Harris Selenio SEL-1ENC1 User manual

SEL-1ENC1
Universal Encoder
Installation and Operation Manual
D
Edition B
175-100266-00

Selenio
SEL-1ENC1
Universal Encoder
Installation and Operation Manual
Edition B
May 2011

Harris Corporation
Broadcast
Communications
Transmission
4393 Digital Way
Mason, OH USA 45040
Media & Workflow
9800 South Meridian
Blvd.
Suite 300
Englewood, CO USA
80112
Infrastructure &
Networking
25 Dyas Road
North York, ON
M3B 1V7
Canada
Copyright © 2011, Harris Corporation, 1025 West NASA Boulevard, Melbourne, Florida 32919-0001 U.S.A. All
rights reserved. This publication supersedes all previous releases. No part of this documentation may be reproduced
in any form or by any means or used to make any derivative work without permission from Harris Corporation.
Harris Corporation reserves the right to revise this documentation and to make changes in content from time to
time without obligation on the part of Harris Corporation to provide notification of such revision or change.
UNITED STATES GOVERNMENT LEGEND If you are a United States government agency, this documentation and
the software described herein are provided to you subject to the following:
All technical data and computer software are commercial in nature and developed solely at private expense.
Software is delivered as “Commercial Computer Software” as defined in DFARS 252.227-7014 (June 1995) or as a
“commercial item” as defined in FAR 2.101(a) and as such is provided with only such rights as are provided by
Harris’ standard commercial license for the Software. Technical data is provided with limited rights only as provided
in DFAR 252.227-7015 (Nov 1995) or FAR 52.227-14 (June 1987), whichever is applicable. You agree not to
remove or deface any portion of any legend provided on any licensed program or documentation contained in, or
delivered to you in conjunction with, this User Guide.
This publication, or any part thereof, may not be reproduced in any form, by any method, for any purpose, without
the written consent of Harris Corporation.
Contact Harris Corporation for permission to use materials as well as guidelines concerning foreign language
translation and publication.
Harris Corporation reserves the right to revise and improve its products as it chooses. This publication is designed
to assist in the use of the product, as it exists on the date of publication of this manual, and may not reflect the
product at the current time or an unknown time in the future. This publication does not in any way warrant
description accuracy or guarantee the use for the product to which it refers.
The Harris logo and assured communications are registered trademarks of Harris Corporation. D-Series is a
trademark of Harris Corporation. All other trademarks are held by their respective owners.
This user guide was created for the Selenio SEL-1ENC1 product.
Windows is a registered trademark of Microsoft Corporation. AMD and Operton are trademarks of Advanced
Micro Devices, Inc. Manufactured under license from Dolby Laboratories. Dolby and the double-D symbol are
registered trademarks of Dolby Laboratories. HD-BNC is a trademark of Amphenol Corporation. Java is a
trademark of Sun Microsystems, Inc. or its subsidiaries in the United States and other countries.
All other trademarks are the property of their respective holders.
Publication Date: May 2011

iii
Copyright © 2011, Harris Corporation
Contents
Preface..........................................................................................................................v
Manual Information .......................................................................................................v
Purpose ......................................................................................................................v
Audience ....................................................................................................................v
Revision History ..........................................................................................................v
Writing Conventions ...................................................................................................v
Obtaining Documents ................................................................................................vi
Unpacking/Shipping Information ................................................................................vi
Unpacking a Product .................................................................................................vi
Product Servicing .......................................................................................................vi
Returning a Product ...................................................................................................vi
Safety Standards and Compliances ............................................................................ vii
Restriction on Hazardous Substances (RoHS) Compliance .......................................... vii
Waste from Electrical and Electronic Equipment (WEEE) Compliance ......................... vii
Safety Terms and Symbols in this Manual ................................................................ viii
Installation, Operation, and Specifications............................................. 1
Product Description ....................................................................................................... 1
Main Features ................................................................................................................ 1
Video Formats ........................................................................................................... 1
Modules and Softkey Options ..................................................................................... 3
3DTV Functionality .................................................................................................... 4
Front Module ................................................................................................................. 5
Back Modules ................................................................................................................ 6
Pinouts ...................................................................................................................... 7
Signal Flow .................................................................................................................... 8
Installing SEL-1ENC1 Modules ...................................................................................... 9
Removing Selenio Modules ........................................................................................ 10
Front Module .......................................................................................................... 10
Back Module ........................................................................................................... 10
Powering Up a Module ............................................................................................... 11
Upgrade Module Firmware ........................................................................................ 11
Upgrade Failure Instructions .................................................................................... 11
Video Input .................................................................................................................. 12
General ................................................................................................................... 12
Status ...................................................................................................................... 13
Video Compression ..................................................................................................... 14
General ................................................................................................................... 14
Status ...................................................................................................................... 18
Audio Compression 1-8 ............................................................................................... 18
General ................................................................................................................... 18
Status ...................................................................................................................... 24

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AAC ........................................................................................................................ 24
Dolby E ....................................................................................................................25
Audio Metadata ....................................................................................................... 25
Transport Stream Mux ................................................................................................27
General .................................................................................................................... 27
MPEG Parameters Main Program ............................................................................. 28
SI Parameters ...........................................................................................................28
ASI Output ............................................................................................................... 29
ASI Status ................................................................................................................29
IP Encapsulation .......................................................................................................... 29
Main Program IP ...................................................................................................... 29
Main Program IP Status ............................................................................................ 29
IP LANs ......................................................................................................................... 30
General .................................................................................................................... 30
Data Services ...............................................................................................................30
Status ...................................................................................................................... 30
Ext Data ...................................................................................................................30
VBI ........................................................................................................................... 30
Field 1 and 2 Line x Function .................................................................................... 30
VBI Status ................................................................................................................32
Ancillary Data .......................................................................................................... 32
Ancillary Status ........................................................................................................ 35
Close Caption .......................................................................................................... 35
AFD ......................................................................................................................... 36
KLV .......................................................................................................................... 37
Teletext and OP-47 .................................................................................................. 37
Splice ....................................................................................................................... 38
Timecode ................................................................................................................. 38
GPIx ..............................................................................................................................39
GPI x Function ..........................................................................................................39
GPI x State ...............................................................................................................39
Serial Data ....................................................................................................................39
Miscellaneous .............................................................................................................. 39
Name ....................................................................................................................... 39
Laser Safety for Fiber Optic Back Modules ................................................................ 40
Precautions for Enclosed Systems ............................................................................. 40
Precautions for Unenclosed Systems ......................................................................... 40
Label .............................................................................................................................41
Inspecting and Cleaning Fiber Optic Connections .................................................... 41
Important Points ......................................................................................................42
Inspection and Cleaning Procedure .......................................................................... 43
Specifications ...............................................................................................................44
ASI Output ............................................................................................................... 44
Audio Compression Specifications ............................................................................ 44
Video Input Specifications ........................................................................................45
Video Output Specifications .....................................................................................46
Index........................................................................................................................... 49

v
Copyright © 2011, Harris Corporation
Preface
Manual Information
Purpose This manual details the features, installation, operation, maintenance, and specifications for
the SEL-1ENC1 Universal Encoder.
Audience This manual is written for engineers, technicians, and operators responsible for installation,
setup, maintenance, and/or operation of the SEL-1ENC1 Universal Encoder.
Revision
History
Writing
Conventions
To enhance your understanding, the authors of this manual have adhered to the following
text conventions:
Table 1-1 Revision History of Manual
Edition Date Comments
AMarch 2011 Initial release
B May 2011 Installation modifications
Table 1-2 Writing Conventions
Term or
Convention Description
Bold Indicates dialog boxes, property sheets, fields, buttons, check boxes,
list boxes, combo boxes, menus, submenus, windows, lists, and
selection names
Italics Indicates E-mail addresses, the names of books or publications, and
the first instances of new terms and specialized words that need
emphasis
CAPS Indicates a specific key on the keyboard, such as ENTER, TAB, CTRL,
ALT, or DELETE
Code Indicates variables or command-line entries, such as a DOS entry or
something you type into a field
>Indicates the direction of navigation through a hierarchy of menus and
windows

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Copyright © 2011, Harris Corporation
Obtaining
Documents
Product support documents can be viewed or downloaded from our website. Alternatively,
contact your Customer Service representative to request a document.
Unpacking/Shipping Information
Unpacking a
Product
This product was carefully inspected, tested, and calibrated before shipment to ensure years
of stable and trouble-free service.
1Check equipment for any visible damage that may have occurred during transit.
2Confirm that you have received all items listed on the packing list.
3Contact your dealer if any item on the packing list is missing.
4Contact the carrier if any item is damaged.
5Remove all packaging material from the product and its associated components before you
install the unit.
Keep at least one set of original packaging, in the event that you need to return a product
for servicing.
Product
Servicing
Except for firmware upgrades, SEL-1ENC1 modules are not designed for field servicing. All
hardware upgrades, modifications, or repairs require you to return the modules to the
Customer Service center.
Returning a
Product
In the unlikely event that your product fails to operate properly, please contact Customer
Service to obtain a Return Authorization (RA) number, and then send the unit back for
servicing.
Keep at least one set of original packaging in the event that a product needs to be returned
for service. If the original package is not available, you can supply your own packaging as
long as it meets the following criteria:
The packaging must be able to withstand the product’s weight.
The product must be held rigid within the packaging.
There must be at least 2 in. (5 cm) of space between the product and the container.
The corners of the product must be protected.
hyperlink Indicates a jump to another location within the electronic document or
elsewhere
Internet address Indicates a jump to a website or URL
Indicates important information that helps to avoid and troubleshoot
problems
Table 1-2 Writing Conventions
Term or
Convention Description

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Copyright © 2011, Harris Corporation
Ship products back to us for servicing prepaid and, if possible, in the original packaging
material. If the product is still within the warranty period, we will return the product prepaid
after servicing.
Safety Standards and Compliances
The Selenio series safety manual is shipped in the Harris Infrastructure and Networking
Documentation and Product Resources DVD, and can be downloaded from our website.
Restriction on Hazardous Substances (RoHS) Compliance
Directive 2002/95/EC—commonly known as the European Union (EU) Restriction on
Hazardous Substances (RoHS)—sets limits on the use of certain substances found in
electrical and electronic equipment. The intent of this legislation is to reduce the amount of
hazardous chemicals that may leach out of landfill sites or otherwise contaminate the
environment during end-of-life recycling. The Directive, which took effect on July 1, 2006,
refers to the following hazardous substances:
Lead (Pb)
Mercury (Hg)
Cadmium (Cd)
Hexavalent Chromium (Cr-V1)
Polybrominated Biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
According to this EU Directive, all products sold in the European Union will be fully
RoHS-compliant and “lead-free.” (See our website for more information on dates and
deadlines for compliance.) Spare parts supplied for the repair and upgrade of equipment
sold before July 1, 2006 are exempt from the legislation. Equipment that complies with the
EU directive will be marked with a RoHS-compliant emblem, as shown in Figure P-1.
Figure P-1 RoHS Compliance Emblem
Waste from Electrical and Electronic Equipment (WEEE) Compliance
The European Union (EU) Directive 2002/96/EC on Waste from Electrical and Electronic
Equipment (WEEE) deals with the collection, treatment, recovery, and recycling of electrical
and electronic waste products. The objective of the WEEE Directive is to assign the
responsibility for the disposal of associated hazardous waste to either the producers or users
of these products. As of August 13, 2005, the producers or users of these products were
required to recycle electrical and electronic equipment at end of its useful life, and may not
dispose of the equipment in landfills or by using other unapproved methods. (Some EU
member states may have different deadlines.)

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Copyright © 2011, Harris Corporation
In accordance with this EU Directive, companies selling electric or electronic devices in the
EU will affix labels indicating that such products must be properly recycled. (See our website
for more information on dates and deadlines for compliance.) Contact your local Sales
representative for information on returning these products for recycling. Equipment that
complies with the EU directive will be marked with a WEEE-compliant emblem, as shown in
Figure P-2.
Figure P-2 WEEE Compliance Emblem
Safety Terms
and Symbols
in this
Manual
This product manual uses the following safety terms and symbols to identify certain
conditions or practices. See page 40 and the Safety Instructions and Standards Manual for
more information.
WARNING
Statements identifying conditions or practices that may result in personal injury or loss of
life. High voltage is present.
CAUTION
Statements identifying conditions or practices that can result in damage to the equipment
or other property.

1
Copyright © 2011, Harris Corporation
Installation, Operation, and
Specifications
Product Description
SEL-1ENC1 modules provide MPEG-2 and H.264 compression of digital video and audio,
with a variety of common compression algorithms for up to 8 stereo pairs of audio, and
processing of associated VBI and VANC data.
The SEL-1ENC1 supports either standard-definition (SD) or high-definition (HD) SDI video
formats and a full range of North American and European formats. In addition, the module
also provides a reduced-resolution compressed stream output, which can be used to support
picture-in-picture requirements in IPTV deployments, or for stream monitoring requirements
in network deployments.
A variety of audio compression options are available, including Dolby®Digital (AC-3) 2.0,
MPEG-1 layer 2 AAC-HE, HE-AAC, AAC-LC, HE-AAC, and Dolby E. All audio can be
presented to the encoder as embedded on the SDI, or as separate AES inputs.
Main Features
Video Formats
Supports the following formats:
1080p/59.94, 1080p/50 - SMPTE424/235 Level A and B
1080i/29.97, 1080i/25 - SMPTE292
720p/59.94, 720p/50 - SMPTE292
480i/29.97 - SMPTE259
576i/25 - SMPTE259
Supports a primary SD/HD encoded stream (except with 1080p60) and secondary
stream encoded at lower resolutions for mobile, picture-in-picture or monitoring
Supports the following coding formats:
H.264 high profile @ up to L4.2 (62.5 Mb/s max)
H.264 restricted to main profile @ up to L4.2
H.264 restricted to baseline profile @ up to L1.3
MPEG-2 422 profile @ up to high level (62.5 Mb/s max)
MPEG-2 restricted to main profile @ up to high level

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Copyright © 2011, Harris Corporation
Supports the following reduced horizontal resolutions:
1920 - 1440, 1280, 960
1280 - 960, 640
720 - 704, 640, 544, 528, 480, 352
Supports the following reduced resolutions:
CIF (352x240/288)
QVGA (320x240 [4:3] 320x180 [16:9])
SQVGA (160x120 [4:3] 160x90 [16:9])
M/H (416x240 [letterbox for 4:3])
Supports video pre-processing:
Inverse telecine
Motion compensated temporal filtering (MCTF)
De-blocking filter
Audio Input
8 (High-Density) HD-BNCTM connectors on the rear connector board for audio input
Embedded audio from the SDI video input
Supports up to 8 audio encoder engines
MPEG-1 Layer 2
Dolby Digital (AC-3)
AAC-LC (MPEG-2 and MPEG-4)
HE-AAC V1 (SBR) and V2 (Parametric Stereo)
Dolby E
SMPTE 302
VANC processing
VANC passthrough (SMPTE 2038) up to 2K words per field
EIA-608/708 closed captioning
AFD
DVITC time code
OP47 teletext
Audio metadata
VBI processing
EIA-608 closed captioning
WSS signaling
WST teletext
VITC time code
AMOL-48 or AMOL-96
VPS data
Data Input
Closed captions from IP/UDP
GPI triggers from back module
Serial data from back module

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Copyright © 2011, Harris Corporation
Modules and Softkey Options
Table 1-1 Module Descriptions
Product Description
SEL-1ENC1-EES MPEG-2/H.264 Standard Encoder hardware;
includes video coding, up to four stereo pairs of audio compression, single back
module with (High-Density) HD-BNC connectors for SDI in/out, ASI out, AES
(unbalanced) in, and socket/plug for GPI in/out and serial data connections (software
model key must be selected to enable functions)
SEL-1ENC1-OES MPEG-2/H.264 Standard Encoder hardware;
includes video coding, up to four stereo pairs of audio compression, single back
module with SFP input (SFP module ordered separately), (High-Density) HD-BNC
connectors for SDI in/out, ASI out, AES in (unbalanced), socket/plug for GPI in/out and
serial data connections (software model key must be selected to enable functions)
Table 1-2 Module Types
Product Description
SEL-SK-EN-ATSC-HD Software model key for ENC1 - ATSC, supporting MPEG-2 SD and HD 4:2:0 video, up
to four channels of AC-3 audio
SEL-SK-EN-ATSC-MBL Software model key for ENC1 - ATSC MH,supporting H.264 mobile video, and a
single channel of HE-AAC V2 audio
SEL-SK-EN-ATSC-SD Software model key for ENC1 - ATSC, supporting MPEG-2 SD 4:2:0 video, up to four
channels of AC-3 audio
SEL-SK-EN-C-1080P Software model key for ENC1 - Contribution, supporting MPEG-2 SD, 4:2:0 and 4:2:2
profiles, H.264 SD High and Main profile and 3G 1080P, up to four channels of
MPEG-1, AC-3 2.0, AAC-LC, HE-AAC V1 and V2 audio
SEL-SK-EN-C-PRO-HD Software model key for ENC1 - Contribution, supporting MPEG-2 HD/SD, 4:2:0 and
4:2:2 profiles, H.264 HD/SD High and Main profile, up to four channels of MPEG-1,
AC-3 2.0, AAC-LC, HE-AAC V1 and V2 audio
SEL-SK-EN-C-PRO-SD Software model key for ENC1 - Contribution, supporting MPEG-2 SD, 4:2:0 and 4:2:2
profiles, H.264 SD High and Main profile, up to four channels of MPEG-1, AC-3 2.0,
AAC-LC, HE-AAC V1 and V2 audio
SEL-SK-EN-DVB-HD Software model key for ENC1 - DVB supporting MPEG-2 SD/HD, 4:2:0, and up to four
channels of MPEG-1 audio
SEL-SK-EN-DVB-MBL Software model key for ENC1 - DVB Mobile, supporting H.264 mobile video, and a
single channel of HE-AAC V2 audio
SEL-SK-EN-DVB-SD Software model key for ENC1 - DVB, supporting MPEG-2 SD, 4:2:0, and up to four
channels of MPEG-1 audio
SEL-SK-EN-IPTV-HD Software model key for ENC1 - IPTV, supporting H.264 HD Main profile, and a single
channel of MPEG-1 or AAC-LC audio
SEL-SK-EN-IPTV-SD Software model key for ENC1 - IPTV, supporting H.264 SD Main profile, and a single
channel of MPEG-1 or AAC-LC audio

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Copyright © 2011, Harris Corporation
3DTV Functionality
The SEL-1ENC1 transports 3DTV signals using the standard shown in Tab le 1-5.
SEL-SK-EN-ISDB-HD Software model key for ENC1 - ISDB-Tb, supporting MPEG-2 SD/HD, 4:2:0, and up to
four channels of MPEG-1, AAC-LC, HE-AAC V1 and V2 audio
SEL-SK-EN-ISDB-MBL Software model key for ENC1 - ISDB-Tb Mobile, supporting H.264 mobile video, and
a single channel of HE-AAC V2 audio
SEL-SK-EN-ISDB-SD Software model key for ENC1 - ISDB-Tb, supporting MPEG-2 SD, 4:2:0, and up to
four channels of MPEG-1, AAC-LC, HE-AAC V1 and V2 audio
Table 1-2 Module Types (Continued)
Product Description
Table 1-3 Softkey Options
Product Description
SELOPT-SK-EN-AAC Software keyed option for AAC audio on 4 stereo pairs
SELOPT-SK-EN-AUD4 Software keyed option for additional 4 stereo pairs of audio available on-board
SELOPT-SK-EN-DDE Software keyed option for support of Dolby Digital (AC-3) 5.1 (uses 3 existing stereo
pairs of audio)
SELOPT-SK-EN-H264 Software keyed option for H.264 encoding, 4:2:0, main and high profile
SELOPT-SK-EN-PRE Software keyed option for pre-processing video enhancements for DTH applications
SELOPT-SK-EN-S302 Software keyed option to support for up to 8 stereo pairs of SMPTE-302 pass-through
audio
Table 1-4 SFP Receiver Option
Product Quantity Description
OP+SFP+RR 1Dual PIN receiver with pathological support for baseband video
Table 1-5 SDTV Compatibility
Picture
Quality Definition Number of Connections 3DTV Standard Use
Half 1.5 Gb/s 3D
(SMPTE 292M)
11/2 resolution or better
(many variants)
Distribution

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Front Module
Figure 1-1 SEL-1ENC1 Front Module

SEL-1ENC1
Installation, Operation, and Specifications
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Copyright © 2011, Harris Corporation
Back Modules
Figure 1-2 Selenio Color Scheme and Encoder Back Modules
Back Module
Color Palette Card
SDI Tx
AUDIO IN
AUDIO OUT
SDI IN
SDI OUT
ASI OUT
ASI IN
MISCELLANEOUS
AUDIO IN/OUT
ASI IN/OUT
SDI Rx
F
SEL-BM-ENC-EES
Encoder
ENC
2
1
20
19
SDI
IN
SEL-BM-ENC-EES
AES
IN
NOT
USED
78
56
34
12
GPI / SERIAL
1
2
ASI
OUT
SDI
OUT
2
1
G
SEL-BM-ENC-OES
Encoder
ENC
2
1
20
19
AES
IN
SDI
Rx
SDI
OUT
1
2
2
SEL-BM-ENC-OES
ASI
OUT
1
2
78
56
34
12
GPI / SERIAL
1

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Copyright © 2011, Harris Corporation
Pinouts
Figure 1-3 GPI/Serial Connector Pinouts
Table 1-6 GPI/Serial Pinouts
Pin Function
1GPI Out 1
2GPI Out 2
3GPI Out 3
4GPI Out 4
5GPI In 1
6GPI In 2
7GPI In 3
8GPI In 4
9D-Ground
10 D-Ground
11 RS-422 Port 2 Rx+
12 RS-422 Port 2 Rx-
(RS-232 Port 2 Rx)
13 RS-422 Port 2 Tx+
14 RS-422 Port 2 TX-
(RS-232 Port 2 Tx)
15 D-Ground
16 D-Ground
17 RS-422Port 1 Rx+
18 RS-422 Port 1 Rx-
(RS-232 Port 1 Rx)
19 RS-422Port 1 Tx+
20 RS-422 Port 1 Tx-
(RS-232 Port 1 Tx)
2
1
20
19

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Installation, Operation, and Specifications
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Copyright © 2011, Harris Corporation
Signal Flow
Figure 1-4 SEL-1ENC1 Block Diagram (EES Version)
Figure 1-5 SEL-1ENC1 Block Diagram (OES Version)
EXT SDI
(EXT SDI)
Video
Input
Video
Compression
1 2 3 4
5 6 7 8
Audio Compression
Data
Services
GPI
Serial
Misc
CTR SDI
EXT SDI 1
EXT ASI 1
EXT GPI 1-4
CTR SDI
(INT SDI )
EXT ASI 2
CXN
EXT IP
Transport
Stream Mux
IP
Encapsulation IP LAN
EXT ASI 1-8
2 1
20 19
EXT Serial 1
EXT IP MGMT
De-Embed
EXT SDI 2
EXT Serial 2
SDI Rx
(E XT SD I ) Video
Input
Video
Compression
Data
Services
GPI
Serial
Misc
CTR SDI
EXT SDI 1
EXT ASI 1
CTR SDI
(INT SDI)
EXT ASI 2
CXN
EXT IP
Transport
Stream Mux
IP
Encapsulation IP LAN
EXT ASI 1-8
EXT IP MGMT
De-Embed
EXT SDI 2
EXT GPI 1-4
2 1
20
19
EXT Serial 1
EXT Serial 2
123 4
5678
Audio Compression

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Copyright © 2011, Harris Corporation
Installing SEL-1ENC1 Modules
You can insert a Selenio module into a frame with the power supply turned on or off.
Follow this procedure:
1Remove a blank back module from the frame, saving the blank back modules and their
captive screws for future configurations.
2Attach the new back module to the empty slot, using the mounting screws provided.
Align the back module’s pin into the guide hole, and ensure that the EMI gaskets
separating the back modules remain in place during the installation. The EMI gaskets fit
tightly. To ease the installation of back modules, gradually press each back module into
place from the left side to the right side.
Figure 1-6 Installing Back Modules
3Apply labels to the back module, if these are supplied separately.
4Print out this page and write down the placement of the back modules in the diagram
below (back modules appear on the reverse side when viewed from the front).
Figure 1-7. Writing Space for Identifying Back Modules
Align pin into
guide hole
14.
10.
9.
8.
7.
6.
5.
4.
3.
2.
1.
13.
12.
11.

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Installation, Operation, and Specifications
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Copyright © 2011, Harris Corporation
CAUTION:
Do not mix and match back and front modules. The front module must mate with a
back module of the same product.
5Open the front panel and then slide the correct front modules into the slots that match the
back modules.
6Push the module until it seats properly, ensuring the edge of the module is flush with the
edge of the module guides, and the square extractor handle clicks into its slot.
7Install the remaining back and front modules, make all of the necessary rear connections,
and then close the front panel.
CAUTION:
To prevent overheating during frame operation, keep the front panel closed and all
back module slots covered.
Removing Selenio Modules
Front Module To remove a front module from a Selenio frame, follow this procedure:
1Open the front panel.
2Grasp the extractor handle on the module, pulling down slightly.
3Using the handle, slide the module out of its slot.
Figure 1-8 Removing a Front Module
4Close the front panel to ensure proper frame ventilation.
Back Module To remove a back module from a Selenio frame, you must first remove the front module.
Then unscrew the back module, and pull it straight out. Cover the opening with a blank
back module to ensure proper frame ventilation.
1. Pull down
to unlock the
extractor.
Extractor lock
2. Slide the
module out of
the slot.
Flat support post
rotates for module
insertion and removal