GSM/GPRS/NB-IoT Module Series
BC68&M66 Compatible Design
BC68&M66_Compatible_Design 3 / 31
Contents
About the Document...................................................................................................................................2
Contents.......................................................................................................................................................3
Table Index...................................................................................................................................................4
Figure Index.................................................................................................................................................5
1Introduction..........................................................................................................................................6
2General Descriptions...........................................................................................................................7
2.1. Product Description...................................................................................................................7
2.2. Features Overview....................................................................................................................8
2.3. Pin Assignment........................................................................................................................10
3Pin Description...................................................................................................................................11
4Hardware Reference Design.............................................................................................................14
4.1. Power Supply..........................................................................................................................14
4.1.1. Reference Design for Power Supply..............................................................................14
4.1.2. Reduce Voltage Drop.....................................................................................................14
4.2. Power-on Circuit......................................................................................................................15
4.3. Power-off Circuit......................................................................................................................16
4.3.1. Power down Module viaAT Command..........................................................................16
4.3.2. Power down M66 Using PWRKEY Pin..........................................................................17
4.4. Reset BC68.............................................................................................................................18
4.5. Network Status Indication........................................................................................................19
4.6. (U)SIM Interface......................................................................................................................19
4.7. UART Interfaces......................................................................................................................20
4.8. ADC Interface..........................................................................................................................21
4.9. RFAntenna Interface..............................................................................................................22
5Recommended Footprint and Stencil Design.................................................................................23
5.1. Recommended Compatible Footprint.....................................................................................23
5.2. Recommended Stencil Design................................................................................................25
5.3. Installation Sketch Map...........................................................................................................27
6Manufacturing and Packaging..........................................................................................................28
6.1. Soldering.................................................................................................................................28
6.2. Packaging................................................................................................................................29
6.2.1. BC68 and M66 Packaging.............................................................................................29
7Appendix A References.....................................................................................................................30