IBM ThinkPad 560Z Manual

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Note
Before using this information and the product it supports, be sure to read the
general information under “Notices” on page B-1.
First Edition (October 1998)
The following paragraph does not apply to the United Kingdom or any country
where such provisions are inconsistent with local law: INTERNATIONAL
BUSINESS MACHINES CORPORATION PROVIDES THIS PUBLICATION “AS IS”
WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some states
do not allow disclaimer of express or implied warranties in certain transactions;
therefore, this statement may not apply to you.
This publication could include technical inaccuracies or typographical errors. Changes
are periodically made to the information herein; these changes will be incorporated in
new editions of the publication. IBM may make improvements or changes in the
products or the programs described in this publication at any time.
Requests for technical information about IBM products should be made to your IBM
Authorized Dealer or your IBM Marketing Representative.
 Copyright International Business Machines Corporation 1998. All rights
reserved.
Note to U.S. Government Users — Documentation related to restricted rights — Use,
duplication or disclosure is subject to restrictions set forth in GSA ADP Schedule
Contract with IBM Corp.

Contents
Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v
Section 1. System Overview . . . . . . . . . . . . . . . . . . . 1-1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
System Board Devices and Features ............... 1-3
System Board I/O Address Map .................. 1-5
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Performance Specifications . . . . . . . . . . . . . . . . . . . 1-7
Physical Specifications . . . . . . . . . . . . . . . . . . . . . . 1-8
Acoustical Readings . . . . . . . . . . . . . . . . . . . . . . . 1-9
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Output Protection . . . . . . . . . . . . . . . . . . . . . . . . 1-11
Voltage Sequencing . . . . . . . . . . . . . . . . . . . . . . . 1-11
Power Supply Connector .................... 1-11
Battery Pack . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
Section 2. System Board . . . . . . . . . . . . . . . . . . . . . 2-1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Cache Memory Operation .................... 2-2
Cacheable Address Space .................... 2-3
Keyboard/Mouse Connector . . . . . . . . . . . . . . . . . . . . . 2-4
Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Scan Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
Keyboard ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
Displayable Characters and Symbols .............. 2-7
Hard Disk Drive Connector ..................... 2-8
External Connector . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
Diskette Drive and Controller ................... 2-12
Diskette Drive Connector ..................... 2-13
Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
ROM Subsystem . . . . . . . . . . . . . . . . . . . . . . . . 2-14
RAM Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
System Memory Map ...................... 2-15
System Board Memory Connector for DIMM ........ 2-15
RT/CMOS RAM . . . . . . . . . . . . . . . . . . . . . . . . . 2-17
Miscellaneous System Functions and Ports .......... 2-27
Nonmaskable Interrupt (NMI) ................. 2-27
System Control Port B (X'0061')............... 2-28
 Copyright IBM Corp. 1998 iii

System Control Port A (X'0092')............... 2-29
Power-On Password . . . . . . . . . . . . . . . . . . . . . . 2-30
Selectable Drive-Startup Sequence .............. 2-30
Hardware Compatibility . . . . . . . . . . . . . . . . . . . . . . 2-31
Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32
Section 3. Subsystems . . . . . . . . . . . . . . . . . . . . . . 3-1
Video Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Video Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Audio Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Sound Blaster Support Function ................ 3-5
Audio Port Specifications ..................... 3-5
Infrared (IR) Subsystem ....................... 3-6
PC Card Subsystem ......................... 3-7
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
Appendix A. System Management API (SMAPI) BIOS
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1
What Is SMAPI BIOS? ........................ A-3
Header Image . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-4
Calling Convention . . . . . . . . . . . . . . . . . . . . . . . . . . A-6
Parameter Structure . . . . . . . . . . . . . . . . . . . . . . . A-6
Calling Convention Pseudo Code ................ A-9
Return Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-11
Function Description . . . . . . . . . . . . . . . . . . . . . . . . A-12
System Information Service .................. A-12
System Configuration Service ................. A-21
Power Management Service .................. A-28
Event Bit Definition ....................... A-33
Samples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-52
Function Declaration . . . . . . . . . . . . . . . . . . . . . . A-56
Installation Check . . . . . . . . . . . . . . . . . . . . . . . . A-57
BIOS Call . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-61
Appendix B. Notices . . . . . . . . . . . . . . . . . . . . . . . . B-1
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-2
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . X-1
iv

Preface
This technical reference contains hardware and software interface
information specific to the IBM ThinkPad 560Z computer. This
technical reference is intended for those who develop hardware and
software products for the computer. Users should understand
computer architecture and programming concepts.
This publication consists of the following sections and appendixes:
Section 1, “System Overview,” describes the system, features,
and specifications.
Section 2, “System Board,” describes the system-specific
hardware implementations.
Section 3, “Subsystems,” describes the hardware functions
specific to the ThinkPad 560Z computers.
Appendix A, “System Management API (SMAPI) BIOS
Overview,” describes the system software interface built into the
system, called the System Management Application Program
Interface (SMAPI) BIOS, which controls the system information,
system configuration, and power management features of the
ThinkPad system.
Appendix B, “Notices,” contains special notices and trademark
information.
An index is also included.
This technical reference should be used with the following
publications:
IBM Personal System/2 Hardware Interface Technical Reference
IBM Personal System/2 and Personal Computer BIOS Interface
These publications contain additional information on many of the
subjects discussed in this technical reference. Information about
diskette drives, hard disk drives, adapters, and external options are
in separate technical references.
 Copyright IBM Corp. 1998 v

Attention
The term Reserved describes certain signals, bits, and registers
that should not be changed. Use of reserved areas can cause
compatibility problems, loss of data, or permanent damage to the
hardware. When the contents of a register are changed, the
state of the reserved bits must be preserved. If possible, read
the register first and change only the bits that must be changed.
vi ThinkPad 560Z Preface

Section 1. System Overview
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
System Board Devices and Features ............... 1-3
System Board I/O Address Map .................. 1-5
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Performance Specifications . . . . . . . . . . . . . . . . . . . 1-7
Physical Specifications . . . . . . . . . . . . . . . . . . . . . . 1-8
Acoustical Readings . . . . . . . . . . . . . . . . . . . . . . . 1-9
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Output Protection . . . . . . . . . . . . . . . . . . . . . . . . 1-11
Voltage Sequencing . . . . . . . . . . . . . . . . . . . . . . . 1-11
Power Supply Connector .................... 1-11
Battery Pack . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
 Copyright IBM Corp. 1998 1-1

Description
The IBM Personal System/2 Hardware Interface Technical Reference
describes devices common to the PS/2 AT-bus system family.
The IBM ThinkPad 560Z computer (hereafter called the 560Z,
ThinkPad computer , or computer ) is a notebook-size computer that
features the AT* bus architecture. Each computer supports one
external diskette drive and one internal hard disk drive.
Programs can distinguish the foregoing models of computers from
other ThinkPad models by reading the system ID: Interrupt X'15',
function code (AH)=X'23', (AL)=X'10', returns (AL)=X'37' for the
560Z.
The system microprocessor contains an internal cache and cache
controller.
Figure 1-1 lists the model bytes, submodel bytes, and system clock
speed of the system board.
Figure 1-1. Model and Submodel Bytes
Model Model Byte
(Hex) Submodel Byte (Hex) System Clock
560Z FC 01 66 MHz
For a listing of the other systems, refer to the IBM Personal
System/2 and Personal Computer BIOS Interface .
1-2 ThinkPad 560Z System Overview

System Board Devices and Features
Figure 1-2 lists the system board devices and their features. The
IBM Personal System/2 Hardware Interface Technical Reference
describes devices common to PS/2 products by type number.
Figure 1-2 (Part 1 of 2). System Board Devices and Features
Device Type Features
Microprocessor – Intel Mobile Pentium II Processor
233/300 MHz
32 KB on-chip cache
Level 2 cache – 512 KB
System timers 1 Channel 0: system timer
Channel 1: refresh generation
Channel 2: tone generator for speaker
ROM subsystem – 128 KB by 4 banks (1 KB equals 1024 bytes)
RAM subsystem – 32 MB. Expandable up to 96 MB.
64 MB. Expandable up to 128 MB.
CMOS RAM
subsystem – 128 bytes CMOS RAM with real-time clock/calendar
ThinkPad 560Z System Overview 1-3

Figure 1-2 (Part 2 of 2). System Board Devices and Features
Device Type Features
Video subsystem – SVGA video functions:
Up to 16,777,216 colors on the TFT LCD
and an external display
See “Video Subsystem” on page 3-2 for more
details of the video subsystem.
DMA controller 1 Seven DMA channels (AT compatible)
Four 8-bit channels and three 16-bit channels
Interrupt controller 1 15 levels of system interrupts
(interrupts are edge-triggered)
Keyboard/auxiliary
device controller 1 Internal keyboard TrackPoint Press-to-Select
Auxiliary device connector
Password security
Diskette drive
controller 2 Supports:
3.5-in. diskette (1.44 MB)
3.5-in. diskette (1.2 MB) (Japan-unique)
3.5-in. diskette (720 KB)
Hard disk controller – Supports IDE controller
Serial controller
port 2 EIA-232-E interface (16550 compatible) Programmable as serial port 1, 2, 3, or 4
One 9-pin, D-sub connector
Parallel controller
port 1 Programmable as parallel port 1, 2, or 3 IEEE P1284-A compatible
Supports bidirectional input and output
Enhanced Parallel Port (EPP) compatible
Extended Capabilities Port (ECP) compatible
Expansion bus
adapter – Supports externally attached devices:
Port replicator
Port replicator with Advanced EtherJet
Feature
PC Cardñ slots – Conforms to the standards and
specifications listed in Figure 3-3 on page 3-8
Two Type I or II PC cards
One Type III PC card
Audio subsystem – Sound Blaster**-Pro compatible
Infrared subsystem – Supports:
IrDA 1.1
Universal serial bus
(USB) – Supports:
USB input and output devices
1-4 ThinkPad 560Z System Overview

System Board I/O Address Map
Figure 1-3 shows the I/O address map.
Figure 1-3 (Part 1 of 2). System Board I/O Address Map
Address (Hex) Device
0000–001F DMA controller 1
0020, 0021 Interrupt controller 1 (Master)
002E, 002F aSuper I/O configuration registers
0040, 0043 Timer counter 1
0060 Keyboard, auxiliary device
0061 System control port B
0062 Power management controller
0064 Keyboard, auxiliary device
0066 Power management controller
0070 NMI mask and RTC address
0071 RTC data
0072, 0073 RTC/CMOS Extended
0080–008F DMA page registers
0092 System control port A
00A0, 00A1 Interrupt controller 2 (slave)
00B2, 00B3 bAdvanced power management port
00C0–00DF DMA controller 2
00F0 Coprocessor error
0170–0177 IDE Secondary
01F0–01F7 IDE Primary
0201 Game port (Joy Stick)
0220–022F Audio port - Sound Blaster 1
0230–023F Audio port - Sound Blaster 2
0240–024F Audio port - Sound Blaster 3
0250–025F Audio port - Sound Blaster 4
0278–027F Parallel port 3 - LPT3 or EPP/ECP
02E8–02EF Serial port 4 - COM4 (IR)
02F8–02FF Serial port 2 - COM2 (IR)
0300–0301 Audio port - MIDI (MPU-401) 1
0310–0311 Audio port - MIDI (MPU-401) 2
0320–0321 Audio port - MIDI (MPU-401) 3
0330–0331 Audio port - MIDI (MPU-401) 4
0370–0375 FDC secondary
0376 IDE secondary
0377 FDC secondary
0378–037F Parallel port 2 - LPT2 or EPP/ECP
0388–038B Audio port - Adlib (FM synthesizer)
ThinkPad 560Z System Overview 1-5

Figure 1-3 (Part 2 of 2). System Board I/O Address Map
Address (Hex) Device
03B4, 03B5, 03BA Video subsystem
03BC–03BF Parallel port 1 - LPT1 or ECP
03C0–03C5 Video subsystem
03C6–03C9 Video DAC
03D4, 03D5, 03DA, Video subsystem
03E0–03E3 PC Card interface
03E8–03EF Serial port 3 - COM3
03F0–03F5 FDC primary
03F6 IDE primary
03F7 FDC primary
03F8–03FF Serial port 1 - COM1
04D0, 04D1 bInterrupt controller edge/level control
0534–0537 Audio port - WSS-1
0538–053F Audio port - Control port-1
0608–060B Audio port - WSS-2
0678–067A Parallel port 3 - ECP
0778–077A Parallel port 2 - ECP
07BC–07BE Parallel port 1 - ECP
0CF8–0CFB PCI configuration address register
0CF9 bReset control register
0CFC–0CFF PCI configuration data register
0D38–0D3F Audio port - control port-2
0E84–0E87 Audio port - WSS-3
0E88–0E8F Audio port - control port-3
0F44–0F47 Audio port - WSS-4
0FF0–0FF7 Audio port - control port-4
15E0–15EF Power management register
8000–801F USB I/O space register
EF00–EF37 Power management I/O register
EF00–EF3F Power management register
EFA0–EFAD SMBus I/O space register
EFA0–EFAF SMBus I/O space register
aNS PC97338 unique registers; bIntel PIIX4E unique registers
1-6 ThinkPad 560Z System Overview

Specifications
Figure 1-4 to Figure 1-7 on page 1-9 list the specifications for the
computer.
Performance Specifications
Figure 1-4. Performance Specifications for the ThinkPad 560Z
Device Cycle Time (ns)
Microprocessor (66 MHz–15 ns clock)
Access to RAM:ñ
Memory read Page hit, burst
Page miss, burst 135 ns 255 ns
Memory write Page miss, burst 45 ns
Access to ROM: 1000
Refresh rate (typically performed every 15.6 µs) 750 (minimum)
DMA controller (4 MHz–250 µs clock): 1250
Bus cycles (AT):
8 bit
16 bit
1000
625
ñThe cycle times shown for access to system-board RAM are based on 60-ns
EDO memory.
ThinkPad 560Z System Overview 1-7

Physical Specifications
Figure 1-5. Physical Specifications for the ThinkPad 560Z
Size
Width: 297 mm (11.7 in.)
Depth: 222 mm (8.7 in.)
Height: 31.0 mm (1.22 in.)
Weightñ (approximate value)
2640-9xx model:
1.86 kg (4.10 lb)
2640-Bxx model:
1.90 kg (4.20 lb)
Air Temperature
System on (without diskette)
5.0°C to 35.0°C (41°F to 95°F)
System on (with diskette)
10.0°C to 35.0°C (50°F to 95°F)
System off
5.0°C to 43.0°C (41°F to 110°F)
Humidity
System (without diskette)
8% to 95%
System (with diskette)
8% to 80%
Maximum altitudeò: 3048 m (10000 ft) in unpressurized conditions
Heat output: 35 W (119.4 BTUs/hour) at maximum configuration
Acoustical readings (see Figure 1-7 on page 1-9)
Electrical (see Figure 1-6 on page 1-9)
Electromagnetic compatibility: FCC class B
ñWith battery pack installed.
òThis is the maximum altitude at which the specified air temperatures apply. At
higher altitudes, the maximum air temperatures are lower than those specified.
1-8 ThinkPad 560Z System Overview

Electrical Specifications
Figure 1-6. Electrical Specifications for the ThinkPad 560Z
(56 W)
Input Voltageñ
(V ac) 100–240
Frequency (Hz) 50/60
Inputò (kVA) 0.132
ñ Range is automatically selected; sine wave input is required.
ò At maximum configuration.
Acoustical Readings
Figure 1-7. Acoustical Readings for the ThinkPad 560Z
LWAd in bels LpAm in dB <LpA>m in dB
Operate Idle Operate Idle Operate Idle
3.7 3.5 30 28 27 26
Notes:
LWAd Is the declared sound power level for the random sample of
machines.
LpAm Is the mean value of the A-weighted sound pressure levels at the
operator position (if any) for the random sample of machines.
<LpA>mIs the mean value of the A-weighted sound pressure levels at the
one-meter position for the random sample of machines.
Operate Shows the value while using the hard disk drive.
All measurements made in accordance with ANSI S12.10 and reported in
conformance with ISO 9296.
ThinkPad 560Z System Overview 1-9

Power Supply
The power supply converts the ac voltage to dc voltage and provides
power for the following:
System board set
Diskette drive
Hard disk drive
Auxiliary devices
Keyboard
LCD panel
PC Card cards
Voltages
The power supply generates five different dc voltages: VCCCPU,
VCC3A, VCC5M, VCCSW, and VCC12M. Figure 1-8 shows the
maximum current for each voltage.
Figure 1-8. Power Supply Maximum Current
Output Voltage (V dc) Current (A)
VCCCPU +1.7 or +1.6 2.20
VCC3A +3.3 2.00
VCC5M +5.0 3.00
VCCSW +5.0 0.01
VCC12M +12.0 0.11
1-10 ThinkPad 560Z System Overview

Output Protection
A short circuit placed on any dc output (between outputs or between
an output and a dc return) latches all dc outputs into a shutdown
state, with no hazardous condition to the power supply.
If an overvoltage fault occurs in the power supply, the power supply
latches all dc outputs into a shutdown state before any output
exceeds 135% of the nominal value of the power supply.
Voltage Sequencing
When power is turned on, the output voltages reach their operational
voltages within 2 seconds.
Power Supply Connector
The following connector is used with the AC Adapter. The total
power capacity of this connector must not exceed 4.0 A.
1
2
Refer to Figure 1-9 for the appropriate adapter pin assignments.
Figure 1-9. Voltage Pin Assignments for 56-W AC Adapter
Pin Voltage
1+7.0 V dc to +16.0 V dc (depending on charging conditions)
2 Ground
ThinkPad 560Z System Overview 1-11

Battery Pack
The ThinkPad computer uses a lithium-ion (Li-ion) battery pack that
meets the following electrical specifications:
Figure 1-10. Battery Pack Specifications
Nominal Voltage +10.8 V dc
Capacity (average) 2.2 ampere hours (AH)
Protection Overcurrent protection
Overvoltage protection
Overdischarge protection
Thermal protection
1-12 ThinkPad 560Z System Overview

Section 2. System Board
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Cache Memory Operation .................... 2-2
Cacheable Address Space .................... 2-3
Keyboard/Mouse Connector . . . . . . . . . . . . . . . . . . . . . 2-4
Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Scan Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
Keyboard ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
Displayable Characters and Symbols .............. 2-7
Hard Disk Drive Connector ..................... 2-8
External Connector . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
Diskette Drive and Controller ................... 2-12
Diskette Drive Connector ..................... 2-13
Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
ROM Subsystem . . . . . . . . . . . . . . . . . . . . . . . . 2-14
RAM Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
System Memory Map ...................... 2-15
System Board Memory Connector for DIMM ........ 2-15
RT/CMOS RAM . . . . . . . . . . . . . . . . . . . . . . . . . 2-17
RT/CMOS Address and NMI Mask Register (X'0070'). 2-18
RT/CMOS Data Register (X'0071')............ 2-18
RT/CMOS RAM I/O Operations .............. 2-19
CMOS RAM Configuration ................. 2-23
Miscellaneous System Functions and Ports .......... 2-27
Nonmaskable Interrupt (NMI) ................. 2-27
System Control Port B (X'0061')............... 2-28
System Control Port A (X'0092')............... 2-29
Power-On Password . . . . . . . . . . . . . . . . . . . . . . 2-30
Selectable Drive-Startup Sequence .............. 2-30
Hardware Compatibility . . . . . . . . . . . . . . . . . . . . . . 2-31
Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32
 Copyright IBM Corp. 1998 2-1

Description
This section describes the microprocessor, connectors, memory
subsystems, and miscellaneous system functions and ports for the
ThinkPad computers. You can find additional information about
these topics in IBM Personal System/2 Hardware Interface Technical
Reference–AT-Bus Subsystems .
Microprocessor
The ThinkPad 560Z computer uses the Intel Mobile Pentium II
233-MHz or 300-MHz processor with MMX technology.
The processor has a 32-bit address bus and a 64-bit data bus. It is
software-compatible with all previous microprocessors. The
processor has an internal, split data and instruction, 32-KB
write-back cache. It includes pipelined math coprocessor functions
and superscalar architecture (two execution units).
Cache Memory Operation
The cache memory in the Intel Pentium microprocessor enables the
microprocessor to read instructions and data much faster than if the
microprocessor had to access system memory. When an instruction
is first used or data is first read or written, it is transferred to the
cache memory from main memory. This enables future accesses to
the instructions or data to occur much faster.
The cache is disabled and empty when the microprocessor comes
out of the reset state. The cache is tested and enabled during the
power-on self-test (POST).
The cache memory in the Intel Pentium microprocessor is loaded
from system memory in 32-byte increments, each referred to as a
cache line . A cache line is aligned on a paragraph boundary. A
reference to any byte contained in a cache line results in the entire
line being read into the cache memory (if the data was not already in
the cache). When the microprocessor gives up control of the system
bus, the cache memory enters “snoop” mode and monitors all write
and read operations. If memory data is written to a location in the
cache and the cache line is in the “modified” state, the corresponding
cache line is written back to system memory and is invalidated.
2-2 ThinkPad 560Z System Board