HP Compaq Presario V6000 Series Assembly instructions

HP-00007-01, Appendix 3 13-Oct-2004
HP Restricted
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
Compaq Presario V6000 Series Notebook PC Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA) With a surface greater than 10 square cm 6
Batteries All types including standard
alkaline and lithium coin or button
style batteries
l
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
1
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm Includes background illuminated displays with gas discharge lamps 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT) 0
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants Declaration limited to case plastics only. 0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos 0
Components, parts and materials 0

HP-00007-01, Appendix 3 13-Oct-2004
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containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Screwdriver Type-cross #1 (JIS
B 4633-1987)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1 Remove 6 (12 )cell battery.
2 Remove m2.5X6.5 x3 and m2.5x 4.5 x3 screws
3 Remove screws on HDD door then remove HDD
4 Remove screws on HDD door then remove HDD.
5 Remove M2.5*6.5Lx11 pcs screw on BASE cover then remove ODD.
6 Remove three screw on base case-M2.5x7( white Ni).
7 Remove 2 screw on base case-M2.5x9 ( right /left of top case)
8 Remove 2 mini card screw ( remove antenna cable)
9 Reverse system and remove keyboard cover
10 Remove keyboard
11 Remove M2.5x4.5x 2 pcs
12 Remove antenna
13 Remove M2.5x6.5x2 pcs/ release FFC x 2 pcs
14 Remove hexagon nut x2 on MB( arrow indicate)
15 Remove RTC coin cell battery on MB for selective treatment
16 Remove top case
17 Remove M2.5*4.5x1 on MB/
18 Remove 2.5x4.5x2 pcs on express card socket then remove express card board
19 Remove LCD module

HP-00007-01, Appendix 3 13-Oct-2004
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20 Disassemble LCD module and remove mercury bulb for selective treatment
3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below: