Ebyte MBL Series User manual

MBL Series Evaluation Kit User Manual
Next generation package-compatible S ub-1G wireless module
E220-400MBL-01

Chengdu Ebyte Electronic Technology Co.,Ltd. MBL test board User Manual
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Contents
DISCLAIMER ............................................................................................................................................ 2
CHAPTER 1 PRODUCT OVERVIEW................................................................................................. 3
1.1 PRODUCT INTRODUCTION ....................................................................................................................................................................3
1.2 SIZE AND INTERFACE DESCRIPTION ................................................................................................................................................... 3
1.3 SUPPORT MATRIX ...................................................................................................................................................................................4
CHAPTER 2 INTRODUCTION TO SOFTWARE ............................................................................. 5
2.1 DIRECTORY STRUCTURE .......................................................................................................................................................................5
2.2 IAR ENGINEERING .................................................................................................................................................................................7
2.3 MAIN FUNCTIONS ...................................................................................................................................................................................8
2.4 SENDING AND RECEIVING TIMING .................................................................................................................................................... 8
2.5 PROGRAMMING .................................................................................................................................................................................... 10
CHAPTER 3 QUICK PRESENTATION............................................................................................ 12
3.1 SIGNAL LINE CONNECTION ................................................................................................................................................................12
3.2 SERIAL PORT ASSISTANT .................................................................................................................................................................... 13
CHAPTER IV FREQUENTLY ASKED QUESTIONS .................................................................... 14
4.1 THE TRANSMISSION DISTANCE IS NOT IDEAL ................................................................................................................................14
4.2 MODULES ARE EASILY DAMAGED ....................................................................................................................................................14
4.3 THE BIT ERROR RATE IS TOO HIGH ...................................................................................................................................................14
REVISION HISTORY ............................................................................................................................ 15
ABOUT US ................................................................................................................................................15

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Disclaimer
EBYTE reserves all rights to this document and the information contained herein.
Products, names, logos and designs described herein may in whole or in part be
subject to intellectual property rights. Reproduction, use, modification or disclosure to
third parties of this document or any part thereof without the express permission of
EBYTE is strictly prohibited.
The information contained herein is provided “as is” and EBYTE assumes no liability
for the use of the information. No warranty, either express or implied, is given,
including but not limited, with respect to the accuracy, correctness, reliability and
fitness for a particular purpose of the information. This document may be revised by
EBYTE at any time. For most recent documents, visit www.ebyte.com.

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Chapter 1 Product Overview
1.1 Product Introduction
The MBL series evaluation kits are designed to help users quickly evaluate Ebait's next-generation package-compatible wireless
modules. Most of the pins on the board are led out to the pin headers on both sides, making it easy for developers to connect a variety
of peripherals via jumpers to their needs.
The kit provides complete software application examples to help customers get started quickly with wireless data communication
development. Different types of Sub-1G wireless modules can be loaded on board according to customer needs. Supported
modules are available in pin-compatible packages for quick replacement.
1.2 Size and interface description

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1.3 Support Matrix
Pin serial number
definition
Function description
1
VCC
The module power supply pin needs to be shorted
to pin 2 to power the module
2
3.3V
3.3V electrical lead pin
3
3.3V
3.3V electrical lead pin
4
SAW
The MCU power supply pin needs to be shorted to
pin 3 to power the MCU
5
GND
Bottom plate reference
6
RIS
MCU external reset pin
7
SWIM
The SWIM pin of the MCU
8
SAW
MCU supply pin
9
PC0
Module reset pin
10
PB7
Module MISO pin
11
PB6
Module MOSI pin
12
PB5
Module SCLK pin
13
PB4
Module NSS pin
14
TXD
MCU serial port TXD
15
RXD
MCU serial port RXD
16
M1
Module mode switch pin (see module data sheet
for details)
17
GND
Bottom plate reference
18
M0
Module mode switch pin (see module data sheet
for details)
19
GND
Bottom plate reference

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RF solutions
manufacturer
Module model
1
CC1101
Texas Instruments
E07-400M10S
2
CC1101
Texas Instruments
E07-900M10S
3
SI4438
Silicon Labs
E30-400M20S
4
SI4463
Silicon Labs
E30-900M20S
5
LLCC68
Semtech
E220-400M22S
6
LLCC68
Semtech
E220-900M22S
7
SX1278
Semtech
E32-400M20S
8
SX1276
Semtech
E32-900M20S
9
SX1268
Semtech
E22-400M22S
10
SX1262
Semtech
E22-900M22S
11
AX5243
ON Semiconductor
E31-400M17S
12
LLCC68
Semtech
E220-400MM22S
13
LLCC68
Semtech
E220-900MM22S
Chapter 2 Introduction to Software
2.1 Directory Structure
Matters
illustrate
1
File directory
You can download the sample project from the official website and open the directory as
shown in the following figure
2
Table of
contents
description
You can use the IARFor STM8 development environment to locate the entry file to open the
project

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2.2 IAR engineering
Matters
illustrate
Engineering
structure
Open the project using the IAR For STM8 development environment to see the basic
structure
Switch
workspaces
The C/C++ Compiler option defines global macro definitions and file paths to
distinguish driver files from different modules. When switching workspaces, different macro
definitions are used, switching the driver files for different modules
Changed the Exclude from build property of Drivers/Ebyte/RF to select the target
module driver folder to participate in the compilation process. Changed the additional
include in the project C/C++ Compiler, which specifies the path to the module driver file.
Changed the Defined symbols in the project C/C++ Compiler, which defines global macro
definitions to help configure module-driven properties.

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2.3 Main functions
main.c is the main function entry. The demo feature flow simplifies the process as follows:
Matters
illustrate
1
Key function
If a button is pressed, the command data will be sent wirelessly. Essentially, sending a
specific string "ping" and expecting to receive a response "pong"
2
Serial port data to
wireless sending
After the serial port receives the data, it automatically starts wireless transparent
transmission of data, of course, it contains some special instruction responses, which
are mainly used for special tests and can be ignored by users. After the sending is
complete, the user function is automatically called, so that the sending logic is handled
by itself.
3
Receive data wirelessly
Generally, the internal state ID of the module is read to determine whether there is
data, and the underlying driver will copy the data and pass it to the user callback
function, so as to handle the receiving logic by itself
The software process simplification is shown in the following diagram:
2.4 Sending and Receiving Timing
Wireless modules have multiple operating states and can only complete specific functions in the corresponding state.
From the simplest sending and receiving data, only the sending mode and receiving mode are considered.
Matters
illustrate
1
Receive mode
After the default initialization is completed, it automatically enters receive mode.
Essentially, the receive function is called in initialization, thus entering receive mode.
If you need to consider entering other modes after initialization, such as sleep, you
can simply replace it with a function of the same type Go_xxxxx().
2
Send mode
When calling the transmit function, the underlying driver actually switches the module
into standby mode first, usually in this mode to complete the configuration of
modulation parameters, such as frequency, power, frequency offset, and so on. After

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the parameters are configured correctly, gradually enter some intermediate modes, turn
on internal FIFO, PA, external XTAL, etc., and the current consumption also gradually
increases. Finally, it switches into transmit mode, triggering wireless data
transmission. After completion, the module enters standby mode, and cannot continue
to send and receive in this state, and the user needs to handle the next mode by himself
in the callback function. When the function is complex, continuous reception or
continuous transmission is required, please further switch other modes according to
the characteristics of the chip.
The timing diagram looks like this:

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2.5 Programming
file
Key notes
1
ebyte_core.h
A module structure is defined, abstracting the basic functionality to which the
functions of the underlying module will be bound. When used for simple sending and
receiving applications, there is no need to understand the low-level working details of
each module, and you can directly call the abstract function to start sending and receiving
data. If you need to customize some functionality, you can also consider integrating it into
the structure. If you know enough about the functional functions of the underlying
module, you can also directly remove the ebyte_core.c/h file, and there is no strong
coupling between layers.
2
ebyte_exx.c
It is a specific module driver file, which is generally encapsulated and does not
require users to change, only needs to consider how to input and output data from this
"box".
3
ebyte_port.c
It is specially designed to bind SPI and GPIO under different hardware platforms,
abstracted as "box" inputs. Users need to fill in the communication interfaces in their
hardware platform to fixed locations according to comments. In general, it provides the
transceiver function of the SPI and the level control of the pins. Some modules are slightly
special, such as E49 uses half-duplex SPI, if you are too lazy to write the communication
driver, then directly bind the IO to a fixed position, and the rest is left to the module driver
to simulate IO to achieve communication. As shown in the following figure, the SPI
interface location is required to fill in the specific transceiver function in the comment,
and the data is sent by send to SPI and the result returns to SPI Receive data.
ebyte_callback.c
It is specially used to bind the user's own sending and receiving logic, abstracted into
the output of the "box". Essentially, a module driver is to directly call the user's callback
function after determining that the send or receive is complete. As shown in the following

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figure, the user's logical function can be filled in the To-do prompt position. state is
driven out by the module, which is actually handled by the Exx_GoTransmit() function,
and can be considered modified to support more cases when the functionality is complex.
ebyte_exx.h
Some general modulation parameters are defined, which generally do not need to be
modified and can be adjusted by themselves. Note that when modifying, please
understand the instructions in the comments, there is a range check for parameters in the
module driver, and incorrect modulation parameters will cause initialization failure. As
shown in the figure below, the FSK modulation parameters are example:
board.c
STM8 peripheral initialization, involving SPI, TIMER, GPIO, etc., is strongly coupled to
the hardware used.
board_button.c
The key event queue is a FIFO in terms of data structure. After the timer detects the
keystroke, it will save the corresponding event to the queue and wait for the main loop
response.
board_mini_printf.c
Simplified printf, although the function is shrunk, but the footprint is small. DEBUG
macros in the project mainly rely on the mprintf provided by this file.
ebyte_kfifo.c
For serial port data reception, optimized universal FIFO queue, suitable for cache.
ebyte_debug.c
It is used to connect to a PC for some tests and is generally not required.
stm8l15x_it.c
All interrupt function entries will be for serial ports, timers, button IO and other interrupt
service functions are concentrated here

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Chapter 3 Quick Presentation
3.1 Signal line connection
Matters
illustrate
1
Power jumper cap
2
Mode selection jumper
cap
3
auxiliary
USB cable, antenna, PC, etc

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3.2 Serial port assistant
Matters
illustrate
1
Device Manager
Check the serial port
number
2
Serial port software
3
Example of keystroke
communication
#RECV identifier, used only as a hint, to represent the data received by the wireless
module.
#SEND identifier, used only for hints, to represent the data sent by the wireless
module
4
Serial port data
transparent
transmission
Serial port data transmission directly transmits the required content through XCOM

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Chapter IV Frequently Asked Questions
4.1 The transmission distance is not ideal
When there is a straight-line communication barrier, the communication distance will be attenuated accordingly;
Temperature, humidity, and co-channel interference will lead to an increase in the communication packet loss rate;
The ground absorbs and reflects radio waves, and the test effect near the ground is poor;
Seawater has a strong ability to absorb radio waves, so the seaside test effect is poor;
If there is a metal object near the antenna, or placed in a metal case, the signal attenuation will be very serious;
the power register is set incorrectly, the air rate is set too high (the higher the air rate, the closer the distance);
The low voltage of the power supply at room temperature is lower than the recommended value, and the lower the voltage, the
smaller the power;
The antenna used is poorly matched to the module or the quality of the antenna itself.
4.2 Modules are easily damaged
Please check the power supply to ensure that between the recommended supply voltages, exceeding the maximum value will
cause permanent damage to the module;
Please check the stability of the power supply, the voltage cannot fluctuate greatly and frequently;
Please ensure that the installation and use process of anti-static operation, high-frequency devices electrostatic sensitivity;
Please ensure that the humidity during installation and use should not be too high, and some components are humidity sensitive
devices;
If there is no special need, it is not recommended to use it at too high or too low temperature.
4.3 The bit error rate is too high
There is co-channel signal interference nearby, stay away from the interference source or modify the frequency and channel to
avoid interference;
Unsatisfactory power supply may also cause garbled characters, be sure to ensure the reliability of the power supply;
Poor or long quality extension wires and feeders can also cause high bit error rates.

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Revision history
version
Revision date
Revision Instructions
Maintainers
1.0
2021-09-22
Initial version
CENTURY
1.1
2022-12-29
Modify the schematic diagram of the module and how to use it
HWJ
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