HP LA1905wg - Widescreen LCD Monitor Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
Name / Model #1：LA1905wg
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 4
Batteries All types including standard alkaline and lithium coin
or button style batteries 0
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 2
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 1
External electrical cables and cords 4
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0
Components and waste containing asbestos 0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1：SCREW DRIVER 25cm
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Take off the screws of stand，and remove the stand
2. Take off the screws of rear cover，remove the rear cover
3. Remove BEZEL
4. Release the screws besides connectors
5. Release the screws from mainframe and panel
6. Pull out the PIN of lamp
7. Release the screws besides conn
8. Pull out the PIN of FFC cable, separate the mainframe and PANEL
9. dismantle the power (main usb) board screws
10. take off the board
11.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP LA1905WG disassembly
SOP
SOP
FROM：IE/NPI/Huan.Wu
DATE：APR-27-09
1

1. dismantle the screws of stand，get down the stand

2.Dismantle the STAND

3.Dismantle the cover of monitor

4.Dismantle the bezel of monitor
4.Dismantle
the
bezel
of
monitor

5. dismantle screws

6. dismantle the screws of PANEL

7lltthPINfl
7
.pu
ll
ou
t
th
e
PIN
o
f
l
amp

8.pull out the PIN of FFC cabel，separate the
mainframe and PANEL

9. dismantle the power(main usb) board screws

10. take off board

Thank You!