DIGITAL-LOGIC SM800/900DK User manual

TECHNICAL USER MANUAL FOR:
SM800/900DK
(Development Kit & Design IN Manual)
Nordstrasse 11/F
CH - 4542 Luterbach
Tel.: ++41 (0)32 681 58 00
Fax: ++41 (0)32 681 58 01
Email: [email protected]
Homepage: http://www.digitallogic.com

DIGITAL-LOGIC AG SM800/900DK Technical Manual V1.2B
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For internal use only:
File: SM800-900DK_V1.2B.doc
Path: R:\HANDBUCH\smart\SM800-900DK\SM800-900DK_V1.2B.doc
COPYRIGHT 

2008 BY DIGITAL-LOGIC AG
This publication is protected by copyright and all rights are reserved. No part of this document may be
reproduced, transmitted, transcribed or stored in a retrieval system, in any form or by any means, electronic,
mechanical, optical, manual, or otherwise, without the prior written permission of DIGITAL-LOGIC AG.
The software described herein, together with this document, are furnished under a license agreement and
may be used or copied only in accordance with the terms of that agreement.
About this Manual and How to Use It
This manual is written for the original equipment manufacturer (OEM) who plans to build computer systems
based on the single board MICROSPACE-PC. It is for integrators and programmers of systems based on the
MICROSPACE-Computer family. This manual provides instructions for installing and configuring the board,
and describes the system and setup requirements. This document contains information on hardware
requirements, interconnections, and details of how to program the system. Please check the Product CD for
further information and manuals.
REVISION HISTORY:
Document
Version
Date/Initials: Modification:
Remarks, News, Attention:
V1.0 04.2008 KUF New release of the DK manual
V1.0A 05.2008 DAR Chapter 12.2
V1.1 05.2008 KUF Added Signal Definitions / Corrections to Integration Checklist /
Interfaces supplemented
V1.2 05.2008 KUF SUSC specified, program example for GPIO30/31/34 in 13.7.
V1.2A 05.2008 KUF Detail corrections. Checked all voltagelevels on X200.
V1.2B 05.2008 KUF Data sheets from Intel and PULSE added
Attention!
1. All information in this manual, and the product, are subject to change without prior notice.
2. Read this manual prior to installation of the product.
3. Read the security information carefully prior to installation of the product.

DIGITAL-LOGIC AG SM800/900DK Technical Manual V1.2B
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Table of Contents
1. PREFACE .....................................................................................................................................................5
1.1. Trademarks ..................................................................................................................................... 5
1.2. Disclaimer ....................................................................................................................................... 5
1.3. Environmental Protection Statement ........................................................................................... 5
1.4. Who should use this Product ....................................................................................................... 5
1.5. Recycling Information.................................................................................................................... 6
1.6. Technical Support .......................................................................................................................... 6
1.7. Limited Two Year Warranty........................................................................................................... 6
1.8. Explanation of Symbols................................................................................................................. 7
1.9. Applicable Documents and Standards ........................................................................................ 8
1.10. For Your Safety............................................................................................................................... 9
1.11. RoHS Commitment......................................................................................................................... 9
1.11.1. RoHS Compatible Product Design ........................................................................................ 10
1.11.2. RoHS Compliant Production Process ................................................................................... 10
1.11.3. WEEE Application.................................................................................................................. 10
1.12. Swiss Quality ................................................................................................................................ 11
1.13. The Swiss Association for Quality and Management Systems............................................... 11
2. OVERVIEW .................................................................................................................................................12
2.1. Packing List .................................................................................................................................. 12
2.2. Features......................................................................................................................................... 13
2.3. Block Diagrams ............................................................................................................................ 14
2.3.1. MSEBX800/900 ..................................................................................................................... 14
2.3.2. SM800/900 ............................................................................................................................ 15
2.4. Ordering Information ................................................................................................................... 15
2.5. Specifications ............................................................................................................................... 16
3. SYSTEM PREPARATION...............................................................................................................................17
3.1. Important Information .................................................................................................................. 17
3.2. Print Detailed Information from the CD...................................................................................... 17
3.3. Power & Reset Buttons................................................................................................................ 18
3.4. smartModule Replacement ......................................................................................................... 18
3.4.1. Tools Needed ........................................................................................................................ 18
3.4.2. Removing the smartModule................................................................................................... 19
3.4.3. Mounting the smartModule .................................................................................................... 21
4. DESCRIPTION AND LOCATION OF THE CONNECTORS ....................................................................................22
4.1. Connector Plan............................................................................................................................. 23
4.2. Connector Descriptions............................................................................................................... 24
5. JUMPER LOCATIONS ON THE BOARD ...........................................................................................................35
5.1. The 2pin Jumpers......................................................................................................................... 35
5.2. The 3pin Jumpers......................................................................................................................... 35
5.3. Jumpers on the MSEBX800......................................................................................................... 36
5.4. LED Type, Reference and Function............................................................................................ 37
6. DRIVER INSTALLATION................................................................................................................................38
7. SOFTWARE ................................................................................................................................................38
8. SPECIAL PERIPHERALS,CONFIGURATIONS,SOFTWARE...............................................................................38
9. BIOS ........................................................................................................................................................38
9.1. Core BIOS Download ................................................................................................................... 39
9.2. BIOS Recovery ............................................................................................................................. 40
10. DIAGNOSTICS ........................................................................................................................................41
10.1. Post Codes.................................................................................................................................... 41
11. SMARTMODULE ACCESSIBLE DK FEATURES...........................................................................................45
12. DESIGN-IN WITH THE SMARTMODULE .....................................................................................................46
12.1. Mechanical Dimensions of the SM800/900PC/X........................................................................ 46
12.1.1. Mechanical PCB Pad Dimensions on the Carrier Board ....................................................... 47
12.1.2. PCB to SM800/900PC/X Height ............................................................................................ 48
12.1.3. Mechanical Dimensions of the PCB Plug .............................................................................. 49

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12.1.4. Mechanical Dimensions of the SM800/900PC/X Receptacle ............................................... 50
12.2. The PCB Orientation of the smart480 Bus................................................................................. 51
12.3. The smart480 Bus for the SM800/900PC.................................................................................... 52
12.4. Signal Definitions ......................................................................................................................... 58
12.4.1. Supply Inputs to the Module .................................................................................................. 58
12.4.2. Supply Outputs from the Module ........................................................................................... 58
12.4.3. Clock Outputs of the Module ................................................................................................. 58
12.4.4. Reset Outputs of the Module................................................................................................. 58
12.4.5. Reset Inputs of the Module.................................................................................................... 59
12.4.6. LPC Bus of the Module.......................................................................................................... 59
12.4.7. Suspend Outputs of the Module............................................................................................ 59
12.4.8. PM Controller In-Circuit Programming Signals...................................................................... 60
12.4.9. JTAG Interface of the Module................................................................................................ 60
12.4.10. ISA Bus of the Module....................................................................................................... 60
12.4.11. AC97 Bus of the Module ................................................................................................... 60
12.4.12. SMB/I2C Bus of the Module.............................................................................................. 61
12.4.13. PCI Bus of the Module ...................................................................................................... 61
12.4.14. LAN Interface of the Module ............................................................................................. 61
12.4.15. USB Interface of the Module ............................................................................................. 61
12.4.16. GPIOxx Interface of the Module........................................................................................ 62
12.4.17. COM1/2 Interface of the Module ....................................................................................... 62
12.4.18. LPT Interface of the Module.............................................................................................. 62
12.4.19. PS2 Interface of the Module.............................................................................................. 62
12.4.20. IDE Interface of the Module .............................................................................................. 63
12.4.21. VGA Interface of the Module............................................................................................. 63
12.4.22. LCD Interface of the Module ............................................................................................. 63
12.4.23. Floppy-Interface of the Module ......................................................................................... 64
12.4.24. VideoIn Interface of the Module ........................................................................................ 64
12.4.25. LCD Interface Signal / Color Definition ............................................................................. 65
12.4.26. CRT Monitor Signal Definition........................................................................................... 65
13. DESIGN RULES FOR INTEGRATION ..........................................................................................................66
13.1. Start up/Power off Procedure ..................................................................................................... 67
13.1.1. AUTOSTART Mode (Default) ................................................................................................ 67
13.1.2. ATX-START Mode................................................................................................................. 67
13.1.3. The ATX-Power for VCC ....................................................................................................... 68
13.1.4. Power Planes......................................................................................................................... 69
13.2. Integration Checklist.................................................................................................................... 70
13.3. PCI-Bus.......................................................................................................................................... 72
13.3.1. PCI Bus Signals..................................................................................................................... 72
13.3.2. Design Considerations .......................................................................................................... 72
13.3.3. PCI Signal Descriptions......................................................................................................... 73
13.3.4. PCI Slot Assignment.............................................................................................................. 74
13.4. Clocks............................................................................................................................................ 75
13.4.1. Clock Layout Guidelines........................................................................................................ 75
13.5. ITP / JTAG Signals ....................................................................................................................... 75
13.6. ISA Bus Signals............................................................................................................................ 76
13.7. Interfaces ...................................................................................................................................... 77
13.7.1. USB Interface ........................................................................................................................ 77
13.7.2. LAN Signals ........................................................................................................................... 79
13.7.3. IDE Interface.......................................................................................................................... 82
13.7.4. Serial COM1/2 Interface ........................................................................................................ 83
13.7.5. Parallel Interface.................................................................................................................... 83
13.7.6. Floppy Interface ..................................................................................................................... 83
13.7.7. PS/2-Keyboard/Mouse Interface ........................................................................................... 83
13.7.8. VGA Interface ........................................................................................................................ 83
13.7.9. AC’97 Sound Interface .......................................................................................................... 84
13.7.10. Programming the GPIO30/31/34 signals .......................................................................... 85
14. SCHEMATICS SM800/900PC DEVELOPMENT KIT....................................................................................88
15. INDEX ..................................................................................................................................................102

DIGITAL-LOGIC AG SM800/900DK Technical Manual V1.2B
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1. PREFACE
The information contained in this manual has been carefully checked and is believed to be accurate; it is
subject to change without notice. Product advances mean that some specifications may have changed.
DIGITAL-LOGIC AG assumes no responsibility for any inaccuracies, or the consequences thereof, that may
appear in this manual. Furthermore, DIGITAL-LOGIC AG does not accept any liability arising from the use or
application of any circuit or product described herein.
1.1. Trademarks
DIGITAL-LOGIC, DIGITAL-LOGIC-Logo, MICROSPACE, and smartModule are registered trademarks
owned worldwide by DIGITAL-LOGIC AG, Luterbach (Switzerland). In addition, this document may include
names, company logos, and registered trademarks which are, therefore, proprietary to their respective
owners.
1.2. Disclaimer
DIGITAL-LOGIC AG makes no representations or warranties with respect to the contents of this manual, and
specifically disclaims any implied warranty of merchantability or fitness, for any particular purpose. DIGITAL-
LOGIC AG shall, under no circumstances, be liable for incidental or consequential damages or related
expenses resulting from the use of this product, even if it has been notified of the possibility of such damage.
1.3. Environmental Protection Statement
This product has been manufactured to satisfy environmental protection requirements wherever possible.
Many of the components used (structural parts, printed circuit boards, connectors, batteries, etc.) are
capable of being recycled. Final disposal of this product after its service life must be accomplished in
accordance with applicable country, state, or local laws or regulations.
1.4. Who should use this Product
Electrical engineers with know-how in PC-technology.
Because of the complexity and the variability of PC-technology, we cannot guarantee that the product
will work in any particular situation or set-up. Our technical support will try to help you find a solution.
Pay attention to electrostatic discharges; use a CMOS protected workplace.
Power supply must be OFF when working on the board or connecting any cables or devices.

DIGITAL-LOGIC AG SM800/900DK Technical Manual V1.2B
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1.5. Recycling Information
All components within this product fulfill the requirements of the RoHS (Restriction of Hazardous Substances
Directive). The product is soldered with a lead free process.
1.6. Technical Support
1. Contact your local DIGITAL-LOGIC Technical Support, in your country.
2. Use the Internet Support Request form at http://support.digitallogic.ch/ embedded products New
Support Request
Support requests are only accepted with detailed information about the product (i.e., BIOS-, Board-
version)!
1.7. Limited Two Year Warranty
DIGITAL-LOGIC AG guarantees the hardware and software products it manufactures and produces to be
free from defects in materials and workmanship for two years following the date of shipment from DIGITAL-
LOGIC AG, Switzerland. This warranty is limited to the original purchaser of the product and is not
transferable.
During the two year warranty period, DIGITAL-LOGIC AG will repair or replace, at its discretion, any
defective product or part at no additional charge, provided that the product is returned, shipping prepaid, to
DIGITAL-LOGIC AG. All replaced parts and products become property of DIGITAL-LOGIC AG.
Before returning any product for repair, direct customers of DIGITAL-LOGIC AG, Switzerland
are required to register a RMA (Return Material Authorization) number in the Support Center at
http://support.digitallogic.ch/
All other customers must contact their local distributors for returning defective materials.
This limited warranty does not extend to any product which has been damaged as a result of accident,
misuse, abuse (such as use of incorrect input voltages, wrong cabling, wrong polarity, improper or
insufficient ventilation, failure to follow the operating instructions that are provided by DIGITAL-LOGIC AG or
other contingencies beyond the control of DIGITAL-LOGIC AG), wrong connection, wrong information or as
a result of service or modification by anyone other than DIGITAL-LOGIC AG. Nor if the user has insufficient
knowledge of these technologies or has not consulted the product manuals or the technical support of
DIGITAL-LOGIC AG and therefore the product has been damaged.
Empty batteries (external and onboard), as well as all other battery failures, are not covered by this
manufacturer’s limited warranty.
Except, as directly set forth above, no other warranties are expressed or implied, including, but not limited to,
any implied warranty of merchantability and fitness for a particular purpose, and DIGITAL-LOGIC AG
expressly disclaims all warranties not stated herein. Under no circumstances will DIGITAL-LOGIC AG be
liable to the purchaser or any user for any damage, including any incidental or consequential damage,
expenses, lost profits, lost savings, or other damages arising out of the use or inability to use the product.

DIGITAL-LOGIC AG SM800/900DK Technical Manual V1.2B
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1.8. Explanation of Symbols
CE Conformity
This symbol indicates that the product described in this manual is in compliance with all
applied CE standards.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your equipment.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 32V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your equipment
Warning, ESD Sensitive Device!
This symbol and title inform that electronic boards and their components are sensitive to
Electro Static Discharge (ESD). In order to ensure product integrity at all times, care must
always be taken while handling and examining this product.
Attention!
This symbol and title emphasize points which, if not fully understood and taken into
consideration by the reader, may endanger your health and/or result in damage to your
equipment.
Note...
This symbol and title emphasize aspects the user should read through carefully for his, or
her, own advantage.
Warning, Heat Sensitive Device!
This symbol indicates a heat sensitive component.
Safety Instructions
This symbol shows safety instructions for the operator to follow.
This symbol warns of general hazards from mechanical, electrical, and/or
chemical failure. This may endanger your life/health and/or result in damage
to your equipment.

DIGITAL-LOGIC AG SM800/900DK Technical Manual V1.2B
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1.9. Applicable Documents and Standards
The following publications are used in conjunction with this manual. When any of the referenced
specifications are superseded by an approved revision, that revision shall apply. All documents may be
obtained from their respective organizations.
Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright
© 1996-2003 Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix
Technologies Ltd., Toshiba Corporation. All rights reserved. http://www.acpi.info/
ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS)
Interface Circuits, January 1, 2001. http://www.ansi.org/
ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002.
http://www.ansi.org/
ANSI INCITS 376-2003: American National Standard for Information Technology – Serial Attached
SCSI (SAS), October 30, 2003. http://www.ansi.org/
Audio Codec ’97 Revision 2.3 Revision 1.0, April 2002 Copyright © 2002 Intel Corporation. All rights
reserved. http://www.intel.com/labs/media/audio/
Display Data Channel Command Interface (DDC/CI) Standard (formerly DDC2Bi) Version 1, August
14, 1998 Copyright © 1998 Video Electronics Standards Association. All rights reserved.
http://www.vesa.org/summary/sumddcci.htm
ExpressCard Standard Release 1.0, December 2003 Copyright © 2003 PCMCIA. All rights reserved.
http://www.expresscard.org/
IEEE 802.3-2002, IEEE Standard for Information technology, Telecommunications and information
exchange between systems–Local and metropolitan area networks–Specific requirements – Part 3:
Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical
Layer Specifications. http://www.ieee.org
IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision
Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access
Control (MAC) Parameters, Physical Layers, and Management Parameters for 10 GB/s Operation.
http://www.ieee.org
Intel Low Pin Count (LPC) Interface Specification Revision 1.1, August 2002 Copyright © 2002 Intel
Corporation. All rights reserved. http://developer.intel.com/design/chipsets/industry/lpc.htm
PCI Express Base Specification Revision 1.1, March 28, 2005, Copyright © 2002-2005 PCI Special
Interest Group. All rights reserved. http://www.pcisig.com/
PCI Express Card Electromechanical Specification Revision 1.1, March 28, 2005, Copyright © 2002-
2005 PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
PCI Local Bus Specification Revision 2.3, March 29, 2002 Copyright © 1992, 1993, 1995, 1998, 2002
PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
PCI-104 Specification, Version V1.0, November 2003. All rights reserved. http://www.pc104.org
PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004,
PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500,
Wakefield, MA 01880, USA, Tel: [phone], Fax: [phone]. http://www.picmg.org/
Serial ATA: High Speed Serialized AT Attachment Revision 1.0a January 7, 2003 Copyright © 2000-
2003, APT Technologies, Inc, Dell Computer Corporation, Intel Corporation, Maxtor Corporation,
Seagate Technology LLC. All rights reserved. http://www.sata-io.org/

DIGITAL-LOGIC AG SM800/900DK Technical Manual V1.2B
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Smart Battery Data Specification Revision 1.1, December 11, 1998. www.sbs-forum.org
System Management Bus (SMBus) Specification Version 2.0, August 3, 2000 Copyright © 1994, 1995,
1998, 2000 Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear
Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, Power-
Smart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved.
http://www.smbus.org/
Universal Serial Bus Specification Revision 2.0, April 27, 2000 Copyright © 2000 Compaq Computer
Corporation, Hewlett-Packard Company, Intel Corporation, Lucent Technologies Inc., Microsoft
Corporation, NEC Corporation, Koninklijke Philips Electronics N.V. All rights reserved.
http://www.usb.org/
1.10. For Your Safety
Your new DIGITAL-LOGIC product was developed and tested carefully to provide all features
necessary to ensure its compliance with electrical safety requirements. It was also designed for a
long, fault-free life. However, this life expectancy can be drastically reduced by improper treatment
during unpacking and installation. Therefore, in the interest of your own safety and for the correct
operation of your new DIGITAL-LOGIC product, please comply with the following guidelines.
Attention!
All work on this device must only be carried out by sufficiently skilled personnel.
Caution, Electric Shock!
Before installing your new DIGITAL-LOGIC product, always ensure that your mains power is
switched off. This applies also to the installation of piggybacks or peripherals. Serious
electrical shock hazards can exist during all installation, repair and maintenance operations
with this product. Therefore, always unplug the power cable and any other cables which
provide external voltage before performing work.
Warning, ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. In order to ensure
product integrity at all times, be careful during all handling and examinations of this product.
1.11. RoHS Commitment
DIGITAL-LOGIC AG is committed to develop and produce environmentally friendly products according to the
Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC) and the Waste Electrical and Electronic
Equipment (WEEE) Directive (2002/96/EC) established by the European Union. The RoHS directive was
adopted in February 2003 by the European Union and came into effect on July 1, 2006. It is not a law but a
directive, which restricts the use of six hazardous materials in the manufacturing of various types of
electronic and electrical equipment. It is closely linked with the Waste Electrical and Electronic Equipment
Directive (WEEE) 2002/96/EC, which has set targets for collection, recycling and recovery of electrical goods
and is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste.
Each European Union member state is adopting its own enforcement and implementation policies using the
directive as a guide. Therefore, there could be as many different versions of the law as there are states in
the EU. Additionally, non-EU countries like China, Japan, or states in the U.S. such as California may have
their own regulations for green products, which are similar, but not identical, to the RoHS directive.

DIGITAL-LOGIC AG SM800/900DK Technical Manual V1.2B
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RoHS is often referred to as the "lead-free" directive but it restricts the use of the following substances:
Lead
Mercury
Cadmium
Chromium VI
PBB and PBDE
The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for
Cadmium, which is limited to 0.01%) by weight of homogeneous material. This means that the limits do not
apply to the weight of the finished product, or even to a component but to any single substance that could
(theoretically) be separated mechanically.
1.11.1. RoHS Compatible Product Design
All DIGITAL-LOGIC standard products comply with RoHS legislation.
Since July 1, 2006, there has been a strict adherence to the use of RoHS compliant electronic and
mechanical components during the design-in phase of all DIGITAL-LOGIC standard products.
1.11.2. RoHS Compliant Production Process
DIGITAL-LOGIC selects external suppliers that are capable of producing RoHS compliant devices. These
capabilities are verified by:
1. A confirmation from the supplier indicating that their production processes and resulting devices are
RoHS compliant.
2. If there is any doubt of the RoHS compliancy, the concentration of the previously mentioned
substances in a produced device will be measured. These measurements are carried out by an
accredited laboratory.
1.11.3. WEEE Application
The WEEE directive is closely related to the RoHS directive and applies to the following devices:
Large and small household appliances
IT equipment
Telecommunications equipment (although infrastructure equipment is exempt in some countries)
Consumer equipment
Lighting equipment – including light bulbs
Electronic and electrical tools
Toys, leisure and sports equipment
Automatic dispensers
It does not apply to fixed industrial plants and tools. The compliance is the responsibility of the company that
brings the product to market, as defined in the directive. Components and sub-assemblies are not subject to
product compliance. In other words, since DIGITAL-LOGIC does not deliver ready-made products to end
users the WEEE directive is not applicable for DIGITAL-LOGIC. Users are nevertheless encouraged to
properly recycle all electronic products that have reached the end of their life cycle.

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1.12. Swiss Quality
100% Made in Switzerland
DIGITAL-LOGIC is a member of "Swiss-Label"
This product was not manufactured by employees earning
piecework wages
This product was manufactured in humane work conditions
All employees who worked on this product are paid
customary Swiss market wages and are insured
ISO 9000:2001 (quality management system)
1.13. The Swiss Association for Quality and Management
Systems
The Swiss Association for Quality and Management Systems (SQS) provides certification and assessment
services for all types of industries and services. SQS certificates are accepted worldwide thanks to
accreditation by the Swiss Accreditation Service (SAS), active membership in the International Certification
Network, IQNet, and co-operation contracts/agreements with accredited partners.
www.sqs.ch
The SQS Certificate ISO 9001:2000 has been issued to DIGITAL-LOGIC AG, the entire company, in the field
of development, manufacturing and sales of embedded computer boards, embedded computer modules and
computer systems. The certification is valid for three years at which time an audit is performed for
recertification.

DIGITAL-LOGIC AG SM800/900DK Technical Manual V1.2B
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2. OVERVIEW
2.1. Packing List
After opening the package, check that the following items
are inside the carrying case:
1. The SM800/900 DK:
a. an SM800/900 with passive cooler mounted on
b. an MSEBX board mounted on
c. the DK housing, incl. HDD, FD, CD/DVD drive
d. including the floppy and IDE cables
2. External power supply with cabling.
3. The User Manual.
4. The Product CD containing other manuals, drivers,
software, schematics, etc.
5. A jumper set: 5x 2.54mm and 5x 2mm.
6. Part Nr. 802051, the PC/104 spacer kit.
7. An MSCF (CompactFlash adapter) with IDE cable.
Contents of the DK:

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2.2. Features
External power supply in a metal housing
Standard ATX power supply 110/220V 60/50Hz
Including 3.5 inch floppy disk
SM480 interface to smartModule including SM800/900PC/X
Standard PC/AT connectors such as:
o2x dual USB
oPS/2 connectors for mouse and keyboard
oDSUB15 VGA and LCD connector
oTwo serial port DSUB9 connectors for Serial ports 1 and 2
oLAN RJ-45 ethernet connection
oLPT1 DSUB26 parallel port
oMicro-floppy connection
oHard drive 3.5 inch (40 pin) and 2.5 inch (44 pin) connector with optional flash card connector
oBuzzer
oIRDA (infrared port)
Peripheral extension possibility like
oPC/104 ISA slot for peripheral ISA extension
oPC/104+ PCI slot for peripheral PCI extension
oStandard PCI slot for peripheral PCI extension
oIntel Ethernet LAN chip 82559ER on DK for Smart Module without LAN
Debugging code (POST address ISA 80hex)
Power management and battery feature
oBattery for RTC and CMOS
oReset, LID and power switch
BIOS test possibility (for VGA and CORE)
oSelectable BIOS source for VGA and CORE BIOS (on the DK or on the smartModule)

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2.3. Block Diagrams
2.3.1. MSEBX800/900

DIGITAL-LOGIC AG SM800/900DK Technical Manual V1.2B
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2.3.2. SM800/900
2.4. Ordering Information
Part / Option Part Nr. Comments
SM800DK 805220 Incl. SM800PC and 512MB RAM
For current ordering information, please see the current price list.

DIGITAL-LOGIC AG SM800/900DK Technical Manual V1.2B
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2.5. Specifications
BUS Specification
Standard SM480
Size and Type Embedded smart480 Bus
Standard PCI
Size and Type PCI multiplexed 32bit Address/Data Bus
Standard PC/104
Size and Type IEEE-996 standard bus, buffered
Standard PC/104+
Size and Type PCI multiplexed 32bit Address/Data Bus
BIOS Specification
Standard Present on the smartModule
Available Can be updated from DK
Power Supply Specification
Power supply, external Brand: Delta Electronics INC
Model: DSP-300AB-9 C REV: 02F
Input: 100-127VAC / 6A or 200-240VAC / 3A (50-60Hz)
Output: 12V1/11A; 12V2/14.5A; 12V/0.4A; +3.3V/18A; +5V/18A; +5VSB/2A
Power supply onboard 12V
5V
Interface Specification
FD Floppy Disk Interface, 26pin
IDE IDE Interface, 44pin
VGA DSUB connector 15pin
LCD 50pin 36bit LCD interface
COM1 Serial Interface Connector DSUB 9pin
COM2 Serial Interface Connector DSUB 9pin
LPT1 Parallel Port Interface DSUB 25pin
Keyboard PS/2 Keyboard Connector
Mouse PS/2 Mouse Connector
USB Dual USB Connector
LAN RJ-45 LAN Connector
PCI Standard PCI V2.1 connector
PC/104+ PCI interface PC/104+
PC/104 ISA interface PC/104
IRDA Infrared port
Physical Characteristics
Specification PC/104plus
Dimensions
Length:
220mm
Depth:
150mm
Height:
3mm
Operating Environment Specification
Relative Humidity 5 - 90% non-condensing
Vibration 5 to 2000Hz
Shock 10G
Temperature, operating Standard version: -25°C to +70°C
Industrial version: -25°C to +85°C (ask DIGITAL-LOGIC AG)
Temperature, storage -55°C to +85°C

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3. SYSTEM PREPARATION
3.1. Important Information
Warning, ESD Sensitive Device!
Place the embedded computer board on an isolated, ESD-protected surface. Also ensure that all
equipment, tools and people are fully protected against ESD.
Note…
1. The IDE cable connects both the hard drive and CD/DVD drive. Therefore, disconnecting
the IDE cable will disconnect both devices.
2. The floppy cable connects to a Micro-floppy drive.
Attention!
The smartModule must be firmly attached to the board with screws. Do not attempt to
power-up the system without taking this step or the system may not work and you risk damaging
the equipment! See Section 3.4.2 for photos and full description of how to assemble/disassemble
the smartModule.
3.2. Print Detailed Information from the CD
Note…
Place the Product-CD into the CD-Drive of a personal computer with a connected printer.
Open the CD; open the directory SM800-900DK.
Print out the following detailed manual:
The driver/software/BIOS manual: GEODE_LX800-900.pdf
The schematics, found in a separate file on the Product CD, may also be printed.

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3.3. Power & Reset Buttons
Power Button: Push the Power Button for 2 seconds to start up the system.
Reset Button: Should the system hang, press the Reset Button.
3.4. smartModule Replacement
3.4.1. Tools Needed
Phillips head screwdriver, 1-80 Ph
Wrench/spanner, size 6

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3.4.2. Removing the smartModule
1. Disconnect the floppy cable (marked as 1 on Photo 1).
2. Disconnect the IDE cable (marked as 2 on Photo 1).
3. Loosen and remove the 4 Phillips head screws at the corners (circled in red and marked "3" on
Photo 1, the one marked with an asterisk is almost not visible as it is hidden beneath the IDE cable).
4. Loosen and remove the 4 bolts which may be used to attach PC104 boards (circled in yellow and
marked "4" on Photo 1).
Photo 1:

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5. Lift the MSEBX board and place it upside down as in Photo 2.
6. Loosen and remove the 4 Phillips head screws which are holding the smartModule in place (on the
opposite side). These screws are circled in green and marked "6" on Photo 2.
7. Remove the smartModule.
Photo 2: