HP 24uh Assembly instructions
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP 24uh 24-inch LED Backlit Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
I/F Board*1, Power Board*1, Control Board*1
3
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps panel*1
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
power board
1
External electrical cables and cords
VGA cable*1, Power cord*1
All are inside monitor carton box
2
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
Hexagon Screw Driver
Diagonal cutting nippers
Nosed pliers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Separate base and column by hand, then use tool to separate monitor head and stand.
2. Use tool to separate screw from rear cover, then separate rear cover from monitor head by hand.
3. Tear the tape from lamp wire and LVDS FFC, then disassemble the lamp wire, LVDS FFC and ctrl-BD FFC from
connector, disassemble the chassis from panel.
4. Disassemble the ctrl-BD from panel and ctrl-BD, then disassemble ctrl-BD from bezel and separate panel and bezel by
hand.
5. Separate safety Mylar from chassis, then use tool to release screws on PCBs, tear gaskets from chassis, and separate
all connector on PCBs.
6. Use tool to separate wall mount plate from rear cover, and separate HP LOGO, button and lens form bezel.
7. Use tool to disassemble column rear cover from column, then release the screws to separate hinge from column, and
release screws to separate hinge top bracket from hinge.
8. Tear the rubber foot from base, then use tool to release screws from base plate, and use tool to separate base plate
and base cover.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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