HP Enterprise Apollo XL450 Gen10 Assembly instructions

MF877-00
Template Revision A
Page 1
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE Apollo XL450 Gen10 Server
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sqcm
13
Batteries
All types including standard alkaline and lithium coin
or button style batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
5
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
0
1.0Items Requiring Selective Treatment

MF877-00
Template Revision A
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HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in product
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
T10
Screw driver
T15
Screw driver
T20
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery –Locate the battery on the system Board, use fingers to remove the battery and dispose of
properly.
2. Mega Cell –Pull the mega cell holder to get them out of the chassis.
3. Capacitors 2.5cm –Remove the PSU from the system. Remove the screws securing the top cover, locate the
capacitors and use a medium flat head crew driver to remove them and dispose of properly
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1 –7 Cap Location in PSU
Attachment 8 Mega Cell Holder Location
Attachment 9 System Battery Location

Attachment 1#: HSTNS-PD44
MF877-00
Template Revision A
Page 3
HPE instructions for this template are available at MF877-01
Attachment 2#: HSTNS-PL45
Remove capacitor
Remove capacitor

MF877-00
Template Revision A
Page 4
HPE instructions for this template are available at MF877-01
Attachment 3#: HSTNS-PF46
Attachment 4#: HSTNS-PL41
Remove capacitor
Remove capacitor

MF877-00
Template Revision A
Page 5
HPE instructions for this template are available at MF877-01
Attachment 5#: HSTNS-PL62
Attachment 6#: HSTNS-PR62
Remove capacitor
Remove capacitor

MF877-00
Template Revision A
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HPE instructions for this template are available at MF877-01
Attachment 7#: HSTNS-PD40
Attachment 8#
Remove Mega Cell
Remove capacitor

MF877-00
Template Revision A
Page 7
HPE instructions for this template are available at MF877-01
Attachment 9#
Remove Battery