Ebyte E73-2G4M04S-52832 User manual

nRF52832/nRF52810 Wireless Module Website: www.cdebyte.com
nRF52832/nRF52810 Wireless Module
E73 Series
This manual may be modified based on product upgrade, please refer to the latest version.
All rights to interpret and modify this manual belong to Chengdu Ebyte Electronic Technology Co., Ltd.
User Manual

nRF52832/nRF52810 Wireless Module User Manual of E73 Series Modules
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd. 2/9
Version
Date
Description
Issued by
1.00
2017/12/06
Initial version
huaa
Brief Introduction
E73 series are wireless Bluetooth modules designed by Chengdu Ebyte which feature small size, low power consumption, built in PCB
antenna and IPX interface. E73 series adopt the originally imported RFIC nRF52832/ nRF52810 of NORDIC, supporting BLE 4.2 and BLE 5.0.
The chip has high-performance ARM CORTEX-M4F kernel and other peripheral resources, such as UART, I2C, SPI, ADC, DMA, PWM etc.
The module led out all the IO port of nRF52832 for multilateral development. For more details about nRF52832/ nRF52810, please refer to
the datasheet of NORDIC.
Compared with Bluetooth 4.2, Bluetooth 5 has the following advantages: Four data rates are now available 2Mbps, 1Mbps, 500kbps
and 125kbps. The 2Mbps clearly offers higher throughput possibilities. The broadcasting capacity is increased(x8). Broadcasting extension
makes the data length increase to 251 bytes which enables more effective data transmission in beacon applications. 5210 applies S112
protocol stack which has been strictly tested and upgraded. It supports Flash/24kB RAM of nRF52810 SoCs. S112 protocol stack only take
100kbB flash which means it saves enough space for massive low consumption Bluetooth applications and provides reliable support for
upgrade for OTA applications.
E73 series are hardware platform without firmware, so users need to conduct a secondary development. This series have maximized
the RF characteristics of chip. The built-in 32.768K real-time clock crystal oscillator can benefit the users in programming.
Model
Frequency
Transmitting power
Distance(PCB/IPX)
Packing
Antenna
E73-2G4M04S-52832
2.4GHz
4dBm
100m
SMD
PCB/IPX
E73-2G4M04S-52810
2.4GHz
4dBm
110m
SMD
PCB/IPX

nRF52832/nRF52810 Wireless Module User Manual of E73 Series Modules
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd. 3/9
CONTENTS
1. Technical Parameters........................................................................................................................................................... 4
1.1 E73-2G4M04S-52832.....................................................................................................................................................................................4
1.2 E73-2G4M04S-52810.....................................................................................................................................................................................4
Parameters Notes.................................................................................................................................................................................................. 4
2. Mechanical Characteristics................................................................................................................................................ 5
2.1 E73-2G4M04S-52832/ E73-2G4M04S-52810...........................................................................................................................................5
2.1.1 Dimension................................................................................................................................................................................................ 5
2.1.2 Pin Definition...........................................................................................................................................................................................5
3. Development and Application......................................................................................................................................... 7
4. Production Guidance........................................................................................................................................................... 7
4.1 Reflow Soldering Temperature.................................................................................................................................................................... 7
4.2 Reflow Soldering Curve................................................................................................................................................................................. 8
5. FAQ............................................................................................................................................................................................. 8
5.1 Communication range is too short..............................................................................................................................................................8
5.2 Module is easy to damage............................................................................................................................................................................ 8
6. Important Notes....................................................................................................................................................................9
7. About Us...................................................................................................................................................................................9

nRF52832/nRF52810 Wireless Module User Manual of E73 Series Modules
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd. 4/9
1. Technical Parameters
Model
IC
Size
Net weight
Operating
temperature
Operating
humidity
Storage
temperature
E73-2G4M04S-52832
nRF52832
PCB/IPX
17.5 * 28.7 mm
1.8±0.1g
-40 ~ 85℃
10% ~ 90%
E73-2G4M04S-52810
nRF52810
PCB/IPX
17.5 * 28.7 mm
1.8±0.1g
-40 ~ 85℃
10% ~ 90%
1.1 E73-2G4M04S-52832
Parameter
Min
Typ
Max
Unit
Transmitting current
78
83
91
mA
Receiving current
14.7
18.5
20.0
mA
Turn-off current
0.4
0.5
0.6
μA
Transmitting power
19
20
21
dBm
Receiving sensitivity
-119
-121
-123
dBm
Voltage supply
425
433
525
MHz
Communication level
1.8
3.3
3.6
V
1.2 E73-2G4M04S-52810
Parameter
Min
Typ
Max
Unit
Transmitting current
17
18
20
mA
Receiving current
12
13
14
mA
Turn-off current
1
2
3
μA
Transmitting power
3.7
4
4.2
dBm
Receiving sensitivity
-94.5
-95
-96
dBm
Voltage supply
2379
2430
2496
MHz
Communication level
1.8
3.3
3.6
V
Parameters Notes
When designing current supply circuit, 30% margin is recommended to be remained so as to ensure long-term stable operation of
the whole module.
The current at the instant of transmitting may be high, but the total energy consumed may be lower due to very short transmitting
time.
When using external antenna, the impedance matching degree at different frequency points between antenna and module may
affect the transmitting current at different levels.
The current consumed when the RF chip is only working at receiving mode is called as receiving current. The tested receiving
current may be higher for some RF chips with communication protocol or when the developers have loaded their own protocol to
the whole module.
The current at pure receiving mode is at mA level. To achieve µA level receiving current, the users need to manage it through
firmware development.
The receiving sensitivity is tested at the speed rate of 1kbps.
The turn-off current is always lower than the current consumed when the power supply source of the whole module is at no-load
status.
Each LRC component has ±0.1% error, and the error will accumulate since multiple LRC components are used in the whole RF
circuit, and the transmitting current will be different at different modules.
The power consumption can be lowered by lowering the transmitting power, but the efficiency of the internal PA will be decreased
by lowering transmitting power due to various reasons.

nRF52832/nRF52810 Wireless Module User Manual of E73 Series Modules
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd. 5/9
2. Mechanical Characteristics
2.1 E73-2G4M04S-52832/ E73-2G4M04S-52810
2.1.1 Dimension
2.1.2 Pin Definition
No.
Pin item
Pin direction
Application
0
GND
Input
Ground electrode, connect to reference ground of power
1
GND
Input
Ground electrode, connect to reference ground of power
2
GND
Input
Ground electrode, connect to reference ground of power
3
DEC2
Input/Output
MCU GPIO
4
DEC3
Input/Output
MCU GPIO
5
P0.25
Input/Output
MCU GPIO
6
P0.26
Input/Output
MCU GPIO
7
P0.27
Input/Output
MCU GPIO
8
P0.28
Input/Output
MCU GPIO
9
P0.29
Input/Output
MCU GPIO
10
P0.30
Input/Output
MCU GPIO

nRF52832/nRF52810 Wireless Module User Manual of E73 Series Modules
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd. 6/9
11
P0.31
Input/Output
MCU GPIO
12
DEC4
Input/Output
MCU GPIO
13
DCC
Input/Output
MCU GPIO
14
DEC1
Input/Output
MCU GPIO
15
GND
Input/Output
MCU GPIO
16
VCC
Input
Power supply 1.8 ~ 3.6V DC（Note: The voltage higher 3.6V is forbidden）
17
P0.02
Input/Output
MCU GPIO
18
P0.03
Input/Output
MCU GPIO
19
P0.04
Input/Output
MCU GPIO
20
P0.05
Input/Output
MCU GPIO
21
P0.06
Input/Output
MCU GPIO
22
P0.07
Input/Output
MCU GPIO
23
P0.08
Input/Output
MCU GPIO
24
P0.09
Input/Output
MCU GPIO
25
P0.10
Input/Output
MCU GPIO
26
P0.11
Input/Output
MCU GPIO
27
P0.12
Input/Output
MCU GPIO
28
P0.13
Input/Output
MCU GPIO
29
P0.14
Input/Output
MCU GPIO
30
P0.15
Input/Output
MCU GPIO
31
P0.16
Input/Output
MCU GPIO
32
P0.17
Input/Output
MCU GPIO
33
P0.18
Input/Output
MCU GPIO
34
P0.19
Input/Output
MCU GPIO
35
P0.20
Input/Output
MCU GPIO
36
P0.21
Input/Output/RST
MCU GPIO
37
SWDCLK
Input
MCU GPIO
38
SWDIO
Input/Output
MCU GPIO
39
P0.22
Input/Output
MCU GPIO
40
P0.23
Input/Output
MCU GPIO
41
P0.24
Input/Output
MCU GPIO
42
GND
Input
Ground electrode, connect to power reference ground
43
GND
Input
Ground electrode, connect to power reference ground
For more details, please refer to《nRF52832Datasheet》in NORDIC.

nRF52832/nRF52810 Wireless Module User Manual of E73 Series Modules
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd. 7/9
3. Development and Application
No.
Item
Notes
1
Burn Firmware
1. The module is embedded with ARM MCU. For program downloading, please use the J-LINK
downloader, any other serial port or JTAG、ISP、ICP are unavailable to download.
2. There are two ways to download the program. The protocol stack of NORDIC is not
programmed yet, so users need to use the official nRFgo studio of NORDIC to program the
protocol stack first, then program the hex of application code. Or, to program the protocol stack
of NORDIC first and download via the IAR or KEIL.
Website of tool download:
http://www.nordicsemi.com/eng/Products/Bluetooth-low-energy/nRF52832/(language)/eng-G
B
2
Testing Board
Testing board is not available.
4. Production Guidance
4.1 Reflow Soldering Temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time（tL）Maintained Above（TL）
60-90 sec
30-90 sec
Peak temperature（Tp）
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max

nRF52832/nRF52810 Wireless Module User Manual of E73 Series Modules
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd. 8/9
4.2 Reflow Soldering Curve
5. FAQ
5.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is, the lower the
transmitting power is.
Due to antenna quality or poor matching between antenna and module.
5.2 Module is easy to damage
Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to a
permanent damage to the module.
Please check the stability of power supply and ensure the voltage not to fluctuate too much.
Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic susceptibility.
Please ensure the humidity is within limited range for some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.

nRF52832/nRF52810 Wireless Module User Manual of E73 Series Modules
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd. 9/9
6. Important Notes
All rights to interpret and modify this manual belong to Ebyte.
This manual will be updated based on the upgrade of firmware and hardware, please refer to the latest version.
Please refer to our website for new product information.
7. About Us
Technical support: [e-mail]
Documents and RF Setting download link: www.cdebyte.com/en/
Tel：[phone]
Fax：[phone]
Web：www.cdebyte.com/en/
Address：Innovation Center D347, 4# XI-XIN Road, Chengdu, Sichuan, China