HP Compaq L2301w Assembly instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP L2301w Widescreen LCD Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
(Main Board & Power Board
2
Batteries
All types including standard alkaline and lithium coin or
button style batteries (No)
0
Mercury-containing components
For example, mercury in lamps, display backlights, scanner
lamps, switches, batteries (B/L of panel)
4
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps (Panel)
1
Cathode Ray Tubes (CRT)
NO
0
Capacitors / condensers (Containing
PCB/PCT)
CBPC board/Power boardKey board
25
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in diameter or
height
C905
1
External electrical cables and cords
Power Cord,VGA cable DVI cabel
3
Gas Discharge Lamps
NO
0
Plastics containing Brominated Flame
Retardants weighing > 25 grams (not including
NO
0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
PCBs or PCAs already listed as a separate
item above)
Components and parts containing toner and
ink, including liquids, semi-liquids (gel/paste)
and toner
Include the cartridges, print heads, tubes, vent chambers,
and service stations. NO
0
Components and waste containing asbestos
NO
0
Components, parts and materials containing
refractory ceramic fibers
C903/C904/C908/C909/C913/C923/C929/C930/C906/C928
10
Components, parts and materials containing
radioactive substances
NO
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
ESD wrist ring Wrist which forfend static
1
ESD glove Glove which forfend static
1
Screwdriver type:3220/5200
、
shank type2#
：φ
=5mm
、
L=85mm
1
Screwdriver type:3220/5200、shank type hexagram：φ=5mm、L=85mm
1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the screws of stand，get down the stand
2. Dismantle BEZEL
3. Dismantle the button，pull out the pin of function key board ,get down function key board
4. Pull out the PIN of power of function key board ,and get down it
5. Dismantle REAR COVER
6. Dismantle the D-SUB screws and DVI screws
7. Pull out the Pin of the lamps
8. Dismantle the screws of PANEL
9. Pull out the PIN of FFC cabel，separate the mainframe and PANEL
10. Dismantle the screws of main board and power supply board
11. First : take off the power supply unit and main board from the metal cabinet
12. Pull out the connectors that between power supply unit and main board;
13. Pull out the connector between cable to function key board and FFC cable from main board
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1
HP L2301W disassembly SOP
FROM：IE/NPI/Huan.Wu
DATE：SEP.-29-09

1. dismantle the screws of stand，get down the stand

2.Dismantle the STAND

3.Dismantle the bezel of monitor

4.Dismantle the kepc of monitor

5.Dismantle the of Rear cover of monitor

6. dismantle the screws of PANEL

7.Pull out the PIN of lamp

8.Pull out the FFC cable from panel LVDS

9. dismantle the screw on power supply unit and main board

10. Pull out the connectors that between power supply unit and
main board;
11.Pull out the connector between cable to function key board and
FFC cable from main board