Intel BLKDX79SI Configuration guide
Intel® Desktop Board
DX79SI
Technical Product Specification
March 2012
Order Number: G31801-003
The Intel®Desktop Board DX79SI may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DX79SI Specification Update.
ii
Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DX79SI Technical Product
Specification
November 2011
-002 Specification Change January 2012
-003 Specification Clarification March 2012
This product specification applies to only the standard Intel®Desktop Board DX79SI with BIOS
identifier SIX7910J.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
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IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
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OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
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WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
All Intel®desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
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to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, Intel Core, and Xeon are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright ©2011, 2012 Intel Corporation. All rights reserved.
iii
Board Identification Information
Basic Desktop Board DX79SI Identification Information
AA Revision BIOS Revision Notes
G288087-600 SIX7910J.0281 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The X79 PCH used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
82X79 PCH C0 SLJHW
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel®Desktop Board DX79SI.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
January 2012 Spec Change Added Section 11.13.2.10 Power Supervisor
March 2012 Spec Clarification Updated Figure 13 on page 48 to correct the pin numbering on
the Front panel USB 3.0 connector
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
Intel Desktop Board DX79SI Technical Product Specification
iv
v
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
Intel®Desktop Board DX79SI.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DX79SI and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DX79SI
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
Intel Desktop Board DX79SI Technical Product Specification
vi
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vii
Contents
1Product Description
1.1Overview........................................................................................ 11
1.1.1Feature Summary ................................................................ 11
1.1.2Board Layout
....................................................................... 13
1.1.3Block Diagram ..................................................................... 15
1.2Legacy Considerations...................................................................... 16
1.3Online Support................................................................................ 16
1.4Processor ....................................................................................... 16
1.4.1PCI Express x16 Graphics
...................................................... 17
1.5System Memory
.............................................................................. 17
1.5.1Memory Configurations ......................................................... 19
1.6Intel®X79 Express Chipset ............................................................... 21
1.6.1USB ................................................................................... 21
1.6.2SATA Interfaces ................................................................... 21
1.7Real-Time Clock Subsystem .............................................................. 23
1.8Legacy I/O Controller....................................................................... 23
1.8.1Consumer Infrared (CIR)....................................................... 23
1.9Audio Subsystem ............................................................................ 24
1.9.1Audio Subsystem Software .................................................... 24
1.9.2Audio Subsystem Components ............................................... 24
1.10LAN Subsystem............................................................................... 26
1.10.1Intel®82579L and Intel 82574L Gigabit Ethernet Controllers ...... 26
1.10.2LAN Subsystem Software ...................................................... 27
1.10.3RJ-45 LAN Connector with Integrated LEDs .............................. 27
1.11Bluetooth*/WiFi Module.................................................................... 28
1.11.1Bluetooth Technology ........................................................... 28
1.11.2WiFi 802.11 Wireless ............................................................ 29
1.12Hardware Management Subsystem .................................................... 29
1.12.1Hardware Monitoring and Fan Control...................................... 29
1.12.2Fan Monitoring..................................................................... 30
1.12.3Chassis Intrusion and Detection ............................................. 30
1.12.4Thermal Monitoring .............................................................. 31
1.13Power Management ......................................................................... 32
1.13.1ACPI................................................................................... 32
1.13.2Hardware Support ................................................................ 35
1.14Onboard Power and Reset Buttons ..................................................... 41
Intel Desktop Board DX79SI Technical Product Specification
viii
2Technical Reference
2.1Memory Resources .......................................................................... 43
2.1.1Addressable Memory............................................................. 43
2.1.2Memory Map........................................................................ 45
2.2Connectors and Headers................................................................... 45
2.2.1Back Panel Connectors.......................................................... 46
2.2.2Component-side Connectors and Headers ................................ 48
2.3Jumper Block
.................................................................................. 58
2.4Mechanical Considerations
................................................................ 60
2.4.1Form Factor......................................................................... 60
2.5Electrical Considerations................................................................... 61
2.5.1Power Supply Considerations ................................................. 61
2.5.2Fan Header Current Capability................................................ 62
2.5.3Add-in Board Considerations
.................................................. 62
2.6Thermal Considerations
.................................................................... 63
2.7Reliability ....................................................................................... 65
2.8Environmental ................................................................................ 65
3Overview of BIOS Features
3.1Introduction ................................................................................... 67
3.2BIOS Flash Memory Organization....................................................... 68
3.3Resource Configuration .................................................................... 68
3.3.1PCI Autoconfiguration ........................................................... 68
3.4System Management BIOS (SMBIOS)................................................. 69
3.5Legacy USB Support ........................................................................ 69
3.6BIOS Updates ................................................................................. 70
3.6.1Language Support
................................................................ 70
3.6.2Custom Splash Screen .......................................................... 71
3.7BIOS Recovery................................................................................ 71
3.8Boot Options................................................................................... 72
3.8.1Optical Drive Boot ................................................................ 72
3.8.2Network Boot....................................................................... 72
3.8.3Booting Without Attached Devices .......................................... 72
3.8.4Changing the Default Boot Device During POST ........................ 72
3.9Adjusting Boot Speed....................................................................... 73
3.9.1Peripheral Selection and Configuration .................................... 73
3.9.2BIOS Boot Optimizations ....................................................... 73
3.10BIOS Security Features .................................................................... 74
3.11BIOS Performance Features .............................................................. 75
4Error Messages and Beep Codes
4.1Speaker ......................................................................................... 77
4.2BIOS Beep Codes ............................................................................ 77
4.3Front-panel Power LED Blink Codes.................................................... 78
4.4BIOS Error Messages ....................................................................... 78
4.5Port 80h POST Codes ....................................................................... 79
Contents
ix
5Regulatory Compliance and Battery Disposal Information
5.1Regulatory Compliance..................................................................... 85
5.1.1Safety Standards ................................................................. 85
5.1.2European Union Declaration of Conformity Statement................ 86
5.1.3Product Ecology Statements .................................................. 87
5.1.4EMC Regulations .................................................................. 89
5.1.5ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 92
5.1.6Regulatory Compliance Marks (Board Level)............................. 93
5.2Battery Disposal Information............................................................. 94
Figures
1. Major Board Components ................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration........................................... 20
4. Back Panel Audio Connectors ............................................................ 25
5. LAN Connector LED Locations............................................................ 27
6. Bluetooth/WiFi Module ..................................................................... 28
7. Thermal Sensors and Fan Headers ..................................................... 31
8. Location of Board Status LEDs........................................................... 39
9. Location of the Onboard Power and Reset Buttons................................ 41
10. Detailed System Memory Address Map ............................................... 44
11. Back Panel Connectors ..................................................................... 46
12. I/O Shield Reference Diagram ........................................................... 47
13. Component-side Connectors and Headers ........................................... 48
14. Connection Diagram for Front Panel Header ........................................ 55
15. Connection Diagram for Front Panel USB 2.0 Headers........................... 57
16. Location of the Jumper Block ............................................................ 58
17. Board Dimensions ........................................................................... 60
18. Localized High Temperature Zones..................................................... 64
Tables
1. Feature Summary............................................................................ 11
2. Components Shown in Figure 1 ......................................................... 14
3. Supported Memory Configurations ..................................................... 18
4. Audio Jack Support.......................................................................... 24
5. LAN Connector LED States................................................................ 27
6. Effects of Pressing the Power Switch .................................................. 32
7. Power States and Targeted System Power .......................................... 33
8. Wake-up Devices and Events ............................................................ 34
9. Board Status LEDs........................................................................... 40
10. System Memory Map ....................................................................... 45
11. Component-side Connectors and Headers Shown in Figure 13................ 49
12. Front Panel Audio Header for Intel HD Audio ....................................... 50
13. Front Panel Audio Header for AC ’97 Audio
.......................................... 50
Intel Desktop Board DX79SI Technical Product Specification
x
14. IEEE 1394a Header.......................................................................... 51
15. SATA Connectors............................................................................. 51
16. S/PDIF Header ................................................................................ 51
17. USB 2.0 Headers ............................................................................. 51
18. USB 3.0 Connector .......................................................................... 52
19. Chassis Intrusion Header.................................................................. 52
20. Processor, Front and Rear Chassis, and Auxiliary (4-Pin) Fan Headers..... 52
21. Processor Core Power Connector........................................................ 54
22. Main Power Connector...................................................................... 54
23. Front Panel Header .......................................................................... 55
24. States for a One-Color Power LED...................................................... 56
25. States for a Two-Color Power LED...................................................... 56
26. BIOS Setup Configuration Jumper Settings.......................................... 59
27. Recommended Power Supply Current Values ....................................... 61
28. Fan Header Current Capability........................................................... 62
29. Thermal Considerations for Components............................................. 64
30. Environmental Specifications............................................................. 65
31. BIOS Setup Program Menu Bar.......................................................... 68
32. BIOS Setup Program Function Keys ................................................... 68
33. Acceptable Drives/Media Types for BIOS Recovery ............................... 71
34. Boot Device Menu Options ................................................................ 72
35. Supervisor and User Password Functions ............................................ 74
36. BIOS Beep Codes ............................................................................ 77
37. Front-panel Power LED Blink Codes
.................................................... 78
38. BIOS Error Messages ....................................................................... 78
39. Port 80h POST Code Ranges ............................................................. 79
40. Port 80h POST Codes ....................................................................... 80
41. Typical Port 80h POST Sequence ....................................................... 84
42. Safety Standards............................................................................. 85
43. EMC Regulations ............................................................................. 89
44. Regulatory Compliance Marks ........................................................... 93
11
1Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Processor •Intel®Core™ i7 and Intel®Xeon®processors in an LGA 2011 socket:
―Two PCI Express 3.0 x16 graphics interfaces
―One PCI Express 3.0 x16 graphics interface (x8 electrical)
―Four DDR3 memory channels (Quad Channel total of 8 DIMMs)
Memory •Eight 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
arranged as four channels
•Support for DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and
1066 MHz DIMMs
•Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•Support for up to 64 GB of system memory with eight DIMMs using 4 Gb
memory technology
•Support for non-ECC and ECC memory
•Support for 1.35 V low voltage JEDEC memory
•Support for XMP memory
•Support for manual memory over clocking (voltage, clock, ratio)
Chipset Intel®X79 Express Chipset consisting of the Intel®X79 Platform Controller
Hub (PCH)
Audio Intel®High Definition Audio subsystem using the Realtek* ALC892 audio codec
Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR)
Peripheral
Interfaces
•Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
•Two front panel USB 3.0 ports are implemented through one internal connector
(blue)
•Fourteen USB 2.0 ports:
―Six ports are implemented with stacked back panel connectors (black)
―Eight front panel ports implemented through four internal headers
•Two Serial ATA (SATA) 6.0 Gb/s interfaces through the Intel X79 Express
Chipset with Intel®Rapid Storage Technology RAID support (blue)
•Four internal SATA 3.0 Gb/s interfaces through the Intel X79 Express Chipset
with Intel Rapid Storage Technology RAID support (black)
•Two IEEE 1394a ports:
―One port via a back panel connector
―One port via a front-panel header (blue)
Wireless Module •Separate module that provides both Bluetooth* and WiFi is included
continued
Intel Desktop Board DX79SI Technical Product Specification
12
Table 2. Feature Summary (continued)
BIOS •Intel®BIOS resident in the SPI Flash device
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
•Fast Boot
•Support for advanced over clocking
Instantly Available
PC Technology
•Support for PCI* Local Bus Specification Revision 2.2
•Support for PCI Express* Revision 3.0
•Suspend to RAM support
•Wake on PCI, PCI Express, LAN, front panel, CIR, and USB ports
LAN Support Dual-Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel®82579L and
Intel®82574L Gigabit Ethernet Controllers
Expansion
Capabilities
•Two PCI Express 3.0 x16 connectors
•One PCI Express 3.0 x16 connector (x8 electrical)
•Two PCI Express 2.0 x1 bus add-in card connectors from the PCH
•One Conventional PCI bus add-in card connector from the PCH
Hardware Monitor
Subsystem
•Hardware monitoring and fan control through the Nuvoton I/O controller
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Four fan headers using PWM control
•Four fan sense inputs used to monitor fan activity
•Fan speed control using voltage control (4-pin fan headers for processor, front,
rear, and auxiliary) with selectable support in BIOS for 3 wire fans
•Support for Platform Environmental Control Interface (PECI)
Product Description
13
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DX79SI.
Figure 1. Major Board Components
Table 3 lists the components identified in Figure 1.
Intel Desktop Board DX79SI Technical Product Specification
14
Table 3. Components Shown in Figure 1
Label Description
A Front panel audio header
B PCI Express x1 add-in card connector
C S/PDIF out header
D PCI Express 3.0 x16 add-in card connector (x8 electrical)
E Piezoelectric speaker
F Conventional PCI add-in card connector
G PCI Express 3.0 x16 add-in card connector
H PCI Express x1 add-in card connector
I PCI Express 3.0 x16 add-in card connector
J Rear chassis fan header
K Battery
L Back panel connectors
M Processor fan header
N DIMM 1 (Channel A, DIMM 0)
O DIMM 5 (Channel B, DIMM 0)
P DIMM 2 (Channel A, DIMM 1)
Q DIMM 6 (Channel B, DIMM 1)
R LGA 2011 processor socket
S 12 V processor core voltage connector (2 x 4 pin)
T DIMM 8 (Channel D, DIMM 1)
U DIMM 4 (Channel C, DIMM 1)
V DIMM 7 (Channel D, DIMM 0)
W DIMM 3 (Channel C, DIMM 0)
X Main power connector (2 x 12 pin)
Y Remote thermal probe header
Z Front chassis fan header
AA 3.0 Gb/s SATA connectors (black) and 6.0 Gb/s SATA connectors (blue)
BB Intel X79 Express Chipset
CC Front panel USB 2.0 headers (4)
DD Consumer IR emitter (output) header
EE BIOS Setup configuration jumper block
FF Power Fault LED
GG Front panel USB 3.0 connector
HH Alternate front panel power LED header
II Consumer IR receiver (input) header
JJ Voltage measurement test points
KK Front panel header
LL Post Code LED display
MM Front panel IEEE 1394a header
NN Onboard Reset button
OO Onboard Power button
PP Chassis intrusion header
QQ Auxiliary fan header
RR Board Status LEDs
Product Description
15
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram
Intel Desktop Board DX79SI Technical Product Specification
16
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
•No parallel port connector
•No floppy drive connector
•No PS/2 connectors
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DX79SI http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DX79SI
http://ark.intel.com
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
1.4 Processor
The board is designed to support Intel Core i7 and Intel Xeon processors in an
LGA 2011 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 130 W with margin to allow for greater than
200 W operation. The processors listed above are only supported when falling within
the wattage requirements of the Intel Desktop Board DX79SI. See the Intel web site
listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 61 for information on power supply requirements for this board.
Product Description
17
1.4.1 PCI Express x16 Graphics
Intel Core i7 and Intel Xeon processors in an LGA2011 package support PCI Express
add-in graphics cards via the board’s PCI Express x16 connectors. These processors
support the following generations of PCI Express:
•PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
8.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a bandwidth of 32 GB/s.
•PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
4.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 8 GB/s in each direction, simultaneously, for a bandwidth of 16 GB/s.
•PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
2.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 4 GB/s in each direction, simultaneously, for a bandwidth of 8 GB/s.
For information about Refer to
PCI Express technology http://www.pcisig.com
1.5 System Memory
The board has eight DIMM sockets and supports the following memory features:
•1.35 V DDR3 SDRAM DIMMs (JEDEC Specification)
•Four independent memory channels with interleaved mode support
•Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
•64 GB maximum total system memory (using 4 Gb memory technology). Refer to
Section 2.1.1 on page 43 for information on the total amount of addressable
memory.
•Minimum total system memory: 1 GB using 512 MB x16 module
•Non-ECC and ECC DIMMs
•Serial Presence Detect
•DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and 1066 MHz
SDRAM DIMMs
•XMP performance profile support for memory speeds above 1600 MHz
•Full support for over clocking memory (see
www.intel.com/support/motherboards/desktop/sb/CS-031689.htm for more
information about over clocking)
•DIMM slots are numbered in installation order
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance.
Intel Desktop Board DX79SI Technical Product Specification
18
CAUTION
1.5 V is the recommended and default setting for DDR3 memory voltage. The other
memory voltage settings in the BIOS Setup program are provided for performance
tuning purposes only. Altering the memory voltage may (i) reduce system stability
and the useful life of the system, memory, and processor; (ii) cause the processor
and other system components to fail; (iii) cause reductions in system performance;
(iv) cause additional heat or other damage; and (v) affect system data integrity.
Intel has not tested and does not warranty the operation of the processor beyond its
specifications. For information on the processor warranty, refer to
http://www.intel.com/support/processors/sb/CS-
020033.htm?wapkw=(processor+warranty).
Intel assumes no responsibility that the memory installed on the desktop board, if
used with altered clock frequencies and/or voltages, will be fit for any particular
purpose. Check with the memory manufacturer for warranty terms and additional
details.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity
Configuration (Note)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
512 MB SS 1 Gbit 64 M x16/empty 4
1024 MB SS 1 Gbit 128 M x8/empty 8
1024 MB SS 2 Gbit 128 M x16/empty 4
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 128 M x16/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm
Product Description
19
1.5.1 Memory Configurations
The Intel Core i7 and Intel Xeon processors support the following types of memory
organization:
•Quad channel (Interleaved) mode. This mode offers the highest throughput for
real world applications.
•Tri channel (Interleaved) mode. Tri channel mode is enabled when the installed
memory capacities of any three DIMM channels are equal.
•Dual channel (Interleaved) mode. Dual channel mode is enabled when the
installed memory capacities of both DIMM channels are equal. Technology and
device width can vary from one channel to the other but the installed memory
capacity for each channel must be equal. If different speed DIMMs are used
between channels, the slowest memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
Intel Desktop Board DX79SI Technical Product Specification
20
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
For best memory performance always install memory into the blue DIMM memory
sockets if installing four DIMMs or less in your configuration.
This manual suits for next models
2
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