Dell EU2SPE Installation instructions

WEEE Disassembly Instructions
EU2SPE
EU2SPE WEEE Disassembly Instructions
302-004-114
REV 01
July 2017
This document provides clear guidance for end-of-life recyclers on how to identify and
disassemble reportable materials in compliance with the Waste Electrical and Electronic
Equipment (WEEE) directive. The document does not replace disposal instructions in
contracts, or those included in Product and Residuals Disposal Guidelines. It contains
the following sections:
lDocument purpose..................................................................................................2
lRelated documentation...........................................................................................2
lAcronyms................................................................................................................2
lProduct identification............................................................................................. 3
lProduct material information.................................................................................. 4
lLocating materials.................................................................................................. 5
lPrinted circuit boards (PCBs).................................................................................6
lDisassembling the product......................................................................................6

Document purpose
This document provides information on the location and removal of reportable
materials as required by the European Union (EU) Waste Electrical and Electronic
Equipment (WEEE) Directive 2002/96/EC 2012/19/EC.
Related documentation
Separate WEEE disassembly instructions are provided per product platform.
Additional information can be found in the support documentation for each specific
product platform.
Acronyms
The following are the acronyms that may be used in this document.
Table 1 Acronym List
Acrony
m
Meaning
ABS Acrylonitrile butadiene styrene
Ag Silver
Au Gold
BBU Battery Backup Unit
Cd Cadmium
CFC Chlorofluorocarbons
CPU Central Processing Unit
Cr Vl Hexavalent Chromium
Cu Copper
DAE Disk Array enclosure
DIMMs Dual in-line Memory Modules
DPE Disk Processor Enclosure
DRL Device Regulatory Label
EMI Electromagnetic Interference
ESD Electrostatic discharge
EU European Union
GWP Global Warming Potential
HC Hydrocarbons
HCFC Hydrochlorofluorocarbons
Hg Mercury
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Table 1 Acronym List (continued)
Acrony
m
Meaning
LCC Link Control Card
LDPE Low-Density Polyethylene
Pb Lead
PBB Polybrominated Biphenyls
PBDE Polybrominated Diphenyl Ethers
PC Polycarbonate
PCB Printed Circuit Board
PCT Polychlorinated Terphenyl
Pd Palladium
PETE or
PET
Polyethylene Terephthalate
PP Polypropylene
PS Polystyrene
Pt Platinum
PVC Polyvinyl Chloride
RoHS Restriction of Hazardous Substances
SAS Serial Attached SCSI
SP Storage Processor
SPE Storage Processor Enclosure
SSD Solid State Disk
V Volt
WEEE Waste Electrical and Electronic Equipment
Product identification
Note:The Product Regulatory Model Name is used as the main identifier throughout
this document. Locate the product regulatory model name on the Device Rating Label
(DRL) affixed to a rectangular recess on the top of the product chassis.
Table 2 Product Regulatory Model Name and Specifications
Product
Regulatory Model
Name
EU2SPE
Product
Description
2U, Disk Processor Enclosure (DPE) that supports 12, 3.5" disk drives; 1,
2.5" disk drive; and Input/Output modules.
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Product identification 3

Table 2 Product Regulatory Model Name and Specifications (continued)
Mass 24.9 kg (55 pounds)
Dimensions Height: 8.64 cm (3.40 inches)
Width: 44.45 cm (17.50 inches)
Depth: 77.5 cm (30.5 inches)
Product material information
The following substances, preparations, or components should be disposed of or
recovered separately from other WEEE in compliance with Article 4 of EU Council
Directive 75/442/EEC.
Batteries Mercury Does not use internal batteries based on Mercury (Hg) and its
compounds
Cadmium Does not use internal batteries based on Cadmium (Cd) and its
compounds
Lead Does not use internal batteries based on Lead (Pb) and its
compounds
Other This product may use a Lithium Primary Coin Cells. Depending on
the feature set, some may also include Lithium Ion secondaries.
Previous platforms may have included Nickel Metal Hydride
batteries
Mercury Lamps,
Bulbs, and
other
Lighting
Application
s
Product does not contain a Mercury based lamp or bulb.
Other
Uses
Other parts used in products can not contain intentionally added
Mercury
Liquid Crystal Displays
(LCD) - > 100 cm2
Product does not contain an LCD greater than 100 cm2
Cathode Ray Tubes
(CRT)
Product does not contain a CRT
Plastic containing
Brominated flame
retardants other than in
PCB / PCA
This product may contain plastic parts greater than 25 grams. Many
of these parts are bromine free. Regardless, these parts are labeled
(usually molded directly into the plastic) per ISO 11469:2000(E). A
typical label would look like: > Polymer Abbreviation - FR(#) <
i.e. > PC + ABS FR(40) < Flame retardant codes (FR(#)) are given
in ISO 1043-4. Codes for some Brominated flame retardants: 14
aliphatic/alicyclic Brominated compounds 15 aliphatic/alicyclic
Brominated compounds in combination with antimony compounds 16
aromatic Brominated compounds (excluding Brominated diphenyl
ether and biphenyls) 17 aromatic Brominated compounds (excluding
Brominated diphenyl ether and biphenyls) in combination with
antimony compounds 22 aliphatic/alicyclic chlorinated and
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Brominated compounds 42 Brominated organic phosphorus
compounds
Capacitors with PCB’s Does not use capacitors with PCB
Electrolyte capacitors
(height > 25mm,
diameter > 25mm)
Electrolytic capacitors (height and/or diameter greater than 25mm)
are not used on Dell motherboards. However, these capacitors are
often present in power supply units (silver box)
Asbestos and its
compounds
Parts used in products cannot contain asbestos or its compounds
Refractory ceramic
fibers
Parts used in products cannot contain refractory ceramic fibers
Radioactive substances Parts used in products cannot contain radioactive substances
Beryllium and its
compounds (including
Beryllium Oxide)
Beryllium may be present in electronic components as a copper
beryllium alloy, which contains less than 2% beryllium. CuBe alloys
may be used in various components such as connectors, switches,
relays, current carrying springs, integrated circuit sockets, and RF
shielding
Gasses - which fall
under Regulation (EC)
2037/2000 and all
hydrocarbons (HC)
Parts used in products do not contain gasses which fall under
Regulation (EC 2037/2000) and all hydrocarbons (HC).
Components with
pressurized gas which
need special attention
(Pressure > 1,5bar)
Product does not contain parts with pressurized gas
Liquids Product does not contain liquid
Locating materials
The following lists the main components of the product.
1. Power Supply
2. I/O assembly
3. 3.5" disk drive
4. 2.5" disk drive
5. Storage processor
6. Fan
7. Air duct
8. DIMM
9. AC power cord
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Locating materials 5

Printed circuit boards (PCBs)
The following PCBs may be located within the product. Some variation may exist
depending on configuration.
lDIMMs (number varies by configuration)
lI/O pcb
lSSD pcb
lPDB pcb
lDIB pcb
lSP pcb
Disassembling the product
This section describes how to disassemble the product for disposal and recycling.
Required tools
The following tools are required to disassemble the product.
Tool Description
Phillips
screwdriver
#1
Phillips
screwdriver
#2
Flat-head
screwdriver
Small
Needle-nose
pliers
Use to remove precise hardware from PCBs.
Wire Cutters Use to remove capacitors, or cut wires
Safety precautions
Comply with the following precautions:
lWear protective glasses during disassembly;
lFollow the recommended disassembly method and sequence;
lAlways use the tool specified in the removal procedures;
lFollow standard industry best practices, including all applicable health and safety
regulations.
Disassembly sequence
Disassemble the product according to the following disassembly sequence.
1. Remove Power supplies (2)
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2. Remove I/O assemblies (varies according to configuration)
3. Remove 3.5" disk drives (12)
4. Remove 2.5" disk drive
5. Remove Storage processor
6. Remove Fans (6)
7. Remove DIMMs (varies according to configuration)
8. Disassemble SP:
a. Remove SLIC cage
b. Remove Fan cage
c. Remove SSD pcb
d. Remove PDB pcb
e. Remove DIB pcb
f. Remove SP pcb
Disassembly instructions
This section contains the disassembly instructions for the product.
Remove a Power Supply
Before you begin
Note
lYou can replace one power supply while the system is running. As long as one
power supply is functional, you do not have to power down the system.
lHave the replacement power supply unit on hand before removing an existing
power supply. With a running system, swap the old and new power supply within
five minutes to ensure proper air flow and to avoid overheating the system.
lOnly trained and qualified personnel should install or replace this equipment.
lAlways replace a failed power supply as soon as possible.
CAUTION
Whenever servicing parts in a running system, move slowly while removing,
inserting, or latching the new parts. This avoids creating strong vibrations in the
chassis, which might interfere with other running parts.
Procedure
1. Unlatch the bale securing the power supply power cord.
2. Disconnect the power cord from the power supply.
3. Press the orange unlocking tab to unlock the power supply unit (1).
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4. Continuing to depress the unlocking tab and using the power supply handle, pull
the unit from the chassis (2).
Remove an I/O assembly
This procedure describes how to remove an I/O assembly.
A properly functioning I/O assembly is identified by the green LED illuminated on the
handle. A faulty I/O assembly can be identified by an amber LED that is illuminated on
the handle of the I/O assembly
Procedure
1. From the rear of the chassis, pull the handle on the I/O assembly handle to
release it. The ejector button should release.
2. Pull the assembly from the chassis.
3. Place the I/O assembly on a clean, ESD-protected surface.
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Remove a 3.5" disk drive
Procedure
1. Attach an ESD wristband to your wrist and the enclosure.
2. Slide the disk's latch button the right to release the latch.
3. Rotate the latch outward (1) and slowly pull the disk from its slot (2). Place the
disk on a padded, static-free surface.
Figure 1 Removing a 3.5" disk drive
1
2
Remove the 2.5" disk drive
This procedure describes how to remove the 2.5 disk drive
Procedure
1. From the rear of the device, press the release button down on the 2.5" disk
drive cover to free it from the chassis.
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2. Remove the 2.5" disk drive cover.
3. Slide the disk's orange release button downward to release it from its slot (1).
The latch will rotate outward (2).
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Figure 2 Sliding the 2.5" disk drive orange release button down
4. Grasp the latch and pull the disk from its slot to remove it.
Remove a storage processor
This procedure describes how to remove a storage processor.
Procedure
1. Label each of the cables as to their connection location. Taking a photograph
for reference is also helpful for re-connecting the cables.
2. Disconnect the power and data cables from the rear of the storage processor.
3. On the storage processor extractors, push up on the release buttons (1), and
rotate the storage processor extractors down until they come to a complete
stop (2). The storage processor will be extracted approximately 1-inch from the
chassis.
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4. Grasp the storage processor and firmly pull it from the chassis.
5. If the storage processor is being replaced, then the DIMMs must be moved from
the current storage processor to the replacement storage processor as follows:
a. Remove the air duct from the current storage processor and the
replacement storage processor.
b. Remove the DIMMs one at a time from the current storage processor and
install them in the same location on the replacement storage processor.
c. When the last DIMM has been moved, replace the air duct in the
replacement storage processor.
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Remove a fan
This procedure describes how to remove a fan.
Before you begin
The SP must be removed from the chassis to remove the fans.
Procedure
1. Identify the failed fan. The SP fault LED, located at the bottom left rear of the
chassis, will show an amber color if there is a fan failure.
2. Press the locking tabs inward to release the fan from its mounting location.
Firmly pull the fan straight up and remove it from the SP.
Remove the air duct
Remove the air duct before removing or replacing the DIMMs . This procedure
describes how to remove the air duct.
Before you begin
The storage processor must be removed from the chassis before the air duct can be
removed.
Procedure
1. Grasp the air duct firmly.
2. Firmly pull the air duct up to remove it from the storage processor.
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Remove a DIMM (memory module)
This procedure describes how to remove a DIMM.
Before you begin
The storage processor and the air duct must be removed before the DIMMs can be
removed.
Procedure
1. Attach an ESD grounding strap to your wrist and to the instrument that is being
worked on.
2. Press the tabs of the DIMM slot out to remove the DIMM.
3. Remove the DIMM from the slot.
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Disassemble SPS assembly
Procedure
1. Remove four screws securing the SLIC cage lever handle to the chassis.
2. Pull up on the SLIC cage lever handle. Pull the SLIC cage forward and remove
the SLIC cage.
3. Remove eight screws from the side of the chassis (four each side) and remove
the fan cage.
4. Disconnect the cable from the rear I/O pcb and pull the rear I/O pcb from its
slot.
5. Disconnect the cable from the SSD pcb and slide the SSD pcb from the 2.5"
HDD bracket.
6. Remove two screws to remove the PDB pcb cover.
7. Remove two screws and remove the PDB pcb.
8. Remove nine screws and remove the DIB pcb.
9. Remove 24 screws and remove the SP pcb from the SP tray.
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Copyright ©2017 Dell Inc. or its subsidiaries. All rights reserved.
Published July 2017
Dell believes the information in this publication is accurate as of its publication date. The information is subject to change without notice.
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REQUIRES AN APPLICABLE SOFTWARE LICENSE.
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Published in the USA.
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