Dell PowerEdge M710HD Quick start guide

PowerEdge M710HD
Name
Technical Guide
Designed for enterprise
database and virtualization
deployments, the
PowerEdge M710HD
features tremendous I/O
throughput, maximized
memory density, and
robust processing power.

Dell
PowerEdge M710HD Technical Guide ii
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Citrix and XenServer are registered trademarks of Citrix Systems, Inc. and/or one or more of its
subsidiaries, and may be registered in the United States Patent and Trademark Office and in other
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©Copyright 2012 Dell Inc. All rights reserved. Reproduction or translation of any part of this work
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and strictly forbidden.
December 2012 | Version 4.0

Dell
PowerEdge M710HD Technical Guide iii
Table of Contents
1Product Comparison ...........................................................................................6
1.1 Overview ..................................................................................................6
1.2 Rack-Dense Performance ...............................................................................6
1.3 Efficiency Without Compromise........................................................................6
1.4 Enterprise-Class Reliability and Management........................................................6
1.5 Comparison ...............................................................................................7
2Key Technologies...............................................................................................9
2.1 Overview ..................................................................................................9
2.2 Dual Intel Xeon Quad-Core and Six-Core Processors ................................................9
2.3 DDR3 Memory .............................................................................................9
2.4 PCI Express Generation 2 ...............................................................................9
2.5 Network Daughtercard ..................................................................................9
2.6 Redundant Internal SD Module .........................................................................9
2.7 iDRAC6 Enterprise........................................................................................9
3System Information .......................................................................................... 10
3.1 Overview ................................................................................................ 10
3.2 Product Features Summary ........................................................................... 10
4Mechanical .................................................................................................... 13
4.1 Chassis Description..................................................................................... 13
4.2 Dimensions and Weight................................................................................ 13
4.3 Internal Module......................................................................................... 13
4.4 Security.................................................................................................. 14
4.5 Cover Latch ............................................................................................. 14
4.6 TPM (Trusted Platform Module)...................................................................... 14
4.7 Power Off Security..................................................................................... 14
4.8 iDRAC6 Security Features ............................................................................. 14
4.9 USB ....................................................................................................... 15
4.10 Battery................................................................................................... 15
4.11 Field Replaceable Units (FRU)........................................................................ 15
4.12 User Accessible Jumpers, Sockets, and Connectors............................................... 15
5Power, Thermal, Acoustic .................................................................................. 16
5.1 Power Supplies ......................................................................................... 16
5.2 Power Efficiency ....................................................................................... 16
5.3 Thermal Operating and Storage Specifications .................................................... 16
5.4 Acoustics ................................................................................................ 17
5.5 Thermal.................................................................................................. 18
6Processors..................................................................................................... 19
6.1 Overview ................................................................................................ 19
6.2 Features ................................................................................................. 19
6.3 Supported Processors.................................................................................. 20
6.4 Processor Installation.................................................................................. 21
7Memory ........................................................................................................ 22
7.1 Overview ................................................................................................ 22
7.2 DIMMs Supported ....................................................................................... 23
7.3 DIMM Slots............................................................................................... 23
7.4 Speed .................................................................................................... 23
8Chipset ........................................................................................................ 25
8.1 Overview ................................................................................................ 25

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PowerEdge M710HD Technical Guide iv
8.2 I/O Hub .................................................................................................. 25
8.3 QuickPath Interconnect ............................................................................... 25
8.4 IOH PCIe ................................................................................................. 25
8.5 Intel I/O Controller Hub 9 ............................................................................ 26
8.6 PCIe Gen2 ............................................................................................... 26
8.7 Direct Media Interface ................................................................................ 26
8.8 PCIe Mezzanine Connectors........................................................................... 26
9BIOS ............................................................................................................ 27
9.1 Overview ................................................................................................ 27
9.2 Supported ACPI States................................................................................. 27
10 Embedded LAN on Motherboard ........................................................................... 28
10.1 Overview ................................................................................................ 28
10.2 Broadcom BCM5709S................................................................................... 28
10.3 Broadcom BCM57712-k NDC .......................................................................... 28
11 I/O Mezzanine Cards......................................................................................... 29
12 Storage ........................................................................................................ 30
12.1 Drives .................................................................................................... 30
12.2 Hard Disk Drive Carrier................................................................................ 30
12.3 Empty Drive Bays....................................................................................... 30
12.4 Diskless Configuration Support ....................................................................... 30
12.5 PERC H200 HBA......................................................................................... 31
12.5.1 Selecting Preferred Boot Device in H200 Controller ........................................ 31
12.5.2 PERC H200 SAS 6Gb/s............................................................................ 31
12.5.3 PERC H200 Solid State Drive Support.......................................................... 31
12.6 RAID Configurations.................................................................................... 32
12.7 Optical Drives........................................................................................... 32
12.8 External Storage........................................................................................ 32
13 Video........................................................................................................... 33
14 Rack Information............................................................................................. 34
15 Operating Systems ........................................................................................... 35
16 Virtualization ................................................................................................. 36
16.1 Resources................................................................................................ 36
16.2 Advanced Infrastructure Manager by Scalent ...................................................... 36
17 Systems Management........................................................................................ 37
17.1 Overview ................................................................................................ 37
17.2 Server Management.................................................................................... 37
17.3 Embedded Server Management ...................................................................... 38
17.4 Dell Lifecycle Controller and Unified Server Configurator ....................................... 38
17.5 Integrated Dell Remote Access Controller.......................................................... 39
17.6 iDRAC6 Enterprise...................................................................................... 39
17.7 iDRAC6 Enterprise with Virtual Flash Media........................................................ 39
17.8 Chassis Management Controller ...................................................................... 41
18 USB Peripherals .............................................................................................. 42
Appendix A. Statement of Volatility .......................................................................... 43
Appendix B. Certifications ..................................................................................... 48
B 1. Regulatory Certifications ............................................................................. 48
B 2. Product Safety Certifications......................................................................... 48
B 3. Electromagnetic Compatibility....................................................................... 49
B 4. Ergonomics, Acoustics and Hygienics ............................................................... 49

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PowerEdge M710HD Technical Guide v
Appendix C. Industry Standards ............................................................................... 50
Tables
Table 1. Product Comparison ..................................................................................7
Table 2. Product Features .................................................................................... 10
Table 3. Operating and Storage Specifications ............................................................ 16
Table 4. Acoustical Performance of M1000e Chassis with Eight M710HD Blades Installed .......... 17
Table 5. Comparison of Processor Technology ............................................................ 20
Table 6. Supported Processors ............................................................................... 20
Table 7. Memory Populations and Maximum Frequency.................................................. 24
Table 8. M710HD PCIe Assignments ......................................................................... 26
Table 9. Supported Hard Drives.............................................................................. 30
Table 10. Supported Storage Controllers .................................................................... 31
Table 11. RAID Configurations................................................................................. 32
Table 12. Supported Video Modes ............................................................................ 33
Table 13. Server Management Documentation and Information.......................................... 37
Table 14. Unified Server Configurator Features and Description......................................... 38
Table 15. Features List for Base Management Functionality, iDRAC, and vFlash Media .............. 39
Table 16. PowerEdge M710HD Statement of Volatility .................................................... 43
Table 17. Product Safety Certifications...................................................................... 48
Table 18. Electromagnetic Compatibility Certifications................................................... 49
Table 19. Ergonomics, Acoustics and Hygienics............................................................. 49
Table 20. Industry Standards .................................................................................. 50
Figures
Figure 1. PowerEdge M1000e Blade Enclosure.............................................................. 13
Figure 2. Internal Module View ............................................................................... 14
Figure 3. Memory Slots and Risers............................................................................ 23
Figure 4. 2.5‖ Hard Drive Carrier ............................................................................ 30

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PowerEdge M710HD Technical Guide 6
1Product Comparison
1.1 Overview
The Dell™ PowerEdge™ M710HD blade server helps you run business applications efficiently, reduce
your data center footprint, ease data management, and trim system maintenance time.
The PowerEdge M710HD is a data-center, virtualization-optimized blade that offers tremendous I/O
throughput, maximized memory density, and robust optional Intel®Xeon®5600 processing power, all
in an ultra-dense form factor with enterprise-class high availability. The PowerEdge M710HD has the
option to set up redundant, mirrored SD cards through a BIOS setting.
1.2 Rack-Dense Performance
Unleash the power of massive I/O throughput, core-rich Intel Xeon processors, and an abundance of
DDR3 DIMMs on your toughest data center workloads. With massive I/O throughput, powerful multi-
core processing and ultra-high-density memory options, the PowerEdge M710HD blade server can let
you flex your data center muscles while taking on the toughest workloads. Flexible and robust I/O
deployment is achievable through multiple iSCSI, Ethernet, Fibre Channel and InfiniBand options with
additional future integrated network connectivity through the network daughtercard (NDC).
Processing power from up to 12 Intel Xeon 5600 series cores and maximized RAM density with 18
DIMM slots allows for condensed full-height blade horsepower and cost-efficient DDR3 memory
scaling in an ultra-dense form factor.
1.3 Efficiency Without Compromise
Increase your capability to deploy virtualized solutions that can reduce power consumption while
increasing performance capacity. The expanded addressable memory in the PowerEdge M710HD
allows you to use more virtual machines from your existing hypervisor licensing, helping you save
money, and increase your virtualized deployments using existing resources. Optimized airflow design
coupled with high-efficiency fans and power supplies enable the Dell M1000e blade enclosure to
effectively power and cool PowerEdge M710HD servers while helping to reduce overall power draw.
This allows you to reclaim power for use elsewhere in your data center, save on operational costs,
and help the environment.
1.4 Enterprise-Class Reliability and Management
Spend more time on your business and less on maintaining your IT with embedded system
management features on the PowerEdge M710HD and the Chassis Management Controller (CMC). The
PowerEdge M710HD blade server is designed to ease your mind and reduce your operating costs
delivering the closest thing to a worry-free data center. Optional failsafe embedded hypervisors and
hard drive fault tolerance through a hardware RAID controller offer protective redundancy that
safeguards your organization’s data from loss or corruption. Simplified systems management is
achieved through automated discovery that automates configuration of new hardware and enables
pre-provisioning of LAN/SAN resources.
In addition, one-to-many updating through the CMC and Virtual File Share simplifies the update
process for BIOS, firmware, and drivers without additional software. Proactive management provides
immediate access to system status, issues, and alerts through a single, easy-to-use interface that
includes one-click key functions to help quickly resolve issues.

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PowerEdge M710HD Technical Guide 7
1.5 Comparison
The PowerEdge M710HD is an optimized blade solution for customers looking for large capacity
memory capabilities and I/O scalability in a dense, easy-to-deploy, half-height blade form factor.
Table 1 compares the PowerEdge M710HD blade server to the PowerEdge M710, M610x, and M610
servers.
Table 1. Product Comparison
M710HD
M710
M610x
M610
Description
General purpose
Half-height 2S
General purpose
Full-height 2S
Special purpose
Full-height 2S
General purpose
Half-height 2S
Processor
Intel Xeon Processor 5500 or 5600 Series
Front Side
Bus
Two Intel QuickPath Interconnect (QPI) links
Sockets
Two
Cores
Up to six
L2/L3 Cache
8MB (5500 Series) or 12MB (5600 Series)
Chipset
Intel 5520
Intel 5520
Intel 5500
Intel 5500
DIMMs
18 x DDR3 DIMMs
(800/1066/1333MT/s)
18 x DDR3 DIMMs
(800/1066/1333MT/s)
12 x DDR3 DIMMs
(800/1066/1333MT/s)
12 x DDR3 DIMMs
(800/1066/1333MT/s)
Min/Max RAM
4GB/288GB
4GB/288GB
4GB/192GB
4GB/192GB
Form Factor
Half-height blade,
dual socket
Full-height blade,
dual socket
Full-height blade,
dual-socket/
expansion module
Half-height blade,
dual socket
Hard Drive
Bays (2.5”
only)
SAS: 2 x 2.5‖
(hot-plug)
SSD SATA: 2 x 2.5‖
SAS: 4 x 2.5‖
(hot-plug)
SSD SATA: 2 x 2.5‖
SAS: 2 x 2.5‖
(hot-plug)
SATA: 1 x 2.5‖
SAS: 2 x 2.5‖
(hot-plug)
SATA: 1 x 2.5‖
Hard Drive
Types
SAS/SSD
Hard Drive
Controller
Embedded H200
PERC H200
PERC H700
CERC 6/i
PERC Η200
PERC Η700
PERC Η800
SAS 6/Ε
PERC H200
Non-RAID SATA
(one hard drive only)
Optional Hard
Drive
Controller
SAS 6/iR
PERC 6/i with RAID
battery
SAS 6/iR
PERC 6/i with RAID
battery
SAS 6/iR
PERC 6/i with RAID
battery
Availability
Hot-plug hard drives
ECC memory
Single Device Data Correction (SDDC)
Supports memory demand and patrol scrubbing
High-availability failover cluster support
Server
Management
Integrated Dell Remote Access Controller iDRAC6 Express/Enterprise (both standard) with IPMI
2.0 +vMedia/vKVM, and CMC (on the PowerEdge M1000e chassis)
Mezz Slots
2 x8 PCIe Mezzanine
1 x4 and 3 x 8 PCIe
2 x8 (PCI Gen 2);
Fabric B limited to a
2 x8 (PCI Gen 2);
Fabric B limited to a

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PowerEdge M710HD Technical Guide 8
M710HD
M710
M610x
M610
Cards
Mezzanine Cards
small form factor
(SFF) mezzanine card
small form factor
(SFF) mezzanine card
I/O slots
NA
NA
Two x16 PCIe Gen2
H800/6GB SAS
NVIDIA®M1060 and
M2050-204
NA
RAID
0, 1
0, 1, 5
0, 1
0, 1
NIC/LOM
4 x 1GbE dual
Broadcom®BCM5709S
2 x 10GbE Broadcom
BCM57712-k
4 x TOE with optional
iSCSI offload
2-port Broadcom®
5709S 1Gb with TOE
plus optional iSCSI
Accelerator
2-port Broadcom®
5709S 1Gb with TOE
plus optional iSCSI
Accelerator
USB
2 x external USB 2.0
ports at front bezel
1 x internal USB port
3 x external USB 2.0
ports at front bezel
1 x internal USB port
2 external, 1 internal
2 external, 1 internal
SD Card
2 x internal SD slot
1 for persistent
storage
1 for management
(can also be
configured as
redundant SD cards
for embedded
hypervisor)
1 x internal SD slot
1 for persistent
storage
1 for management
1 for persistent
storage
1 for management
1 for persistent
storage
1 for management
TPM
Yes (Trusted Computing Module [TCM] used in China)
Video
Matrox®G200eW integrated into iDRAC chip
Power
Supplies
See the PowerEdge M1000e Technical Guide.
Fans
See the PowerEdge M1000e Technical Guide.
Chassis
See the PowerEdge M1000e Technical Guide.

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PowerEdge M710HD Technical Guide 9
2Key Technologies
2.1 Overview
The Dell™ PowerEdge™ M710HD is a half-height blade server with the following features:
Dual quad-core or six-core Intel®Xeon®processors 5500 and 5600 series
DDR3 memory
PCI Express Generation 2 (PCIe Gen2)
Optional redundant, mirrored SD cards
iDRAC6 Enterprise with integrated video controller
2.2 Dual Intel Xeon Quad-Core and Six-Core Processors
The Intel Xeon processor 5500 and 5600 series features quad-core and six-core processing to
maximize performance and performance/watt for data center infrastructures and highly dense
deployments. The Intel Xeon processor 5500 series 2S family of processor also features Intel Core™
micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit applications and
operating systems.
2.3 DDR3 Memory
The M710HD uses DDR3 memory that provides a high-performance, high-speed memory interface
capable of low latency response and high throughput. The M710HD supports registered ECC DDR3
DIMMs (RDIMMs).
The DDR3 memory interface consists of three channels, with up to three RDIMMs per channel for
single/dual-rank and up to two RDIMMs per channel for quad rank. The interface uses 2 GB, 4 GB,
8 GB, or 16 GB RDIMMs. The memory mode is dependent on how the memory is populated in the
system.
2.4 PCI Express Generation 2
PCIe is a serial point‐to‐point interconnect for I/O devices. PCIe Gen2 doubles the signaling bit rate
of each lane from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports is backwards‐compatible with
Gen1 transfer rates.
2.5 Network Daughtercard
The Network Daughtercard (NDC) is flexible LAN-on-motherboard (LOM) networking solution with
integration into embedded management and configuration subsystems.
2.6 Redundant Internal SD Module
The Internal SD Module is dedicated for an SD Flash Card with embedded hypervisor for
virtualization. The SD Flash Card contains a bootable OS image for virtualized platforms.
The persistent storage solution on the M710HD allows for redundant SD cards.
2.7 iDRAC6 Enterprise
The iDRAC6 Enterprise feature set is a managed persistent storage space for server provisioning data.
It consists of 1GB flash and vFlash media (an optional externally accessible SD card). vFlash offers
the hot-plug portability and increased storage capacity benefits of SD while still being managed by
the system.

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PowerEdge M710HD Technical Guide 10
3System Information
3.1 Overview
The PowerEdge™ M710HD is an optimized solution with large capacity memory capabilities and I/O
scalability in a dense, easy-to-deploy blade form factor. Its key differentiators are superior memory
scalability and granularity, new management capabilities with iDRAC and Lifecycle Controller,
internal persistent storage, two internal hard drives, and trusted platform module (TPM) support.
The M710HD can be a valuable asset in High Performance Cloud Computing (HPCC), messaging,
database, and virtualization solutions.
3.2 Product Features Summary
Table 2 summarizes the product features for the PowerEdge M710HD. For the latest information on
supported features for the PowerEdge M710HD, visit Dell.com.
Table 2. Product Features
Feature
Technical Specifications
Processors
Quad-core or six-core Intel®Xeon®processor 5500 and 5600 series
Chipset
Intel 5520
Memory1
Up to 288GB (18 DIMM slots): 1GB/2GB/4GB/8GB/16GB ECC DDR3 up to 1333MT/s
Hard Drive Bays
Two 2.5‖ SAS/SSD hot-plug drives
Storage1
Internal Hot-Plug Hard-Drive Options:
2.5‖ SATA SSD, SAS (10K, 15K)
2.5‖ SAS (15K rpm): 73GB or 146GB
Solid State Drives (SSD): 50GB, 100GB, or 149GB
Maximum Internal Storage:
Up to 2TB per blade
External Storage:
For more information about Dell external storage solutions, visit Dell.com/Storage.
RAID Controller
Options
PERC H200 Integrated SAS Controller (6Gb/s)

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PowerEdge M710HD Technical Guide 11
Feature
Technical Specifications
I/O Mezzanine Card
Options
Fully populated mezzanine card slots and switch modules will yield three redundant
I/O fabrics per blade.
1Gb and 10Gb Ethernet:
Dual-Port Broadcom®Gb Ethernet with TOE (BCM5709S)
Quad-Port Intel Gb Ethernet
Quad-Port Broadcom Gb Ethernet (BCM5709S)
Dual-Port Intel 10Gb Ethernet
Dual-Port Broadcom 10Gb Ethernet (BCM57711)
Brocade®BR1741M-k Dual-Port Mezzanine CNA
InfiniBand:
Dual-Port Mellanox®ConnectX®-2 Dual Data Rate (DDR) and Quad Data Rate (QDR)
InfiniBand
10Gb Enhanced Ethernet and Converged Network Adapters (CEE/DCB/FCoE):
Dual-Port Intel 10Gb Enhanced Ethernet (FCoE Ready for Future Enablement)
Dual-Port Emulex®Converged Network Adapter (OCM10102-F-M)—Supports CEE/DCB
10GbE + FCoE
Dual-Port Qlogic®Converged Network Adapter (QME8142)—Supports CEE/DCB 10GbE
+ FCoE
Dual-Port Qlogic Converged Network Adapter (QME8242-k)—Supports 10GbE + NPAR
Fibre Channel:
Dual-Port QLogic FC8 Fibre Channel Host Bus Adapter (HBA) (QME2572)
Dual-Port Emulex FC8 Fibre Channel HBA (LPe1205-M)
Emulex 8 or 4 Gb/s Fibre Channel Pass-through module
Communications
Two embedded Broadcom®NetXtreme II™ 5709 Gigabit Ethernet NICs with failover
and load balancing.
TOE (TCP/IP Offload Engine) supported on Microsoft®Windows Server®2003 SP1 or
higher with Scalable Networking Pack. iSCSI Offload supported on Windows Server®
2003 SP1 or higher, Red Hat®Enterprise Linux®5, and SUSE®Linux Enterprise Server
10. Scalable Networking Pack for Windows Server®2003 is not required.
Boot from SAN (iSCSI and FC) supported
Optional add-in NICs: see I/O Mezzanine Cards
Optional add-in HBAs: see I/O Mezzanine Cards
Operating Systems
Microsoft®Windows Server®2012
Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V®)
Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2)
Microsoft Windows HPC Server 2008
Novell®SUSE®Linux Enterprise Server
Red Hat Enterprise Linux
Oracle®Solaris™
For more information on the specific versions and additions, visit
Dell.com/OSsupport.

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PowerEdge M710HD Technical Guide 12
Feature
Technical Specifications
Virtualization OS
Options
Citrix®XenServer®
Microsoft Hyper-V through Microsoft Windows Server®2008
VMware®vSphere®ESX™and ESXi™
Red Hat Enterprise Virtualization®
Management Options
Dell™ OpenManage™ software tools
Dell Management Console
Integration with 3rd party management solutions via the Dell Certified Partner
Program
Altiris™ Deployment Solution for Dell Blade Servers
Designed to help reduce deployment time from hours to minutes
Integrated Dell Remote Access Controller (iDRAC)
Out-of-Band alerting, status, inventory, and troubleshooting via Secure Web GUI/CLI
(telnet/SSH)
Console Redirection
vMedia (virtual media) map optical or hard drives to the blade from remote
workstations over a network
vKVM (virtual KVM) out-of-band remote console redirection; supports Java or ActiveX
plug-ins
IPMI 2.0 support
Power Supply
Supplied by Dell PowerEdge M1000e Blade Chassis
Video
Integrated Matrox®G200 with 8MB memory
Systems Management
BMC, IPMI2.0 compliant
Dell OpenManage featuring Dell Management Console
Unified Server Configurator
Lifecycle Controller
iDRAC6 Enterprise with optional vFlash media
1GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and
operating environment and will be less.

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PowerEdge M710HD Technical Guide 13
4Mechanical
4.1 Chassis Description
The Dell™ PowerEdge™ M710HD is a half-height blade server that requires an M1000e chassis to
operate.
Figure 1. PowerEdge M1000e Blade Enclosure
The M710HD blade server occupies one half-height slot vertically in the M1000e chassis for a
maximum of 16 blades in one M1000e chassis. It can be mixed with other existing Dell blades of half-
height or full-height form factors, and designed to mix with possible future half-height-double-wide
and full-height-double-wide blades. Some highlights are:
First Dell blade with support for network daughtercard
Support for 18 DIMMs in a half-height form factor
Support for persistent storage (internal USB connector and two external SD card slots)
Refer to the PowerEdge M1000e Technical Guide for information on fans, power and power supply,
racks, security, and other chassis information.
4.2 Dimensions and Weight
The PowerEdge M710HD dimensions and weight are as follows:
Height: 18.9cm (7.4in)
Width: 5cm (2in)
Depth: 48.6cm (19.2in)
Weight (maximum configuration): 7.4kg (16.3lb)
4.3 Internal Module
A view of the internal module is shown in Figure 2. See Opening and Closing the Blade in the Dell
PowerEdge Modular Systems Hardware Owner’s Manual on Support.Dell.com/Manuals for more
information.

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PowerEdge M710HD Technical Guide 14
Figure 2. Internal Module View
4.4 Security
Configurable client IP address range for clients connecting to iDRAC6.
4.5 Cover Latch
The blade module includes a latch for the cover. See Opening and Closing the Blade in the Dell
PowerEdge Modular Systems Hardware Owner’s Manual on Support.Dell.com/Manuals for more
information.
4.6 TPM (Trusted Platform Module)
The TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital
certificates. TPM can also be used to enable the BitLocker™ hard drive encryption feature in Windows
Server 2008.
TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. A Trusted Computing
Module (TCM) version of the planar is available for use where TCM is the standard, for example, in
China.
4.7 Power Off Security
Through the BIOS, the front blade server USB ports and power button can be disabled so as to not
allow any control of the system from the front of the blade. The enclosure video can also be
restricted.
The BIOS System Setup program’s system security screen allows administrators to set the system
password, control TPM activation and reporting, clear the TPM’s memory, and disable the power
button and USB ports.
4.8 iDRAC6 Security Features
The iDRAC6 modular solution offers many security features including:
•User authentication through Microsoft Active Directory, generic LDAP Directory Service, or
locally administered user IDs and passwords
•Two-factor authentication provided by the Smart–Card logon feature; the two-factor
authentication is based on what the users have (the Smart–Card) and what they know
(the PIN)
•Role-based authorization, which enables an administrator to configure specific privileges for
each user
•User ID and password configuration

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PowerEdge M710HD Technical Guide 15
•SM-CLP and Web interfaces that support 128-bit and 40-bit encryption (for countries where
128 bit is not acceptable), using the SSL 3.0 standard
•Session time-out configuration (in seconds)
•Configurable IP ports (where applicable)
•Secure Shell (SSH), which uses an encrypted transport layer for higher security
•Login failure limits per IP address, with login blocking from that IP address when the limit is
exceeded
For greater security, access to iDRAC6 configuration through iDRAC6 Configuration Utility or the local
RACADM CLI can be disabled by means of a RACADM command or from the GUI.
4.9 USB
The M710HD supports the following USB devices:
•DVD (bootable; requires two USB ports)
•USB Key (bootable)
•Keyboard (only one USB keyboard is supported)
•Mouse (only one USB mouse is supported)
4.10 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH9 chip.
4.11 Field Replaceable Units (FRU)
The planar contains a serial EEPROM to contain FRU information including Dell part number, part
revision level, and serial number.
4.12 User Accessible Jumpers, Sockets, and Connectors
See System Board Information in the Dell PowerEdge Modular Systems Hardware Owner’s Manual on
Support.Dell.com/Manuals for more information.

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PowerEdge M710HD Technical Guide 16
5Power, Thermal, Acoustic
5.1 Power Supplies
See the PowerEdge M1000e Technical Guide for information on power supplies and power supply
specifications.
5.2 Power Efficiency
One of the main features of blade servers is enhanced power efficiency. The PowerEdge™ M710HD
achieves higher power efficiency by implementing the following features:
User-configurable power options through the M1000e Chassis Management Controller (CMC)
(see M1000e documentation on Support.Dell.com/Manuals for further details)
Improved power budgeting
Voltage Regulator (VR) efficiency improvements
Processor VR dynamic phase shedding
Switching regulators instead of linear regulators
Closed loop thermal throttling
DDR3 and LV-DDR3 memory
Memory VR static phase shedding
BIOS Power/Performance options page
Active Power Controller (BIOS-based processor P-state manager)
Ability to power down or throttle memory
Ability to disable a processor core
Ability to turn off embedded NICs or PCIe lanes when not being used
Option to run PCIe at Gen1 speeds instead of Gen2
Energy Smart components at the M1000e chassis level to selectively enable more computing
performance with less power consumption.
5.3 Thermal Operating and Storage Specifications
Thermal specifications for the PowerEdge M710HD are detailed in Table 3 along with other important
operating and storage information.
Table 3. Operating and Storage Specifications
Temperature
Operating
10°C to 35°C (50°F to 95°F) with a maximum temperature gradation
of 10°C per hour
Note: For altitudes above 2950 feet, the maximum operating
temperature is derated 1°F/550 ft.
Storage
-40°C to 65°C (-40°F to 149°F) with a maximum temperature
gradation of 20°C per hour
Relative humidity
Operating
20% to 80% (noncondensing) with a maximum humidity gradation of
10% per hour
Storage
5% to 95% (noncondensing) with a maximum humidity gradation of 10%
per hour

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PowerEdge M710HD Technical Guide 17
Maximum vibration
Operating
0.26 Grms at 5Hz-350Hz in operational orientations
Storage
1.54 Grms at 10 Hz-250Hz in all orientations
Maximum shock
Operating
Half sine shock in all operational orientations of 31 G +/- 5% with a
pulse duration of 2.6 ms +/-10%
Storage
Half sine shock on all six sides of 71 G +/- 5% with a pulse duration of
2 ms +/-10%
Square wave shock on all six sides of 27 G with velocity change @ 235
in/sec or greater
Altitude
Operating
-16m to 3048m (-50ft to 10,000ft)
Note: For altitudes above 2950 feet, the maximum operating
temperature is derated 1°F/550 ft.
Storage
-16m to 10,600m (-50ft to 35,000ft)
Airborne contaminant level
Class G1 or lower as defined by ISA-S71.04-1985 (G1 maximum corrosive contaminant levels measured
at ≤ 50% relative humidity)
5.4 Acoustics
The acoustical design of the PowerEdge M710HD reflects adherence to Dell’s high sound quality
standards. Sound quality is different from sound power level and sound pressure level in that it
describes how humans respond to annoyances in sound, like whistles or hums. Definitions for
acoustical performance data are as follows:
•Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other
specific activity.
•LwA–UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296
(1988) and measured in accordance to ISO 7779 (1999).
Table 4 shows the acoustical performance for a typical configuration of the M1000e chassis with eight
PowerEdge M710HD blade servers installed. Acoustical performance varies with hardware
configurations.
Table 4. Acoustical Performance of M1000e Chassis with Eight M710HD Blades Installed
Typical Configuration (per blade) @
23±2°C Ambient in M1000e Chassis
Operating
Mode
LwA-UL
(bels)
Tones
Processors
Hard
Drives
DIMMs
2 x Intel®
Xeon®
processors
5600 series
(80W)
2 x 2.5‖
SAS (15K)
736GB
12 x 4GB
dual-rank
Standby
7.1
No prominent
tones
Idle
7.5
No prominent
tones

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PowerEdge M710HD Technical Guide 18
Stress
8.2
No prominent
tones
5.5 Thermal
The M710HD thermal solution includes:
Optimized airflow impedance for individual blade and chassis level airflow balancing
Custom air baffling to direct air flow through the components to maintain proper cooling
Custom-designed heat sinks that maintain processor, DIMM, and board-level chip
temperatures within thermal design targets
Highly optimized fan control algorithm:
oBase fan speeds are a function of hardware configuration and ambient temperature to
minimize airflow for a given environment.
oPID control algorithms are used for both processor, DIMMs, and NDC to maintain
appropriate thermal margin

Dell
PowerEdge M710HD Technical Guide 19
6Processors
6.1 Overview
The Intel®Xeon®processors 5500 and 5600 series are designed specifically for servers and
workstation applications. These processors feature quad-core processing to maximize performance
and performance/watt for data center infrastructures and highly dense deployments. They feature
Intel Core™ micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit
applications and operating systems and use a 1366-contact Flip-Chip Land Grid Array (FC-LGA)
package that plugs into a surface-mount socket. The M710HD provides support for up to two 2S
processors.
6.2 Features
Key features of the Intel Xeon processor 5500 series include:
•Up to four cores per processor
•Two point-to-point QuickPath Interconnect links at 6.4 GT/s
•45 nm process technology
•No termination required for non-populated processors (must populate CPU1 socket first)
•Integrated QuickPath DDR3 memory controller
•64-byte cache line size
•RISC/CISC hybrid architecture
•Compatible with existing x86 code base
•Intel MMX™ support
•Execute Disable Bit
•Intel Wide Dynamic Execution
Executes up to four instructions per clock cycle
•Simultaneous Multi-Threading (SMT) capability
•Support for CPU Turbo Mode (on certain models)
Increases processor frequency if operating below thermal, power and current limits
•Streaming SIMD (Single Instruction, Multiple Data) Extensions 2, 3, and 4
•Intel 64 Technology
•Intel VT-x and VT-d Technology for virtualization support
•Enhanced Intel SpeedStep®Technology
•Demand-based switching for active processor power management as well as support for ACPI
P-States, C-States and T-States
The Intel Xeon processor 5600 series encompasses all the features of the 5500 series along with:
•Support for DDR3L, 1.35v DIMMs for even lower system power
•Support for memory sparing
•AES-NI (hardware encryption assist) for more efficient encryption for uses such as online
transactions SSL.
•Intel TXT (Trusted Execution Technology) provides hardware assisted protection against
emerging software attacks

Dell
PowerEdge M710HD Technical Guide 20
Table 5. Comparison of Processor Technology
Intel Xeon Processor
5400 Series
5500 Series
5600 Series
Cores
4
4
6
Last Level Cache
2 x 6MB shared
8MB shared
12MB shared
FSB (MT/s) / Link
Frequency (GT/s)
1333MT/s
Up to 6.4 GT/s
Up to 6.4 GT/s
Max TDP
120W
130W for workstation
95W for server
130W for workstation
and server
Max Frequency
>3GHz
>3GHz
>3GHz
Memory Controller
Separate in
chipset
Integrated 3-channel
DDR3
Integrated
3-channel DDR3
Process Technology
45nm
45nm
32nm
Intel Trusted Execution
Technology
No
No
Yes
Intel Advanced Encryption
Security- New Instructions
No
No
Yes
Intel Virtualization
Technology
Yes
Yes
Yes
Intel 64
Yes
Yes
Yes
Intel Hyper-Threading
Technology
No
Yes
Yes
Socket
LGA771
LGA1366
LGA1366
6.3 Supported Processors
Supported processors are detailed in Table 6.
Table 6. Supported Processors
Model
Speed
TDP
Power
Cache
Cores
Usage
Type
Max
Memory
Speed
QPI
Link
Speed
Turbo
Mode
Enabled
Hyper-
threading
X5675
3.06GHz
95W
12M
6
Advanced
1333MT/s
6.4GT/s
Yes
Yes
X5670
2.93GHz
95W
12M
6
Advanced
1333MT/s
6.4GT/s
Yes
Yes
X5660
2.8GHz
95W
12M
6
Advanced
1333MT/s
6.4GT/s
Yes
Yes
X5650
2.66GHz
95W
12M
6
Advanced
1333MT/s
6.4GT/s
Yes
Yes
E5645
2.4GHz
80W
12M
6
Standard
1333MT/s
5.86GT/s
Yes
Yes
E5649
2.53GHz
80W
12M
6
Standard
1333MT/s
5.86GT/s
Yes
Yes
L5640
2.26GHz
60W
12M
6
Low
Voltage
1066MT/s
5.86GT/s
Yes
Yes
X5667
3.06GHz
95W
12M
4
Advanced
1333MT/s
6.4GT/s
Yes
Yes