Intel D50TNP User manual

Intel® Server D50TNP
Family
Intel® Server Board D50TNP Family
Intel® Module D50TNP Family
Intel® Server System D50TNP Family
Integration and Service Guide
A guide providing instructions for the insertion and
extraction of system components and available Intel
accessories and spares.
Rev. 1.0
May 2021
Delivering Breakthrough Data Center System Innovation –Experience What’s Inside!

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Document Revision History
Date
Revision
Changes
May 2021
1.0
Initial production release.

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Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software, or service
activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your
system manufacturer or retailer or learn more at intel.com.
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which
includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
The products described may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
This document contains information on products, services and/or processes in development. All information provided here is subject
to change without notice. Contact your Intel representative to obtain the latest Intel product specifications.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725
or by visiting www.intel.com/design/literature.htm.
Intel, the Intel logo, Xeon, Stratix, and Intel Optane are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other
countries.
*Other names and brands may be claimed as the property of others.
© Intel Corporation

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Warnings
Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other
products/components will void the UL listing and other regulatory approvals of the product. It will most
likely result in noncompliance with product regulations in the region(s) in which the product is sold.
System power on/off: The power buttons on the front panel of each module DO NOT turn off the server
chassis AC power. To remove power from the server chassis, you must unplug the AC power cord from the
wall outlet. Make sure the AC power cord is unplugged before you open the server chassis.
To service a module, it is not necessary to power down the entire system. Power off only the module
requiring servicing before attempting to remove it from the server chassis.
Hazardous conditions, devices and cables: Hazardous electrical conditions may be present on power,
telephone, and communication cables. Turn off the module and disconnect all telecommunications systems,
networks, and modems attached to it before removing it from the server chassis. Otherwise, personal injury
or equipment damage can result.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle
nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or
install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide
sides can damage the contacts inside the jumper, causing intermittent problems with the function controlled
by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper,
or you may bend or break the pins on the board.
Electrostatic Discharge (ESD)
Electrostatic discharge can damage your computer or the components within it. ESD can occur without the
user feeling a shock while working inside the system chassis or while improperly handling electronic devices
like processors, memory or other storage devices, and add-in cards.
Intel recommends the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
•Where available, all system integration and/or service should be performed at a properly equipped
ESD workstation.
•Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive
shoes.
•Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.
•Remove all jewelry.
•Disconnect all power cables and cords before opening the Server Chassis
•Power down the Module and remove it from the Server Chassis, remove power feed from the Server
Board before performing any integration or service
•Touch any unpainted metal surface of the chassis before performing any integration or service.

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•Hold all circuit boards and other electronic components by their edges only.
•After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive foam pad. Do not place
electronic devices on to the outside of any protective packaging.
Caution: Slide/rail mounted equipment is not to be used as a shelf or a work space.
Intel warranties that this product will perform to its published specifications. However, all computer systems
are inherently subject to unpredictable system behavior under various environmental and other conditions.
This product is not intended to be the sole source for any critical data and the user must maintain a
verified backup. Failure to do so or to comply with other user notices in the product user guide and
specification documents may result in loss of or access to data.
Weight of the system:
•Remove all installed modules from the system before attempting to install the system into the rack.
•Due to the weight of a system, Intel recommends carrying the system with two people supporting the
system from the sides or using a mechanical lift or a cart when moving the system from one location
to another.
•If your system has rack handles installed, do not lift or carry the system by the rack handles
•When lifting or moving a chassis, always grasp it by all four corners. Do not grasp the chassis by two
points at opposing diagonal corners, doing so may damage the internal components.
•If you can only grasp the chassis at two different points, always grasp the chassis by the sides at the
midpoint.
Liquid cooling safety guidelines:
•Make sure there are no leaks and/or damaged parts before operating the liquid cooling system.
•Do not energize the system or any installed modules if the liquid cooling subsystem is compromised.
•Do not attempt to perform any service to the server chassis before removing power to the system.
Turn off and disconnect power from the chassis before disconnecting the liquid cooling quick
disconnect tube connectors from the back of the chassis. Turn off the modules before disconnecting
the liquid cooling quick disconnect tube connectors.
•To reduce the risk of damage to the cooling system, use care when installing or removing the liquid-
cooled modules.
•Avoid excessive force when connecting and disconnecting quick disconnect couplings.
•Keep the liquid cooling tubing clear of pinch points when installing or removing the server modules
in/from the chassis.

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Important Safety Certification Standards and Transition Support
Information
The IEC 60950-1 2nd Edition safety standard (Information Technology Equipment) is going through a
replacement phase due to the new IEC 62368-1 3rd Edition safety standard (Audio/Video, Information, and
Communication Technology Equipment).
Intel® server systems identified in this service guide are certified to:
•The new IEC 62368-1 3rd Edition standard for countries that have adopted this new standard.
•The outgoing IEC 60950-1 2nd Edition standard for countries that have not yet adopted the new
standard.
During the global adoption/certification transition phase between the outgoing and new standards, safety
requirement differences between the standards may temporarily dictate restricted usage of Intel® server
system products as follows:
•In countries that have adopted the new IEC 62368-1 3rd Edition standard, no location restrictions
apply beyond the standard intended application use requirements.
•In countries that have not yet adopted the new IEC 62368-1 3rd Edition standard, restricted access
locations are required. Access in these locations is permitted only by technically trained and qualified
personnel who are aware of potential safety hazards.
Note: This requirement applies only to Intel® server system products released in 2019 or later. Legacy Intel®
server system products (released in 2018 or earlier) provide safeguards that require no additional access
restrictions.
Explanation of temporary restricted access location measures
The new IEC 62368-1 3rd Edition standard does not consider 240 VA an energy hazard. The outgoing IEC
60950-1 2nd Edition standard does consider 240 VA an energy hazard, therefore Intel® server system
products released in 2019 or later certified to this standard require restricted access locations. Legacy Intel®
server system products (released in 2018 or earlier) were designed with additional safeguards to meet IEC
60950-1 2nd Edition standard 240 VA requirements, so no location restrictions apply beyond the standard
intended application use requirements. After the IEC 60950-1 standard is phased out globally and Intel
server system products are certified to the new IEC 62368-1 standard, the temporarily restricted access
locations will no longer be required.

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Contents
1. Introduction............................................................................................................................................................... 19
1.1 Reference Documents and Support Collaterals................................................................................................20
2. L6 Integrated System –Essential System Component Installation .............................................................. 22
2.1 Air Duct Removal / Installation.................................................................................................................................24
2.1.1 Air Duct Removal............................................................................................................................................................24
2.1.2 Air Duct Installation.......................................................................................................................................................24
2.2 Opening and Closing Storage Module (iPC –D50TNP2MHSTAC).............................................................25
2.2.1 Opening the Top Tray ..................................................................................................................................................25
2.2.2 Closing the Top Tray.....................................................................................................................................................26
2.3 Processor Assembly and Installation.....................................................................................................................26
2.3.1 Assembly and Installation for Standard Air-Cooled Heat Sinks ................................................................28
2.3.2 Assembly and Installation for EVAC Heat Sinks................................................................................................34
2.3.3 Assembly and Installation for Liquid-Cooled Configurations.....................................................................42
2.4 Liquid-Cooling Loop Installation (for Compute Module iPC –D50TNP1MHCRLC) ...........................44
2.5 Memory (DIMM) Installation ......................................................................................................................................52
2.5.1 DIMM Installation for Air-Cooled Modules..........................................................................................................52
2.5.2 DDR4 DIMM Installation for liquid-Cooled Modules.......................................................................................54
2.6 Module Installation........................................................................................................................................................56
2.6.1 Storage Module Installation (iPC –D50TNP2MHSTAC Only)......................................................................57
3. System Options / Accessory Kit Installation...................................................................................................... 58
3.1 Installing the Chassis Into a Rack ............................................................................................................................59
3.1.1 Installing the Fixed Rail Kit.........................................................................................................................................59
3.1.2 Installing the Chassis Into a Rack ............................................................................................................................60
3.2 Module Removal / Installation..................................................................................................................................61
3.2.1 Module Removal.............................................................................................................................................................61
3.2.2 Module Installation........................................................................................................................................................62
3.3 Air Duct Removal / Installation.................................................................................................................................64
3.3.1 Air Duct Removal............................................................................................................................................................64
3.3.2 Air Duct Installation.......................................................................................................................................................64
3.4 Opening and Closing Storage Module (iPC –D50TNP2MHSTAC).............................................................65
3.4.1 Opening the Top Tray ..................................................................................................................................................65
3.4.2 Closing the Top Tray.....................................................................................................................................................66
3.5 Add-in Card Option Installation...............................................................................................................................66
3.5.1 Riser Assembly Removal.............................................................................................................................................68
3.5.2 PCIe* Add-In Card Installation..................................................................................................................................68
3.5.3 Riser Assembly Installation........................................................................................................................................69
3.6 Liquid-Cooled Mellanox Add-In Card Installation
(for Compute Module iPC –D50TNP1MHCRLC)................................................................................................70
3.7 Accelerator Module Add-in Card Installation (iPC –D50TNP2MFALAC Only).....................................71
3.8 Drive Carrier Extraction, Assembly, and Installation .......................................................................................81

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3.8.1 Drive Carrier Extraction................................................................................................................................................81
3.8.2 Drive Carrier Assembly ................................................................................................................................................82
3.8.3 Drive Carrier Installation .............................................................................................................................................83
3.9 M.2 Storage Devices Installation..............................................................................................................................84
3.9.1 M.2 SSD Installation for Air-Cooled Configurations........................................................................................84
3.9.2 Air-Cooled M.2 Heat Sink Installation ...................................................................................................................85
3.9.3 M.2 SSD Installation for Liquid-Cooled configurations .................................................................................85
3.9.4 M.2 Cold Plate Installation –Liquid-Cooled Configurations Only.............................................................86
3.10 EDSFF NVMe* Extraction and Installation (iPC –D50TNP2MHSTAC Only)...........................................87
3.10.1 EDSFF Drive Extraction................................................................................................................................................87
3.10.2 EDSFF Drive Installation..............................................................................................................................................87
3.11 Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key Installation .........................................................88
3.12 Trusted Platform Module (TPM) Installation......................................................................................................88
3.13 Ethernet Management Port Module (EMP Module) (iPC –AXXFCEMP) ..................................................89
4. System Software Updates and Configuration.................................................................................................... 90
4.1 Using the BIOS Setup Utility......................................................................................................................................90
4.1.1 Entering BIOS Setup .....................................................................................................................................................90
4.1.2 No Access to the BIOS Setup Utility.......................................................................................................................90
4.1.3 Navigating the BIOS Setup Utility............................................................................................................................90
5. System Packaging Assembly Instructions .......................................................................................................... 92
6. System / Module –Features Overview ................................................................................................................ 96
6.1 System Feature Identification...................................................................................................................................96
6.2 Front Panel Features.....................................................................................................................................................98
6.3 Front Control Panel Features....................................................................................................................................99
6.4 System Component Identification....................................................................................................................... 100
6.5 Server Board Features............................................................................................................................................... 103
7. FRU Replacement ................................................................................................................................................... 105
7.1 Module Removal / Installation............................................................................................................................... 106
7.1.1 Module Removal.......................................................................................................................................................... 106
7.1.2 Module Installation..................................................................................................................................................... 106
7.2 Air Duct Removal / Installation.............................................................................................................................. 109
7.2.1 Air Duct Removal......................................................................................................................................................... 109
7.2.2 Air Duct Installation.................................................................................................................................................... 109
7.3 Opening and Closing Storage Module (iPC –D50TNP2MHSTAC).......................................................... 110
7.3.1 Opening the Top Tray ............................................................................................................................................... 110
7.3.2 Closing the Top Tray.................................................................................................................................................. 111
7.4 Processor Replacement............................................................................................................................................ 111
7.4.1 Processor Replacement for Standard Air-Cooled Heat Sinks.................................................................. 111
7.4.2 Processor Replacement for EVAC Heat Sinks................................................................................................. 119
7.4.3 Processor Replacement for Liquid-Cooled Configurations ...................................................................... 128
7.5 Memory (DIMM) Replacement ............................................................................................................................... 135
7.5.1 DIMM Replacement for Air-Cooled Modules................................................................................................... 135

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7.5.2 DDR4 DIMM Replacement for Liquid-Cooled Modules .............................................................................. 137
7.6 Memory Heat Spreader Thermal Pad Replacement (Liquid-Cooled Modules Only)...................... 140
7.7 M.2 Storage Devices Replacement ...................................................................................................................... 142
7.7.1 M.2 and Heat Sink Replacement for Air-Cooled Configurations............................................................. 142
7.7.2 M.2 SSD and Cold Plate Replacement for Liquid-Cooled Configurations .......................................... 144
7.8 Riser Assembly Replacement................................................................................................................................. 146
7.8.1 Riser Assembly Removal.......................................................................................................................................... 148
7.8.2 PCIe* Add in Card Replacement............................................................................................................................ 148
7.8.3 Riser Assembly Installation..................................................................................................................................... 149
7.9 Liquid-Cooling Loop Replacement (for Compute Module iPC –D50TNP1MHCRLC) .................... 150
7.10 Mellanox Add-In Card Replacement (for Compute Module iPC –D50TNP1MHCRLC).................. 159
7.11 Accelerator Module Add-in Card Replacement (iPC –D50TNP2MFALAC Only).............................. 161
7.12 Accelerator Module Riser Card Replacement (iPC –D50TNP2MFALAC Only).................................. 171
7.13 Accelerator Module Power Connector Board Replacement (iPC –D50TNP2MFALAC Only) ..... 173
7.14 Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key Replacement .................................................. 175
7.15 Trusted Power Module (TPM) Replacement.................................................................................................... 175
7.16 Power Supply Replacement.................................................................................................................................... 177
7.17 Server Board Replacement ..................................................................................................................................... 178
7.18 System Fan Replacement ........................................................................................................................................ 180
7.19 Chassis Plumbing Assembly Replacement (Liquid-Cooled Systems Only)........................................ 182
7.20 Power Distribution Board (PDB) Assembly Replacement .......................................................................... 188
7.21 Internal Chassis Rail Replacement....................................................................................................................... 193
7.22 System Battery Replacement................................................................................................................................. 194
Appendix A. Getting Help ........................................................................................................................................ 196
Appendix B. Memory Population Rules................................................................................................................ 197
B.1 DDR4 DIMM Population Rules ............................................................................................................................... 197
B.2 Intel® Optane™ Persistent Memory 200 Series Module Rules
(Intel® Server Board D50TNP1SB Only) ............................................................................................................ 197
Appendix C. System Status LED State Definitions............................................................................................. 199
Appendix D. Onboard Configuration and Service Jumpers............................................................................. 202
D.1 BIOS Default Jumper (BIOS DFLT –J17)........................................................................................................... 203
D.2 Password Clear Jumper (PASSWD_CLR –J12) .............................................................................................. 203
D.3 Intel® Management Engine (Intel® ME) Firmware Force Update Jumper
(ME_FRC_UPDT –J13).............................................................................................................................................. 204
D.4 BMC Force Update Jumper (BMC_FRC_UPDT –J2X4) ............................................................................... 205
D.5 BIOS SVN Downgrade (SVN_Bypass –J16) ..................................................................................................... 205
D.6 BMC SVN Downgrade (J33) .................................................................................................................................... 206
Appendix E. POST Code Diagnostic LED Decoder............................................................................................. 207
E.1 Early POST Memory Initialization MRC Diagnostic Codes......................................................................... 208
E.2 BIOS POST Progress Codes.................................................................................................................................... 210
Appendix F. POST Error Codes .............................................................................................................................. 213
F.1 Processor Initialization Error Summary............................................................................................................. 219

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Appendix G. Product Safety –Multi-Language................................................................................................... 221
Appendix H. Glossary ............................................................................................................................................... 233
List of Figures
Figure 1. System Directional Reference...........................................................................................................................................23
Figure 2. Removing the Air Duct .........................................................................................................................................................24
Figure 3. Installing the Air Duct...........................................................................................................................................................24
Figure 4. Removing the Air Duct .........................................................................................................................................................25
Figure 5. Removing the Air Duct .........................................................................................................................................................26
Figure 6. 1U Supported Standard Processor Heat Sinks..........................................................................................................26
Figure 7. 1U Supported EVAC Processor Heat Sinks.................................................................................................................27
Figure 8. 2U Heat Sinks...........................................................................................................................................................................27
Figure 9. 1U Heat Sinks Installed in Module..................................................................................................................................28
Figure 10. Processor Components and Processor Socket Reference Diagram with Standard Heat Sink ...........29
Figure 11. Installing the Processor Carrier Clip onto the Processor –Part 1...................................................................30
Figure 12. Installing the Processor Carrier Clip onto the Processor –Part 2...................................................................30
Figure 13. Removing the Heat sink from its Packaging.............................................................................................................31
Figure 14. Processor Heat Sink Anti-tilt Wires in the Outward Position............................................................................ 31
Figure 15. Pin 1 Indicator of Processor Carrier Clip....................................................................................................................32
Figure 16. Socket Protective Cover Removal ................................................................................................................................32
Figure 17. PHM Alignment with the Socket Assembly .............................................................................................................. 33
Figure 18. PHM Installation onto the Server Board....................................................................................................................33
Figure 19. Tighten Heat Sink Fasteners...........................................................................................................................................34
Figure 20. Processor Components and Processor Socket Reference Diagram with EVAC Heat Sink...................35
Figure 21. Installing the Processor Carrier Clip onto the Processor –Part 1...................................................................36
Figure 22. Installing the Processor Carrier Clip onto the Processor –Part 2...................................................................36
Figure 23. Removing the Heat Sink from its Packaging ............................................................................................................37
Figure 24. Processor Heat Sink Anti-tilt Wires in the Outward Position............................................................................ 37
Figure 25. Pin 1 Indicator of Processor Carrier Clip....................................................................................................................38
Figure 26. Removing a Riser Assembly............................................................................................................................................38
Figure 27. Socket Protective Cover Removal ................................................................................................................................39
Figure 28. PHM Alignment with the Socket Assembly .............................................................................................................. 40
Figure 29. PHM Installation onto the Server Board....................................................................................................................40
Figure 30. Tighten EVAC Heat Sink Extension ..............................................................................................................................41
Figure 31.Installing a Riser Assembly...............................................................................................................................................41
Figure 32. Installing Processor Carrier Clip onto Processor –Part 1...................................................................................42
Figure 33. Installing Processor Carrier Clip onto Processor –Part 2...................................................................................43
Figure 34. Socket Protective Cover Removal ................................................................................................................................43
Figure 35. Align Processors and Processor Carrier Clips with Sockets..............................................................................44
Figure 36. Screws to be Removed Before the Installation.......................................................................................................44

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Figure 37. Liquid-Cooling Loop Components...............................................................................................................................45
Figure 38. Removing Front VR Cooling Block’s Protective Covers.......................................................................................46
Figure 39. Installing Front VR Blocks................................................................................................................................................47
Figure 40. Assembling the Manual Applicator..............................................................................................................................47
Figure 41. Applying Center VR Thermal Gap Filler .....................................................................................................................48
Figure 42. Installing Liquid-Cooling Loop.......................................................................................................................................49
Figure 43. Securing the Processor Cold Plates.............................................................................................................................50
Figure 44. Removing Liquid-Cooling Loop Carrier......................................................................................................................50
Figure 45. Securing Conduction Plate..............................................................................................................................................51
Figure 46. Securing the Quick Disconnect Block and Memory Cooler ...............................................................................51
Figure 47. DIMM Blank Removal.........................................................................................................................................................52
Figure 48. DIMM Installation.................................................................................................................................................................53
Figure 49.Loosen Memory Cooler Screws......................................................................................................................................54
Figure 50. Memory Replacement Tools and Retention Clip ...................................................................................................54
Figure 51. Installing the DDR4 DIMM in a Liquid-Cooled System ........................................................................................55
Figure 52. Installing the DDR4 DIMM Retention Clips ...............................................................................................................55
Figure 53. Securing the Memory Cooler to the Server Board ................................................................................................56
Figure 54. Installing a Module..............................................................................................................................................................56
Figure 55. Removing the Internal Chassis Rail..............................................................................................................................57
Figure 56. Installing the Internal Chassis Rail................................................................................................................................57
Figure 57. System Directional Reference........................................................................................................................................58
Figure 58. Securing the Front of the Rack Rail..............................................................................................................................59
Figure 59. Securing the Back of the Rail..........................................................................................................................................60
Figure 60. Installing the Chassis into the Rack .............................................................................................................................60
Figure 61. Removing a Module............................................................................................................................................................61
Figure 62. Installing a Module..............................................................................................................................................................62
Figure 63. Removing the Internal Chassis Rail..............................................................................................................................63
Figure 64. Installing the Internal Chassis Rail................................................................................................................................63
Figure 65. Removing the Air Duct.......................................................................................................................................................64
Figure 66. Installing the Air Duct ........................................................................................................................................................64
Figure 67. Removing the Air Duct.......................................................................................................................................................65
Figure 68. Removing the Air Duct.......................................................................................................................................................66
Figure 69. 1U Riser Assembly and Riser Card Features (D50TNP1MHCPAC and D50TNP2MHSTAC).................67
Figure 70. 1U Riser Assembly and Riser Card Features (D50TNP1MHCRAC, D50TNP1MHCRLC, and
D50TNP1MHEVAC)............................................................................................................................................................67
Figure 71. 2U Riser Assembly and Riser Card Features (D50TNP2MHSVAC and D50TNP2MFALAC)..................67
Figure 72. Removing a Riser Assembly............................................................................................................................................68
Figure 73. Installing an Add-in Card..................................................................................................................................................68
Figure 74. Installing a Riser Assembly into the Chassis............................................................................................................ 69
Figure 75. Mellanox Liquid Cooled Add-in Card with Thermal Pad.....................................................................................70
Figure 76. Installing the Mellanox Add-in Card Foam Pads....................................................................................................70
Figure 77. Air-Cooled Accelerator Module.....................................................................................................................................71

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Figure 78. Accelerator Module Riser Assembly............................................................................................................................71
Figure 79. Accelerator Module Riser Card 1 –Front View........................................................................................................72
Figure 80. Accelerator Module Riser Card 2 –Front View........................................................................................................72
Figure 81. Removing a Riser Assembly............................................................................................................................................73
Figure 82. Removing the Bracket from the Chassis....................................................................................................................73
Figure 83. Removing the Inside Screw for OCuLink Cables ....................................................................................................74
Figure 84. Removing the OCuLink Cables ......................................................................................................................................74
Figure 85. Removing the Riser Card Power Cables.....................................................................................................................75
Figure 86. Removing the Accelerator Module Riser Assembly ..............................................................................................75
Figure 87. Replacing the Add-in Card Metal Bracket .................................................................................................................76
Figure 88. Installing the Accelerator Add-in Card in the Riser Assembly..........................................................................76
Figure 89. Securing the Accelerator Add-in Card in the Riser Assembly ..........................................................................77
Figure 90. Installing the Accelerator Module Riser Assembly................................................................................................77
Figure 91. Connecting the Riser Card Power Cables..................................................................................................................78
Figure 92. Connecting the Add-in Card Power Cable................................................................................................................78
Figure 93. Installing the OCuLink Cables........................................................................................................................................79
Figure 94. Installing the Inside Screws for OCuLink Cables....................................................................................................79
Figure 95. Installing the Bracket on the Chassis ..........................................................................................................................80
Figure 96. Installing Riser Assembly into the Chassis................................................................................................................80
Figure 97. Drive Carrier Extraction from the Chassis .................................................................................................................81
Figure 98. 2.5” Drive Carrier Assembly – Drive / Blank Removal ..........................................................................................82
Figure 99. 2.5” Drive Carrier Assembly – Drive Installation into the Carrier.....................................................................82
Figure 100. 2.5” Drive Carrier Assembly –Alignment Features.............................................................................................83
Figure 101. Drive Carrier Installation into the Chassis ..............................................................................................................83
Figure 102. Installing Air-Cooled M.2 SSD .....................................................................................................................................84
Figure 103. Installing Air-Cooled M.2 Heat Sink ..........................................................................................................................85
Figure 104. Installing the Thermal Interface Material (TIM) on M.2 SSD...........................................................................85
Figure 105. Installing the M.2 SSD.....................................................................................................................................................86
Figure 106. Installing the M.2 cold Plate.........................................................................................................................................86
Figure 107. EDSFF Drive Extraction from the Chassis...............................................................................................................87
Figure 108. EDSFF drive Installation into the Chassis...............................................................................................................87
Figure 109. Installing the Intel® VROC Upgrade Key..................................................................................................................88
Figure 110. Installing the Trusted Platform Module (TPM).....................................................................................................88
Figure 111. Removing the EMP Blank .............................................................................................................................................. 89
Figure 112. Installing the EMP Module/Blank...............................................................................................................................89
Figure 113. Module Identification for four-Module System Configuration......................................................................96
Figure 114. Module Identification for Two-Module System Configuration......................................................................96
Figure 115. Module Identification for Three-module System Configuration..................................................................96
Figure 116. Module Identification for One-Module System Configuration...................................................................... 97
Figure 117. Liquid-Cooled System Back View..............................................................................................................................97
Figure 118. Air-Cooled System Back View .....................................................................................................................................97
Figure 119. 1U Compute Module Front Panel Feature Identification.................................................................................98

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Figure 120. 2U Management Module Front Panel Feature Identification.........................................................................98
Figure 121. 2U Storage Module Front Panel Feature Identification....................................................................................98
Figure 122. 2U Accelerator Module Front Panel Feature Identification............................................................................99
Figure 123. Front Control Panel Features ......................................................................................................................................99
Figure 124. I/O Breakout Cable Connector Identification........................................................................................................99
Figure 125. Server Chassis Component Identification........................................................................................................... 100
Figure 126. 1U liquid-Cooled Compute Module Component Identification................................................................. 101
Figure 127. 1U air-Cooled Compute Module Component Identification ....................................................................... 101
Figure 128. 2U Management Module Component Identification ...................................................................................... 102
Figure 129. 2U Storage Module Component Identification................................................................................................. 102
Figure 130. 2U Accelerator Module Component Identification ......................................................................................... 103
Figure 131. Intel® Server Board D50TNP1SB Feature Identification................................................................................ 103
Figure 132. Intel® Server Board D50TNP1SBCR Feature Identification.......................................................................... 104
Figure 133. Onboard LED Location ................................................................................................................................................ 104
Figure 134. Removing a Module...................................................................................................................................................... 106
Figure 135. Installing a Module........................................................................................................................................................ 107
Figure 136. Removing the Internal Chassis Rail........................................................................................................................ 108
Figure 137. Installing the Internal Chassis Rail.......................................................................................................................... 108
Figure 138. Removing the Air Duct................................................................................................................................................. 109
Figure 139. Installing the Air Duct................................................................................................................................................... 109
Figure 140. Removing the Air Duct................................................................................................................................................. 110
Figure 141. Removing the Air Duct................................................................................................................................................. 111
Figure 142. Processor Heat Sink Handling.................................................................................................................................. 112
Figure 143. PHM Assembly Removal from Processor Socket............................................................................................. 112
Figure 144. Reinstall the Socket Cover......................................................................................................................................... 113
Figure 145. Processor Removal from PHM Assembly ............................................................................................................ 113
Figure 146. Processor Carrier Clip Removal from PHM Assembly.................................................................................... 114
Figure 147. Installing Processor Carrier Clip onto Processor –Part 1............................................................................. 114
Figure 148. Installing Processor Carrier Clip onto Processor –Part 2............................................................................. 115
Figure 149. Processor Heat Sink Handling.................................................................................................................................. 115
Figure 150. Processor Heat Sink Anti-tilt Wires in the Outward Position...................................................................... 116
Figure 151. Pin 1 Indicator of Processor Carrier Clip.............................................................................................................. 116
Figure 152. Socket Protective Cover Removal........................................................................................................................... 117
Figure 153. PHM Alignment with Socket Assembly ................................................................................................................ 117
Figure 154. PHM Installation onto Server Board ...................................................................................................................... 118
Figure 155. Tighten Heat Sink Fasteners ..................................................................................................................................... 118
Figure 156. Processor Heat Sink Handling.................................................................................................................................. 119
Figure 157. Removing a Riser Assembly ...................................................................................................................................... 120
Figure 158. Loosen EVAC Heat Sink Fasteners ......................................................................................................................... 120
Figure 159. PHM Assembly Removal from Processor Socket............................................................................................. 121
Figure 160. Reinstall the Socket Cover......................................................................................................................................... 122
Figure 161. Processor Removal from PHM Assembly ............................................................................................................ 122

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Figure 162. Processor Carrier Clip Removal from PHM Assembly.................................................................................... 123
Figure 163. Installing Processor Carrier Clip onto Processor –Part 1............................................................................. 123
Figure 164. Installing Processor Carrier Clip onto Processor –Part 2............................................................................. 124
Figure 165. Processor Heat Sink Handling.................................................................................................................................. 124
Figure 166. Processor Heat Sink Anti-tilt Wires in the Outward Position...................................................................... 125
Figure 167. Pin 1 Indicator of Processor Carrier Clip.............................................................................................................. 125
Figure 168. Socket Protective Cover Removal........................................................................................................................... 126
Figure 169. PHM Alignment with Socket Assembly ................................................................................................................ 126
Figure 170. PHM Installation onto Server Board ...................................................................................................................... 127
Figure 171. PHM Installation onto Server Board ...................................................................................................................... 127
Figure 172.Installing a Riser Assembly ......................................................................................................................................... 128
Figure 173. Loosening Processor Cold Plate Nuts................................................................................................................... 129
Figure 174. Removing Processor Cold Plate .............................................................................................................................. 129
Figure 175. Reinstall the Socket Cover......................................................................................................................................... 130
Figure 176. Processor Removal from Processor Carrier Clip and Processor Cold Plate ......................................... 130
Figure 177. Processor Carrier Clip Removal from Processor Cold Plate........................................................................ 131
Figure 178. Installing Processor Carrier clip onto Processor –Part 1 ............................................................................. 131
Figure 179. Installing Processor Carrier Clip onto Processor –Part 2............................................................................. 132
Figure 180. Socket Protective Cover Removal........................................................................................................................... 132
Figure 181. Processor Installation onto Server Board............................................................................................................ 133
Figure 182. Assembling the Manual Applicator ........................................................................................................................ 133
Figure 183. Applying Center VR Thermal Gap Filler................................................................................................................ 134
Figure 184. Reinstalling Processor Cold Plate........................................................................................................................... 134
Figure 185. Securing Processor Cold Plate................................................................................................................................. 135
Figure 186. Removing the DIMM from an Air-Cooled System............................................................................................ 136
Figure 187. Installing the DIMM in an Air-Cooled System.................................................................................................... 136
Figure 188. Memory Replacement Tools and Retention Clip.............................................................................................. 137
Figure 189. Loosen Memory Cooler Mounting Screws .......................................................................................................... 137
Figure 190. Removing the DIMM Retention Clips..................................................................................................................... 138
Figure 191. Removing the DIMM from a Liquid-Cooled System........................................................................................ 138
Figure 192. Installing the DIMM in a Liquid-Cooled System................................................................................................ 139
Figure 193. Installing the DIMM Retention Clips....................................................................................................................... 139
Figure 194. Securing the Memory Cooler to the Server Board........................................................................................... 140
Figure 195. Removing a Thermal Pad ........................................................................................................................................... 141
Figure 196. Installing a Thermal Pad............................................................................................................................................. 141
Figure 197. Removing Air-Cooled M.2 Heat Sink ..................................................................................................................... 142
Figure 198. Removing Air-Cooled M.2 SSD................................................................................................................................. 142
Figure 199. Installing Air-Cooled M.2 SSD .................................................................................................................................. 143
Figure 200. Installing Air-Cooled M.2 Heat Sink ....................................................................................................................... 143
Figure 201. Removing the Liquid-Cooled M.2 Cold Plate..................................................................................................... 144
Figure 202. Removing liquid-Cooled M.2 SSD........................................................................................................................... 144
Figure 203. Installing Liquid-Cooled M.2 SSD........................................................................................................................... 145

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Figure 204. Installing the M.2 SSD.................................................................................................................................................. 145
Figure 205. Installing Liquid-Cooled M.2 Cold Plate............................................................................................................... 146
Figure 206. 1U Riser Assembly and Riser Card Features (D50TNP1MHCPAC and D50TNP2MHSTAC) ........... 147
Figure 207. 1U Riser Assembly and Riser Card Features (D50TNP1MHCRAC D50TNP1MHCRLC, and
D50TNP1MHEVAC) ...................................................................................................................................................... 147
Figure 208. 2U Riser Assembly and Riser Card Features (D50TNP2MHSVAC and D50TNP2MFALAC)............ 147
Figure 209. Removing a Riser Assembly ...................................................................................................................................... 148
Figure 210. Add-in Card Removal................................................................................................................................................... 148
Figure 211. Add-in Card Installation.............................................................................................................................................. 149
Figure 212. Installing a Riser Assembly ........................................................................................................................................ 149
Figure 213. Liquid-Cooling Loop Components......................................................................................................................... 150
Figure 214. Removing the Screws on Quick Disconnect Block and Memory Cooler................................................. 151
Figure 215. Removing the Screws on the Conduction Plate................................................................................................ 151
Figure 216. Installing the Liquid-Cooling Loop Carrier.......................................................................................................... 152
Figure 217. Loosening Processor Cold Plates ........................................................................................................................... 152
Figure 218. Removing Liquid-Cooling Loop............................................................................................................................... 153
Figure 219. Align Processors and Processor Carrier Clips with Sockets ........................................................................ 153
Figure 220. Removing Front VR Cooling Blocks........................................................................................................................ 154
Figure 221. Removing front VR Cooling Blocks Protective Covers................................................................................... 155
Figure 222. Installing Front VR Blocks .......................................................................................................................................... 155
Figure 223. Assembling the Manual Applicator ........................................................................................................................ 156
Figure 224. Applying Center VR Thermal Gap Filler................................................................................................................ 156
Figure 225. Installing Liquid-Cooling Loop................................................................................................................................. 157
Figure 226. Securing the Processor Cold Plates....................................................................................................................... 157
Figure 227. Removing the Liquid-Cooling Loop Carrier........................................................................................................ 158
Figure 228. Securing the Conduction Plate ................................................................................................................................ 158
Figure 229. Securing the Quick Disconnect Block and Memory Cooler ......................................................................... 159
Figure 230. Mellanox Liquid Cooled Add-in Card with Thermal Pad............................................................................... 160
Figure 231. Installing the Mellanox Add-in Card Foam Pads .............................................................................................. 160
Figure 232. Removing a Riser Assembly ...................................................................................................................................... 161
Figure 233. Removing the Bracket from the Chassis .............................................................................................................. 161
Figure 234. Removing the Inside Screw for OCuLink Cables .............................................................................................. 162
Figure 235. Removing the OCuLink Cables................................................................................................................................. 162
Figure 236. Disconnecting the Riser Card Power Cables ...................................................................................................... 163
Figure 237. Disconnecting Add-in Power Cable ....................................................................................................................... 163
Figure 238. Removing the Accelerator Module Riser Assembly ........................................................................................ 164
Figure 239. Lifting the Flap up on the Front Side of the Riser Assembly....................................................................... 164
Figure 240. Detaching the Accelerator Add-in Card from the Riser Assembly............................................................ 165
Figure 241. Removing the Accelerator Add-in Card from the Riser Assembly............................................................ 165
Figure 242. Replacing the Add-in Card Metal Bracket ........................................................................................................... 166
Figure 243. Installing the Accelerator Add-in Card in the Riser Assembly.................................................................... 166
Figure 244. Securing the Accelerator Add-in Card in the Riser Assembly..................................................................... 167

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Figure 245. Installing the Accelerator Module Riser Assembly .......................................................................................... 167
Figure 246. Connecting the Riser Card Power Cables............................................................................................................ 168
Figure 247. Connecting Add-in Card Power Cable .................................................................................................................. 168
Figure 248. Installing the OCuLink Cables .................................................................................................................................. 169
Figure 249. Installing the Inside Screws for OCuLink Cables .............................................................................................. 169
Figure 250. Installing the Bracket on the Chassis..................................................................................................................... 170
Figure 251. Installing Riser Assembly into the Chassis.......................................................................................................... 170
Figure 252. Accelerator Riser Assembly Rear Bracket Removal......................................................................................... 171
Figure 253. Accelerator Riser Card Removal .............................................................................................................................. 171
Figure 254. Accelerator Riser Card Installation......................................................................................................................... 172
Figure 255. Accelerator Riser Assembly Rear Bracket Installation ................................................................................... 172
Figure 256. Accelerator Module Power Connector Board Removal................................................................................. 173
Figure 257. Accelerator Module power connector board installation............................................................................. 174
Figure 258. Removing the Intel® VROC Upgrade Key ............................................................................................................. 175
Figure 259. Installing the Intel® VROC Upgrade Key............................................................................................................... 175
Figure 260. Removing the Trusted Platform Module (TPM) ................................................................................................ 176
Figure 261. Installing the Trusted Platform Module (TPM).................................................................................................. 176
Figure 262. Removing the Power Supply..................................................................................................................................... 177
Figure 263. Installing the Power Supply....................................................................................................................................... 177
Figure 264. Server Board Removal ................................................................................................................................................. 178
Figure 265. Server Board Installation............................................................................................................................................ 179
Figure 266. System Fan Configuration –Liquid-Cooled System ....................................................................................... 180
Figure 267. System Fan Configuration –Air-Cooled System .............................................................................................. 180
Figure 268. Removing the System Fan ......................................................................................................................................... 181
Figure 269. Installing the System Fan ........................................................................................................................................... 181
Figure 270. Removing the Quick Connect Fillers...................................................................................................................... 182
Figure 271. Removing the Quick Connect Screws ................................................................................................................... 183
Figure 272. Removing Quick Connect Covers............................................................................................................................ 183
Figure 273. Removing the Back Cover .......................................................................................................................................... 183
Figure 274. Removing the Chassis Plumbing Assembly........................................................................................................ 184
Figure 275. Installing the Chassis Plumbing Assembly ......................................................................................................... 185
Figure 276. Installing Quick Connect Covers ............................................................................................................................. 186
Figure 277. Securing the Quick Connect Couplings to the Covers ................................................................................... 186
Figure 278. Installing the Quick Connect Fillers ....................................................................................................................... 187
Figure 279. Securing the Back Cover............................................................................................................................................. 187
Figure 280. Removing the Back Cover .......................................................................................................................................... 188
Figure 281. Disconnecting the System Fan Power Cables.................................................................................................... 189
Figure 282. Removing the Power Distribution Board ............................................................................................................. 190
Figure 283. Installing the Power Distribution Board............................................................................................................... 191
Figure 284. Connecting System Fan Power Cables ................................................................................................................. 192
Figure 285. Securing the Back Cover............................................................................................................................................. 192
Figure 286. Removing the Internal Chassis Rail........................................................................................................................ 193

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Figure 287. Installing the Internal Chassis Rail.......................................................................................................................... 194
Figure 288. Removing the System Battery .................................................................................................................................. 194
Figure 289. Installing the System Battery.................................................................................................................................... 195
Figure 290. Front Control Panel Features ................................................................................................................................... 199
Figure 291. Reset and Recovery Jumper Block Location...................................................................................................... 202
Figure 292. Onboard POST Diagnostic LEDs ............................................................................................................................. 207
List of Tables
Table 1. Intel® Server D50TNP Family Reference Documents and Support Collaterals.............................................20
Table 2. Intel® D50TNP Module Family............................................................................................................................................22
Table 3. BIOS Setup: Keyboard Command Bar ............................................................................................................................ 91
Table 4. Intel® Optane™ Persistent Memory 200 Series Module Support...................................................................... 198
Table 5. Standard DDR4 DIMMs Compatible with Intel® Optane™ PMem Modules................................................... 198
Table 6. Power / Sleep LED Functional States........................................................................................................................... 199
Table 7. Intel® D50TNP Module Status LED State Definitions ............................................................................................ 200
Table 8. POST Progress Code LED Example............................................................................................................................... 207
Table 9. MRC Progress Codes........................................................................................................................................................... 208
Table 10. MRC Fatal Error Codes..................................................................................................................................................... 209
Table 11. POST Progress Codes...................................................................................................................................................... 210
Table 12. POST Error Messages and Handling.......................................................................................................................... 214
Table 13. Mixed Processor Configurations Error Summary................................................................................................. 220

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1. Introduction
The Intel® Server System D50TNP family consists of products that are designed to support
demanding high-performance computing (HPC) and artificial intelligence (AI) applications and
workloads. The product family includes a variety of different independent modules that can be
accommodated in a flexible 2U rack-mount chassis. The modules support the 3rd Gen Intel® Xeon®
Scalable processors that deliver a high core count alongside new hardware-enhanced security
features. Previous generation Intel® Xeon® processor and Intel® Xeon® Scalable processor families
are not supported.
For details on all system and module features, refer to the Intel® Server D50TNP family Technical Product
Specification listed in Table 1.
Note: In this document, the term Intel® D50TNP Module family refers to all module types supported by the
Intel® Server System D50TNP family: Compute Module, Management Module, Storage Module, and
Accelerator Module.
Note: In this service guide, the 3rd Gen Intel® Xeon® Scalable processor family may be referred to simply as
“processor”.
For the latest revision of this document, see Table 1.
About This Document
This setup and service guide provides system integrators and service technicians with instructions for the
installation and removal of system components. The document also provides available Intel accessories
supported by this server system.
The document is organized into two sections. The first section (Chapters 2 through 4) is focused on the
installation of system components and accessories into an L6 or L9 integrated server system
1
.
The second section (Chapters 6, 7, and appendices A-F) is focused on system service. This section provides
the service technician with valuable system information and procedures necessary to successfully identify
and replace a faulty system component.
System Integration
Chapter 2 –L6 System Integration –Essential System Components –Installation procedures for the
following system components: Processors, Memory, and Power Supply
Chapter 3 –L9 System Integration - Installation procedures for system options and accessories
Chapter 4 –System Software Update and Configuration –A short overview describing the system
software stack installed on new Intel servers and where to get the latest revisions.
Chapter 5 –System Packaging Assembly Instructions –Packing instructions for shipments of fully
integrated systems
1
An L6 integrated system requires essential components to be installed in order to make it power-on ready. An L9
integrated system is power-on ready but may require additional options and/or accessories to be installed to enable
specific system features.

Intel® Server D50TNP Family Integration and Service Guide
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System Service
Chapter 6 –System Service –System Features Overview. An overview that identifies and locates the
features associated with the Intel® Server System D50TNP family.
Chapter 7 –System Service –FRU Replacement. Installation and replacement procedures for system
field replaceable units (FRUs).
Appendix A –Getting Help. Provides server system support and contact information.
Appendix B –General Memory Population Rules. Summary of general memory population rules.
Appendix C –System Status LED State Definitions. System status LED operating states and definition.
Appendix D –Onboard Configuration and Service Jumpers. Descriptions of jumpers on the D50TNP
server board.
Appendix E –POST Code Diagnostic LED Decoder. List of post progress codes and error codes.
Appendix F –POST Code Errors. List of POST code errors that represent specific failures, warnings, or
information.
Appendix G –Product Safety –Multi-language
1.1 Reference Documents and Support Collaterals
For additional information, see the product support collaterals specified in the following table. The following
webpage provides support information for the Intel® Server D50TNP family:
https://www.intel.com/content/www/us/en/support/products/201583.html
Table 1. Intel® Server D50TNP Family Reference Documents and Support Collaterals
Topic
Document Title or Support Collateral
Document
Classification
For technical information about this
product family
Intel® Server D50TNP Family Technical Product Specification
Public
For system integration instructions and
service guidance
Intel® Server D50TNP Family Integration and Service Guide
Public
For server configuration guidance and
compatibility
Intel® Server D50TNP Family Configuration Guide
Public
For information on the Integrated BMC
Web Console
Intel® Integrated Baseboard Management Controller Web
Console (Integrated BMC Web Console) User Guide
For the Intel® Server Board D50TNP and M50CYP Families
Public
For BIOS technical information on
Intel® Server D50TNP Family
BIOS Firmware External Product Specification (EPS)
For the Intel® Server Board D50TNP and M50CYP Families
Intel Confidential
For BIOS setup information on Intel®
Server D50TNP Family
BIOS Setup Utility User Guide
For the Intel® Server Board D50TNP and M50CYP Families
Public
For BMC technical information on
Intel® Server D50TNP Family
Integrated Baseboard Management Controller Firmware
External Product Specification (EPS)
For the Intel® Server System D50TNP and M50CYP Families
Intel Confidential
Base specifications for the IPMI
architecture and interfaces
Intelligent Platform Management Interface Specification
Second Generation v2.0
Intel Confidential
Specifications for the PCIe* 3.0
architecture and interfaces
PCIe* Base Specification, Revision 3.0
http://www.pcisig.com/specifications
Public
Specifications for the PCIe* 4.0
architecture and interfaces
PCIe* Base Specification, Revision 4.0
http://www.pcisig.com/specifications
Public