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Contents
1. General Information................................................................................................................4
1.1. Features................................................................................................................4
1.2. System Specifications ...........................................................................................5
1.3. Dimensions ...........................................................................................................7
1.4. Module Descriptions..............................................................................................8
2. Installation ............................................................................................................................10
3. Operation..............................................................................................................................12
3.1. EZ code overview................................................................................................12
3.2. Dispensing Coins To Low Level...........................................................................14
3.3. Operating Function Descriptions.........................................................................15
3.4. Setting Function Descriptions..............................................................................18
3.5. Executive Setting Function Descriptions .............................................................39
3.6. DIP Switch Setting...............................................................................................47
4. Harness Application..............................................................................................................48
4.1. List of Main Wire Harness:...............................................................................48
4.2. List of Wire Harness for ICT Bill Acceptor:.......................................................48
4.3. Wire Harness Pin Assignment for JPSTD interface.............................................49
4.4. Wire Harness Pin Assignment for MDB interface................................................53
4.5. Wire Harness Pin Assignment for Executive & MDB Interface............................57
4.6. Wire Harness Pin Assignment for Download Box................................................59
5. I/O Circuit..............................................................................................................................60
6. Maintenance.........................................................................................................................63
7. Troubleshooting....................................................................................................................65
7.1. Error Code Messages .........................................................................................65
7.2. Error Handling.....................................................................................................66
8. Firmware Download and Upgrade Instruction.......................................................................80
8.1. MCU STM32 Firmware Download by FP-004 .....................................................80
8.2. MCU STM32 Firmware Download by IrDA Special Function ...........................83
9. PC Tool Instruction................................................................................................................84
9.1. Cashfloat Setting.................................................................................................84
9.2. Serial Number Setting .........................................................................................89
10. Read Audit Data...........................................................................................................90
10.1. Read Audit Data by ICT MTB ..............................................................................90
10.2. Read Audit Data by IrDA .....................................................................................91
11. Module Assembling Procedure ....................................................................................92
11.1. Upper Module Disassembling: ............................................................................92
11.2. Recognition Module Disassembling: ...................................................................93
11.3. Coin Discharge Module Disassembling:..............................................................94
12. Module Exploded Views...............................................................................................95