Intel S7200AP Quick setup guide

Intel® Server Board S7200AP/APR
Intel® Compute Module
HNS7200AP/APR
Product Family
System Integration and Service Guide
A document providing instruction on installation and removal of subassemblies.
Revision 1.1
April 2018
Datacenter Systems Group

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Revision History
Date
Revision
Number
Modifications
Oct 2017
0.8
Update with Adams Pass Refresh information
Jan 2018
1.0
Update Processor Information; image modifications; warnings updated.
April 2018 1.1
Updated Intel® Xeon™ Phi™ x205 Product Family CPUs to official marketing
name of
Intel® Xeon™ Phi™ 72x5 Product Family CPUs

Disclaimers
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this
document.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of
merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from
course of performance, course of dealing, or usage in trade.
This document contains information on products, services and/or processes in development. All information
provided here is subject to change without notice. Contact your Intel representative to obtain the latest.
The products and services described may contain defects or errors known as errata which may cause
deviations from published specifications. Current characterized errata are available on request.
Intel, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others
© 2018 Intel Corporation.

Safety Information
Important Safety Instructions
Read all caution and safety statements in this document before performing any of the instructions. See also
Intel Server Boards and Server Chassis Safety Information at
http://www.intel.com/support/motherboards/server/sb/cs-010770.htm.
Wichtige Sicherheitshinweise
Lesen Sie zunächst sämtliche Warnund Sicherheitshinweise in diesem Dokument, bevor Sie eine der
Anweisungen ausführen. Beachten Sie hierzu auch die Sicherheitshinweise zu Intel-Serverplatinen und
Servergehäusen auf der
http://www.intel.com/support/motherboards/server/sb/cs-010770.htm.
Consignes de sécurité
Lisez attention toutes les consignes de sécurité et les mises en garde indiquées dans ce document avant de
suivre toute instruction. Consultez Intel Server Boards and Server Chassis Safety Information sur le site
http://www.intel.com/support/motherboards/server/sb/cs-010770.htm.
Instrucciones de seguridad importantes
Lea todas las declaraciones de seguridad y precaución de este documento antes de realizar cualquiera de las
instrucciones. Vea Intel Server Boards and Server Chassis Safety Information en
http://www.intel.com/support/motherboards/server/sb/cs-010770.htm.
重要安全指导
在执行任何指令之前，请阅读本文档中的所有注意事项及安全声明。和/或
http://www.intel.com/support/motherboards/server/sb/cs-010770.htm 上的 Intel®Server Boards and Server Chassis
Safety Information（《Intel 服务器主板与服务器机箱安全信息》）。

Warnings
Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the assembly
instructions in this guide to ensure and maintain compliance with existing product certifications and approvals.
Use only the described, regulated components specified in this guide. Use of other products/components will
void the UL listing and other regulatory approvals of the product and will most likely result in noncompliance
with product regulations in the region(s) in which the product is sold.
System power on/off: Risk of electric shock or fire exist. Do not service the systems if energized by any source
of power. The power button DOES NOT turn off the system AC power. To remove power from the system, you
must unplug the AC power cords fully from the systems and from the wall outlet. Make sure the AC power cord
is unplugged before you open the chassis, add, or remove any components. Hazardous conditions, devices and
cables: Hazardous electrical conditions may be present on power, telephone, and communication cables. Turn
off the server and disconnect the power cord, telecommunications systems, networks, and modems attached
to the server before opening it. Otherwise, personal injury or equipment damage can result.
Liquid Cooling Solutions: Follow the power off guidance. Prior to powering up any compute modules, check
the liquid cooling system for leaks and/or damaged parts (e.g. tubing, fittings, and disconnects). Ensure that
all power is off prior to disconnecting any cooling quick disconnects. Do not to energize or power up any server
node if the liquid cooling system is compromised in any way. To reduce risk of damage to the cooling system,
use care when installing or removing server nodes. Avoid excessive force when connecting & disconnecting
quick disconnects. Keep cooling tubing clear of pinch points when sliding server nodes.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper pins.
Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle nosed
pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or install a
jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide sides can
damage the contacts inside the jumper, causing intermittent problems with the function controlled by that
jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper, or you may
bend or break the pins on the board.
Electrostatic Discharge (ESD)
Electrostatic discharge can cause damage to your computer or the components within it. ESD can occur
without the user feeling a shock while working inside the system chassis or while improperly handling
electronic devices like processors, memory or other storage devices, and add-in cards.
Intel recommends the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
•Where available, all system integration and/or service should be performed at a properly equipped ESD
workstation.
•Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive shoes.
•Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.

•Remove all jewelry.
•Disconnect all power cables and cords attached to the server before performing any integration or
service.
•Touch any unpainted metal surface of the chassis before performing any integration or service.
•Hold all circuit boards and other electronic components by their edges only.
•After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive foam pad. Do not place electronic
devices on to the outside of any protective packaging.

Preface
About this document
This document is written for system integrators and service technicians who are responsible for system
assembly, server upgrades, server repair, and component replacement.
This document is divided into two major sections. The first half of the document provides detailed
instructions on how to install critical components to the system like memory, processor and others. It will
guide you through the installation of system components and available accessories. The second half of the
document is focused on system service. It provides many reference diagrams used to identify all key
physical features of the system. It also provides detailed instructions for the replacement of field
replaceable components.
For the latest revision of this document, go to http://www.intel.com/support
Document Organization
Chapter 1 Product Features - provides a high level overview of the Intel® Compute Module HNS7200AP.
In this chapter, you will find a list of the compute module features and illustrations identifying the major
compute module components.
Chapter 2 Hardware Installations and Upgrades - provides instructions on adding and replacing the
components. Use this chapter for step-by-step instructions and diagrams for installing or replacing the
components such as the processors, memory, and add-in cards, among other components.
Chapter 3 System Software Updates and Configuration - provides instructions on using the utilities that
are shipped with the board or that may be required to update the compute module. This includes
information for navigating through the BIOS Setup screens, performing a BIOS update, and resetting the
password or BIOS defaults.
Chapter 4 Server Utilities - provides instructions for server utilities.
Nomenclature
Throughout this manual “compute module” is the abbreviation of the Intel® Compute Module
HNS7200AP or HNS7200APR. It is also referred to as “compute node” or “node”.

Additional Information and Software
For additional information about this family of products or any of their supported accessories, refer to the
following resources available at http://www.intel.com/support.
Table 1. Server System References
For this information or software
Use this Document or Software
For in-depth technical information
about this product
Intel ® Server Board S7200AP Product Family and Intel® Compute Module HNS7200AP
Product Family Technical Product Specification
For product list and supported Intel
spares and accessories
Spares and Accessories List and Configuration Guide
For server configuration guidance
and compatibility
Intel ® Server Configurator tool
http://serverconfigurator.intel.com
For system power budget guidance
Power Budget Tool
http://www.intel.com/support
Product Safety and Regulatory
document
Intel Server Products – Product Safety and Regulatory Compliance Document
The server system has support for several software utilities which can be used to configure system
parameters and aid in troubleshooting system issues. All available utilities can be downloaded from the
following Intel web site: http://downloadcenter.intel.com/

Table of Contents
1Product Features....................................................................................................................................................1
1.1 Product Feature Overview ...............................................................................................................................................2
1.1.1 Server Board Feature Set .......................................................................................................................................2
1.1.2 HNS7200AP Compute Module Feature Set....................................................................................................3
1.1.3 Chassis Feature Set for Intel® Compute Module HNS7200AP................................................................4
1.1.4 HNS7200APR Compute Module Feature Set.................................................................................................6
1.1.5 Chassis Feature Set for Intel® Compute Module HNS7200APR.............................................................7
1.2 Back Panel Feature Identification.................................................................................................................................7
1.3 Power Docking Board Features .....................................................................................................................................8
1.4 Bridge Board Feature Features......................................................................................................................................8
1.5 Server Board Features.......................................................................................................................................................9
1.6 Intel® Light-Guided Diagnostics ................................................................................................................................. 10
1.7 Configuration and Recovery Jumpers ..................................................................................................................... 11
1.8 Advanced Management Options............................................................................................................................... 12
1.8.1 Intel® Remote Management Module 4 Lite ..................................................................................................12
2Hardware Installations and Upgrades ........................................................................................................... 13
2.1 Before You Begin .............................................................................................................................................................. 13
2.1.1 Tools and Supplies Needed................................................................................................................................ 13
2.1.2 System Reference................................................................................................................................................... 13
2.2 Cable Routing .................................................................................................................................................................... 13
2.3 Removing and Installing the Air Duct ...................................................................................................................... 14
2.3.1 Removing the Air Duct.......................................................................................................................................... 14
2.3.2 Installing the Air Duct ........................................................................................................................................... 15
2.4 Processor Assembly Installation and Removal.................................................................................................... 16
2.4.1 Assembling the Processor Heat Sink Module (PHM) ...............................................................................16
2.4.2 Processor Installation ........................................................................................................................................... 22
2.5 Processor Removal .......................................................................................................................................................... 26
2.5.1 PHM Disassembly................................................................................................................................................... 27
2.6 Installation and Removal of the 1U LACC.............................................................................................................. 29
2.6.1 Removal of the 1U LACC Assembly ................................................................................................................ 29
2.6.2 Remove the CPU and Carrier Assembly........................................................................................................ 33
2.6.3 Install the 1U LACC Assembly........................................................................................................................... 33
2.7 Removing and Installing Riser 1 and Riser 2 ........................................................................................................ 38
2.7.1 Remove Riser 1........................................................................................................................................................ 38
2.7.2 Install Riser 1 ............................................................................................................................................................ 38
2.7.3 Remove Riser 2........................................................................................................................................................ 39
2.7.4 Install Riser 2 ............................................................................................................................................................ 39
2.8 Installing and Removing an Add-In Card - Riser Slot 1.................................................................................... 40
2.8.1 Installing a PCIe* Add-In Card Riser 1............................................................................................................ 40
2.8.2 Removing a PCIe* Add-In Card Riser 1 .......................................................................................................... 41
2.9 Installing and Removing an Add-In Card - Riser Slot 2.................................................................................... 43
2.9.1 Installing a PCIe* Add-In Card Riser 2............................................................................................................ 43
2.9.2 Removing a PCIe* Add-In Card from Riser 2 ............................................................................................... 45