Intel D50TNP User manual

Intel® Server D50TNP
Family
Intel® Server Board D50TNP Family
Intel® Module D50TNP Family
Intel® Server System D50TNP Family
Integration and Service Guide
A guide providing instructions for the insertion and
extraction of system components and available Intel
accessories and spares.
Rev. 1.0
May 2021
Delivering Breakthrough Data Center System Innovation –Experience What’s Inside!

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Document Revision History
Date
Revision
Changes
May 2021
1.0
Initial production release.

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Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software, or service
activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your
system manufacturer or retailer or learn more at intel.com.
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which
includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
The products described may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
This document contains information on products, services and/or processes in development. All information provided here is subject
to change without notice. Contact your Intel representative to obtain the latest Intel product specifications.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725
or by visiting www.intel.com/design/literature.htm.
Intel, the Intel logo, Xeon, Stratix, and Intel Optane are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other
countries.
*Other names and brands may be claimed as the property of others.
© Intel Corporation

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Warnings
Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other
products/components will void the UL listing and other regulatory approvals of the product. It will most
likely result in noncompliance with product regulations in the region(s) in which the product is sold.
System power on/off: The power buttons on the front panel of each module DO NOT turn off the server
chassis AC power. To remove power from the server chassis, you must unplug the AC power cord from the
wall outlet. Make sure the AC power cord is unplugged before you open the server chassis.
To service a module, it is not necessary to power down the entire system. Power off only the module
requiring servicing before attempting to remove it from the server chassis.
Hazardous conditions, devices and cables: Hazardous electrical conditions may be present on power,
telephone, and communication cables. Turn off the module and disconnect all telecommunications systems,
networks, and modems attached to it before removing it from the server chassis. Otherwise, personal injury
or equipment damage can result.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle
nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or
install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide
sides can damage the contacts inside the jumper, causing intermittent problems with the function controlled
by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper,
or you may bend or break the pins on the board.
Electrostatic Discharge (ESD)
Electrostatic discharge can damage your computer or the components within it. ESD can occur without the
user feeling a shock while working inside the system chassis or while improperly handling electronic devices
like processors, memory or other storage devices, and add-in cards.
Intel recommends the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
•Where available, all system integration and/or service should be performed at a properly equipped
ESD workstation.
•Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive
shoes.
•Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.
•Remove all jewelry.
•Disconnect all power cables and cords before opening the Server Chassis
•Power down the Module and remove it from the Server Chassis, remove power feed from the Server
Board before performing any integration or service
•Touch any unpainted metal surface of the chassis before performing any integration or service.

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•Hold all circuit boards and other electronic components by their edges only.
•After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive foam pad. Do not place
electronic devices on to the outside of any protective packaging.
Caution: Slide/rail mounted equipment is not to be used as a shelf or a work space.
Intel warranties that this product will perform to its published specifications. However, all computer systems
are inherently subject to unpredictable system behavior under various environmental and other conditions.
This product is not intended to be the sole source for any critical data and the user must maintain a
verified backup. Failure to do so or to comply with other user notices in the product user guide and
specification documents may result in loss of or access to data.
Weight of the system:
•Remove all installed modules from the system before attempting to install the system into the rack.
•Due to the weight of a system, Intel recommends carrying the system with two people supporting the
system from the sides or using a mechanical lift or a cart when moving the system from one location
to another.
•If your system has rack handles installed, do not lift or carry the system by the rack handles
•When lifting or moving a chassis, always grasp it by all four corners. Do not grasp the chassis by two
points at opposing diagonal corners, doing so may damage the internal components.
•If you can only grasp the chassis at two different points, always grasp the chassis by the sides at the
midpoint.
Liquid cooling safety guidelines:
•Make sure there are no leaks and/or damaged parts before operating the liquid cooling system.
•Do not energize the system or any installed modules if the liquid cooling subsystem is compromised.
•Do not attempt to perform any service to the server chassis before removing power to the system.
Turn off and disconnect power from the chassis before disconnecting the liquid cooling quick
disconnect tube connectors from the back of the chassis. Turn off the modules before disconnecting
the liquid cooling quick disconnect tube connectors.
•To reduce the risk of damage to the cooling system, use care when installing or removing the liquid-
cooled modules.
•Avoid excessive force when connecting and disconnecting quick disconnect couplings.
•Keep the liquid cooling tubing clear of pinch points when installing or removing the server modules
in/from the chassis.

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Important Safety Certification Standards and Transition Support
Information
The IEC 60950-1 2nd Edition safety standard (Information Technology Equipment) is going through a
replacement phase due to the new IEC 62368-1 3rd Edition safety standard (Audio/Video, Information, and
Communication Technology Equipment).
Intel® server systems identified in this service guide are certified to:
•The new IEC 62368-1 3rd Edition standard for countries that have adopted this new standard.
•The outgoing IEC 60950-1 2nd Edition standard for countries that have not yet adopted the new
standard.
During the global adoption/certification transition phase between the outgoing and new standards, safety
requirement differences between the standards may temporarily dictate restricted usage of Intel® server
system products as follows:
•In countries that have adopted the new IEC 62368-1 3rd Edition standard, no location restrictions
apply beyond the standard intended application use requirements.
•In countries that have not yet adopted the new IEC 62368-1 3rd Edition standard, restricted access
locations are required. Access in these locations is permitted only by technically trained and qualified
personnel who are aware of potential safety hazards.
Note: This requirement applies only to Intel® server system products released in 2019 or later. Legacy Intel®
server system products (released in 2018 or earlier) provide safeguards that require no additional access
restrictions.
Explanation of temporary restricted access location measures
The new IEC 62368-1 3rd Edition standard does not consider 240 VA an energy hazard. The outgoing IEC
60950-1 2nd Edition standard does consider 240 VA an energy hazard, therefore Intel® server system
products released in 2019 or later certified to this standard require restricted access locations. Legacy Intel®
server system products (released in 2018 or earlier) were designed with additional safeguards to meet IEC
60950-1 2nd Edition standard 240 VA requirements, so no location restrictions apply beyond the standard
intended application use requirements. After the IEC 60950-1 standard is phased out globally and Intel
server system products are certified to the new IEC 62368-1 standard, the temporarily restricted access
locations will no longer be required.

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Contents
1. Introduction............................................................................................................................................................... 19
1.1 Reference Documents and Support Collaterals................................................................................................20
2. L6 Integrated System –Essential System Component Installation .............................................................. 22
2.1 Air Duct Removal / Installation.................................................................................................................................24
2.1.1 Air Duct Removal............................................................................................................................................................24
2.1.2 Air Duct Installation.......................................................................................................................................................24
2.2 Opening and Closing Storage Module (iPC –D50TNP2MHSTAC).............................................................25
2.2.1 Opening the Top Tray ..................................................................................................................................................25
2.2.2 Closing the Top Tray.....................................................................................................................................................26
2.3 Processor Assembly and Installation.....................................................................................................................26
2.3.1 Assembly and Installation for Standard Air-Cooled Heat Sinks ................................................................28
2.3.2 Assembly and Installation for EVAC Heat Sinks................................................................................................34
2.3.3 Assembly and Installation for Liquid-Cooled Configurations.....................................................................42
2.4 Liquid-Cooling Loop Installation (for Compute Module iPC –D50TNP1MHCRLC) ...........................44
2.5 Memory (DIMM) Installation ......................................................................................................................................52
2.5.1 DIMM Installation for Air-Cooled Modules..........................................................................................................52
2.5.2 DDR4 DIMM Installation for liquid-Cooled Modules.......................................................................................54
2.6 Module Installation........................................................................................................................................................56
2.6.1 Storage Module Installation (iPC –D50TNP2MHSTAC Only)......................................................................57
3. System Options / Accessory Kit Installation...................................................................................................... 58
3.1 Installing the Chassis Into a Rack ............................................................................................................................59
3.1.1 Installing the Fixed Rail Kit.........................................................................................................................................59
3.1.2 Installing the Chassis Into a Rack ............................................................................................................................60
3.2 Module Removal / Installation..................................................................................................................................61
3.2.1 Module Removal.............................................................................................................................................................61
3.2.2 Module Installation........................................................................................................................................................62
3.3 Air Duct Removal / Installation.................................................................................................................................64
3.3.1 Air Duct Removal............................................................................................................................................................64
3.3.2 Air Duct Installation.......................................................................................................................................................64
3.4 Opening and Closing Storage Module (iPC –D50TNP2MHSTAC).............................................................65
3.4.1 Opening the Top Tray ..................................................................................................................................................65
3.4.2 Closing the Top Tray.....................................................................................................................................................66
3.5 Add-in Card Option Installation...............................................................................................................................66
3.5.1 Riser Assembly Removal.............................................................................................................................................68
3.5.2 PCIe* Add-In Card Installation..................................................................................................................................68
3.5.3 Riser Assembly Installation........................................................................................................................................69
3.6 Liquid-Cooled Mellanox Add-In Card Installation
(for Compute Module iPC –D50TNP1MHCRLC)................................................................................................70
3.7 Accelerator Module Add-in Card Installation (iPC –D50TNP2MFALAC Only).....................................71
3.8 Drive Carrier Extraction, Assembly, and Installation .......................................................................................81

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3.8.1 Drive Carrier Extraction................................................................................................................................................81
3.8.2 Drive Carrier Assembly ................................................................................................................................................82
3.8.3 Drive Carrier Installation .............................................................................................................................................83
3.9 M.2 Storage Devices Installation..............................................................................................................................84
3.9.1 M.2 SSD Installation for Air-Cooled Configurations........................................................................................84
3.9.2 Air-Cooled M.2 Heat Sink Installation ...................................................................................................................85
3.9.3 M.2 SSD Installation for Liquid-Cooled configurations .................................................................................85
3.9.4 M.2 Cold Plate Installation –Liquid-Cooled Configurations Only.............................................................86
3.10 EDSFF NVMe* Extraction and Installation (iPC –D50TNP2MHSTAC Only)...........................................87
3.10.1 EDSFF Drive Extraction................................................................................................................................................87
3.10.2 EDSFF Drive Installation..............................................................................................................................................87
3.11 Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key Installation .........................................................88
3.12 Trusted Platform Module (TPM) Installation......................................................................................................88
3.13 Ethernet Management Port Module (EMP Module) (iPC –AXXFCEMP) ..................................................89
4. System Software Updates and Configuration.................................................................................................... 90
4.1 Using the BIOS Setup Utility......................................................................................................................................90
4.1.1 Entering BIOS Setup .....................................................................................................................................................90
4.1.2 No Access to the BIOS Setup Utility.......................................................................................................................90
4.1.3 Navigating the BIOS Setup Utility............................................................................................................................90
5. System Packaging Assembly Instructions .......................................................................................................... 92
6. System / Module –Features Overview ................................................................................................................ 96
6.1 System Feature Identification...................................................................................................................................96
6.2 Front Panel Features.....................................................................................................................................................98
6.3 Front Control Panel Features....................................................................................................................................99
6.4 System Component Identification....................................................................................................................... 100
6.5 Server Board Features............................................................................................................................................... 103
7. FRU Replacement ................................................................................................................................................... 105
7.1 Module Removal / Installation............................................................................................................................... 106
7.1.1 Module Removal.......................................................................................................................................................... 106
7.1.2 Module Installation..................................................................................................................................................... 106
7.2 Air Duct Removal / Installation.............................................................................................................................. 109
7.2.1 Air Duct Removal......................................................................................................................................................... 109
7.2.2 Air Duct Installation.................................................................................................................................................... 109
7.3 Opening and Closing Storage Module (iPC –D50TNP2MHSTAC).......................................................... 110
7.3.1 Opening the Top Tray ............................................................................................................................................... 110
7.3.2 Closing the Top Tray.................................................................................................................................................. 111
7.4 Processor Replacement............................................................................................................................................ 111
7.4.1 Processor Replacement for Standard Air-Cooled Heat Sinks.................................................................. 111
7.4.2 Processor Replacement for EVAC Heat Sinks................................................................................................. 119
7.4.3 Processor Replacement for Liquid-Cooled Configurations ...................................................................... 128
7.5 Memory (DIMM) Replacement ............................................................................................................................... 135
7.5.1 DIMM Replacement for Air-Cooled Modules................................................................................................... 135

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7.5.2 DDR4 DIMM Replacement for Liquid-Cooled Modules .............................................................................. 137
7.6 Memory Heat Spreader Thermal Pad Replacement (Liquid-Cooled Modules Only)...................... 140
7.7 M.2 Storage Devices Replacement ...................................................................................................................... 142
7.7.1 M.2 and Heat Sink Replacement for Air-Cooled Configurations............................................................. 142
7.7.2 M.2 SSD and Cold Plate Replacement for Liquid-Cooled Configurations .......................................... 144
7.8 Riser Assembly Replacement................................................................................................................................. 146
7.8.1 Riser Assembly Removal.......................................................................................................................................... 148
7.8.2 PCIe* Add in Card Replacement............................................................................................................................ 148
7.8.3 Riser Assembly Installation..................................................................................................................................... 149
7.9 Liquid-Cooling Loop Replacement (for Compute Module iPC –D50TNP1MHCRLC) .................... 150
7.10 Mellanox Add-In Card Replacement (for Compute Module iPC –D50TNP1MHCRLC).................. 159
7.11 Accelerator Module Add-in Card Replacement (iPC –D50TNP2MFALAC Only).............................. 161
7.12 Accelerator Module Riser Card Replacement (iPC –D50TNP2MFALAC Only).................................. 171
7.13 Accelerator Module Power Connector Board Replacement (iPC –D50TNP2MFALAC Only) ..... 173
7.14 Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key Replacement .................................................. 175
7.15 Trusted Power Module (TPM) Replacement.................................................................................................... 175
7.16 Power Supply Replacement.................................................................................................................................... 177
7.17 Server Board Replacement ..................................................................................................................................... 178
7.18 System Fan Replacement ........................................................................................................................................ 180
7.19 Chassis Plumbing Assembly Replacement (Liquid-Cooled Systems Only)........................................ 182
7.20 Power Distribution Board (PDB) Assembly Replacement .......................................................................... 188
7.21 Internal Chassis Rail Replacement....................................................................................................................... 193
7.22 System Battery Replacement................................................................................................................................. 194
Appendix A. Getting Help ........................................................................................................................................ 196
Appendix B. Memory Population Rules................................................................................................................ 197
B.1 DDR4 DIMM Population Rules ............................................................................................................................... 197
B.2 Intel® Optane™ Persistent Memory 200 Series Module Rules
(Intel® Server Board D50TNP1SB Only) ............................................................................................................ 197
Appendix C. System Status LED State Definitions............................................................................................. 199
Appendix D. Onboard Configuration and Service Jumpers............................................................................. 202
D.1 BIOS Default Jumper (BIOS DFLT –J17)........................................................................................................... 203
D.2 Password Clear Jumper (PASSWD_CLR –J12) .............................................................................................. 203
D.3 Intel® Management Engine (Intel® ME) Firmware Force Update Jumper
(ME_FRC_UPDT –J13).............................................................................................................................................. 204
D.4 BMC Force Update Jumper (BMC_FRC_UPDT –J2X4) ............................................................................... 205
D.5 BIOS SVN Downgrade (SVN_Bypass –J16) ..................................................................................................... 205
D.6 BMC SVN Downgrade (J33) .................................................................................................................................... 206
Appendix E. POST Code Diagnostic LED Decoder............................................................................................. 207
E.1 Early POST Memory Initialization MRC Diagnostic Codes......................................................................... 208
E.2 BIOS POST Progress Codes.................................................................................................................................... 210
Appendix F. POST Error Codes .............................................................................................................................. 213
F.1 Processor Initialization Error Summary............................................................................................................. 219