Hewlett Packard Enterprise Aruba 7240-US Assembly instructions

MF877-00
Template Revision A
Page 1
HPE instructions for this template are available at MF877-01
Product End-of-Life DisassemblyInstructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
Aruba7240-US
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies(PCA)
With a surface greater than 10 sq cm
3
Batteries All types including standard alkaline and lithium
coin or button style batteries(Lithium 3V) 1
Mercury-containingcomponents
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm Includes background illuminated displays with gas dischargelamps 0
Cathode RayTubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords 2
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Front bezel - SABIC cycoloy 6200 PC/ABS
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0
Components and waste containing asbestos
0
Components,parts and materials containing
refractoryceramic fibers
0
1.0 Items Requiring Selective Treatment

MF877-00
Template Revision A
Page 2
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components,parts and materials containing
radioactivesubstances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
ToolDescription
Tool Size (if
applicable)
Phillipsscrewdriver
No. 1
Phillipsscrewdriver No. 2
Description#4
Description#5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unfasten 2 screws to remove the fan module from the chassis.
2. Unfasten 1 screw to remove the power supply from the chassis.
3. Open the chassis by removing the screws on the top cover.
4. Uninstall the front bezel.
5. Remove the bridge board from the chassis.
6. Remove the interface board from the chassis.
7. Remove the main board from the chassis.
8. Remove the battery from main board
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HPE instructions for this template are available at MF877-01
MF877-00 Page 3
Template Revision A
1. Unfasten 2 screws to remove the fan module from chassis.
2. Unfasten 1 screw to remove the power supply from chassis.
3. Open the chassis by removing the screws on the top cover.
4. Remove the interface board from the chassis.
5. Remove the main board from the chassis.
6. Remove the bridge board from the chassis.

HPE instructions for this template are available at MF877-01

HPE instructions for this template are available at MF877-01
MF877-00
Page 4
Template Revision A