HP ENVY x360 - 15 Series Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP ENVY x360 Convertible PC 15
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
PCA
2
Batteries
All types including standard alkaline and lithium
coin or button style batteries Battery pack;RTC
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries N/A
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps 1
LED
Cathode Ray Tubes (CRT)
N/A
0
Capacitors / condensers (Containing PCB/PCT)
N/A
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
N/A
0
External electrical cables and cords
N/A
0
Gas Discharge Lamps
N/A
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
N/A
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. N/A
0
Components and waste containing asbestos
N/A
0
Components, parts and materials containing
refractory ceramic fibers
N/A
0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
N/A
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Phillips screwdriver (for 12 PCS on bottom case )
#1 2.5~3.0
kg-cm
Description #2 Phillips screwdriver (for 9 PCS on motherboard)
#1 2.5~3.0
kg-cm
Description #3 Phillips screwdriver (for 2 PCS on HDD Bracket & 4 PCS on Battery)
#1 2.5~3.0
kg-cm
Description #4 Phillips screwdriver (for 10 PCS on base side hinge bracket)
#1 2.5~3.0
kg-cm
Description #5 Use jig disassembly Lcd Bezel with Lcd cover
Pick
thickness
0.3~0.4mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove rear side rubber foot refer figure 1
2. Release 7pcs Phillips screw from bottom case refer figure 2
3. Two hand together dissemble bottom case from arrow side refer figure 3
4. Release 7pcs Phillips screw from Battery refer figure 4
5. Dissemble:DC-in cable、WLAN cable 、CCD cable 、EDP cable 、SPK cable 、SD FFC 、HDD FFC 、KB BL
FPC 、KB FPC 、TP FFC refer figure 5
6. Release 14pcs Phillips screw from PCB, Next Teardown Mainboard and SD board refer figure 6
7. Release 3pcs Phillips screw from left side hinge bracket refer figure 7
8. Release 3pcs Phillips screw from right side hinge bracket refer figure 8
9. Dissemble LCD module initial step pick insert gap between LCD Cover and LCD Bezel refer figure 9
10. Release 6pcs Phillips screw from right & left hinge Bracket refer figure 10
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01

EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01