Ebyte EoRa PI User manual

EoRa PI User Manual
ESP32-S3 SX1268 SX1262 LoRa Spread Spectrum

Catalog
DISCLAIMER AND COPYRIGHT NOTICE...................................................................................................... 2
CHAPTER 1 PRODUCT OVERVIEW .................................................................................................................3
1.1 PRODUCT PROFILE ....................................................................................................................................................................................3
1.2 CHARACTERISTIC FUNCTIONS....................................................................................................................................................................3
1.3 APPLICATION SCENARIOS......................................................................................................................................................................... 4
CHAPTER 2 SPECIFICATIONS .....................................................................................................................5
2.1 LIMIT PARAMETERS ...................................................................................................................................................................................5
2.2 OPERATING PARAMETERS ........................................................................................................................................................................... 5
2.2.1 Parameters of the whole machine................................................................................................................................5
2.2.2 Wi-Fi parameters...................................................................................................................................................................5
2.2.2 BLE parameters....................................................................................................................................................................... 6
2.2.3 LoRa Parameters - EoRa-S3-400TB................................................................................................................................6
2.2.4 LoRa Parameters-EoRa-S3-900TB.....................................................................................................................................6
2.2.4 Internal LoRa module parameters................................................................................................................................7
CHAPTER 3 MECHANICAL DIMENSIONS AND PIN DEFINITIONS............................................................8
3.1 INTRODUCTION TO FUNCTIONAL COMPONENTS ..........................................................................................................................................8
3.2 GPIO PIN DEFINITION AND SIZE INTRODUCTION ...............................................................................................................................9
CHAPTER 4 BASIC PRODUCT USE INTRODUCTION .................................................................................11
4.1 PRODUCT USE DETAILS ......................................................................................................................................................................... 11
4.2 INTRODUCTION TO USING THE PRODUCT DEVELOPMENT ENVIRONMENT ..................................................................................................12
4.3 INTRODUCTION TO THE ROUTINES .........................................................................................................................................................14
4.4 ANTENNA INTERFACE SWITCHING.......................................................................................................................................................... 14
4.5 BATTERY CHARGING ................................................................................................................................................................................ 15
CHAPTER 5 HARDWARE DESIGN ................................................................................................................ 15
CHAPTER 6 FREQUENTLY ASKED QUESTIONS......................................................................................... 17
6.1 UNSATISFACTORY TRANSMISSION DISTANCE .......................................................................................................................................... 17
6.2 VULNERABILITY OF MODULES .................................................................................................................................................................17
6.3 BER TOO HIGH ...................................................................................................................................................................................... 17
CHAPTER 7 ANTENNA GUIDE .....................................................................................................................19

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REVISION HISTORY................................................................................................................................... 19
ABOUT US.................................................................................................................................................... 20

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Disclaimer and Copyright Notice
The information in this document, including the URL addresses for reference, is
subject to change without notice. this document is provided "as is" without warranty
of any kind, including any warranty of merchantability, fitness for a particular
purpose, or non-infringement, and any warranty that any proposal, specification, or
sample is referred to elsewhere. This document is provided without warranty of any
kind, including any warranty of merchantability, fitness for a particular purpose or
non-infringement, and any warranty mentioned elsewhere in any proposal, specification
or sample. This document does not grant any license, express or implied, by estoppel
or otherwise, to use any intellectual property.
The test data in this article are all obtained from EBYTE laboratory tests, and
the actual results may be slightly different.
All trade names, trademarks and registered trademarks mentioned herein are the
property of their respective owners and are hereby acknowledged.
The final explanation right belongs to Chengdu Yibert Electronic Technology Co.
Attention:
The contents of this manual are subject to change due to product version upgrade or other reasons. Ltd. reserves
the right to make changes to the contents of this manual without notice or prompting. Ltd. makes every effort
to provide accurate information in this manual, however, Chengdu EBYTE Electronic Technology Co., Ltd. does not
warrant that the contents of this manual are error-free, and all statements, information and recommendations in
this manual do not constitute any warranty, express or implied.

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Chapter 1 Product Overview
1.1 Product Profile
EoRa PI is based on Loxin ESP32-S3FH4R2 chip and EBYTE LoRa module and developed two development boards
EoRa-S3-400TB, EoRa-S3-900TB, development boards integrated Type-C interface, E22-400/900MM22S LoRa module,
0.96-inch OLED display, SD card slot, Li-ion battery charging circuit and its power circuit. slot, Li-ion battery
charging circuit and its power supply circuit.
The ESP32-S3 is a low-power MCU system-on-chip (SoC) that supports 2.4 GHz Wi-Fi and Bluetooth® LE wireless
communication. The chip integrates a high-performance Xtensa® 32-bit LX7 dual-core processor, an ultra-low-power
co-processor, Wi-Fi baseband, Bluetooth baseband, RF module, and peripherals up to 240 MHz, with 384 KB of ROM,
512 KB of SRAM, 16 KB of RTC SRAM, and 4 MB of FLASH and 2 MB of PSRAM in the ESP32-S3FH4R2 package. FLASH and
2 MB PSRAM are additionally integrated in the ESP32-S3FH4R2 package.
MCU datasheet link: ESP32-S3 Datasheet
LoRa module information link: E22-400MM22S User's Manual
LoRa chip datasheet link: Semtech SX126X Chip Brochure
1.2 Characteristic functions
The Xtensa® 32-bit LX7 dual-core processor with up to 240 MHz and an additional 4 MB of FLASH and 2 MB of
PSRAM are integrated in the package;
It also supports Wi-Fi and low-power Bluetooth, with a maximum output power of +21dBm for WIFI and +20dBm
for BLE, sharing a common antenna;
Wi-Fi: Supports IEEE 802.11b/g/n protocols, 20 MHz and 40 MHz bandwidths, 1T1R mode, and data rates up to
150 Mbps;
Wi-Fi: Supports Infrastructure BSS Station mode, SoftAP mode and Station + SoftAP mode;
Wi-Fi: Supports 802.11 mc FTM for high-precision indoor positioning;
Bluetooth LE: Supports rates of 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps;
Bluetooth LE: Supports Bluetooth 5, Bluetooth mesh;
E22-400MM22S: Adopts SX1268 chip, supports operating frequency 410 ~ 493 MHz, maximum output power +22 dBm;
E22-900MM22S: Adopts SX1262 chip, supports operating frequency 850 ~ 930 MHz, maximum output power +22 dBm;
Supports 0.96" OLED display;
Supports battery charging, designed for a rated charging current of 500mA;
Tpye-C interface with USB 2.0 protocol.

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1.3 Application scenarios
Smart home as well as industrial automation;
Healthcare;
Smart agriculture, service robotics;
General Purpose Low Power IoT Sensor Hub, General Purpose Low Power IoT Data Logger;
Audio devices, camera video streaming;
USB devices, consumer electronics;
Speech recognition, image recognition;
Wi-Fi + Bluetooth network card;
Touch and proximity sensing.

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Chapter 2 Specifications
2.1 Limit parameters
Main parameters
performances
note
minimum value
maximum values
Supply Voltage
0 V
5.5 V
Supply voltage above 5.5 V may cause module
burnout
LoRa Blocking Power
-
10 dBm
Less likely to burn out in close proximity
operating temperature
-40 °C
+85 °C
industrial grade
2.2 Operating parameters
2.2.1 Parameters of the whole machine
Main parameters
performances
note
minimum
value
typical
value
maximum
values
Whole machine working
voltage (V)
3.2
3.3
5
≥3.3V guaranteed output power
UART communication level
(V)
3.3
Risk of burn-in using 5V TTL
Operating temperature (°
C)
-40
-
+85
Industrial-grade design
2.2.2 Wi-Fi parameters
Wi-Fi parameters
Main parameters
performances
note
minimum
value
typical
value
maximum
values
Operating frequency band
(MHz)
2412
-
2484
Maximum transmit power
(dBm)
18
-
21
See Loxin ESP32-S3 official datasheet for
details
Transmission rate (Mbps)
1
-
150
Maximum rate of 11 Mbps under 802.11b standard
Maximum speed of 54 Mbps under 802.11g standard
Maximum speed of 150 Mbps under 802.11n standard
Receiving sensitivity
-98.4
-
-71.4
See Loxin ESP32-S3 official datasheet for

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(dBm)
details
Emission current (mA)
286
-
340
See Loxin ESP32-S3 official datasheet for
details
Operating current (mA)
88
-
91
See Loxin ESP32-S3 official datasheet for
details
2.2.2 BLE parameters
BLE parameters
Operating frequency band
(MHz)
2402
-
2480
Transmit power (dBm)
-24
0
20
Transmission rate (Mbps)
0.125
-
2
Emission current (mA)
-
-
380
Operating current (mA)
-
-
95
Receiving sensitivity
(dBm)
-104.5
-
-93.5
Sensitivity varies at different rates, the lower
the rate the higher the sensitivity
2.2.3 LoRa Parameters - EoRa-S3-400TB
400MHz LoRa Parameters
Operating frequency band
(MHz)
410
-
493
Supports ISM bands
Transmit power (dBm)
-9
-
22
Emission current (mA)
-
120
-
Instantaneous emission power consumption
Receiving current (mA)
-
10
-
Flat receiving current
Transmit power (dBm)
-9
22
22
Air rate (bps)
0.6K
300K
FSK mode, software configuration
0.018K
-
62.5K
LoRa mode, software configuration
Receiving sensitivity
(dBm)
-147
-146
-145
Airspeed is 0.3kbps (LoRa)
2.2.4 LoRa Parameters-EoRa-S3-900TB
900MHz LoRa Parameters
Operating frequency band
(MHz)
850
-
930
Supports 868MHz/915MHz bands in Europe and the
US
Transmit power (dBm)
-9
-
22
Emission current (mA)
-
120
-
Instantaneous emission power consumption

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Receiving current (mA)
-
10
-
Flat receiving current
Transmit power (dBm)
-9
22
22
Air rate (bps)
0.6K
300K
FSK mode, software configuration
0.018K
-
62.5K
LoRa mode, software configuration
Receiving sensitivity
(dBm)
-147
-146
-145
Airspeed of 0.3kbps (LoRa)
2.2.4 Internal LoRa module parameters
LoRa module main
parameters
descriptive
note
reference distance
6000 m
Clear and open environment, antenna gain 5dBi,
antenna height 2.5 meters, LoRa air rate
0.3kbps.(This parameter is measured in the open
area of Chengdu city.)
FIFO
256 Btye
Maximum length of a single transmission
crystal frequency
32 MHz
passive crystal
modulation method
GFSK/LoRa
Recommended for LoRa
Package
chip-based
interface method
SPI
Overall Dimension
10*10*2.5 mm
Antenna Interface
SMA/IPEX
Characteristic impedance approx. 50 ohms

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Chapter 3 Mechanical Dimensions and Pin Definitions
3.1 Introduction to Functional Components
seria
l
num
ber
Main Hardware
present (sb for a job etc)
1
e22-400mm22s&e22-900mm22s
E22-400MM22S and E22-900MM22S are ultra-small size and
suitable for 433MHz, 470MHz, 868MHz, 915MHz chip LoRaTM
wireless modules independently researched and developed by
Chengdu Yibert Electronics Co. Module.
2
ESP32-S3 chip
The ESP32-S3 is a low-power MCU system-on-chip (SoC) that
supports 2.4 GHz Wi-Fi and Bluetooth® LE wireless
communication.
3
3D Omni Antenna
Maximum gain 4.9dBi, 2.4G omni-directional antenna
4
IPEX Seat
IPEX Generation Seat
5
IPEX Seat
IPEX Generation Seat
6
SMA RF interface
Full length 14.5mm SMA head
7
Reset key
Reset button.
8
switching mode
For complete disconnection of battery power
9
GPIO external interface
GPIOs leading from the ESP32
10
GPIO external interface
GPIOs leading from the ESP32

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11
External Battery Connector
SH1.25mm, 2pin battery connector
12
RGB LED
Addressable RGB LED, driven by GPIO8.
13
Dual Color LED
Charging indicator, red for charging status, green for full
status
14
OLED screen
0.96-inch OLED screen
15
Boot Key
Download button. Press the Reset key while holding down the
Boot key to enter Firmware Download mode and download the
firmware through the serial port.
16
USB Type-C connector
USB interface. It can be used as a power supply for the
development board or as a communication interface between the
PC and the ESP32-S3 chip.
17
TF Card Slot
Short body TF card slot
18
a row of needles
All available GPIO pins (except the SPI bus for flash) are
pinned out to the development board's pinout. See Pinout for
more information.
3.2 GPIO Pin Definition and Size Introduction
Pin
Number
Pin Name
Pin orientation
Pin Usage

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1
VCC
power supply
Power pin, can be used as 5V power output after normal power supply
2
GND
power supply
Power GND
3
VDD
power supply
Power pin, can be used as 3.3V power output after normal power
supply, prohibit external input power supply
4
GND
power supply
Power GND
5
GPIO42
Input/Output
6
GPIO46
Input/Output
7
GPIO45
Input/Output
8
GPIO41
Input/Output
9
GPIO40
Input/Output
10
GPIO39
Input/Output
11
U0RXD
importation
UART serial port RXD
12
U0TXD
exports
UART serial port TXD
13
GPIO38
Input/Output
14
GPIO16
Input/Output
15
GPIO15
Input/Output
16
RST
Input/Output
Connect to the ESP32-S3 reset pin
17
GPIO08
Input/Output
Connect to the reset pin of the LoRa module
18
GPIO12
Input/Output
19
GPIO48
Input/Output
20
GPIO47
Input/Output
21
GPIO33
Input/Output
DIO1 connected to the LoRa module
22
GPIO34
Input/Output
BUSY connected to the LoRa module
23
GPIO35
Input/Output
24
GPIO0
Input/Output
Connect to the BOOT button on the backplane
25
GPIO36
Input/Output
26
GPIO37
Input/Output
LEDs connected to the baseboard

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Chapter 4 Basic Product Use Introduction
4.1 Product Use Details
Figure 5.1.1 Product Physical Drawing
The hardware integrates ESP32-S3 and peripheral circuits, E22-400MM22S LoRa module and peripheral circuits,
power supply circuits, Li-ion battery charging circuits and power voltage detection circuits, OLED display
and peripheral circuits, TF card slot and peripheral circuits, reset button circuits and BOOT button circuits.
ESP32-S3 supports USB 2.0 interface protocol, connect the USB 2.0 interface to the computer USB can
automatically start installing the driver, after the installation is complete, there will be a USB serial
device (COM9), can be used for program download.
GPIO43 and GPIO44 are used as UART interfaces for log output or inter-serial communication, if you need a
computer to view the UART print log you need a TTL to USB tool.
Figure 4.1.2 Getting the port number

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4.2 Introduction to using the product development environment
The development environment is Visual Studio Code + PlatformIO, you need to install Visual Studio Code software
and add PlatformIO plug-in.
Visual Studio Code official website download address: Visual Studio Code official website download .
Under PlatformIO plugin, the related environment packages will be downloaded automatically, and the main
dependent libraries are shown in the figure below. If the download speed is slow, you need to wait patiently,
and some resources require scientific internet access. If the download does not start automatically, try
to press the Compile button.
When the installation of the environment is complete will remind Project has been successfully updated!
After the environment is successfully built, buttons related to the PlatfromIO tool appear in the lower left
of Visual Studio Code, where the main ones are Compile and Download, and the appropriate COM port is checked.
Environment Configuration: The firmware supports devices in two frequency bands (400/900 MHz), just select
the corresponding environment according to the device band.
Default: EoRa_PI_400M is used in the default environment.
EoRa_PI_400M: adopts SX1268 chip, default output frequency is 433 MHz, output power +22 dBm.
EoRa_PI_900M: adopts SX1262 chip, default output frequency is 868 MHz, output power +22 dBm.
Note: SX1268 and SX1262 chips are driven in exactly the same way, only the supported frequency bands are
different.

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The SDK package contains some routines, you need to use the platformio.ini file to compile different routines,
by default the Factory is compiled (factory firmware).
src_dir must not be enabled at the same time, otherwise the compiler will report an error.
Start compiling the code, and the following interface will appear after the compilation is complete.
Before downloading, you need to make sure that the COM port is correct, and start downloading the code, after
the download is complete, the interface will appear as shown below.

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4.3 Introduction to the routines
Routines include: Factory, OLED, Radio Example, Sleep Test.
Compiling different routines requires a different src_dir in platformio.ini, and you cannot have more than
one src_dir enabled at the same time.
Routine Factory is the factory default program, the main function pin test, LoRa RF transceiver, establish
WIFI hotspot, drive OLED to display different contents, etc. The interface can be switched by Boot button,
and long-pressing Boot button can enter the hibernation mode for 30 seconds (the hibernation current needs
to be measured under the battery power supply).
Routine OLEDs provide additional display styles.
The Radio Example provides simple RF transceiver functionality.
The routine Sleep Test provides a test of the development board's hibernation program. The hibernation mode
will reawaken after 30 seconds.
4.4 Antenna Interface Switching
LoRa module antenna adopts SMA interface by default, if you want to switch to IPEX interface you need to
change the 0R resistor connecting to SMA interface (horizontal resistor as below) to the resistor position
connecting to IPEX interface (vertical resistor as below).
The WIFI/BLE module antenna adopts 3D metal antenna by default, if you want to switch to IPEX interface you
need to user to change the 0R resistor connecting the 3D antenna (vertical resistor as below) to the resistor
position connecting the IPEX interface (horizontal resistor as below).

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4.5 Battery charging
The battery can be charged via the TYPE-C connector, the LED will always light up red to indicate when charging,
and when full the LED will always light up green to indicate.
When the TYPE-C port is turned on, the charging circuit will be passed through, so the current of the whole
machine to enter the hibernation state is still maintained at a high level (500uA~1mA or so), and the
hibernation current needs to be measured when the battery is turned on.
Connecting the battery and not connecting the TPYE-C interface, the power consumption with the power off
is around 5 uA. If the power is turned on and all peripherals are in sleep mode, the power consumption of
the whole machine is around 25 uA.
The battery is designed for a maximum charging current of 500mA, please ensure that the power supply capacity
is sufficient.
Chapter 5 Hardware Design
It is recommended that the module be powered by a DC regulated power supply with as low a ripple factor as
possible, and that the module be reliably grounded;
Please pay attention to the correct connection of the positive and negative terminals of the power supply,
such as reverse connection may lead to permanent damage to the module;
Please check the power supply to ensure that it is between the recommended supply voltages, exceeding the
maximum value can cause permanent damage to the module;
Please check the stability of the power supply, the voltage should not fluctuate significantly and frequently;
When designing power supply circuits for modules, it is often recommended to keep more than 30% of the margin,
with the whole machine is conducive to long-term stable operation;
Modules should be kept as far away as possible from power supplies, transformers, high-frequency alignments,
and other parts with high electromagnetic interference;
High-frequency digital routing, high-frequency analog routing, power supply routing must be avoided below
the module, if you really have to go through the module below, assuming that the module is soldered in the
Top Layer, in the contact part of the module in the Top Layer laying copper (all laying copper and good

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grounding), must be close to the digital part of the module and routing in the Bottom Layer;
Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route it in
the Bottom Layer or any other layer, which will affect the spuriousness of the module as well as the reception
sensitivity to varying degrees;
Assuming that there is a large electromagnetic interference devices around the module will also greatly affect
the performance of the module, according to the intensity of the interference is recommended to stay away
from the module, if the situation permits you can do appropriate isolation and shielding;
Assuming that there is a large electromagnetic interference around the module alignment (high-frequency
digital, high-frequency analog, power supply alignment) will also greatly affect the performance of the module,
according to the intensity of the interference is recommended to stay away from the module, if the situation
permits you can do appropriate isolation and shielding;
The communication line must be connected in series with a 1k-5.1k resistor if using a 5V level (not recommended,
still risk of damage);
Try to stay away from some TTL protocols where the physical layer is also 2.4GHz, e.g. USB 3.0;
The antenna mounting structure has a significant impact on module performance. It is important to ensure
that the antenna is exposed and preferably vertically oriented;
When the module is mounted inside the chassis, the antenna can be extended to the outside of the chassis
using a good quality antenna extension cable;
The antenna must not be mounted inside a metal casing, as this will result in a significant reduction in
transmission distance.

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Chapter 6 Frequently asked questions
6.1 Unsatisfactory transmission distance
When there is a straight-line communication barrier, the communication distance is attenuated accordingly;
Temperature, humidity, and co-channel interference can lead to increased communication packet loss;
The ground absorbs and reflects radio waves and is less effective when tested close to the ground;
Seawater has a very strong ability to absorb radio waves, so the results of the seaside test are poor;
Signal attenuation can be very severe with metal objects near the antenna, or when placed in a metal case;
The power register is set incorrectly, the air rate is set too high (the higher the air rate, the closer
the distance);
The low voltage of the power supply at room temperature is lower than recommended, the lower the voltage
the lower the transmit power;
Using an antenna that is poorly matched to the module or the quality of the antenna itself.
6.2 Vulnerability of modules
Please check the power supply to ensure that it is between the recommended supply voltages, exceeding the
maximum value can cause permanent damage to the module;
Please check the stability of the power supply, the voltage should not fluctuate significantly and frequently;
Please ensure that the installation and use of the process of anti-static operation, high-frequency devices
electrostatic sensitivity;
Please make sure that the humidity during installation and use is not too high, as some of the components
are humidity sensitive;
It is not recommended to use it at too high or too low a temperature if there is no special need.
6.3 BER too high
There is co-channel signal interference in the vicinity, stay away from the interference source or modify
the frequency or channel to avoid the interference;
An unsatisfactory power supply may also cause garbled code, be sure to ensure the reliability of the power
supply;
Poor quality or too long extension cords and feeder cables can also cause high BER.

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