F&S Bondtec 56 i Series User manual

Series 56XXi
F&S BONDTEC Semiconductor GmbH
User manual BONDST R 2.0

F&S BONDTEC Semiconductor GmbH
Industriezeile 49a
5280 Braunau am Inn
ustria
Copyright ©2020 F&S BONDTEC Semiconductor GmbH
Reserve technical changes

Table of content
1. GENER L INFORM TION 3
1.1. pplicability of this User Guide 3
1.2. Scope of Documentation 5
2. FOR YOUR S FETY 6
2.1. User Manual 6
2.2. General Instructions for Safe Operation 7
2.3. CE Declaration of Conformity 7
2.4. Intended use 7
2.5. Obvious misuse 8
2.6. Residual hazards 8
2.7. Protective Equipment / Personal Protective Equipment 8
2.8. Parent Safety Instructions 9
3. TECHNIC L SPECIFIC TIONS 10
3.1. Dimension and Weight 10
3.2. Workspace 10
3.3. Environmental conditions and connections 11
3.4. Bondhead 11
3.5. Spezification 12
4. MODEL 56XXI 13
4.1. Overview of the multifunction device 14
4.2. Control Elements 14
4.3. The xes of the Motion System 15
4.4. Bond heads 16
5. TR NSPORT ND INST LL TION 19
5.1. Transport / Packaging 19
5.2. Storage 19
5.3. Suitable Operating Location 19
5.4. Preparatory Work for Commissioning 19
5.5. Electrical Connection 20
5.6. Vacuum Connection 21
5.7. Connection of the Ultrasonic Generator 21
6. B SIC FUNCTIONS 22
6.1. The Most Important Functions 23
6.2. Simple ctions 24

6.3. Frequently Returning Operation 25
6.4. Create a Bond Program 26
6.5. Further Process Parameters 26
7. THE SINGLE WIRE MODE 27
7.1. Bonding in Single Wire Mode 28
7.2. Working in Single Step Mode (Step Mode) 29
8. PROCESS OPTIMIZ TION 30
8.1. Bond parameters 30
8.2. Loop 32
9. MULTIWIRE PROGR M 36
9.1. Creating Chips with “Learn Chip“ 36
9.2. Creating Wires with Learn Wire 37
9.3. Duplicating Modules 37
9.4. Normalize Program 38
9.5. Measure Chipheights 38
9.6. Move the Bond Program 38
9.7. Change Bondprogram with Plot Program (Show Program) 39
9.8. Production Operation 42
9.9. Quality control 43
9.10. Pattern recognition 43
10. C LIBR TIONS 45
10.1. Camera Convex Compensation 45
10.2. Head Calibration 45
10.3. Camera Offset 46
10.4. xis Calibration 46
11. DJUSTMENT WORK ON THE BONDHE D 47
11.1. Bonding Wire 47
11.2. Bond tool 49
11.3. Mechanical Settings 50
11.4. Cleaning of the Components 54

General Information
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 3
1) General Information
1.1 pplicability of this User Guide
1.1.1 Manufacturer´s Address
>> F&S BONDTEC Semiconductor GmbH
>> Industriezeile 49a
>> -5280 Braunau
>> ustria
>> Phone: [phone] - 8270
>> Fax: [phone] - 8272
>> http://www.fsbondtec.at
1.1.2 Scope of Supply
The scope of supply is:
>> Bond head
>> ccessories (as listed on delivery note)
>> Documentation
1.1.3 Nameplate
The nameplate is located on the right-hand side of the machine. lways quote the serial number in all corresponden-
ce relating to service. The serial number appears again on a second, separate plate affixed on the same side of the
machine.
Figure 1.1. - 1 Nameplate
Figure 1.1. - 2 Serial Number

General Information
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 4
1.1.4 Guarantee, Warranty and iability
The general terms and conditions of sale and supply of F&S Bondtec invariably apply. copy of these general terms
and conditions is placed at the purchaser's disposal on conclusion of the contract or earlier.
Claims under guarantee or warranty and claims for liability for personal injury or damage to property are inadmissible
if one or more of the following is causal:
>> Utilization of the machine for other than the use as intended by the manufacturer
>> Incorrect assembly, commissioning, operation or maintenance
>> Non-compliance with the User Guide
>> Operation of the machine despite defective or inoperational safety devices or protective facilities
>> Post-specification structural alterations
>> Post-specification changes to the drive (power, speed, ...)
>> Inadequate monitoring of machine components subject to wear
>> Incorrect repairs
>> Catastrophes, influence of foreign matter and acts of God
>> The installation of any programs
>> Network connection during operation
lterations, additions to and conversions of the machine undertaken without the prior approval of F&S Bondtec are
strictly prohibited.
Conversions always require the manufacturer's prior written consent. Structural alterations undertaken without
prior written consent void your F&S Bondtec warranty.
The installation of any software, particularly anti-virus-programs, void your F&S Bondtec warranty and is absolutely
forbidden.
CAUTION!
The installation of any software, particularly anti-virus-programs, local- as well as networking executed,
can damage the range of functions of the machine and is absolutely forbidden! It is a machine, not a desk-
top- C!
1.1.5 Network Capability
To create backups, the machine can be connected to a network. However, this is not allowed during operation. There
are no warranty or guarantee claim for any problems that occur with a connected network.
CAUTION!
The connection to a network during operation can greatly influence the functions of the machine and is the-
refore strictly prohibited.

General Information
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 5
1.1.6 Copyright
F&S BONDTEC retains full copyright to machine software and documentation. No part of this documentation may be
reproduced, duplicated or transmitted in any form without the express written permission of F&S BONDTEC.
1.2 Scope of Documentation
The entire documentation consists of:
>> User Manual (this manual)
>> dditional information such as List of recommended spare parts, bond head clearance, diagrams etc.
>> Please refer also to: http://www.fsbondtec.at

For your Safety
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 6
2) For your Safety
2.1 User Manual
This user manual contains important instructions for the safe and proper operation of the production system. Rea-
ding and understanding this manual is therefore a prerequisite for working with this production system.
The user manual must always be available at the location of the machine / system. The user manual is part of the
machine and must be handed over when reselling the machine.
The User Manual must always be observed under all circumstances.
The documentation of purchased parts is an integral part of this user manual. ll safety instructions and other infor-
mation contained therein must also be observed.
The rules and regulations for accident prevention and environmental protection valid for the place of use must be
provided and observed by the operator.
On the even page numbers, the issue number is printed on the cover and the headers show the issue version of the
user manual from which this operating manual is valid.
IMPORT NT!
If necessary, please observe the appendices of individual components of this machine, which were created
after the editorial deadline of this manual.
Some illustrations and detailed descriptions in this manual may differ from the actual machine, as the ma-
chine is adapted to the customer's requirements.
F&S BONDTEC reserves the right to update this manual without prior notice and to make technical and con-
tent changes at any time.
Read the entire operating instructions carefully before first use and keep them safe. Non-
consideration of the User Manual can be life-threatening.

For your Safety
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 7
2.2 General Instructions for Safe Operation
2.3 CE Declaration of Conformity
The machine is CE compliant. The manufacturer has prepared a CE declaration of conformity for this machine, which
is attached as an asset to the machine documentation.
2.4 Intended use
Bonder of the company F&S BONDTEC are exclusively approved for bonding.
IMPORT NT!
For any consequential damages regarding compatibility or errors in the construction or modification of the
construction by the buyer, the warranty claim expires.
Before any intervention in the working area of the machine, move the bonding head to the
home position. Risk of injury!
Take care when handling cleaning agents! Observe manufacturer instructions! Do not bring
in contact with eyes or mucous membranes! If this happens, rinse immediately with clear
water and consult a doctor!
Do not reach into the working area of the machine during operation! Risk of injury!
There is a risk of crushing in the area of the cross table (X and Y axis) and substrate pickup!
Only operate the machine when all covers are mounted. Do not remove covers when the
machine is in operation. Risk of injury!
Do not work with long, loose hair or loose-hanging jewelry (chains, etc.) on the machine.
These could get stuck on moving parts as well as drives of the machine and thus lead to inju-
ries.
When using a heater, the substrate holder becomes very hot. Risk of burns! Do not touch the
substrate or substrate support when the heater is on or the substrate holder is still hot.
When the heater is switched on, change the substrate only with suitable tools (eg tweezers).
Work on the electrical supply may only be carried out by a qualified electrician in accordance
with the electrotechnical regulations.
ccess to the power supply must always be kept closed. ccess is only allowed to authori-
zed staff.
When working on live parts, the machine must be de-energized and secured against unin-
tentional restart.

For your Safety
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 8
Permitted materials.
Depending on the type of machine, the machine is designed only for materials specified in the purchase contract.
ny other or further use is considered improper use. F&S BONDTEC assumes no liability for damage resulting from
improper use of the machine or individual components.
Intended use also includes:
>> The observance of all instructions in the user manual.
>> The observation of all references of other components.
>> The timely execution of all inspection and maintenance work.
2.5 Obvious misuse
The manufacturer is not aware of any misuse.
2.6 Residual hazards
Drives / Power Unit.
Long, loose hair can be wrapped with removed covers. Risk of injury!
Hazardous Substances.
The machine contains no hazardous substances. However, hazardous substances can be used in cleaning (e.g., ace-
tone).
When handling cleaning agents, observe the corresponding safety regulations of the manufacturer!
Heated substrate shots.
For bonding with gold wire a temperature > 100 ° C is necessary. The substrate is heated via the substrate holder.
2.7 Protective Equipment / Personal Protective Equipment
Before starting the machine, all guards must be properly installed and functioning.
Protective devices may only be removed:
>> after standstill and
>> after protection against re-starting the machine
When sub-components are supplied, the guards must be installed by the operator in accordance with regulations.
Personal protective equipment is not necessary for working with the machine.
Do not reach into uncovered areas of electronics when the machine is running. Danger of
electric shock!
Only operate the machine when all covers are closed. Do not remove covers when the
machine is in operation. Risk of injury!

For your Safety
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 9
2.8 Parent Safety Instructions
2.8.1 Behaviour in an emergency
By operating the main switch with EMERGENCY STOP button, the machine can be stopped from any operating situa-
tion. In order to be able to start the bonder safely again, the cause of the fault must first be eliminated by authorized
personnel.
2.8.2 Qualification of the staff
Only trained and instructed staff may work on the machine.
The responsibility of the staff has to be clearly defined for assembly, commissioning, operation, set-up, maintenance
and repair.
Staff to be trained may only work on the machine under the supervision of an experienced person.
ll persons entrusted with the installation, commissioning, operation and maintenance of the machine undertake to:
>> Read all safety instructions and warnings in this user manual carefully.
>> Observe the regulations on occupational safety and accident prevention.
>> ll safety and hazard warnings on the machine / system must be observed.
2.8.3 Disposal Considerations
Ensure that the machine is disposed of in an environmentally sound manner and in accordance with local regulations,
or contact the manufacturer.

Technical Specifications
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 10
3) Technical Specifications
IMPORTANT!
The information refers to the basic model and can therefore differ from the stated values depending on the
version.
3.1 Dimension and Weight
Dimensions, weight, free space, required table size
3.2 Workspace
Dimension and weight
Height ca. 700 mm
Width ca. 700 mm
Depth ca. 650 mm
Weight (basic equipment) ca. 75 kg
Free space
front free accessible
back 100 mm
for maintenance 500 mm
lateral 40 mm
above 100 mm
Required table size
Width
- with Monitor
- with lateral placement of the
monitor
min. 780 mm
min. 1100 mm
Depth min. 750 mm
X-, Y- and Z- xis
Bondarea
X- xis 102 mm / 4‘‘
Y- xis 102 mm / 4‘‘
Z- xis 60 mm

Technical Specifications
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 11
3.3 Environmental conditions and connections
3.4 Bondhead
Environmental conditions
mbient temperature
- in the operationg state
- during transport and storage
+18° C to +24,5° C
-10° C to +50° C
Humidity 45% +/- 10% abs. not condensing
Noise development (workplace - related
emission value: noise level without
external noise effect and reaction
through the room)
< 70 dB
Connection Data
Nominal voltage 90 - 260 V C
Voltage frequency 50 - 60 Hz
Nominal current
- 110 … 120 V
- 200 … 240 V
5
3,15
Power consumption 450 W
Compressed air (oil- and water free
according to DIN ISO 8573-1 goods
class 2)
min. 4,5 bar (6 bar, Ø 6 mm outside)
Vacuum connection < 300 mbar (Ø 6 mm outside)
5610i
Wire diameter 17 µm to 50 µm (0,7 mil to 2 mil)
Wire guide 90°
Capillary 16 mm, optional stehen andere
usführungen zur Verfügung
Bond strength programmable
resolution 1cN
5630i
Wire diameter 17 µm bis 75 µm (0,7 mil bis 3
mil)
Wire guide 45° Standard optional 60°
Bond tool 1“ (~25,4 mm)
Bond strength programmable
resolution 1cN

Technical Specifications
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 12
3.5 Spezification
The substrate types and bonding wires to be used are specified in the purchase agreement. Other specifications - not
mentioned above - are also stated in the purchase contract.
5632 i
Wire diameter 17 µm to 75 µm (0,7 mil to 3 mil) in
addition Ribbon Wire to 250 µm x 30
µm (10 mil x 1,2 mil)
Wire guide 90°
Bond tool ¾“ (~19,05 mm) or 1“ (~25,4 mm)
Bond strength programmable
resolution 1cN
5650 i / 5650i HR
Wire diameter 100 µm to 500 µm (4 mil to 20 mil)
300 µm to 2000 µm (Ribbon)
Wire guide 55° Clip fixing
Bond tool 2“ Standard (~50 mm) V-Groove 100
µm- 500 µm
Bond strength programmable from 0-2000 cN /
resolution 1cN
at 5850 HR: to 4000 cN

Model 56XXi
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 13
4) Model 56XXi
Figure 4.0. - 1 Model 56xxi
IMPORTANT!
Some illustrations and detailed descriptions in this manual may differ from the actual machine if the hard-
ware of the machine has been customized.
The following chapters assume a basic knowledge of electronics, especially of wire bonding technology.
TIP
You can find more information about wire bonding on the Internet.

Model 56XXi
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 14
4.1 Overview of the multifunction device
Figure 4.1. - 1 Overview multifunction device
4.2 Control Elements
4.2.1 Main switch (with emergency stop function)
Serves to switch the machine on/off.
4.2.2 EMERGENCY-STOP Button
The machine stops immediately when the EMERGENCY-STOP button is pressed.
4.2.3 Monitor
ll process-relevant information is displayed to the user on the monitor.
4.2.4 Microscope
The microscope is an optical tool and is used for setup as well as for the control of the process optimization.
4.2.5 US-Generator
The US generator acts as an electrical ultrasound source.
4.2.6 Joystick
With the joystick the axes of the machine can be moved.

Model 56XXi
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 15
4.2.7 Keypad
The machine is operated using the keys on the keypad. Process-relevant functions can be started with them.
4.2.8 PC Keyboard / Service Keyboard
Inputs can be made with the PC keyboard.
4.2.9 EBP-Connection
The user can make a conductive connection to the machine at the EBP connector to prevent the destruction of
electronic components caused by electrical charges.
4.2.10 Workholder
The part holder is connected to the positioning system of the machine. The product to be processed is fixed to the
component holder during the bonding process.
4.2.11 Bondhead
The bond head contains the components and calibration data required for bonding. It carries out the welding process
and, together with the motion system, generates the desired wire connections via a previously defined motion se-
quence.
4.3 The xes of the Motion System
Figure 4.3. - 1 Work Axis
The names of the working axes follow the Cartesian coordinate system.
Positive coordinates run from left to right (X axis), back to front (Y axis), top to bottom (Z axis) and counterclockwise
(P axis), so the zero position is at the back, left and top.
+ Y
+ Z
+ X
+P

Model 56XXi
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 16
4.4 Bond heads
4.4.1 Bondhead 5610i
The 5610i bond head is an ultrasonic ball wedge bonder for gold wires in the thin wire range and is designed for wire
diameters from 17 µm to 50 µm (0.7 mil to 2 mil).
Figure 4.4. - 1 Bonding head 5610i
Terminoligy
Wire spool holder protection and support of the used wire spool.
Camera a live camera image is used when positioning all process relevant
positions.
head clamp / bond head holder fixes the bond head to the base machine.
Wire guide guides the wire from the wire spool to the tip of the bonding tool.
Turning head contains those components that require a wire connection for
generation
Touchdown Sensor detects the placement of the bonding tool on the component sur-
face; the measured values supplied by the sensor are also dis-
played graphically on the monitor.
Transducer converts an electrical oscillation into a mechanical oscillation,
which is used to produce a welded joint.
Bond tool the welding tool used to create the weld transfers the energy
during the bonding process.
Wire guide for 5x50, HR leads the wire up to the tool tip is clipped to the tool
Knife is used for cutting the bonding wire after the last bonding point
when bondering in the thick wire area.

Model 56XXi
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 17
4.4.2 5630i Thin-Wire Head
The bonding head 5630i is designed for the ultrasonic wedge-wedge welding process.
Bond wires with a diameter of 17µm to 75µm (0.7mil to 3mil) can be welded on suitable surfaces.
Figure 4.4. - 1 Thin-Wire Head 5630i
4.4.3 5632i Thin-Wire Head
The 5632i Deep ccess Bond Head features a special design of the bond head. This gives the bonder a high flexibility.
In contrast to the 5630i, this head is especially suited for bonding into deeper packages. Ribbon Wire from 30 µm -
250 µm (1.2 mil - 10 mil) can also be processed.
Figure 4.4. - 1 Thin-Wire Head 5632i

Model 56XXi
© 2020 F&S BONDTEC Semiconductor GmbH. ll rights reserved. 18
4.4.4 5650i / 5650i HR Heavy-Wire Head
The heavy wire bonding head is designed for aluminum wires with a thickness of 100 µm to 500 µm (4 mil to 20 mil).
In contrast to the thin wire bonding heads, the heavy wire bonding head has a knife built in (front or back cut possible).
The finished bonded wire is cut off here because the wires are too thick to tear. The cutting process is automatically
integrated into the software when the 5650i head is attached.
The Heavy-Ribbon version of the 5650i bond head is an ultrasonic wedge bonder for thick aluminum strips up to
2000 x 300 µm thickness.
Figure 4.4. - 1 Bondung Head 5650i