Ezurio Winbond W681360 User manual

Bluetooth Audio Development Pack
Winbond W681360 Codec Board
User Guide
Part Number ACC-005
The information contained in this document is subject to change without notice. EZURiO Ltd makes no warranty of any kind with
regard to this material including, but not limited to, the implied warranties of merchant ability and fitness for a particular purpose.
EZURiO Ltd shall not be liable for errors contained herein or for incidental or consequential damages in connection with the
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EZURiO.
Other product or company names used in this publication are for identification purposes only and may be trademarks of their
respective owners.
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Bluetooth®Development Kit
Winbond Audio Codec Board
Part Number: ACC-005
1. General Description
The EZURiO Winbond Codec Evaluation Board plugs into the EZURiO Developers kit and
allows you to rapidly test and evaluate Bluetooth audio applications using the EZURiO
Bluetooth Intelligent Serial Module to implement the wireless link.
The ACC-005 evaluation board is based on the Winbond W681360 codec - a 3V, single
channel, 13 bit linear voice-band codec, which is pin compatible to the Motorola MC145483.
The codec is used to digitise incoming audio from the microphone into PCM data and convert
the PCM digital audio output of the Bluetooth chip into an analogue signal for the
headphones. The codec board has a microphone input and headphone output which are
compatible with standard PC headsets.
The W681630 codec has several features such as power down mode and high pass filter
disable (to allow frequencies down to DC to be used). The ACC-005 codec evaluation board
provides options to allow these features to be tested.
The W681360 incorporates a feature that allows the volume of the codec output to be
digitally controlled via 3 bits of the PCM data stream. The BISM II provides an AT command
(ATS589) that allows you to control the volume of the codec.
This document provides you with information to prototype and evaluate your own audio
application. Once you have tried out your application, you will be able to design your own
audio solution based around the Winbond codec and the EZURiO Bluetooth Intelligent Serial
module.
Bluetooth is a trademark owned by Bluetooth SIG, Inc., USA and licensed to EZURIO Ltd.
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2. Overview
The codec board is powered by an on-board 3.3V regulator to reduce noise to a minimum. The
PCM control signals for the codec go directly to the Bluetooth module on the motherboard via the
10-way connector, as do the 3 push button switches. This allows the switches to be used with
an external program that implements the upper portion of headset or Handsfree profile.
The microphone input, designed to interface to PC compatible headsets, has a fixed gain of 16
set by external components to the codec (the amplifier itself is part of the codec). Part of the
microphone signal is mixed into the headphone output signal via VR2. This feature is known as
“sidetone” and allows the user to hear their own voice when speaking. It is commonly used in
telephony applications to give the user the necessary audio feedback that their ears expect.
The audio output gain is by default fixed at 1. By fitting VR1, the audio gain can be made
adjustable.
The 120mW stereo output amplifier U3 ensures that the codec board can drive standard 32Ω
stereo headphones while keeping total harmonic distortion down to 0.1%.
Component Placement
Note that not all
components are fitted –
non-fitted components are
shown without pads. Refer
to Section 7 for details of
component fitment and
specification.
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3. Codec Board Quick Start Guide
3.1 Getting Started
The codec board is supplied with a right angle, 10 way connector that can be used to connect
it to the main developers kit. If required, this should be soldered to the main board.
Alternatively other connectors or ribbon cables can be used.
3.2 Equipment Required (not supplied)
•Headsets (with microphone) (Standard PC headsets are fine)
•EZURiO Wireless Developers Kit
•BISM II Bluetooth module (Firmware release V9_20_22 onwards supports audio volume
control)
Normally two sets of development kit are required to test both ends of an audio link. If an
application is being developed with an existing endpoint, such as a mobile phone or headset,
only one set may be needed.
3.3 Motherboard Jumper Settings
Before using the codec board, there is a jumper setting on the motherboard that needs to be
checked. This is CB1, next to the USB adaptor, which must be removed. If fitted it will
short out the PCM output from the codec and prevent it operating. CB1 is only relevant for
the WLAN 802.11 data module.
REMOVE
3.4 Procedure:
1) Plug the BISM II into the socket on the Dev Kit, connect to a PC serial port and power up.
See the dev kit manual for different power supply options.
2) Check that AT commands are working using EZURiO terminal. (Refer to blu2i Quick Start
Guide if needed)
3) Run the “ATI3” command to find out the firmware release number. If it is less than
V9_20_22, contact EZURiO to get a firmware upgrade for the BISM II. (Note: older
versions of firmware will work, but audio output will be at half the full volume and the
ats589=7 command will not be recognised)
4) Power down, plug the codec board into the dev kit and power up. Check that AT
commands are working.
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Configure the Slave unit as follows:
AT&F* Restore system defaults
ATZ Reset the unit
ATS512=4 Make connectable and discoverable
ATS0=1 Answer after 1 ring
ATS531=1 Keep AT command mode going after a connection is
established
ATS589=7 Set Max. Volume level (requires firmware V9_20_22)
AT&W Save the above settings
ATZ Reset the unit.
5) Find out the Bluetooth address of the Slave Unit by typing ATI4<return>
6) Configure the Master Unit as follows:
AT&F* Restore System Defaults
ATZ Reset the unit
ATS531=1 Keep the AT commands going after a connection is
established
ATS589=7 Set volume to maximum
AT&W Save to flash
ATZ Reset the unit.
ATD008098nnnnnn Connect to the slave (substitute your slave’s Bluetooth
address that you found in step 5 for nnnnnn)
AT+BTA1 Establish an audio link – displays AUDIO ON on both sides.
(Alternatively AT+BTA7 can be used and the units will
negotiate the best link type.)
An Audio link is now established between the two units.
AT=BTA0 will turn off the audio link (but still leave the units connected).
To change volume use ATS589. ATS589=0 gives minimum, ATS589=7 gives maximum.
4. Bluetooth SCO Links – A Primer
4.1 Normal SCO
Bluetooth uses a Synchronous Connection-Orientated link (SCO) for audio. All this means is
that for an audio link, the bandwidth needed to maintain the data rates required by the audio
link is pre-allocated between the master and slave. This ensures audio data is always
transmitted at the required data rate, and takes priority over the transmission of digital
data.
The Bluetooth specification for SCO is such that there is no re-transmission if data is
corrupted or lost. This explains the crackling and popping that occurs when you get to the
limits of radio range.
The actual data rate over the air is 64 kbits/sec. There are 1600 timeslots available per
second and when a master transmits a SCO packet in one timeslot, the slave replies with its
SCO packet in the next. The SCO packet size is fixed at 240 bits (30 bytes). This means
when a SCO link is established using the HV3 packet type, two out of every 6 timeslots are
used up by the SCO link. This means there is enough bandwidth to have up to three SCO
links active between a master and slave at the same time. In this scenario, there are no
spare timeslots for other data.
There are 3 main types of SCO packets, HV1, HV2 and HV3 (High Quality Voice). As
mentioned earlier, the HV3 packet type has a 1 to 1 mapping between incoming audio data
and the data transmitted over the air. There is no error correction possible with HV3.
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With HV1, each bit is transmitted 3 times and a simple voting algorithm is used at the other
end to correct for any bit errors. This means that only 10 bytes of actual audio data can be
transmitted in a SCO packet. To maintain the 64 kbits/sec data rate, all 6 timeslots have to
be used for the SCO link, leaving no bandwidth available for data.
With HV2, an FEC algorithm is used to correct for 1 bit errors. This increases the data packet
size by 50%. This means that only 20 bytes of actual audio data can be transmitted in a SCO
packet. To maintain the 64 kbits/sec data rate, 4 out of every 6 timeslots are used for the
SCO link.
AT+BTA1 enables HV3
AT+BTA2 enables HV2
AT+BTA4 enables HV1
AT+BTA7 allows the link manager to negotiate which packet type to use, the default is HV1
4.2 Enhanced SCO
Enhanced SCO or eSCO was implemented as part of the 1.2 Bluetooth Core Specification
Release. The main driving factor was to improve audio quality. This has been achieved by:
1) including a CRC as part of the audio data packet to allow error detection and a re-
transmission request.
2) allowing higher data rates by using packets that span more than 1 timeslot
3) allowing asymmetric links to allow high quality audio to be streamed in one
direction.
eSCO offers significantly better audio quality, but has to be configured at both ends of the
link before a unit is enabled to accept incoming connections or enquiries.
To try out eSCO, add the ATS584=1 command to the commands listed in the quick start
section immediately after the AT&F* and ATZ commands.
Both ends of the link must be configured for eSCO for the audio link to be established. If one
end is set to eSCO and the other to SCO, you will get an “AUDIO FAIL” when the AT+BTA1
command is issued.
The following are the packet types associated with the AT+BTA commands for eSCO.
AT+BTA1 – EV3 packet. Up to 30 bytes + CRC. Uses up 1 timeslot
AT+BTA2 – EV4 packet. Up to 120 bytes + CRC + 2/3 FEC. Up to 3 timeslots
AT+BTA4 – EV5 packet. Up to 180 bytes + CRC. Up to 3 timeslots. Currently
Unsupported
4.3 SCO / eSCO Transport Delays
The following delays have been measured between incoming audio and audio output at the
other end of a Bluetooth link.
Normal SCO:
AT+BTA1 7.84 ms
AT+BTA2 9.24 ms
AT+BTA4 10.8 ms
Enhanced SCO
AT+BTA1 12.1 ms
AT+BTA2 33.4 ms
AT+BTA4 41.2 ms
As can be seen, the additional error correction of eSCO comes with a transport delay penalty.
This is because a buffer is needed to ensure that there is still data to output while waiting for
a corrupted data packet to be re-transmitted.
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For AT+BTA1 and normal SCO, the data is transmitted once every 6 timeslots so the
transport delay is expected to be 6/1600 = 3.75ms. When doing loop-round testing with the
codec, i.e. with no transport delay, it was found that from input to output, the codec added
~1ms of delay at 1kHz and 1.5ms at lower frequencies.
4.4 PCM Timing
The codec samples at 8 kHz. The default mode of operation of the codec is 16 bit Receive
Gain Adjust Mode. In this mode, in every 8 kHz cycle, 16 bits of data is clocked into the
codec. The first 13 bits are PCM audio data, the last 3 bits are volume data. Of the last three
bits, 000 equates to maximum volume (ATS589=7), 111 equates to minimum volume
(Ats589=0).
At maximum volume, the output signal matches the amplitude of the input signal at the
other end of the Bluetooth link. It is more appropriate to think of this feature as being an
attenuation control.
The clock rate used for sampling is 250kHz (4µs). 16 clock cycles takes 64µs. 8kHz equates
to 125µs.
The same timing is used for all packet types in both SCO and eSCO modes.
5. Frequency Response
5.1 Codec Frequency Response
The codec frequency response can be measured by connecting PCM_IN from the codec to
PCM_OUT to the codec (PCM_OUT from J1, the 10 way connector has to be disconnected). A
1kΩpull down resistor is needed on PCM_OUT to ensure maximum volume setting.
The following graph shows the measured frequency response. For this test, R32, the side-
tone resistor was removed to prevent audio feedback.
A 1V peak to peak sine wave was injected into the microphone circuit and its amplitude
measured at TP5, A0, the input to the codec. The output from the codec was measured on
TP6, PA0+.
The chart below shows the codec frequency response with the High Pass Filter Enable (HB –
Pin 16) pin set high and set low.
Frequency Response of Codec (R32 Removed)
0
0.2
0.4
0.6
0.8
1
1.2
0 500 1000 1500 2000 2500 3000 3500 4000
Frequency (Hz)
PAO+ (V)
HB=1
HB=0
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As can be seen from the chart, the codec frequency response is flat between 300 and 3,300
Hz. With the high pass filter on, the 3dB points are at 150Hz and 3,600 Hz respectively. With
the high pass filter off, the 3dB point goes down to approximately 15Hz.
5.2 Bluetooth Link Frequency Response
The Codec 13bit linear data is coded within the Bluetooth chip using CVSD (Continuous
Variable Slope Decode) encoding for transport over the Bluetooth link. CVSD is essentially a
form of Adaptive Differential PCM (ADPCM) and is well suited for voice transmission. It is
forgiving of individual bit corruption as each bit only implements an up or a down shift
relative to the previous level (corruption of the MSB of a 13 bit sample would create a much
larger error term than is possible with ADPCM). A draw back of ADPCM is that it cannot track
large delta changes in signal quickly enough. For voice, this does not present a problem.
The chart below shows the frequency response of the Bluetooth link at different levels of
input sine wave.
Over the Air Frequency Transfer Characteristics
0
0.2
0.4
0.6
0.8
1
1.2
0 1000 2000 3000 4000
Frequency (Hz)
Voltage (V)
Codec Loop Around Test
1V Sine Wave
0.6V Sine W ave
0.3V Sine W ave
As can be seen, the frequency response can only be considered to be flat when the input
voltage level is less than a 0.3V peak to peak sine wave.
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6. Circuit Description
This section describes the individual parts of the circuit and give design information about
the components, to allow you to adapt the circuitry of the codec board for your own
implementation.
6.1 Audio Amplifier
The Winbond codec is capable of driving a 32Ωload directly if the gain of the output amplifier
is reduced by a factor of 4. This is done by Setting R1 to 39kΩ.
Of the stereo headsets tested, it was found that 32Ωwas a common impedance for each
earpiece. For a stereo headset where two speakers are being driven in parallel this would be
equivalent to driving a 16Ωload. This is out of the codec’s specification so a small
headphone amplifier, U3, has been used on the evaluation board. This is not required if the
impedance of the earpiece is equal or greater than 32Ω.
The large 100 μF decoupling capacitors have been used so that the codec could be tested in
its “high pass filter mode disabled” configuration. If you do not require a frequency response
to go down below 300 Hz, then these capacitors can be reduced to small values. The main
design consideration is the impedance should not be significant compared to the impedance
of the headphone selected at frequencies of interest.
E.g. if using a 32Ωheadphone and expecting a 3dB point at 300 Hz, then the decoupling
capacitor impedance could be 32Ωat 300Hz i.e. 10 μF. This requires a much smaller
footprint than the 100μF used in the reference design.
6.2 Driving the Headset Directly from the Codec
This will achieve the most cost effective design but care must be taken to ensure that the
32Ωspecification of load is met by selecting an appropriate headset.
Remove R10, R13 and R12. Fit R11, R9, R38 as zero ohm links. Fit 39kΩin place of R1 to
reduce the gain by 4.
In-house testing showed that with a 32Ωload and with R1 set to 39kΩ, that there was some
distortion at zero cross-over but that it was not easily perceptible.
Even though the output signal level had been reduced by a factor of 4, on the headsets
tested, the volume levels sounded loud enough for most applications. It is important to
check this with the target headset for your application.
6.3 Microphone Circuit
The microphone circuit is designed for an electret microphone (which is commonly used in PC
applications). Typically this would be powered by 5V via a 2.2kΩseries resistor. In the
reference design, it is powered by 3.3V to ensure a clean supply regardless of the power
supply used to power the Dev kit. This reduces the sensitivity of the microphone - you
should test your application with the microphone and voltage you intend to use in order to
determine your component values.
The gain of the microphone is set by R22 and R24, with gain being equal to R22/R24. The
current values are 62K and 3.9K, giving a gain of approximately 16. When changing to a
different gain, R27 and R25 should be set to the new values as well. This ensures that the
load seen by common mode noise on the microphone is identical and prevents it from being
amplified.
R31 is a no fit resistor. It’s purpose is to facilitate test modes where a user wants to loop
audio output directly back to the audio input to conduct an over the air audio test.
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6.4 Sidetone
When we talk, we hear our own voice, which is part of normal speech perception. If our ears are
covered by headphones, we do not hear our voice, which is perceived as abnormal. (Try
covering your ears while talking to notice the difference).
To compensate for the loss in feedback to the ear when it is covered with a headphone, most
telephony systems inject some of the microphone signal back into the audio output path so that
the person perceives their own speech as normal. This feature is commonly referred to as
sidetone.
Variable resistor VR2 allows you to control the amount of sidetone that is fed back to the audio
output so that the user perceives their speech as normal.
If the headset design does not totally cover the ear, then the sideband circuitry can be omitted.
6.5 Power Down
For battery powered audio applications, the power down feature of the codec allows you to turn it
off and save power when it is not being used. This feature can be tested by fitting R7 with a 0Ω
link and controlling the PUI input of the codec via MPIO_5.
For AT commands, MPIO_5 translates to GPIO 7.
The put GPIO 7 into output mode, use “ats610=$040”
To turn the codec on, use “ats627=1”
To turn the codec off, use “ats627=0”
6.6 Alternative PCM_CLK
Some applications require that the PCM Clock is driven by external circuitry. This requires the
PCM Interface provided by the BISM to be put in Slave mode and a clock is supplied by the
external circuitry on MPIO_7.
Contact Ezurio for further details if this is a requirement.
6.7 Switches
The switches S1, S2 and S3 have no defined function. They are there to assist you to prototype
your audio application. e.g. If your application requires a button to be pressed for the user to
answer an incoming connection, you can prototype that function using one of the switches
provided.
ATS620 allows you to read the status of the GPIO ports.
No switches pressed: ATS620? => $0028
S1 pressed (GPIO 9) ATS620? => $0128
S2 pressed (GPIO 7) ATS620? => $0068
S3 pressed (GPIO 8) ATS620? => $00A8
6.8 High Pass Filter Enable
The W681360 can have its High Pass filter enabled or disabled, depending on the state of the
HB pin (Pin 16). This is pulled high or low by R3 or R4 (Default). See section 5.1 for more
details.
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6.9 GPIO to MPIO Mapping
AT commands use GPIO numbers to represent I/O lines. These GPIO numbers map to physical
signals drawn on the schematics as MPIO lines. Some of the GPIO/MPIO lines are used when
providing a full RS232 interface.
The following tables gives the mapping between GPIO, MPIO and RS232 signals.
RS232 Hardware
DCD MPIO_3
RI MPIO_2
DTR MPIO_9
DSR MPIO_8
AT Command Hardware
GPIO_1 MPIO_0
GPIO_2 MPIO_1
GPIO_3 MPIO_9
GPIO_4 MPIO_10
GPIO_5 MPIO_11
GPIO_6 MPIO_4
GPIO_7 MPIO_5
GPIO_8 MPIO_6
GPIO_9 MPIO_7
Note: For the BISM PA (Class 1 design), MPIO_0 and MPIO_1 are used to control the RF
switch so are not available to the AT Command Set.
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7. Bill of Materials
Not all components are fitted, as some provide alternative functionality or implement non-
standard options.
Refer to the previous sections and the schematic for information on the component function.
Components marked in blue are not fitted.
Reference Part Tolerance Description Manufacture r Part No / Footprint
C1,C7 100nF 20% Ceramic Capacitor 0805
C2,C3,C6 10uF '+80/-20% Tantalum Capacitor TANA
C4,C5,C8 10nF 20% Ceramic Capacitor 0805
C9,C10 100uF 20% Electrolytic Capacitor Panasonic EEE0JA101SP
C11,C12,C17,C18 2.2uF '+80/-20% Ceramic Capacitor 0805
C13 22uF '+80/-20% Ceramic Capacitor 1210
C14 100nF '+80/-20% Ceramic Capacitor 0805
C15,C19 100pF 20% Ceramic Capacitor 0805
C16 1.0uF '+80/-20% Ceramic Capacitor 0805
D1,D2,D3,D4,D5,D6,D7,D8 BAT54S Dual Schottky Diode BAT54S Zetex BAT54S
J1 10 Way 0.1" R/A PCB Socket Harwin M20-7891046
J2,J3 3.5mm 3way Audio Jack Skt Schurter 4832.232
L1 10uH Thin Film Inductor 1210
R1,R2,R5,R35,R36,R37 10K 1% Thick Film Resistor 0805
R3,R7,R8,R9,R11,R34,R38 0R Not Fitted 5% Thick Film Resistor 0805
R4,R6,R10,R12,R13,R33 0R 5% Thick Film Resistor 0805
R14,R28,R29,R30 1K 5% Thick Film Resistor 0805
R15 2K2 Not Fitted 5% Thick Film Resistor 0805
R16,R17,R18,R19,R24,R2
5 3.9K 1% Thick Film Resistor 0805
R26,R20 1.5K 5% Thick Film Resistor 0805
R23,R21 200K 5% Thick Film Resistor 0805
R27,R22 62K 1% Thick Film Resistor 0805
R31 62K Not Fitted 1% Thick Film Resistor 0805
R32 75K 5% Thick Film Resistor 0805
S1,S2,S3
OMRON/B3S-
1000 Push Button Switch SPNO SMD Omron B3S-1000
U1 AME8800AEFT
3.3V Low Drop Out Regulator
300mA AME AME8800AEFT
U2 W681360RG W681360RG CODEC Winbond W681360RG
U3 LM4908MM Dual Headphone Amplifier Nat. Semi. LM4909MM
VR1 20K Not Fitted 20% 20K Trimmer Vishay TS53YL 20K 20% TR
VR2 50K 20% 50K Trimmer Vishay TS53YL 50K 20% TR
8. References
1. Winbond W681360 Data Sheet – http://www.winbond.com.tw/PDF/Sheet/W681360.pdf
2. ACC-005 Schematic – ERBLU49-002A1-02
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9. Disclaimers
EZURIO’S WIRELESS PRODUCTS ARE NOT AUTHORISED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN
APPROVAL OF THE MANAGING DIRECTOR OF EZURIO LTD.
The definitions used herein are:
a) Life support devices or systems are devices which (1) are intended for surgical implant
into the body, or (2) support or sustain life and whose failure to perform when properly used
in accordance with the instructions for use provided in the labelling can reasonably be
expected to result in a significant injury to the user.
b) A critical component is any component of a life support device or system whose failure to
perform can be reasonably expected to cause the failure of the life support device or system,
or to affect its safety or effectiveness.
EZURiO does not assume responsibility for use of any of the circuitry described, no circuit
patent licenses are implied and EZURiO reserves the right at any time to change without
notice said circuitry and specifications.
9.1 Data Sheet Status
This data sheet contains preliminary data for use with Engineering Samples. Supplementary
data will be published at a later date. EZURiO Ltd reserve the right to change the
specification without prior notice in order to improve the design and supply the best possible
product.
Please check with EZURiO Ltd for the most recent data before initiating or
completing a design. Designers should check the production status of any
engineering firmware used during development before it is deployed.
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