E
L-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
including liquids, semi-liquids (gel/paste) and toner chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Screwdriver T-15
Micro shear 170II
Screwdriver PH1
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the access panel.(see Figure 1 below)
2. Disconnect the cables.(see Figure 2-5 below)
3. Remove the HDD from cage.(see Figure 6 below)
4. Remove PSU from chassis.(see Figure 7~11 below)
5. Remove system fan.(see Figure 12&13 below)
6. Remove the Memory card from the board.(see Figure 14&15 below)
7. Remove the HeatSink.(see Figure 16 below)
8. Remove the CPU from the board .(see Figure 17-18 below)
9. Remove the battery from the system board.(see Figure 19 below)
10.Remove M/B from chassis.(see Figure 20&21 below)
11. Remove front panel.(see Figure 22 below)
12.Remove slim ODD from chassis.(see Figure 23&24 below)
13.Remove Front I/O cable, power LED cable and speaker.(see Figure 25~30 below)
14. Remove HDD/Slim ODD/5.25'' bay's Latch from chassis.(see Figure 31-36 below)
15. Remove PSU cover.(see Figure 37&38 below)
16. Unscrew and remove Fan and Inlet from case.(see Figure 39&40 below)
17. Remove the thin-film plastic sheet and PCA.(see Figure 41&42below)
18.Remove bulk cap(electrolytic capacitor) from PCB.(see Figure 43 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
