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HP EliteBook x360 830 G5 Assembly instructions

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EL-MF877-00 Page 1
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks
Marketing Name / Model
[List multiple models if applicable.]
HP EliteBook x360 830 G8 Notebook PC
HP EliteBook x360 830 G8
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HP Inc. products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking or identification of location of parts or components requiring selective treatment,
please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment. An “X” in the list of components and parts indicates the product
contains the component or part requiring selective treatment
Item Description
Components and parts requiring selective treatments
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) with a surface greater than 10 sq cm
☒Main board (MB) PCB
☒Solid state drive (SSD) PCB
☒Wireless WAN module (WWAN) PCB
☐Touch module PCB
☒Power supply PCB
☐External Keyboard (KB)
☐External Mouse
☐Others: _____________
4
Batteries, excluding Li-Ion batteries. This includes
standard alkaline, coin or button style batteries
☒RTC/CMOS battery
☐Others: _____________
1
Li-Ion batteries. Includes all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, etc.)
Li-ion battery(ies) are attached to the product by:
☒screws
☐snaps
☐adhesive
☐other. Explain
1
Mercury-containing components. For example,
mercury in lamps, display backlights, scanner lamps,
switches, batteries
0
EL-MF877-00 Page 2
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Item Description
Components and parts requiring selective treatments
Quantity of
items
included in
product
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm. Includes background illuminated
displays with gas discharge lamps
☒Panel LCD
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
☐Power Supply capacitor(s) or condenser(s)
0
External electrical cables and cords
☒AC power cord
☐Audio, video or data cables
☐Other: _________
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants (not
including external electrical cables and cords, PCBs or
PCAs already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner.
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing refractory
ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
Components containing chlorofluorocarbons (CFC),
hydrochlorofluorocarbons (HCFC) or
hydrofluorocarbons (HFC), hydrocarbons (HC)
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
#1
Screwdriver
T5
Heatgun
N/A
Suction cup
N/A
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including
the required steps to remove the external enclosure.
EL-MF877-00 Page 3
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
1. Follow steps described in disassembly instruction & operation name in 3.2 section.
2. If parts can be removed without using a tool, remove it first.
3. Use correct screwdriver and torque value before unlocking the screw.
3.2 Location of components requiring selective treatment. The photos and/or graphics below identify the location of the parts or
components requiring selective treatment within the main unit. For End-of-Life product disassembly instructions of external
accessories including external power supply (EPS), external keyboard (KB) external mouse and external cables and cords, refer to the
following URL: End-of-Life Product Disassembly Instructions (hp.com)
EL-MF877-00 Page 4
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Prepared by::
Checked by:Yang jsaon Yi qiu-ling
Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver.
1 1.00 9 1.00 17 1.00
2 1.00 10 1.00 18 1.00
3 1.00 11 1.00 19 1.00
4 1.00 12 1.00 20 1.00
5 1.00 13 1.00 21 1.00
6 1.00 14 1.00 22 1.00
7 1.00 15 1.00 23 1.00
8 1.00 16 1.00 24 1.00
Sta. Ver.
ALL 1.**
2020/3/21
initial
Zhao neil
A.Current station version list:
B.Version Modify list:
Date
Content
Design
Written by:
Yi qiu-ling
Date:
2020/3/21
Page:
1 of 25
Sub-assembly name:
Oleander Disassemble SOP
Document No.:
Oleander Disassemble SOP
Revision:
1.00
MANUFACTURING PROCESS INSTRUCTIONS
MECHANICAL ASSEMBLY
MODEL : Oleander
EL-MF877-00 Page 5
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Standard Operation Procedure
step:
Document No. : Oleander Disassemble SOP Station :
Operation Name : Ver. : Edit date :
Prepared :Zhou.gui-ling
Notice: Please inform production line leader or master if you found any abnormal..
Fixture list (Spec.) Qty Symbol
Issued:IE department
Safe Order Hear Look Do Static
Qual
ity
Fixtur
e
1(1/1)
1. Loosen Base screw *5pcs as below
picture showing
❖Torque:2.5 ±0.2 kgf.cm
❖screw can not be slipped.
2. Disassembly Base
❖Pull down the back shell to the side of
the sky after the left and right side of the
card is removed
Disassembly Base 1.00 2020/3/21
Picture 1
5
12
4
3
Screw driver(T5)1
EL-MF877-00 Page 6
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Standard Operation Procedure
step:
Document No. : Oleander Disassemble SOP Station :
Operation Name : Ver. : Edit date :
Prepared :Zhou.gui-ling
Notice: Please inform production line leader or master if you found any abnormal..
Fixture list (Spec.) Qty Symbol
Issued:IE department
Safe Order Hear Look Do Static
Qual
ity
Fixtur
e
2(1/1)
1. Disassemble battery CNTR(picture 1)
2. Disassemble SSD Shielding
Can(6053B1743801) (picture 2)
❖pull shielding can remove the handle is on
the right
Disassembly SSD Shielding Can 1.00 2020/3/21
Picture 1
Picture 2
EL-MF877-00 Page 7
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Standard Operation Procedure
step:
Document No. : Oleander Disassemble SOP Station :
Operation Name : Ver. : Edit date :
Prepared :Zhou.gui-ling
Notice: Please inform production line leader or master if you found any abnormal..
Fixture list (Spec.) Qty Symbol
Issued:IE department
Safe Order Hear Look Do Static
Qual
ity
Fixtur
e
3(1/1)
1. Disassemble DDR Shielding
Can(6053B1744001) (picture1)
❖pull shielding can the right handle lift
unloading
2. Take DDR(picture 2)
1.00 2020/3/21
Disassemble DDR
Picture 1
Picture 2
EL-MF877-00 Page 8
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Standard Operation Procedure
step:
Document No. : Oleander Disassemble SOP Station :
Operation Name : Ver. : Edit date :
Prepared :Zhou.gui-ling
Notice: Please inform production line leader or master if you found any abnormal..
Fixture list (Spec.) Qty Symbol
Issued:IE department
Safe Order Hear Look Do Static
Qual
ity
Fixtur
e
4(1/1)
1. Hold the Camera Cable handle,and
unplug the CNTR(picture1)
2. Hold the LCM Cable handle,and unplug
the CNTR (picture2)
Disassemble LCM&camera CNTR 1.00 2020/3/21
picture1
picture2
EL-MF877-00 Page 9
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Standard Operation Procedure
step:
Document No. : Oleander Disassemble SOP Station :
Operation Name : Ver. : Edit date :
Prepared :Zhou.gui-ling
Notice: Please inform production line leader or master if you found any abnormal..
Fixture list (Spec.) Qty Symbol
Issued:IE department
Safe Order Hear Look Do Static
Qual
ity
Fixtur
e
5(1/1)
1. Unplug all antenna CNTR on WWAN
card and tie the antenna out of the
antenna slot(picture1)
Disassemble WWAN antenna 1.00 2020/3/21
picture1
picture2
NO.6
antenna
NO.5an
tenna
No.7
antenna
NO.号
antenna
EL-MF877-00 Page 10
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Standard Operation Procedure
step:
Document No. : Oleander Disassemble SOP Station :
Operation Name : Ver. : Edit date :
Prepared :Zhou.gui-ling
Notice: Please inform production line leader or master if you found any abnormal..
Fixture list (Spec.) Qty Symbol
Issued:IE department
Safe Order Hear Look Do Static
Qual
ity
Fixtur
e
6(1/1)
1. Remove the 7 and 8 antennas from the
I/O frame and speaker(picture)
Remove the 7and8 antennas 1.00 2020/3/21
picture1