Dell SE2219H User manual

DELL SE2219H, SE2419H
1
1. Disassemble Procedures
S1
Turn off power
Unplug cables from monitor.
S4
Press upper edge of the back cover (start with top
of monitor) with both thumbs, the rest 4 fingers
pull back cover upwards. Repeat the action 2-8
position to remove back cover.
S2
Remove stand from monitor release button
(with Philip-head screwdriver)
S5
Remove 2 aluminium foil (#1 as yellow) and 2
acetate tape (#2 & #3 as green).
Remove Keypad cable & Backlight cable (#4 & #5
as blue).
Use Hexgonal screwdriver to remove 2 VGA
screws 4-40 x 11.8 (#6 & #7). Torque: 4.5 +/-
0.5Kgf.cm
Use Philips-head screwdriver (Φ5 mm) to remove
2 metal frame screws M3*5 (#8 & #9). Torque: 4.5
+/- 0.5Kgf.cm
S3
Use Philips-head screwdriver (Φ5 mm) to
remove 2 screws for unlocking.
M4 x 4.5, Torque = 12 +/- 1Kgf.cm
S6
Remove 1 aluminium foil & unplug LVDS cable.

DELL SE2219H, SE2419H
2
S7
Flip chassis, remove mylar.
Use Philips-head screwdriver (Φ5 mm) to
remove PCBAs screws.
M3 x 5 & M3 x 6 for ground screw.
Torque = 6.0 kgf +/-0.5 kgf
S10
Use Philips-head screwdriver (Φ3 mm) to remove
3 screws from mid frame (to disassemble front
trim).
T2 x3. Torque: 1.0 +/- 0.1Kgf.cm
S8
Remove cables from IF & power board.
S11
Remove electrolyte capacitor >25mm height (red
mark) from printed circuit boards.
Cut the glue between bulk cap and PCBA with
knife –ensure cutting path within the glue, don’t
touch bulk cap and PCBA.
S9
Use Philips-head screwdriver (Φ3 mm) to
remove 11 screws from mid-frame
M3 x 4. Torque: 3.5 +/- 0.5Kgf.cm
S12
Take out the capacitor pin solder with soldering
iron.
Lift the bulk capacitor away from power board.

DELL SE2219H, SE2419H
3
2. Product Material Information
The following substances, preparation, or components should be disposed of or recovered separately
from other WEEE in compliance with Article 4 of EU Council Directive 75/422/EEC.
Capacitors / Condensers (containing PCB/PCT)
Not used
Mercury containing components
Not used
Batteries
Not used
Printed circuit boards (with surface greater than 10
square cm)
Product has printed circuit boards (with surface
greater than 10 square cm)
Component contain toner, ink and liquids
Not used
Plastic containing BFR
Component and waste contain asbestos
Not used
CRT
Not used
Component contain CFC, HCFC, HGC and HC
Not used
Gas discharge lamps
Not use
LCD display > 100 cm2
Product LCD greater than 100cm2
External electric cable
Product has external cables
Component contain refractory ceramic fibers
Not used
Component contains radio-active substances
Not used
Electrolyte capacitors (height > 25mm,
diameter >25mm)
Product has electrolyte capacitors (height > 25mm)
3. Tools Required
List the type and size of the tools that would typically can be used to disassemble the product to a point
where components and materials requiring selective treatment can be removed.
Tool Description:-
-Screwdriver (Philip head with Φ5 mm & Φ3 mm)
-Screwdriver (Hexgonal to remove VGA connectivity)
-Soldering iron
-Knife