HP 280 G5 SFF Business PC Assembly instructions

EL-MF877-00
Template Revision C
Page 1
Last revalidation date 08-May-2020
HPI instructions for this template are available at EL-MF877-01
1.0 Items Requiring Selective Treatment
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 280 G5 SFF Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking
code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm 2
Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button
style batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin
cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[x] snaps
[ ] adhesive
[ ] other. Explain

EL-MF877-00
Template Revision C
Page 2
Last revalidation date 08-May-2020
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
PSU 1
External electrical cables and cords DC Cable for External Power Supply 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.

EL-MF877-00
Template Revision C
Page 3
Last revalidation date 08-May-2020
HPI instructions for this template are available at EL-MF877-01
Tool Description Tool Size (if
applicable)
Hexagon Screw Driver
T-15
Electric Iron QUICK 310
Crisscross Screw Driver PH1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selectivetreatment
including the required steps to remove the external enclosure:
1. Remove access panel (Step1-2)
2. Disconnect ODD/ HDD cable and remove ODD/ HDD (Step3~Step11)
3. Remove all cables and cooler from MB(step12-16)
4. Remove Memory/CPU/GFX/WLAN/Batteryfrom MB(step17~23)
5. Remove antenna from chassis (step24
6. Remove MB from chassis(Step25~26)
7. Remove PSU from chassis(step27~29)
8. Separate PSU and remove the Electrolytic Capacitors（step30~33）
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying location

L-MF877-00
emplate Revision C
ast revalidation date 08
-May-2020
HPI instructio
mplate are available at EL-MF877-01
ge 4
Step1 Use T-15 screwdriver to Loose thumb
screw and remove access panel.
Step2 Remove front bezel from chassis
Step3 Loose screw and remove blank module
Step4 Disconnect HDD power cable and HDD SATA cable
from 1st HDD.
Step5 Disconnect ODD power cable and ODD SATA
cable from ODD.
E
T
L
ns for this t
Step6 Press the ODD’s latch on ODD cage and remove ODD
Pa
e

EL-MF877-00
Template Revision C
Page 5
Last revalidation date 08-May-2020
HPI instructions for this template are available at EL-MF877-01
Step7 Use T-15 screwdriver to Loose screw
Step8 Remove the driver cage from Chassis
Step9:Use T-15 screw driver to loose the screws of HDD
and remove HDD from HDD cage
Step10 Disconnect HDD power cable and HDD SATA cable
from 2ndHDD.
Step11 Loose 2nd HDD screw and remove the 2nd HDD Step12：Disconnect CPU Cooler Fan cable from MB

EL-MF877-00
Template Revision C
Page 6
Last revalidation date 08-May-2020
HPI instructions for this template are available at EL-MF877-01
Step13 Loose the screws and remove cooler fan
Step14: Disconnect system fan cable from MB

EL-MF877-00
Template Revision C
Page 7
Last revalidation date 08-May-2020
HPI instructions for this template are available at EL-MF877-01
Step15 Loose the screws and remove system fan
Step16
Disconnect all cables from MB
Step17 Remove memory from the MB Step18 Rotate the handle and open it up

EL-MF877-00
Template Revision C
Page 8
Last revalidation date 08-May-2020
HPI instructions for this template are available at EL-MF877-01
Step19:Remove the CPU from the board Step20 loose screw from behind panel
Step21 remove graphic card from board Step22 Remove the battery from MB
Step23 Remove M.2 WLAN card Step24 Loose the screw of rear antenna and remove it

EL-MF877-00
Template Revision C
Page 9
Last revalidation date 08-May-2020
HPI instructions for this template are available at EL-MF877-01
Step25 Loose the all screws of motherboard Step26 Remove motherboard from chassis

EL-MF877-00
Template Revision C
Page 10
Last revalidation date 08-May-2020
HPI instructions for this template are available at EL-MF877-01
Step27 Remove the screws of PSU from chassis Step28 Press the PSU’s latch on chassis
Step29 Remove the power supply from chassis Step30 loose screws from top and right

EL-MF877-00
Template Revision C
Page 11
Last revalidation date 08-May-2020
HPI instructions for this template are available at EL-MF877-01
Step31 Remove the screw and open cage Step32 Loose screws and remove PCB from cage
Step33 Take off CAP using electric iron from the PSU