Torque: 2.0±0.5kgf)
S20
U plug Power LENS FFC cable from
“LENS BD” (Power LENS BD)
S21
Disassemble “MYLAR CTRL-BD” from
“LENS BD” (Power LENS BD)
S22
U lock 2 screws to disassemble “LENS
BD” (Power CTRL BD) from Power
Butto
(Screw Torque: 2.0±0.5kgf)
S23
U lock 1 screw o Docki g BD
(Screw Torque: 8.5±1.0 kgf)
S24
Disassemble “I/F BD to Docki g BD
wire” from Docki g BD
S25
Take off “MYLAR PWR-BD” from Mai
SHD
S26
Tear off the adhesive tape o “FFC
EDP” a d u plug “FFC EDP “ from I/F
BD, the , U lock 8 PCBA screws
(Screw Torque: 8.5±1.0kgf)
S2
Disassemble I/F BD from Mai SHD

5 DELL AW2521HF/ AW2521HFL/ AW2521HFA/ AW2521HFLA
S28
Disassemble wires from I/F BD
S29
Disassemble SPS BD from Mai SHD
a d disassemble “AC Socket Wire” from
SPS BD
S30
U lock 1 grou d screw a d
disassemble AC power socket from
Mai SHD
(Screw Torque: 8.5±1.0 kgf)

6
D
ELL
AW2521HF
/ AW2521HFL
/ AW2521HFA/ AW2521HFLA
S31
Remove electrolyte capacitors (red mark) from pri ted circuit boards
S31-1 Cut the glue betwee bulk cap. a d PCB with a k ife
S31-2 E sure cutti g path withi the glue, do ’t touch bulk cap. or PCB

7 DELL AW2521HF/ AW2521HFL/ AW2521HFA/ AW2521HFLA
S31-3 Take out bulk cap. pi solder with solderi g iro a d absorber
S31-4 Lift the bulk cap. up a d away from the PCB

8
D
ELL
AW2521HF
/ AW2521HFL
/ AW2521HFA/ AW2521HFLA
2. Product material information
The following substances, preparations, or components should be disposed of or
recovered separately from other WEEE in compliance with Article 4 of EU Council
Directive 75/442/EEC.
Capacitors / condensers (containing
PCB/PCT)
No used
Mercury containing components
No used
Batteries No used
Printed circuit boards (with a surface greater
than 10 square cm)
Product has printed circuit boards
(with a surface greater than 10 square
cm)
Component contain toner, ink and liquids No used
Plastic containing BFR
No used
Component and waste contain asbestos
No used
CRT No used
Component contain CFC, HCFC, HFC and
HC
No used
Gas discharge lamps
No used
LCD display > 100 cm2 Product has an LCD greater than 100
cm2
External electric cable Product has external cables
Component contain refractory ceramic fibers
No used
Component contain radio
-
active substances
No used
Electrolyte capacitors (height
> 25mm, diameter > 25mm)
Product has electrolyte capacitors
(height >25mm, diameter > 25mm)
3. Tools Required
List the type and size of the tools that would typically can be used to disassemble the
product to a point where components and materials requiring selective treatment can be
removed.
Tool Description:
- Screwdriver
- Scraper Bar
- Penknife
- Soldering iron and absorber