HP M27fwa Assembly instructions
EL-MF877-00 Page 1
Template Revision C
Last revalidation date 19-March-2021
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and DisplaysExternal Options
Marketing Name / Model
[List multiple models if applicable.]
HP M27fwa FHD Monitor
HP M27fwa FHD Monitor-NA
HP M27fwa
HSD-0104-K
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Display Board*1, Main Board*1
2
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries
0
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps panel*1
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
C605 in SPS board
1
External electrical cables and cords
HDMI cable*1, VGA cable*1, Power cord*1,
4
EL-MF877-00 Page 2
Template Revision C
Last revalidation date 19-March-2021
HPI instructions for this template are available at EL-MF877-01
Item Description
Notes
Quantity of
items
included in
product
Audio cable*1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
2
Slothead screwdriver
1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Lay the display on soft desk and push the button of stand to unlock the stand, then pull out the stand form the monitor
head.
2. Twist out the screw and separate base and stand.
3. Strip two screws from the rear cover，then move rear cover follow the below way
4. Strip four screws from the hinge.
5. Remove the acetate tapes from the LVDS/ LED cable.
6. Pull out the LVDS/ LED cable to panel.
7. Strip fourteen screws from the rear cover supporter and M/B.
EL-MF877-00 Page 3
Template Revision C
Last revalidation date 19-March-2021
HPI instructions for this template are available at EL-MF877-01
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Lay the display on soft desk and push the button of stand to unlock the stand, then pull out the
stand form the monitor head.
2. Twist out the screw and separate base and stand.
Push up the whlte
button
EL-MF877-00 Page 4
Template Revision C
Last revalidation date 19-March-2021
HPI instructions for this template are available at EL-MF877-01
3. Strip two screws from the rear cover，then move rear cover follow the below way
4. Strip four screws from the hinge
Twist out the
screw
Remove the screws with
Screwdriver
Dismantle the rear cover first from
the two marked position
Remove the 8pin FFC from main
board then remove rear cover
Remove the DECO
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