HP 406 G1 MT Installation instructions

Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 406 G1 MT
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MB, Memory,HDD PCA,ODD PCA,PSU PCA
5
Batteries
All types including standard alkaline and lithium coin
or button style batteries MB
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
PSU
2
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
system fan, Cooler fan,PSU fan
3
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
0
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refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 crisscross screw driver
2#
Description #2 hexagon screw driver
T15
Description #3 electric iron
QUICK 310
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel from the unit
2. Remove front panel from the unit
3. Remove all the cables from the unit
4. Remove ODD from the unit
5. Remove HDD from the unit
6. Take off FIO from the unit
7. Take off system fan from the unit
8. Take off PSU from the unit.
9. Take off Memory from the unit.
10. Take off CPU cooler from the unit.
11. Take off battery from the unit.
12. Take off PCA from the unit.
13. Open the PSU
14. Take off PSU fan
15. Take off CAP using electric iron.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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1. Remove access panel
from the unit.
Release screw on the access
panel. Griping the tab at the end
of access panel, pull towards the
rear and remove it from unit.
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2 Remove front panel from
the unit.
Release 3 bezel latches from
chassis by pulling the bezel
latches outwards.
3.Remove all the cable from
the unit.
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4.Remove ODD from the unit.
Rotate the screw driver to release
the ODD and remove the ODD
from the cage.
5.Remove HDD from the unit.
Rotate the screw driver to release
the ODD and remove the ODD
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from the cage.
6 Take off FIO from the unit.
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7.Take off the system fan
from the unit
Rotate screw driver to loose
screw and then take off the
system fan.
8.Take off PSU from the unit.
Rotate the screw driver to release
PSU from the unit.
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9. Take off Memory from the
unit.
Release memory socket levers
by pulling outward.
10. Take off CPU cooler from
the unit.
Rotate the screw driver to release
CPU cooler from the unit.
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11. Take off battery from the
unit.
12.Take off PCA from the
unit.
Rotate screw driver to loose
PCA from the unit.
13.Open the PSU
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Rotate the screw driver to
release the PSU cover.
Rotate screw driver to
loose PCA from the unit.
14. Take off PSU fan.
Rotate screw driver and
remove PSU fan.
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15. Take off CAP using
electric iron.
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PSG instructions for this template are available at EL-MF877-01