HP Z2 Tower G5 Assembly instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Workstation
Marketing Name / Model
[List multiple models if applicable.]
HP Z2 Tower G5 Workstation
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button style
batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[X] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
Chicony 700W EPA92 PSU
2
External electrical cables and cords
Power Cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Hexagon Screw Driver
T-15
Crisscross Screw Driver
PH1
Electric Iron
QUICK 310
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Open access panel
2. Remove front bezel from chassis
3. Disconnect cable from Graphic card
4. Press the Graphic cards latch and unplug Graphic card
5. Press the ODD’s latch on ODD cage
6. Disconnect ODD power cable and ODD SATA cable from ODD
7. Remove the ODD from ODD cage
8. Use T-15 screw driver to loose the screws of iron plate
9. Remove the iron plate of ODD
10. Loose the screws of HDD and remove HDD from HDD cage
11. Disconnect HDD power cable and HDD SATA cable from HDD
12. Remove the driver cage from Chassis
13. Disconnect all cables from MB
14. Disconnect system fan cable from MB
15. Use PH1 screwdriver to remove system fan from chassis
16. Remove system fan from chassis
17. Use T-15 screwdriver to loose the screws and remove cooler
18. Use PH1 screwdriver to loose the screws and remove the fan
19. Separate the fan from cooler
20. Remove memory from MB
21. Rotate the handle and open it up
22. Remove the CPU from the board
23. Remove the battery from the system board
24. Remove speaker from Chassis
25. Remove WLAN M.2 Card
26. Use T-15 screwdriver to loose the screws of MB from board

EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
27. Remove MB from chassis
28. Use T-15 screwdriver remove the screws on the PSU Chassis
29. Disconnect the PSU cable from the MB
30. Remove the PSU from chassis
31. Use PH1 screwdriver to remove screw for the PSU
32. Remove cover
33. Use PH1 screwdriver to remove FG screw
34. Disconnect fan connector and inlet connector
35. Use PH1 screwdriver to remove AC inlet & Fan screw
36. Remove the PCB from the the PSU
37. Heat the solder of the Electrolytic Capacitors of greater than 2.5cm in diameter or height and Remove it
38. The electrolytic Capacitors had been removed.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
Step1 Open access panel
Step2 Remove front bezel from chassis
Step3 Disconnect cable from Graphic card
Step4 Press the Graphic card s latch and unplug Graphic card
Step 5 Press the ODD’s latch on ODD cage
Step 6 Disconnect ODD power cable and ODD SATA cable from
ODD

EL-MF877-00 Page 4
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step7 Remove the ODD from ODD cage
Step8 Use T-15 screw driver to loose the screws of iron plate

EL-MF877-00 Page 5
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 9 Remove the iron plate of ODD
Step 10 Loose the screws of HDD and remove HDD from HDD
cage
Step 11 Disconnect HDD power cable and HDD SATA cable
from HDD
Step 12 Remove the driver cage from Chassis

EL-MF877-00 Page 6
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 13 Disconnect system fan cable from MB
Step 14 Disconnect all cables from MB
Step 15 Use PH1 screwdriver to remove system fan from
chassis
Step 16 Remove system fan from chassis

EL-MF877-00 Page 7
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 17 Use T-15 screwdriver to loose the screws and remove
cooler
Step 18 Use PH1 screwdriver to loose the screws and remove
the fan
Step 19 Separate the fan from cooler
Step 20 Remove memory from MB

EL-MF877-00 Page 8
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 21 Rotate the handle and open it up
Step 22 Remove the CPU from the board
Step 23 Remove the battery from the system board
Step 24 Remove speaker from Chassis

EL-MF877-00 Page 9
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 25 Remove WLAN M.2 Card
Step 26 Use T-15 screwdriver to loose the screws of MB from
board
Step 27 Remove MB from chassis
Step 28 Use T-15 screwdriver remove the screws on the PSU
Chassis

EL-MF877-00 Page 10
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 29 Disconnect the PSU cable from the MB
Step 30 Remove the PSU from chassis
Step 31 Use PH1 screwdriver to remove screw for the PSU Step 32 Remove cover