Embedian SMARC T335x User manual

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SMART-BEE User’s Manual Document Revision v.1.2
SMARC T335X Evaluation Carrier
SMART-BEE

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Revision History
Revision Date Changes from Previous Revision
1.0 2013/6/21 Initial Release
1.1 2014/4/17 Update to SMARC T335X Hardware Revision 00B0
1. SPI_D0 and SPI_D1 interchanged
2. LCD_BKLT_PWM and GPIO1 interchanged
3. Change Baseboard name from
SMARTBASE-T3 to SMART-BEE
1.2 2014/0509 1. Correct RS422 TX Polarity of CN12
2. Add Mounting Hole Mechanical Drawing
Information

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USER INFORMATION
About This Manual
This document provides information about products from EMBEDIAN, INC.
No warranty of suitability, purpose, or fitness is implied. While every
attempt has been made to ensure that the information in this document is
accurate, the information contained within is supplied “as-is” and is subject
to change without notice.
For the circuits, descriptions and tables indicated, EMBEDIAN assumes
no responsibility as far as patents or other rights of third parties are
concerned.
Copyright Notice
Copyright © 2013 EMBEDIAN, INC..
All rights reserved. No part of this manual may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means (electronic, mechanical,
photocopying, recording, or otherwise), without the express written
permission of EMBEDIAN.
Trademarks
The following lists the trademarks of components used in this board.
ARM is a registered trademark of ARM Limited.
Android is a registered trademark of Google
Linux is a registered trademark of Linus Torvalds.
WinCE is a registered trademark of Microsoft
TI is a registered trademark of Texas Instruments
All other products and trademarks mentioned in this manual are
trademarks of their respective owners.
Standards
EMBEDIAN is ISO 9001:2008 and ISO14001-certified manufacturer.
SMARC is an SGET standard for ARM computer on module.
Warranty
This EMBEDIAN product is warranted against defects in material and
workmanship for the warranty period from the date of shipment. During
the warranty period, EMBEDIAN will at its discretion, decide to repair or
replace defective products.
Within the warranty period, the repair of products is free of charge as long
as warranty conditions are observed.
The warranty does not apply to defects resulting from improper or
inadequate maintenance or handling by the buyer, unauthorized
modification or misuse, operation outside of the product’s environmental

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specifications or improper installation or maintenance.
EMBEDIAN will not be responsible for any defects or damages to other
products not supplied by EMBEDIAN that are caused by a faulty
EMBEDIAN product.
Technical Support
Technicians and engineers from EMBEDIAN and/or its subsidiaries and
official distributors are available for technical support. We are committed
to making our product easy to use and will help you use our products in
your systems.
Before contacting EMBEDIAN technical support, please consult our Web
site for the latest product documentation, utilities, and drivers. If the
information does not help solve the problem, contact us by e-mail or
telephone.

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Table of Contents
CHAPTER 1 INTRODUCTION................................................................................................................9
1.1 SMARC T335X EVALUATION CARRIER GOALS.............................................................................9
1.2 FEATURE SET OVERVIEW...............................................................................................................9
1.3 BLOCK DIAGRAM .......................................................................................................................... 11
1.4 PERIPHERAL OVERVIEW..............................................................................................................13
FIGURE 2: SMART-BEE PERIPHERAL DIAGRAM.............................................................................13
1.5 LAYOUT DIAGRAM.........................................................................................................................14
FIGURE 3: SMART-BEE CONNECTORS, HEADERS AND JUMPERS...............................................14
1.6 MOUNTING HOLES MECHANICAL DRAWING ...........................................................................15
1.7 DOCUMENT AND STANDARD REFERENCES..............................................................................16
CHAPTER 2 JUMPERS, SWITCHES AND LEDS.................................................................................20
2.1 JUMPERS.........................................................................................................................................20
FIGURE 5: JUMPER LOCATIONS.......................................................................................................20
2.2 SWITCHES.......................................................................................................................................24
FIGURE 6: SWITCH LOCATIONS........................................................................................................24
2.3 LEDS ................................................................................................................................................26
FIGURE 7: LED LOCATIONS...............................................................................................................26
CHAPTER 3 HEADERS AND CONNECTORS......................................................................................28
3.1 CONNECTORS.................................................................................................................................28
FIGURE 8: CONNECTOR LOCATIONS...............................................................................................28
FIGURE 9: 24-BIT SINGLE PIXEL TRANSMISSION, UNBALANCED ...............................................41
3.2 HEADERS ........................................................................................................................................47
FIGURE 10: HEADER LOCATIONS.....................................................................................................47
FIGURE 11: 10-WAY BOX HEADER TO DB9 CABLE..........................................................................49
FIGURE 12: AIC3106 BLOCK DIAGRAM............................................................................................58
CHAPTER 4 I2C0 DEVICES AND CARRIER EEPROM FORMAT......................................................60
4.1 I2C0 DEVICES.................................................................................................................................60
4.2 CARRIER EEPROM FORMAT ........................................................................................................61
CHAPTER 5 QUICK START GUIDE.....................................................................................................64
STEP1. PLUG A WORKING SD CARD INTO SD SLOT.......................................................................64
STEP2. CHECK JUMPERS AND SWITCHES.......................................................................................64
STEP3. WIRED THE CONSOLE AND ETHERNET CABLE.................................................................65
OPEN A SERIAL TERMINAL LIKE PUTTY IN YOUR PC. SET THE COM PORT AS 115200, 8N1....66
STEP4. POWER 5V TO THE DEVICE...................................................................................................66

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Using this Manual
This guide provides information about the Embedian SMARC (formerly
ULP-COM) T335X Evaluation Carrier for TI AM335x embedded SMARC core
module family.
Conventions used in this guide
This table describes the typographic conventions used in this guide:
This Convention Is used for
Italic type Emphasis, new terms, variables, and
document titles.
monospacedtypeFilenames, pathnames, and code
examples.
Embedian Information
Document Updates
Please always check the product specific section on the Embedian
support website at www.embedian.com/ for the most current revision of
this document.
Contact Information
For more information about your Embedian products, or for customer
service and technical support, contact Embedian directly.
To contact Embedian by Use
Mail Embedian, Inc.
4F-7. 432 Keelung Rd. Sec. 1,
Taipei 11051, Taiwan
World Wide Web http://www.embedian.com/
Telephone + 886 2 2722 3291

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Additional Resources
Please also refer to the most recent SMARC T335x User’s Manual and TI
AM335x processor reference manual and related documentation for additional
information.

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Introduction
This Chapter gives background information on the
SMART-BEE Evaluation Carrier
Section include：
SMARC T335X Evaluation Carrier Goals
Feature Set Overview
Block Diagram
Peripheral Overview
Layout Diagram
Document and Standard References

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Chapter 1 Introduction
This document serves as a user manual and technical reference for the
EMBEDIAN SMARC T335X Evaluation Baseboard (SMART-BEE). The
manual is intended for use by engineering personnel working with SMARC
T335X systems. It will be very helpful if developers can refer together with the
carrier board schematics.
1.1 SMARC T335X Evaluation Carrier Goals
EMBEDIAN SMART-BEE evaluation carrier is equipped with all mechanical
and electrical components necessary for the rapid start-up of the SMARC
T335X computer on module. The SMART-BEE is designed for evaluation,
testing and prototyping of the SMARC T335X in development environments
prior to use in customer designed applications. It can also be used together
with SMARC T335X as an “application ready” 3.5-inch single board computer.
The SMARC T335X Evaluation Carrier is intended to serve multiple needs and
summarized as followed:
SMARC T335X Module bring-up platform for hardware and software
development.
Module validation platform.
Customer evaluation platform.
Customer design reference.
Manufacturing test platform.
Flexible prototyping vehicle (facilitated by multiple mezzanines).
An “application ready” single board computer. (together with SMARC
T335X module)
1.2 Feature Set Overview
The SMART-BEE has the following features for supporting the SMARC T335X
modules:
SMARC specification compliant.
Length x Width: 102mm x 145mm (4.0" x 5.7"), 3.5-inch form factor
Accepts 82mm x 50mm SMARC Modules.
Accepts 3.3V SMARC V_IO only.
24-bit color packing, single channel LVDS port.

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18-bit color depth Parallel LCD port.
3.3V or 5V LCD signaling option
Reset Jumper
5V LED Backlight support
USB OTG mini AB connector – direct from SMARC.
USB R/A Type A connector – direct from SMARC. SMARC (ULP-COM)
compliant in an 82mm x 50mm form factor.
2 x Fast Ethernet (10/100Mbps) ports with integrated magnetics.
On-board I2S Audio Codec.
RS232 support for 3 SMARC serial ports (one can be configured as
RS422/RS485).
CAN Bus support (1).
SPI (2) and I2C (2) Header
Boot Option Switch
SD Card slot.
GPIO Header
4-wire Touch Connector
RTC backup power sources – Lithium coin cell onboard.
5V input voltage terminal block with +/-28V over voltage and mis-wiring
protection
External WDT option
A single 4KB EEPROM is provided on I2C0 that holds the board
information. This information includes board name, part number, serial
number, and revision information.

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1.3 Block Diagram
An overall system block diagram for the SMARC T335X Evaluation Carrier is
shown on the following page. The following color coding is used on the block
diagram:
Industry standard wired I/O connectors are shown in orange.
Embedian defined wired I/O connectors and headers are shown in red.
Industry standard mezzanine and slot format connectors are shown in
blue.
ICs on the board are shown in pale yellow.
Miscellaneous features (jumpers, switches) are shown in drab green.
Much may be gleaned from this diagram:
How SMARC resources are used on the Evaluation Carrier.
What the major Evaluation Carrier Features are.
An indication of the power supply architecture.

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Figure 1: SMARC T335X Evaluation Carrier Block Diagram
Details for this diagram will be explained in the following chapters.

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1.4 Peripheral Overview
The following diagram shows the function of all peripherals including of
connectors, headers, configuration jumpers and other important features on
the SMARC T335X Evaluation Carrier.
Figure 2: SMART-BEE Peripheral Diagram

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1.5 Layout Diagram
The following section shows the physical location and reference designator of
connectors, configuration jumpers and other important features on the SMARC
T335X Evaluation Carrier.
Figure 3: SMART-BEE Connectors, Headers and Jumpers

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1.6 Mounting Holes Mechanical Drawing
Figure 4 shows the mounting holes information of SBC-SMART-MEN. The
diameter of mounting hole is 3.2mm and the diameter of the ring is 6mm.
Figure 4: SBC-SMART-BEE Mounting Holes Mechanical Drawing
Information

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1.7 Document and Standard References
1.7.1. External Industry Standard Documents
eMMC (Embedded Multi-Media Card) the eMMC electrical standard is
defined by JEDEC JESD84-B45 and the mechanical standard by
JESD84-C44 (www.jedec.org).
The I2C Specification, Version 2.1, January 2000, Philips
Semiconductor (now NXP) (www.nxp.com).
I2S Bus Specification, Feb. 1986 and Revised June 5, 1996, Philips
Semiconductor (now NXP) (www.nxp.com).
JTAG (Joint Test Action Group defined by IEEE 1149.1-2001 - IEEE
Standard Test Access Port and Boundary Scan Architecture
(www.ieee.org).
MXM3 Graphics Module Mobile PCI Express Module
Electromechanical Specification, Version 3.0, Revision 1.1, © 2009
NVIDIA Corporation (www.mxm-sig.org).
PICMG® EEEP Embedded EEPROM Specification, Rev. 1.0, August
2010 (www.picmg.org).
SD Specifications Part 1 Physical Layer Simplified Specification,
Version 3.01, May 18, 2010, © 2010 SD Group and SD Card
Association (Secure Digital) (www.sdcard.org).
SPI Bus – “Serial Peripheral Interface” - de-facto serial interface
standard defined by Motorola. A good description may be found on
Wikipedia
(http://en.wikipedia.org/wiki/Serial_Peripheral_Interface_Bus).
USB Specifications (www.usb.org).
1.7.2. SGET Documents
SMARC_Hardware_Specification_V1p0, version 1.0, December 20,
2012.
1.7.3. Embedian Documents
The following documents are listed for reference. The Module schematic is
not usually available outside of Embedian, without special permission. The
other schematics may be available, under NDA or otherwise. Contact your
Embedian representative for more information. The SMARC T335x
Evaluation Carrier Board Schematic is particularly useful as an example of
the implementation of various interfaces on a Carrier board.

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SMARC_T335x Evaluation Carrier Board Schematic, PDF and
OrCAD format
SMARC_T335x Evaluation Carrier Board User’s Manual
SMARC_T335x Carrier Board Hardware Design Guide
SMARC_T335x Carrier Board Hardware Layout Guide
SMARC_T335x User’s Manual
SMARC_T335X Schematic Checklist
1.7.4. TI Documents
AM335x ARM Cortex-A8 Microprocessors (MPUs), April 15 2013 (rev.
F)
AM335x Schematic Checklist, Oct 31 2011
AM335x ARM Cortex-A8 Microprocessors (MPUs) Technical
References Manual, April 15 2013 (rev. H)
AM335x Power Consumption Summary, Oct 31 2011
1.7.5. TI Development Tools
Pin Mux Utility for ARM® Microprocessors
Power Estimation Tool (PET)
1.7.6. TI Software Documents
LINUXEZSDK-AM335x
ANDROIDDEVKIT-JB-AM335x
1.7.7. Embedian Software Documents
Embedian Linux BSP for SMARC T335X Module
Embedian Android BSP for SMARC T335X Module
Embedian Linux BSP User’s Guide
Embedian Android BSP User’s Guide
1.7.8. TI Design Network
Beaglebone
Beaglebone Blask

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Adeneo Embedded (Windows Embedded Compact 7)
Nucleus
QNX

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Jumpers, Switches
and LEDs
This Chapter provides SMART-BEE jumpers, switches
and LEDs information.
Section include：
Jumpers
Switches
LEDs

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Chapter 2 Jumpers, Switches and
LEDs
This chapter gives detail information of the jumpers, switches and LEDs.
2.1 Jumpers
The SMART-BEE has a number of jumpers that allow you to configure your
system to suit your application. All use 2mm shorting blocks (shunts) to select
settings. Turn off power to the SMART-BEE before changing the position of a
shunt.
2.1.1. Jumper Location
Figure 5: Jumper Locations