Panasonic TH-42PM50U User manual

ORDERNO. MTNC050950C1
B19 Canada:B05
ProgressiveWidePlasmaDisplay
TH-42PM50U
GP8DU Chassis
SPECIFICATIONS
Specifications
Power
Source AC120 V, 50/60 Hz
Power
Consumption Maximum:380 W
Stand-bycondition :0.6W
Plasma
Displaypanel Drivemethod :ACtype42-inch, 16 :9aspectratio
Screen
Size Approx. 36 7/32 "(920mm)(W)×20 25/64 “(518 mm)(H)×41 9/16 “(1056 mm)(diagonal)
Dimensions
(W ×H×D) Approx. 42 3/64 “(1068 mm)×27 39/64 “(701 mm)×3 51/64 “(96.5mm)
Mass
(Weight) 71.871 lb. (32.6kg)Net
Sound
Speaker 4 23/32 “(120 mm)×2 23/64 “(60 mm)×2pcs 6
Audio Output 16 W [8W +8W ](10 %THD)
FEATURES
3DY/CFILTER HDMI
Accessories
Supplied Remotecontrol:EUR646539
AA Battery×2
ACCord
Pedestal
Cableclamper×2
Operating
Conditions Temperature:32 °F -104 °F (0° -40 °C)
Humidity:20 %-80 %(non-condensing)
Connection
Terminals AVINPUT1-2 VIDEO 1.0Vp-p (75 )
(Phono Jack Type)
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S-VIDEO Y:1.0Vp-p (75 ), C:0.286 Vp-
p
)
(Mini DIN4-pin)
AUDIOL-R 0.5Vrms
(Phono Jack Type×2)
AVPROG. OUT VIDEO 1.0Vp-p (75 )
(Phono Jack Type)
AUDIOL-R 0.5Vrms
(Phono Jack Type×2)
COMPONENTVIDEO Y 1.0Vp-p (including
synchronization)
INPUT1-2 PB/PR± 0.35 Vp-p
AUDIOL-R 0.5Vrms
(Phono Jack Type×2)
HDMI HDMI typeAConnector
AUDIOL-R 0.5Vrms
(Phono Jack Type×2)
Note
:
Design
and Specificationsaresubjecttochangewithoutnotice. Weightand Dimensionsshownare
approximate.
1. Applicablesignals
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2. SafetyPrecautions
2.1. General Guidelines
1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperlyinstalled.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrombeing exposedtoshock hazards.
2.1.1. LeakageCurrentColdCheck
1. Unplug theACcordand connect ajumperbetweenthetwoprongs
on theplug.
2. Measuretheresistance value, withanohmmeter, betweenthe
jumperedACplug and eachexposedmetalliccabinet parton the
equipmentsuchas screwheads, connectors, control shafts, etc.
Whentheexposedmetallicparthas areturnpathtothechassis,
thereading shouldbebetween1M and 5.2M . / Whenthe
exposedmetal does nothaveareturnpathtothechassis, the
reading must be . Figure1
2.1.2. LeakageCurrentHotCheck (See Figure 1.)
1. Plug theACcorddirectlyintotheACoutlet. Donotuse an
isolation transformerforthischeck.
2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F
capacitors, betweeneachexposedmetallicparton theset and a
good earthground suchas awaterpipe, as shownin Figure 1.
3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to
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measurethepotential across theresistor.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverse theACplug intheACoutlet and repeat eachoftheabove
measurements.
6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A
leakagecurrenttester(Simpson Model 229 orequivalent) maybe
usedtomake thehotchecks, leakagecurrentmust notexceed1/2
milliamp. Incase ameasurementisoutsideofthelimits specified,
thereisapossibilityofashock hazard, and theequipmentshould
berepairedand recheckedbeforeitisreturnedtothecustomer.
3. Prevention of ElectroStaticDischarge (ESD) to
ElectrostaticallySensitive(ES) Devices
Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such
componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical
ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbyelectro staticdischarge(ESD).
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equippedassembly, drainoff anyESDon your
bodybytouching aknownearthground. Alternatively, obtainand
wearacommerciallyavailabledischarging ESDwrist strap, which
shouldberemovedforpotential shock reasonspriortoapplying
powertotheunitundertest.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas alminumfoil,
topreventelectrostaticchargebuildup orexposureofthe
assembly.
3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES
devices.
4. Use onlyananti-staticsolderremoval device. Somesolder
removal devices notclassifiedas "anti-static(ESDprotected)"can
generate electrical chargesufficienttodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
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6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, alminumfoil orcomparable
conductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed.
Caution
Besureno powerisappliedtothechassisorcircuit, and observe
all othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise hamless motion suchas thebrushing
togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricity(ESD)sufficientto
damageanES device).
4. About lead free solder(PbF)
Note:Leadislistedas (Pb)intheperiodictableofelements.
Intheinformation below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.
TheLeadFree Solderusedinour manufacturing process and discussedbelowis(Sn+Ag+Cu).
ThatisTin(Sn), Silver(Ag)and Copper(Cu)although othertypes areavailable.
Thismodel uses PbFree solderinit’smanufactureduetoenvironmental conservation issues.
For service and repairwork, we’dsuggesttheuse ofPbfree solderas well, although Pbsolder
may beused.
PCBsmanufacturedusing leadfree solderwill have thePbF withinaleafSymbol
stampedon theback ofPCB.
Caution
-Pbfree solderhas ahighermelting pointthanstandardsolder.
Typicallythemelting pointis50 ~70 °F(30~40 °C)higher. Please
use ahigh temperaturesoldering iron and set itto700 ±20 °F(370
5

±10 °C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about1100
°For600 °C).
Ifyou must use Pbsolder, please completelyremoveall ofthePb
free solderon thepinsorsolderarea beforeapplying Pbsolder. If
thisisnotpractical, besuretoheat thePbfree solderuntil itmelts,
beforeapplying Pbsolder.
-Afterapplying PbF soldertodoublelayeredboards, please check
thecomponentsideforexcess solderwhichmayflow ontothe
opposite side. (see figurebelow)
SuggestedPbfree solder
Thereareseveral kindsofPbfree solderavailablefor purchase. Thisproductuses Sn+Ag+Cu
(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth)soldercan
alsobeused.
5. Service Hint
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Board Name Function Board Name Function
PPowerSupply C1 DataDriver(Left)
PA DC-DC Converter, PowerSOS C2 DataDriver(Right)
PB AudioPower SC ScanDrive
HAV Terminal, AV Switch SU Scanout(Upper)
DV HDMIInterface
Noneserviceable.
DV-Board shouldbeexchangedfor
service.
SD Scanout(Lower)
SS SustainDrive
KRemotereceiver, Keyscan
DG Digital Signal Processor S PowerSwitch
ZSpeakerout, AudioAMP
DFormatConverter, PlasmaAI
Processor
6. Plasmapanel replacement method
6.1. RemovetheBack cover.
1. See Service hint(Section 5).
6.2. RemovetheP-Board.
Caution:
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To removeP.C.B., wait1minute afterpowerwas off fordischarge
fromelectrolisiscapacitors.
1. Disconnect thecouplers(P2, P5, P9, P10, P11, P12, P23 and P25).
2. Removethescrews(×5 )and removetheP-Board.
6.3. RemovethePB-Board
1. Unlock thecableclamperstofree thecable.
2. Disconnect thecouplers(PB5and PB7).
3. Removethescrews(×3 )and removethePB-Boardmetal frame.
4. Removethescrews(×4 )and removethePB-Board.
6.4. RemovetheD-Board
1. RemovethePB-Board.
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2. Disconnect thecouplers(D3, D5, D20 and D25) and
3. Disconnect theflexiblecables (D33 and D34).
4. Removethescrews(×4 )and removetheD-Board.
6.5. Removetherearterminal cover
1. Removethescrews(×4 , ×3 , ×2 , and ×1 ).
2. Removetherearterminal cover.
6.6. Removethemetal frame
1. Unlock thecableclamperstofree thecable.
2. Disconnect thecouplers(D3, D5, H7, P10 and PB7) and relay
connector(SP-Land SP-R).
3. Removethescrews(×5 )removethemetal frame.
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6.7. RemovetheDV-Board
1. Unlock thecableclamperstofree thecable.
2. Removethescrews(×6 and ×1 ).
3. RemovetheDV-Board.
4. RemovetheDV-Boardunit.
(Becareful thecoupler(DV15) whenremovetheDV-Boardunit.)
6.8. RemovetheDG-Board
1. Unlock thecableclamperstofree thecable.
2. Disconnect thecouplers(DG3and DG5).
3. Disconnect theflexiblecables (DG1, DG2and DG20).
4. Removethescrews(×2 )and removetheDG-Board.
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