HP ProDesk 400 G7 SFF Installation instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 400 G7 Microtower PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking
code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 2
Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button
style batteries 1
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin
cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[] screws
[X] snaps
[] adhesive
[] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height Delta 350W EPA92 PSU 1
External electrical cables and cords Power Cord 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity
of items
included
in product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Hexagon Screw Driver T-15
Crisscross Screw Driver PH1
Electric Iron QUICK 310
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Use T-15 screw driver to loose thumb screw and remove access panel.
2. Disconnect ODD power cable and ODD SATA cable from ODD.
3. Press the ODD’s latch on ODD cage.
4. Remove the ODD from ODD cage.
5. Remove Front Bezel from chassis.
6. Remove the ODD cage.
7. Disconnect HDD power cable and HDD SATA cable from HDD.
8. Use T-15 screw driver to loose the screws of HDD and remove HDD from HDD cage.
9. Remove HDD cage from Chassis
10. Remove HDD from HDD cage
11. Disconnect all SATA data cables from MB.
12. Disconnect P1 Power cable from MB
13. Disconnect system fan cable from MB.
14. Disconnect Speaker and P2 cable from MB
15. Use PH1 screwdriver to remove system fan from chassis.
16. Disconnect cooler fan cable from MB.
17. Use T-15 screwdriver to loose the screws and remove cooler.
18. Use PH1 screwdriver to loose the screws and remove the fan.
19. Separate the fan from cooler.
20. Remove memory from MB.
21. Rotate the handle and open it up.
22. Remove the CPU from the board.
23. Remove the battery from the system board.
24. Remove Graphic card from MB.

EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
25. Use PH1 screwdriver to loose the screws and remove the SSD from the board.
26. Use T-15 screwdriver to loose the screws of MB from board.
27. Remove speaker from Chassis.
28. Remove MB from chassis.
29. Use T-15 screwdriver remove the screws on the PSU chassis.
30. Press the PSU latch on chassis.
31. Remove the PSU from chassis.
32. Use PH1 screwdriver to remove screw for the PSU.
33. Remove PSU cover.
34. Use PH1 screwdriver to remove FG screw.
35. Disconnect fan connector and inlet connector.
36. Loose screws and remove PCA from case.
37. Use PH1 screwdriver to remove AC inlet & Fan screw.
38. Heat the solder of the Electrolytic Capacitors of greater than 2.5cm in diameter or height and remove it.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Step1 Use T-15 screwdriver to Loose thumb screw and
remove access panel
Step2 Disconnect ODD power cable and ODD SATA cable
from ODD
Step3 Press the ODD’s latch on ODD cage
Step4 Remove the ODD from ODD cage

EL-MF877-00 Page 4
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step5 Remove front bezel from chassis
Step6 Remove the ODD cage
Step7 Disconnect HDD power cable and HDD SATA
cable from HDD
Step8 Use T-15 screwdriver to loose the screws of HDD and
remove HDD from HDD cage
Step9 Remove HDD cage from Chassis
Step10 Remove HDD from HDD cage

EL-MF877-00 Page 5
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step11 Disconnect all SATA data cables from MB
Step12 Disconnect P1 Power cable from MB
Step13 Disconnect system fan cable from MB
Step14 Disconnect Speaker and P2 cable from MB

EL-MF877-00 Page 6
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step15 Use PH1 screwdriver to remove system fan from
chassis
Step16 Disconnect cooler fan cable from MB
Step17 Use T-15 screwdriver to loose the screws and
remove cooler
Step18 Use PH1 screwdriver to loose the screws and remove
the fan

EL-MF877-00 Page 7
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step19 Separate the fan from cooler
Step20 Remove memory from MB
Step21 Rotate the handle and open it up
Step22 Remove the CPU from the board

EL-MF877-00 Page 8
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step23 Remove the battery from the system board
Step 24 Remove Graphic card from MB
Step 25 Use PH1 screwdriver to loose the screws and
remove the SSD from the board
Step 26 Use T-15 screwdriver to loose the screw from MB
Step 27 Remove speaker from Chassis
Step 28 Remove MB from chassis

EL-MF877-00 Page 9
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 29 Use T-15 screwdriver remove the screws on the
PSU chassis
Step30 Press the latch on chassis
Step31 Remove the PSU from chassis Step32 Use PH1 screwdriver to remove screws from the PSU
Step33 Remove PSU cover
Step34 Use PH1 screwdriver to remove FG screw

EL-MF877-00 Page 10
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step35 Disconnect fan connector and inlet connector
Step36 Loose screws and remove PCA from case
Step37 Use PH1 screwdriver to remove AC inlet & Fan
screw
Step38 Heat the solder of the Electrolytic Capacitors of greater
than 2.5cm in diameter or height and Remove it