Elma JetKit-3010 User manual

Elma User Manuals:
JetKit-3010
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CHASSIS PLATFORMS
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Revision History
Revision
Description
Date
By
1.00
Initial release
2022-08-04
FF
Preface
Disclaimer
Neither Elma Electronic nor any subsidiary will assume any responsibility for damage resulting from improper
use of its products or failure to comply with the manuals and the applicable rules and regulations.
Our General Terms and Conditions apply. You can download the current version of the General Terms and
Conditions from our website at www.elma.com by clicking on the link at the bottom of every page.
Copyright
All rights reserved.
All marks and names mentioned herein are trademarks or registered trademarks of the respective owners.
Copyright © 2022 Elma Electronic GmbH, Pforzheim, Germany.
Information subject to change without notice!

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Contents
Revision History ........................................................................................................... 3
Preface ......................................................................................................................... 3
Contents ....................................................................................................................... 4
Figures ......................................................................................................................... 6
Tables........................................................................................................................... 7
1Introduction .......................................................................................................... 9
1.1 Symbols Explanation ............................................................................................. 9
1.2 Electrostatic Discharge (ESD) ................................................................................. 9
2Hardware ............................................................................................................ 10
2.1 Overview ............................................................................................................10
2.2 NVIDIA®Xavier™ Software ...................................................................................10
2.3 Technical Specification ..........................................................................................10
2.4 Features .............................................................................................................12
2.4.1 Volta GPU ..................................................................................................12
2.4.2 Tensor Cores..............................................................................................13
2.4.3 Carmel CPU Complex ..................................................................................14
2.4.4 Memory Subsystem ....................................................................................15
2.5 Board Diagrams ...................................................................................................16
2.5.1 Block Diagram............................................................................................16
2.5.2 Front Panel ................................................................................................17
2.5.3 Board assembly ..........................................................................................18
2.5.4 Baseboard layout........................................................................................19
2.5.5 Mezzanine Layout .......................................................................................21
3Functional Description ........................................................................................ 22
3.1 CompactPCI Serial operation .................................................................................22
3.2 PCI Express operation...........................................................................................22
3.2.1 Overview ...................................................................................................22
3.2.2 PCI Express clock .......................................................................................23
3.2.3 PCI Express reset .......................................................................................23
3.3 Board Management Controller (BMC) ......................................................................23
3.3.1 Overview ...................................................................................................23
3.3.2 Command Line Interface (CLI) .....................................................................24
3.3.3 Firmware Update ........................................................................................25
3.4 USB Type C interface management ........................................................................28
3.5 Power Management ..............................................................................................30
3.6 Board Reset.........................................................................................................30

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3.7 Rear-I/O backplane support...................................................................................31
3.8 Board interfaces...................................................................................................31
3.8.1 USB Type C connectors ...............................................................................31
3.8.2 MicroUSB connector ....................................................................................32
3.8.3 MicroSD/UFS card slot .................................................................................32
3.8.4 Mezzanine connector ...................................................................................33
3.8.5 MiniHDMI connector ....................................................................................34
3.8.6 Ethernet connector .....................................................................................34
3.8.7 USB2.0 connector .......................................................................................35
3.8.8 Front Panel LEDs ........................................................................................35
3.8.9 Front Panel Push Buttons .............................................................................36
3.8.10 BMC Programming header ...........................................................................36
3.8.11 CompactPCI Serial connectors ......................................................................37
4Configuration ...................................................................................................... 39
5Mezzanines.......................................................................................................... 40
6Ordering Information .......................................................................................... 40
7Technical Support ............................................................................................... 41
7.1 Contact...............................................................................................................41
7.2 Returning Defective Products .................................................................................41

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Figures
Figure 1 - Matrix processing................................................................................................ 13
Figure 2 - Simplified Block Diagram ..................................................................................... 16
Figure 3 - Mezzanine Block Diagram .................................................................................... 16
Figure 4 - Front Panel ........................................................................................................ 17
Figure 5 - Board with NVIDIA®module, heat sinks and mezzanine .......................................... 18
Figure 6 - Board with NVIDIA®module, without heat sinks and mezzanine ............................... 18
Figure 7 - Baseboard top components .................................................................................. 19
Figure 8 - Board bottom components ................................................................................... 19
Figure 9 - Mezzanine top components .................................................................................. 21
Figure 10 - Mezzanine bottom components ........................................................................... 21
Figure 11 - Bootloader Main Window .................................................................................... 26
Figure 12 - Bootloader application with selected Firmware File ................................................ 26
Figure 13 - Bootloader application with selected MCU architecture ........................................... 27
Figure 14 - Bootloader serial port settings ............................................................................ 27
Figure 15 - Bootloader application configured for BMC update ................................................. 28
Figure 16 - 4 pole DIP switch .............................................................................................. 39

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Tables
Table 1 - Technical Specification.......................................................................................... 10
Table 2 - GPU Operation..................................................................................................... 12
Table 3 - CPU Operation ..................................................................................................... 14
Table 4 - LPDDR4x Memory Bus .......................................................................................... 15
Table 5 –Board main components....................................................................................... 20
Table 6 –Mezzanine main components ................................................................................ 21
Table 7 - CompactPCI Serial Sideband Signals ...................................................................... 22
Table 8 - BMC CLI serial port settings .................................................................................. 24
Table 9 - Measured board voltages ...................................................................................... 25
Table 10 - IO Expander IOs for PD controller configuration / indication .................................... 29
Table 11 - PD controller current advertisement ..................................................................... 30
Table 12 - USB-C 1 pinout .................................................................................................. 31
Table 13 - USB-C 1 pinout .................................................................................................. 31
Table 14 - MicroUSB pinout ................................................................................................ 32
Table 15 - MicroUSB interfaces............................................................................................ 32
Table 16 - MicroSD/UFS card slot pinout .............................................................................. 32
Table 17 –Mezzanine connector pinout legend...................................................................... 33
Table 18 - Mezzanine Connector pinout ................................................................................ 33
Table 19 - MiniHDMI pinout ................................................................................................ 34
Table 20 - RJ45 pinout ....................................................................................................... 34
Table 21 - RJ45 LED indication ............................................................................................ 34
Table 22 - USB2.0 pinout ................................................................................................... 35
Table 23 - Front Panel LEDs................................................................................................ 35
Table 24 - LED GPIO control ............................................................................................... 35
Table 25 –Push Buttons..................................................................................................... 36
Table 26 - BMC Prog pinout ................................................................................................ 36
Table 27 - CompactPCI Serial pinout legend ......................................................................... 37
Table 28 - P1 CompactPCI Serial connector .......................................................................... 37
Table 29 –P2 CompactPCI Serial connector .......................................................................... 38
Table 30 –P5 CompactPCI Serial connector .......................................................................... 38
Table 31 –P6 CompactPCI Serial connector .......................................................................... 38
Table 32 - DIP Switch SW3 Functionality .............................................................................. 39
Table 33 - DIP Switch SW5 Functionality .............................................................................. 39
Table 34 - DIP Switch SW6 Functionality .............................................................................. 39
Table 35 - Ordering Information .......................................................................................... 40

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1Introduction
1.1 Symbols Explanation
This symbol indicates danger of injury for user or risk of damage to product or
components.
This symbol indicates danger for electronic components, which can be damaged
or destroyed by discharge of electrostatic electricity.
This symbol indicates information to specific product configuration or settings
of hardware.
1.2 Electrostatic Discharge (ESD)
This product includes high sensitive microcontrollers and semiconductor products that can be
damaged by electrostatic discharge (ESD).
Electrostatic discharge can destroy static-sensitive devices or micro-circuitries. Damage due to
inappropriate handling is not covered by the warranty.
The following precautions must be taken:
Do not open the protective conductive packaging until you have read the following, and are at an
approved anti-static workstation.
Pay attention to a good grounding of persons, the workstation and devices around the system, tools
and packaging.
Transport the system or other electrostatic sensitive parts in a static safe container (box or bag).
Keep the parts in their container until the workspace around is ESD-safe.
Use a conductive wrist strap attached to a good earth ground.
Use anti-static mats on all surfaces in the workspace

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2Hardware
2.1 Overview
The Elma JetKit-3010 is based on the NVIDIA®Jetson AGX Xavier™Industrial System-on-Module.
It provides the ability to integrate the NVIDIA®Jetson AGX Xavier™seamlessly into existing
CompactPCI Serial infrastructure. With its industry leading performance, power efficiency,
integrated deep learning capabilities and rich I/O, the NVIDIA®Jetson AGX Xavier™enables
emerging technologies with compute-intensive requirements. Designed for applications converging
on artificial intelligence (AI), computer vision (CV) and advanced graphics, the AGX Xavier™is
ideal for (but not limited to): Intelligent Video Analytics (IVA), Robotics, Virtual Reality (VR),
Augmented Reality (AR), Portable Medical Devices and autonomous driving.
2.2 NVIDIA®Xavier™Software
Intentionally, the design of the JetKit-3010 was oriented on the design of the NVIDIA®AGX
Xavier™Developer Kit. This allows Software reutilization between platforms. Main differences
(influencing the Device Tree) are leaving out the audio codec and usage of a different USB type C
power delivery controller. The modified device tree file can be provided on request.
For more information on the NVIDIA®Xavier™module, please consult the NVIDIA®online
documentation:
Jetson™Download Center:
https://developer.nvidia.com/embedded/downloads
NVIDIA®Jetson™Linux Developer Guide:
https://docs.nvidia.com/jetson/l4t/
Getting Started:
https://developer.nvidia.com/embedded/learn/getting-started-jetson
2.3 Technical Specification
The Elma JetKit-3010 is based on the NVIDIA®AGX Xavier™Industrial module and inherits the
module’s features. The module adds further functionality and extendibility as well as it adapts the
interface to the CompactPCI Serial infrastructure. The technical specification of the JetKit-3010 can
be found in Table 1.
Table 1 - Technical Specification
Features
Specifications
SoC
GPU
Volta GPU
Tensor Cores
End-to-end lossless compression
Tile Caching
OpenGL® 4.6
OpenGL ES 3.2
Vulkan™ 1.0
CUDA® 10
CPU
Carmel CPU Complex
ARMv8.2 (64-bit) heterogeneous multi-processing (HMP) CPU
Architecture
Dual-core CPU clusters connected by a high-performance system
coherency interconnect fabric
L3 Cache: 4MB (shared across all clusters)
NVIDIA®Carmel (Dual-Core) Processor: L1 Cache: 128KB L1
instruction cache (I-cache) per core; 64KB L1 data cache (D-cache)
per core
L2 Unified Cache: 2MB per cluster