FujiFilm IGBT Instructions for use

REH984f
Application Manual
Fuji IGBT Module
March, 2023

REH984f © Fuji Electric Co., Ltd. All rights reserved.
This manual contains the product specifications, characteristics, data, materials, and structures as
of March 2023.
The contents are subject to change without notice for specification changes or other reasons.
When using a product listed in this manual, be sure to obtain the latest specifications.
Fuji Electric Co., Ltd.is constantly making every endeavor to improve the product quality and
reliability. However, on rare occasions, semiconductor products may fail or malfunction. To prevent
accidents causing injury or death, damage to property like by fire, and other social damage resulted
from a failure or malfunction of the Fuji Electric Co., Ltd. semiconductor products, take measures to
ensure safety such as redundant design, fire spread prevention design, and malfunction prevention
design.
The contents described in this specification never ensure to enforce the industrial property and
other rights, nor license the enforcement rights.
The products described in this specification are not designed nor made for being applied to the
equipment or systems used under life-threatening situations. When you consider applying the
product of this specification to particular use, such as vehicle-mounted units, shipboard equipment,
aerospace equipment, medical devices, atomic control systems and submarine relaying equipment
or systems, Fuji Electric is not responsible for the applicability.
The data and other information contained in this specification are guaranteed for the product, but
do not guaranteed the characteristics and quality of the equipment applying this product. When
using this product, please evaluate it in the application in which it will be used, and then judge its
applicability at user's own risk. Fuji Electric is not responsible for the applicability.
i
Cautions

REH984f
Chapter 3 IGBT Module Selection and Application Notes
© Fuji Electric Co., Ltd. All rights reserved. 3-1
1.
Selection
of IGBT Module Ratings 3
-2
2.
Static Electricity Countermeasures
3
-4
3.
Protection Circuits Design
3
-5
4.
Cooling Design
3
-5
5.
Gate Drive Circuits Design
3
-5
6.
Parallel Connection
3
-6
7.
Mounting Notes
3
-6
8.
Storage and Transportation Notes
3
-8
9.
Reliability Notes (Lifetime Design)
3
-9
10.
Other Precautions
3-
10

REH984f © Fuji Electric Co., Ltd. All rights reserved.
1. Selection of IGBT Module Ratings
3-2
Table 3-1 IGBT rated voltage and application input voltage
1.2 Current rating
When the collector current ICof the IGBT module increases, the conduction loss and switching loss
increase, resulting in an increase in the module temperature. Since the IGBT module must be used
with the virtual junction temperature Tvj of IGBT and FWD below the maximum virtual junction
temperature Tvj(max),ICmust be set in order not to exceed Tvj(max).
Incorrect selection of current rating may lead to module destruction or deterioration of reliability.
Note that in high frequency switching applications, switching loss increases, which increases the
module temperature.
As a basic selection criteria, it is common to select a module with current rating higher than √2
times of the AC output current RMS value of the inverter circuit. However, the selection of the current
rating depends on the operating conditions and heat dissipation conditions of the equipment, thus it is
important to select the current rating after checking the power loss and temperature rise in the
equipment.
When using IGBT modules, it is important to select modules with the voltage and current ratings most
suited for the intended application.
1.1 Voltage rating
The IGBT must have voltage rating that is suitable with the input voltage of the system in which it
will be installed. Table 3-1 shows the IGBT voltage ratings and applicable input voltages. Use this
table as a reference when selecting modules for a particular voltage application.
This chapter describes the precautions when using IGBT module and application.
Area IGBT rated voltage
600V 1200V 1700V
Commercial power supply
voltage (input voltage)
Asia
Japan 200VAC 400VAC, 440VAC
690VAC
(Industry high
voltage power
supply, wind power
generation, etc.)
South Korea
200VAC, 220VAC 380VAC
China 220VAC 380VAC
North America U.S.A 120VAC, 208V,
240VAC 460VAC, 480VAC
Europe
U.K. 230VAC 480VAC
France 230VAC 400VAC
Germany 230VAC 400VAC
Russia 220VAC 380VAC

REH984f © Fuji Electric Co., Ltd. All rights reserved. 3-3
1.3 Maximum rating
Use the product within the maximum ratings (voltage, current, temperature, etc.) described in the
specifications. Using the product beyond the maximum rating may destroy the product. Also, the
value described in each item of the absolute maximum rating is specified for that item, not for
combination of more than one item.
1.4 RBSOA
Make sure that the IGBT turn-off voltage and current operating trajectories are within the RBSOA
specifications. Using the IGBT beyond the RBSOA region may destroy the product.
1.5 Diode inrush current
When using the rectifier diode or FWD for rectifier application, a large inrush current will flow to
charge the DC smoothing capacitor when the power is turned on. The guaranteed values for this
inrush current are expressed as IFSM (non-repetitive) and I2t(non-repetitive). However, if inrush
current flows frequently into the product, the product may be destroyed due to power cycle
destruction by the repetitive current. For applications where such inrush current flows frequently, take
measures to suppress the inrush current to prevent power cycle destruction.
Note that inrush current may flow to charge the capacitor too when an instantaneous voltage drop
occurs in the power supply system.
On the other hand, if transient surge voltage due to lightning strike, etc.that exceeds the voltage
rating of the product is applied to the product, the product might be destroyed. Thus, if surge voltage
is expected, insert surge protection devices to suppress the voltage to within the product
specifications.

REH984f © Fuji Electric Co., Ltd. All rights reserved. 3-4
2. Static Electricity Countermeasures
Fig. 3-1 IGBT behavior when G-E is open
Generally, the absolute maximum rating of VGE, VGES is ±20V. If voltage exceeding VGES is applied to
G-E, the IGBT gate may be destroyed. Therefore, ensure that VGE value does not exceed VGES.
If voltage is applied between C-E of IGBT while G-E is open as shown in Fig. 3-1, the IGBT may be
destroyed. This is because the current iflows from the collector to the gate due to changes in the
collector voltage, causing the gate voltage to rise and turn-on the IGBT. As a result, collector current
will flow and the IGBT could overheat and be destroyed.
For this reason, after installing an IGBT module, if the gate circuit is malfunctioning or completely
inoperative (gate is open), the IGBT may be destroyed when voltage is applied to the main circuit. In
order to prevent this, it is recommended to connect a 10kΩ resistor (RGE) between G-E.
Furthermore, the IGBT gate is very sensitive to static electricity. Observe the following precautions
when handling the product.
(1)When handling IGBT modules after unpacking, discharge any static electricity from your body and
clothes by grounding through a high resistance (1MΩ). Then, any handling of IGBTs should be
done while standing on a grounded conductive mat.
(2)The terminals of IGBT modules are not protected against static electricity. When handling, hold
them by the module case and do not touch the terminals (especially the control terminals).
(3)When soldering the terminals, ground the tip of the soldering iron through a low resistance to
protect the module from static electricity .
C(Collector)
E(Emitter)
G(gate)
iIc
RGE

REH984f © Fuji Electric Co., Ltd. All rights reserved.
3. Protection Circuits Design
Since IGBT modules may be destroyed by overcurrent, overvoltage or other abnormality, it is
necessary to design protection circuits.
It is important to fully understand the IGBT modules characteristics when designing these circuits. An
inappropriate circuit will not be able to protect the module. For example, the overcurrent cut-off time
may be too long, or the capacitance of the snubber capacitor may be too small.
For more details on overcurrent and overvoltage protection methods, refer to Chapter 5 ‘Protection
Circuit Design’ of this manual.
4. Cooling Design
5. Gate Drive Circuits Design
IGBT modules have a maximum virtual junction temperature (Tvj(max)). An appropriate heat sink must
be selected to keep the temperature below this value. When designing heat sink, the operating
conditions of the IGBT module has to be fully considered.
First, calculate the loss of the IGBT module. Based on that loss, select a heat sink that will keep Tvj
below the limit. If the heat sink design is insufficient, the temperature may exceed Tvj(max) during
operation and destroy the module. For more information on IGBT power loss calculation and heat sink
selection methods, refer to Chapter 6 ‘Cooling Design’ of this manual.
It is no exaggeration to say that the design of the gate drive circuits ultimately determines the
performance of the IGBT. It is also closely related to the protection circuits design.
Gate drive circuits consists of a forward bias circuit to turn-on the IGBT, and a reverse bias circuit to
turn-off and keep the IGBT in a stable off state. The characteristics of the IGBT change in accordance
with each bias condition.
Insufficient reverse bias gate voltage -VGE may cause false turn-on. Set a sufficient -VGE value to
prevent false turn-on.If the dv/dtis high, false turn-on of the opposing arm IGBT, gate overvoltage, or
noise propagation to the power supply line may occur. Set the optimum drive conditions (+VGE, -VGE,
RG,CGE)to avoid these problems.
Also, if the wiring length between the IGBT module and the gate drive circuit is long, the gate voltage
at the product terminal may fluctuate and the product may be destroyed by overvoltage.
For more information on how to design the best gate drive circuits, refer to Chapter 7 ‘Gate Drive
Circuit Design’of this manual.
3-5

REH984f © Fuji Electric Co., Ltd. All rights reserved. 3-6
7. Mounting Notes
6. Parallel Connection
In high capacity inverters and other equipment that needs to control large currents, it may be
necessary to connect IGBT modules in parallel.
In parallel connection, it is important that the circuit design allows an equal flow of current to each of
the modules. If the current is not balanced among the IGBTs, a higher current may concentrate in one
IGBT and destroy it.
The electrical characteristics of each module as well as the wiring design determines the current
balance between parallel modules. Thus, it is necessary to design such that the C-E saturation voltage
VCE(sat) of each parallel modules is matched and the main circuit wiring is symmetrical.
For a detailed explanation, refer to Chapter 8 "Parallel Connections“ of this manual.
Note that the 6-Pack, PIM, IPM, and Small IPM are not designed on the premise of using in parallel
connections, thus application of these modules in parallel connections are not guaranteed.
7.1 Mounting to heat sink
When mounting the product to heat sink, it is recommended to apply thermal grease to the
module’s base plate to ensure heat dissipation. In order to spread the thermal grease evenly, the
flatness and surface roughness of the heat sink should be within the range of the recommended
values described in the specifications.
If the amount and application method of the thermal grease are not appropriate, it may prevent the
thermal grease from spreading over the entire module’s base plate, resulting in poor heat dissipation
and lead to thermal failure. To determine whether the amount of thermal grease applied and the
method of application is appropriate, confirm that the thermal grease has spread over the entire base
plate of the product. (You can check the extent of spreading by removing the module after mounting)
If the amount of thermal grease near the product mounting hole is excessive, the thermal grease
will act as a spacer, hindering the spread of the thermal grease and causing deterioration in heat
dissipation.
Also, depending on the properties of the thermal grease and application method, the thermal grease
may deteriorate or deplete during high temperature operation and temperature cycles, shortening the
product lifetime. Thus, pay attention to the selection and application method of thermal grease.
The surface flatness of the heat sink between the screw mounting holes should be 50μm or less per
100mm,and the surface roughness should be 10μm or less. Excessive convex warpage may cause
insulation failure of the product, leading to serious accidents. On the other hand, excessive concave
warpage or distortion will create gaps between the IGBT module and the heat sink, which will result in
poor heat dissipation and may lead to thermal failure.
Refer to the mounting instruction of each package for details on how to select and apply thermal
grease, and how to mount the product to heat sink.
Note that the surface flatness and roughness requirements for heat sinks of PrimePACKTM* differ
from other products. Refer to the mounting instruction for details.
*PrimePACKTM is a registered trademark of Infineon Technologies

REH984f © Fuji Electric Co., Ltd. All rights reserved. 3-7
7.2 Terminal connections
During soldering of the IGBT module terminals, note that soldering at an excessively high
temperatures may cause deterioration of the package. If reflow soldering method is used, the solder
inside the IGBT module may remelt and affect its reliability. In this case, Fuji Electric Co., Ltd.is not
responsible for the product performance and appearance.
If the applied bus bars are not suitable, the temperature of the main terminals may rise above the
storage temperature. Use the main terminals within the storage temperature range.
Applying excessive stress (tensile, pushing, bending) to the main terminals and control terminals
may deform the terminals and crack the case resin, resulting in poor contact and poor insulation.
Refer to the mounting instructions of each package for the maximum allowable stress on the main
and control terminals.
For screw type terminals, tighten the screws with the specified tightening torque. If the tightening
torque is excessive, insulation failure may occur due to cracking of the case. If the tightening torque is
small, the contact resistance may increase, resulting in increased heat generation at the terminals. In
addition, it is expected that the screws may loosen due to vibration, etc., thus select and use screws
that are difficult to loosen, tighten with the appropriate torque, and perform retightening to suppress
the occurrence.
Refer to the outline drawing in the specifications and select screws with the appropriate length. If
the screw length is longer than the allowable value, the product may be damaged, resulting in ground
fault or insulation failure. In such cases, Fuji Electric will not be held responsible.
If the printed circuit board is not suitable, the temperature of the main terminal pins may rise above
the storage temperature. Use the main terminal pins within the storage temperature range.
Applying excessive stress (tensile, pushing, bending) to the main terminals and control terminals
may deform the terminals and crack the case resin, resulting in poor contact and poor insulation.
Refer to the mounting instructions of each package for the maximum allowable stress on the main
and control terminals.
Do not apply stress that causes the lid to deform. The internal circuit of the product may be
damaged in the pushing direction. In addition, the lid may come off in the pulling direction.

REH984f © Fuji Electric Co., Ltd. All rights reserved. 3-8
8. Storage and Transportation Notes
8.1 Storage
(1) The products should be stored at an ambient temperature of 5to 35oCand humidity of 45 to
75%. If the storage area is very dry, a humidifier may be required. In such case, use only
deionized water or boiled water, since the chlorine in tap water may corrode the product
terminals.
(2) Avoid exposure to corrosive gases and dust.
(3) Rapid temperature changes may cause condensation on the product surface. Avoid such
environment and store products in a place with minimal temperature changes.
(4) Do not apply external force to the products during storage. Unexpected force may be applied to
the products when stacked. Do not place heavy objects on the products.
(5) Store the products with unprocessed terminals. Storing after the terminals are processed may
cause soldering defects later during product mounting due to rust.
(6) Use only antistatic containers or the same container as shipped for storing the products in order
to prevent ESD damage.
(7) Use grounded metal storage shelves.
8.2 Transportation
(1) Avoid extreme forces such as dropping or shock when transporting the products .
(2) When transporting several products in the same box or container, insert padding between the
products to protect the terminals and to keep the products from shifting.
(3) Take measures against static electricity from being applied to the gate terminals, such as using
antistatic bag or shorting the gate and emitter with aluminum foil when transporting the product.