Intel DG965MQ User manual

August 2006
Order Number: D56013-001US
The Intel®Desktop Board DG965MQ may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG965MQ Specification Update.
Intel® Desktop Board
DG965MQ
Technical Product Specification

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DG965MQ Technical Product
Specification.
August 2006
This product specification applies to only the standard Intel®Desktop Board DG965MQ with
BIOS identifier MQ96510A.86A.
Changes to this specification will be published in the Intel Desktop Board DG965MQ Specification
Update before being incorporated into a revision of this document.
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Copyright © 2006, Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board DG965MQ. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DG965MQ and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
 NOTE
Notes call attention to important information.
# INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DG965MQ Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1, 073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Manufacturing Options .......................................................... 11
1.1.3 Board Layout ....................................................................... 12
1.1.4 Block Diagram ..................................................................... 14
1.2 Online Support................................................................................ 15
1.3 Processor ....................................................................................... 15
1.4 System Memory .............................................................................. 16
1.4.1 Memory Configurations ......................................................... 18
1.5 Intel®G965 Express Chipset ............................................................. 23
1.5.1 Intel G965 Graphics Subsystem.............................................. 23
1.5.2 USB ................................................................................... 26
1.5.3 Serial ATA Interfaces ............................................................ 27
1.5.4 Parallel IDE Interface ............................................................ 28
1.5.5 Real-Time Clock, CMOS SRAM, and Battery .............................. 28
1.6 Legacy I/O Controller....................................................................... 29
1.6.1 Serial Port Interface.............................................................. 29
1.6.2 Parallel Port Interface ........................................................... 29
1.6.3 Diskette Drive Interface ........................................................ 29
1.6.4 PS/2 Keyboard and Mouse Interface (Optional)......................... 29
1.7 Audio Subsystem............................................................................. 30
1.7.1 Audio Subsystem Software .................................................... 30
1.7.2 Audio Connectors and Headers ............................................... 31
1.8 LAN Subsystem............................................................................... 32
1.8.1 Intel®82566DC Gigabit Ethernet Controller ............................. 32
1.8.2 LAN Subsystem Software....................................................... 33
1.8.3 RJ-45 LAN Connector with Integrated LEDs .............................. 33
1.9 Hardware Management Subsystem .................................................... 34
1.9.1 Hardware Monitoring and Fan Control...................................... 34
1.9.2 Fan Monitoring..................................................................... 34
1.9.3 Chassis Intrusion and Detection.............................................. 34
1.9.4 Thermal Monitoring .............................................................. 35
1.10 Power Management ......................................................................... 36
1.10.1 ACPI .................................................................................. 36
1.10.2 Hardware Support ................................................................ 38
2Technical Reference
2.1 Memory Map................................................................................... 43
2.1.1 Addressable Memory............................................................. 43
2.2 DMA Channels................................................................................. 45
2.3 Fixed I/O Map ................................................................................. 46
2.4 PCI Configuration Space Map ............................................................ 47

Intel Desktop Board DG965MQ Technical Product Specification
vi
2.5 Interrupts ...................................................................................... 48
2.6 PCI Interrupt Routing Map ................................................................ 49
2.7 Connectors and Headers................................................................... 50
2.7.1 Back Panel Connectors .......................................................... 51
2.7.2 Component-side Connectors and Headers ................................ 52
2.8 Jumper Block .................................................................................. 61
2.9 Mechanical Considerations ................................................................ 62
2.9.1 Form Factor......................................................................... 62
2.9.2 I/O Shield ........................................................................... 63
2.10 Electrical Considerations................................................................... 65
2.10.1 DC Loading.......................................................................... 65
2.10.2 Fan Header Current Capability................................................ 65
2.10.3 Add-in Board Considerations .................................................. 66
2.10.4 Power Supply Considerations ................................................. 66
2.11 Thermal Considerations.................................................................... 67
2.12 Reliability ....................................................................................... 69
2.13 Environmental ................................................................................ 70
3Overview of BIOS Features
3.1 Introduction ................................................................................... 71
3.2 BIOS Flash Memory Organization....................................................... 72
3.3 Resource Configuration .................................................................... 72
3.3.1 PCI Autoconfiguration ........................................................... 72
3.3.2 PCI IDE Support................................................................... 73
3.4 System Management BIOS (SMBIOS)................................................. 73
3.5 Legacy USB Support ........................................................................ 74
3.6 BIOS Updates ................................................................................. 74
3.6.1 Language Support ................................................................ 75
3.6.2 Custom Splash Screen .......................................................... 75
3.7 BIOS Recovery................................................................................ 75
3.8 Boot Options................................................................................... 76
3.8.1 CD-ROM Boot ...................................................................... 76
3.8.2 Network Boot....................................................................... 76
3.8.3 Booting Without Attached Devices........................................... 76
3.8.4 Changing the Default Boot Device During POST ........................ 76
3.9 Adjusting Boot Speed....................................................................... 77
3.9.1 Peripheral Selection and Configuration..................................... 77
3.9.2 BIOS Boot Optimizations ....................................................... 77
3.10 BIOS Security Features .................................................................... 78
4Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 79
4.2 BIOS Beep Codes ............................................................................ 79
4.3 BIOS Error Messages ....................................................................... 79
4.4 Port 80h POST Codes ....................................................................... 80

Contents
vii
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 85
5.1.1 Safety Regulations................................................................ 85
5.1.2 European Union Declaration of Conformity Statement................ 86
5.1.3 Product Ecology Statements................................................... 88
5.1.4 EMC Regulations .................................................................. 92
5.1.5 Product Certification Markings (Board Level)............................. 93
5.2 Battery Disposal Information............................................................. 94
Figures
1. Major Board Components.................................................................. 12
2. Block Diagram ................................................................................ 14
3. Memory Channel Configuration and DIMM Configuration........................ 18
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ 19
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 19
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs ........... 20
7. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 21
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 21
9. Flex Mode Configuration with Two DIMMs............................................ 22
10. Front/Back Panel Audio Connector Options .......................................... 31
11. LAN Connector LED Locations............................................................ 33
12. Thermal Sensors and Fan Headers ..................................................... 35
13. Location of the Standby Power Indicator LED....................................... 42
14. Detailed System Memory Address Map ............................................... 44
15. Back Panel Connectors ..................................................................... 51
16. Component-side Connectors and Headers ........................................... 52
17. Connection Diagram for Front Panel Header ........................................ 58
18. Connection Diagram for Front Panel USB Headers ................................ 60
19. Connection Diagram for IEEE 1394a Header ........................................ 60
20. Location of the Jumper Block............................................................. 61
21. Board Dimensions ........................................................................... 62
22. I/O Shield Dimensions for Boards with PS/2 Connectors ........................ 63
23. I/O Shield Dimensions for Boards without PS/2 Connectors ................... 64
24. Localized High Temperature Zones..................................................... 68
Tables
1. Feature Summary............................................................................ 10
2. Manufacturing Options ..................................................................... 11
3. Board Components Shown in Figure 1 ................................................ 13
4. Supported Memory Configurations ..................................................... 16
5. Memory Operating Frequencies ......................................................... 17
6. DVI Port Status Conditions................................................................ 25
7. Audio Jack Retasking Support ........................................................... 30
8. LAN Connector LED States ................................................................ 33
9. Effects of Pressing the Power Switch .................................................. 36

Intel Desktop Board DG965MQ Technical Product Specification
viii
10. Power States and Targeted System Power........................................... 37
11. Wake-up Devices and Events ............................................................ 38
12. System Memory Map ....................................................................... 45
13. DMA Channels................................................................................. 45
14. I/O Map ......................................................................................... 46
15. PCI Configuration Space Map ............................................................ 47
16. Interrupts ...................................................................................... 48
17. PCI Interrupt Routing Map ................................................................ 49
18. Component-side Connectors and Headers Shown in Figure 16................ 53
19. High Definition Audio Link Header ...................................................... 54
20. Serial ATA Connectors...................................................................... 54
21. Chassis Intrusion Header.................................................................. 54
22. Serial Port Header ........................................................................... 54
23. Parallel Port Header ......................................................................... 55
24. Front and Rear Chassis Fan Headers .................................................. 55
25. Processor Fan Header ...................................................................... 55
26. Front Panel Audio Header ................................................................. 55
27. Processor Core Power Connector........................................................ 57
28. Main Power Connector...................................................................... 57
29. Front Panel Header .......................................................................... 58
30. States for a One-Color Power LED...................................................... 59
31. States for a Two-Color Power LED...................................................... 59
32. Auxiliary Front Panel Power LED Header.............................................. 59
33. BIOS Setup Configuration Jumper Settings.......................................... 61
34. DC Loading Characteristics ............................................................... 65
35. Fan Header Current Capability........................................................... 65
36. Thermal Considerations for Components ............................................. 69
37. Desktop Board DG965MQ Environmental Specifications......................... 70
38. BIOS Setup Program Menu Bar.......................................................... 72
39. BIOS Setup Program Function Keys.................................................... 72
40. Acceptable Drives/Media Types for BIOS Recovery ............................... 75
41. Boot Device Menu Options ................................................................ 76
42. Supervisor and User Password Functions............................................. 78
43. Beep Codes .................................................................................... 79
44. BIOS Error Messages ....................................................................... 79
45. Port 80h POST Code Ranges.............................................................. 80
46. Port 80h POST Codes ....................................................................... 81
47. Typical Port 80h POST Sequence........................................................ 84
48. Safety Regulations........................................................................... 85
49. Lead-Free Board Markings ................................................................ 91
50. EMC Regulations ............................................................................. 92
51. Product Certification Markings ........................................................... 93

9
1Product Description
What This Chapter Contains
1.1 Overview...................................................................................................10
1.2 Online Support...........................................................................................15
1.3 Processor ..................................................................................................15
1.4 System Memory .........................................................................................16
1.5 Intel®G965 Express Chipset .......................................................................23
1.6 Legacy I/O Controller ..................................................................................29
1.7 Audio Subsystem........................................................................................30
1.8 LAN Subsystem..........................................................................................32
1.9 Hardware Management Subsystem ...............................................................34
1.10 Power Management ....................................................................................36

Intel Desktop Board DG965MQ Technical Product Specification
10
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Desktop Board DG965MQ.
Table 1. Feature Summary
Form Factor microBTX Form Factor (10.40 inches by 10.50 inches [264.16 millimeters by
266.70 millimeters])
Processor Support for the following:
•Intel®Core™2 Duo processor in an LGA775 socket with a 1066 or
800 MHz system bus
•Intel®Pentium®D processor in an LGA775 socket with an 800 or
533 MHz system bus
•Intel®Pentium®4 processor in an LGA775 socket with an 800 or
533 MHz system bus
•Intel®Celeron®D processor in an LGA775 socket with a 533 MHz system bus
Memory •Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR2 800, DDR2 667, or DDR2 533 MHz DIMMs
•Support for up to 8 GB of system memory using DDR2 667 or DDR2 533
DIMMs
•Support for up to 4 GB of system memory using DDR2 800 DIMMs
Chipset Intel®G965 Express Chipset, consisting of:
•Intel®82G965 Graphics Memory Controller Hub (GMCH)
•Intel®82801 I/O Controller Hub (ICH8). Refer to Table 2 on page 11 for a list
of manufacturing options for the ICH8 component.
Video Intel® GMA X3000 onboard graphics subsystem
Audio Refer to Table 2 on page 11 for a list of manufacturing options
Legacy I/O Control Legacy I/O controller for diskette drive, serial, parallel, and optional PS/2* ports
USB Support for USB 2.0 devices
Peripheral
Interfaces
•10 USB ports
•Two IEEE-1394a interfaces: one back panel connector and one front-panel
header
•One serial port
•One parallel port
•Six Serial ATA interfaces
•One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support
•One diskette drive interface
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82566DC
Gigabit Ethernet Controller
BIOS •Intel®BIOS (resident in the SPI Flash device)
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available
PC Technology
•Support for PCI Local Bus Specification Revision 2.3
•Support for PCI Express* Revision 1.0a
•Suspend to RAM support
•Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
continued