Lenovo ThinkSystem SR665 V3 User manual

ThinkSystem SR665 V3
User Guide
Machine Type: 7D9A, 7D9B

Note
Before using this inform tion nd the product it supports, be sure to re d nd underst nd the s fety
inform tion nd the s fety instructions, which re v il ble t:
https://pubs.lenovo.com/s fety_document tion/
In ddition, be sure th t you re f mili r with the terms nd conditions of the Lenovo w rr nty for your server,
which c n be found t:
http://d t centersupport.lenovo.com/w rr ntylookup
Sixth Edition (September 2023)
© Copyright Leno o 2022, 2023.
LIMITED AND RESTRICTED RIGHTS NOTICE: If d t or softw re is delivered pursu nt to Gener l Services
Administr tion (GSA) contr ct, use, reproduction, or disclosure is subject to restrictions set forth in Contr ct No. GS-35F-
05925.

Contents
Contents . . . . . . . . . . . . . . . . . i
Safety . . . . . . . . . . . . . . . . . .
S fety inspection checklist . . . . . . . . . . . vi
Chapter 1. Introduction . . . . . . . . . 1
Fe tures. . . . . . . . . . . . . . . . . . . 1
Tech Tips . . . . . . . . . . . . . . . . . . 2
Security dvisories . . . . . . . . . . . . . . 2
Specific tions . . . . . . . . . . . . . . . . 3
Technic l specific tions . . . . . . . . . . . 3
Mech nic l specific tions . . . . . . . . . . 7
Environment l specific tions . . . . . . . . . 8
M n gement options. . . . . . . . . . . . . 11
Chapter 2. Ser er components . . . . 15
Front view . . . . . . . . . . . . . . . . . 15
Front I/O module . . . . . . . . . . . . . . 21
Re r view . . . . . . . . . . . . . . . . . 24
Top view . . . . . . . . . . . . . . . . . 29
System-bo rd- ssembly l yout . . . . . . . . 30
System-bo rd- ssembly connectors. . . . . 30
System-bo rd- ssembly switch . . . . . . 32
System LEDs nd di gnostics displ y . . . . . . 34
Chapter 3. Parts list . . . . . . . . . . 35
2.5-inch drive b y ch ssis. . . . . . . . . . . 35
3.5-inch drive b y ch ssis. . . . . . . . . . . 39
Power cords . . . . . . . . . . . . . . . . 42
Chapter 4. Unboxing and setup . . . . 43
Server p ck ge contents . . . . . . . . . . . 43
Identify the server nd ccess the Lenovo XCl rity
Controller . . . . . . . . . . . . . . . . . 43
Server setup checklist . . . . . . . . . . . . 45
Chapter 5. Hardware replacement
procedures . . . . . . . . . . . . . . . 47
Inst ll tion Guidelines . . . . . . . . . . . . 47
S fety inspection checklist. . . . . . . . . 48
System reli bility guidelines . . . . . . . . 49
Working inside the server with the power on . . 50
H ndling st tic-sensitive devices . . . . . . 50
Technic l rules . . . . . . . . . . . . . . . 51
Memory module inst ll tion rules nd order . . 51
PCIe slots nd PCIe d pters . . . . . . . 54
Therm l rules . . . . . . . . . . . . . . 59
Power on nd power off the server . . . . . . . 61
Power on the server . . . . . . . . . . . 61
Power off the server . . . . . . . . . . . 62
Server repl cement . . . . . . . . . . . . . 62
Remove the server from r ck . . . . . . . . 63
Inst ll the server to r ck . . . . . . . . . . 66
Air b ffle repl cement . . . . . . . . . . . . 70
Remove the ir b ffle . . . . . . . . . . . 70
Inst ll the ir b ffle . . . . . . . . . . . . 72
C ble w ll br cket repl cement . . . . . . . . 75
Remove the c ble w ll br cket . . . . . . . 75
Inst ll the c ble w ll br cket . . . . . . . . 76
CMOS b ttery (CR2032) repl cement . . . . . . 77
Remove the CMOS b ttery . . . . . . . . 77
Inst ll the CMOS b ttery . . . . . . . . . 79
Front d pter c ge repl cement . . . . . . . . 81
Remove the front d pter c ge . . . . . . . 82
Inst ll the front d pter c ge . . . . . . . . 86
Front OCP module nd OCP interposer c rd
repl cement . . . . . . . . . . . . . . . . 91
Front OCP module repl cement. . . . . . . 91
OCP interposer c rd repl cement . . . . . . 94
Front PCIe d pter nd riser c rd repl cement . . 103
Remove the front PCIe d pter nd riser
c rd . . . . . . . . . . . . . . . . . 104
Inst ll the front PCIe d pter nd riser
c rd . . . . . . . . . . . . . . . . . 107
Front drive b ckpl ne repl cement . . . . . . . 110
Remove the front 2.5-inch drive b ckpl ne . . 110
Inst ll the front 2.5-inch drive b ckpl ne . . . 113
Remove the front 3.5-inch drive b ckpl ne . . 116
Inst ll the front 3.5-inch drive b ckpl ne . . . 118
Front I/O module repl cement . . . . . . . . . 120
Remove the front I/O module . . . . . . . . 121
Inst ll the front I/O module. . . . . . . . . 123
GPU repl cement . . . . . . . . . . . . . . 125
Remove GPU d pter . . . . . . . . . . 126
Inst ll GPU d pter . . . . . . . . . . . 129
Hot-sw p drive repl cement . . . . . . . . . . 132
Remove hot-sw p drive . . . . . . . . . 133
Inst ll hot-sw p drive . . . . . . . . . . 134
Intern l RAID/HBA/exp nder d pter
repl cement . . . . . . . . . . . . . . . . 135
Remove n intern l RAID/HBA/exp nder
d pter . . . . . . . . . . . . . . . . 135
Inst ll n intern l RAID/HBA/exp nder
d pter . . . . . . . . . . . . . . . . 138
© Copyright Lenovo 2022, 2023 i

Intrusion switch repl cement . . . . . . . . . 139
Remove the intrusion switch . . . . . . . . 139
Inst ll the intrusion switch . . . . . . . . . 141
M.2 drive nd M.2 b ckpl ne repl cement . . . . 143
Remove n M.2 drive . . . . . . . . . . . 143
Inst ll n M.2 drive . . . . . . . . . . . . 144
Remove the M.2 b ckpl ne . . . . . . . . 146
Inst ll the M.2 b ckpl ne . . . . . . . . . 149
Memory module repl cement . . . . . . . . . 152
Remove memory module . . . . . . . . 152
Inst ll memory module . . . . . . . . . 154
M n gement NIC d pter repl cement . . . . . 156
Remove the m n gement NIC d pter . . . . 156
Inst ll the m n gement NIC d pter . . . . . 158
MicroSD c rd repl cement . . . . . . . . . . 159
Remove the MicroSD c rd . . . . . . . . . 159
Inst ll the MicroSD c rd. . . . . . . . . . 160
Middle drive c ge nd drive b ckpl ne
repl cement . . . . . . . . . . . . . . . . 162
Remove the middle drive c ge nd drive
b ckpl nes. . . . . . . . . . . . . . . 162
Inst ll the middle drive b ckpl nes nd drive
c ge . . . . . . . . . . . . . . . . . 165
Power supply unit repl cement. . . . . . . . . 168
S fety prec utions . . . . . . . . . . . . 168
Remove power supply unit . . . . . . . . 170
Inst ll power supply unit . . . . . . . . . 172
Processor nd he t sink repl cement (tr ined
technici n only) . . . . . . . . . . . . . . . 175
Remove he t sink . . . . . . . . . . . 176
Remove processor . . . . . . . . . . . 179
Inst ll processor . . . . . . . . . . . . 180
Inst ll he t sink . . . . . . . . . . . . 182
R ck l tches repl cement . . . . . . . . . . . 184
Remove the r ck l tches . . . . . . . . . 184
Inst ll the r ck l tches . . . . . . . . . . 187
RAID fl sh power module repl cement. . . . . . 189
Remove RAID fl sh power module from the
ch ssis . . . . . . . . . . . . . . . . 190
Inst ll RAID fl sh power module on the
ch ssis . . . . . . . . . . . . . . . . 192
Remove RAID fl sh power module from the
ir b ffle . . . . . . . . . . . . . . . . 194
Inst ll RAID fl sh power module on the ir
b ffle . . . . . . . . . . . . . . . . . 195
Remove RAID fl sh power module from the
middle 2.5-inch drive c ge. . . . . . . . . 196
Inst ll RAID fl sh power module on the
middle 2.5-inch drive c ge. . . . . . . . . 198
Re rw ll br cket repl cement . . . . . . . . . 200
Remove re rw ll br cket. . . . . . . . . 201
Inst ll re rw ll br cket. . . . . . . . . . 203
Re r 7mm drive b ckpl ne nd drive c ge
repl cement . . . . . . . . . . . . . . . . 205
Remove the 7mm drive c ge . . . . . . . . 205
Remove the 7mm drive b ckpl nes . . . . . 207
Inst ll the 7mm drive b ckpl nes . . . . . . 209
Inst ll the 7mm drive c ge . . . . . . . . . 211
Re r drive b ckpl ne nd drive c ge
repl cement . . . . . . . . . . . . . . . . 213
Remove the 4 x 2.5" drive b ckpl ne nd
drive c ge . . . . . . . . . . . . . . . 213
Inst ll the 4 x 2.5" drive b ckpl ne nd drive
c ge . . . . . . . . . . . . . . . . . 215
Remove the 8 x 2.5" drive b ckpl ne nd
drive c ge . . . . . . . . . . . . . . . 217
Inst ll the 8 x 2.5" drive b ckpl ne nd drive
c ge . . . . . . . . . . . . . . . . . 218
Remove the 2 x 3.5" drive b ckpl ne nd
drive c ge . . . . . . . . . . . . . . . 220
Inst ll the 2 x 3.5" drive b ckpl ne nd drive
c ge . . . . . . . . . . . . . . . . . 221
Remove the 4 x 3.5" drive b ckpl ne nd
drive c ge . . . . . . . . . . . . . . . 223
Inst ll the 4 x 3.5" drive b ckpl ne nd drive
c ge . . . . . . . . . . . . . . . . . 225
Re r OCP module repl cement. . . . . . . . . 228
Remove the re r OCP module . . . . . . . 228
Inst ll the re r OCP module . . . . . . . . 229
Re r PCIe d pter nd riser ssembly
repl cement . . . . . . . . . . . . . . . . 231
Remove re r riser ssembly . . . . . . . 232
Remove re r PCIe d pter . . . . . . . . 236
Inst ll re r PCIe d pter . . . . . . . . . 239
Inst ll re r riser ssembly . . . . . . . . 242
Security bezel repl cement . . . . . . . . . . 245
Remove the security bezel . . . . . . . . . 245
Inst ll the security bezel. . . . . . . . . . 246
System bo rd ssembly repl cement (tr ined
technici n only) . . . . . . . . . . . . . . . 248
Remove the firmw re nd RoT security
module . . . . . . . . . . . . . . . . 249
Inst ll the firmw re nd RoT security
module . . . . . . . . . . . . . . . . 251
Remove the system I/O bo rd or processor
bo rd . . . . . . . . . . . . . . . . . 255
Inst ll the system I/O bo rd or processor
bo rd . . . . . . . . . . . . . . . . . 259
System f n repl cement . . . . . . . . . . . 264
Remove system f n. . . . . . . . . . . 264
Inst ll system f n. . . . . . . . . . . . 266
System f n c ge repl cement . . . . . . . . . 269
Remove the system f n c ge . . . . . . . . 269
Inst ll the system f n c ge. . . . . . . . . 270
Seri l port module repl cement . . . . . . . . 271
ii ThinkSystem SR665 V3 User Guide

Remove seri l port module . . . . . . . . 271
Inst ll seri l port module . . . . . . . . . 274
Top cover repl cement . . . . . . . . . . . . 276
Remove the top cover . . . . . . . . . . 277
Inst ll the top cover . . . . . . . . . . . 278
Complete the p rts repl cement . . . . . . . . 279
Chapter 6. Internal cable routing . . . 281
Identifying connectors . . . . . . . . . . . . 281
Drive b ckpl ne connectors . . . . . . . . 281
7mm drives . . . . . . . . . . . . . . . . 286
Front I/O connectors . . . . . . . . . . . . . 289
GPUs . . . . . . . . . . . . . . . . . . . 291
M.2 drive b ckpl nes . . . . . . . . . . . . 293
M n gement NIC d pter . . . . . . . . . . . 295
OCP interposer c rds . . . . . . . . . . . . 297
RAID fl sh power module . . . . . . . . . . . 298
Riser 3 c ge . . . . . . . . . . . . . . . . 300
Riser 3/4 c ge . . . . . . . . . . . . . . . 306
Riser 5 c ge . . . . . . . . . . . . . . . . 309
Processor interconnection c ble routing . . . . . 311
B ckpl nes: server models with 2.5-inch front
drive b ys . . . . . . . . . . . . . . . . . 312
One 8 x SAS/SATA b ckpl ne . . . . . . . 313
One 8 x AnyB y b ckpl ne . . . . . . . . 316
One 8 x NVMe b ckpl ne . . . . . . . . . 327
Two 8 x SAS/SATA b ckpl nes . . . . . . . 330
Two 8 x AnyB y b ckpl nes . . . . . . . . 339
Two 8 x NVMe b ckpl nes. . . . . . . . . 341
One 8 x SAS/SATA nd one 8 x AnyB y
b ckpl nes. . . . . . . . . . . . . . . 343
One 8 x SAS/SATA nd one 8 x NVMe
b ckpl nes. . . . . . . . . . . . . . . 355
One 8 x AnyB y nd one 8 x NVMe
b ckpl nes. . . . . . . . . . . . . . . 359
Three 8 x SAS/SATA b ckpl nes . . . . . . 362
Three 8 x AnyB y b ckpl nes . . . . . . . 401
Three 8 x NVMe b ckpl nes . . . . . . . . 403
One 8 x AnyB y nd two 8 x NVMe
b ckpl nes. . . . . . . . . . . . . . . 408
One 8 x SAS/SATA nd two 8 x NVMe
b ckpl nes. . . . . . . . . . . . . . . 413
Two 8 x SAS/SATA nd one 8 x AnyB y (Gen
4) b ckpl nes . . . . . . . . . . . . . . 415
Two 8 x SAS/SATA nd one 8 x AnyB y (Gen
5) b ckpl nes . . . . . . . . . . . . . . 418
Two 8 x SAS/SATA nd one 8 x NVMe (Gen 4)
b ckpl nes. . . . . . . . . . . . . . . 421
Two 8 x SAS/SATA nd one 8 x NVMe (Gen 5)
b ckpl nes. . . . . . . . . . . . . . . 426
24 x 2.5-inch SAS/SATA exp nder
b ckpl ne . . . . . . . . . . . . . . . 431
B ckpl nes: server models with 3.5-inch front
drive b ys . . . . . . . . . . . . . . . . . 437
8 x 3.5-inch SAS/SATA b ckpl ne. . . . . . 438
12 x 3.5-inch SAS/SATA b ckpl ne . . . . . 440
12 x 3.5-inch AnyB y b ckpl ne . . . . . . 453
12 x 3.5-inch SAS/SATA exp nder
b ckpl ne . . . . . . . . . . . . . . . 459
Chapter 7. System configuration . . . 465
Set the network connection for the Lenovo XCl rity
Controller . . . . . . . . . . . . . . . . . 465
Set front USB port for Lenovo XCl rity Controller
connection. . . . . . . . . . . . . . . . . 466
Upd te the firmw re . . . . . . . . . . . . . 467
Configure the firmw re . . . . . . . . . . . . 470
Memory module configur tion . . . . . . . . . 471
RAID configur tion . . . . . . . . . . . . . 472
Deploy the oper ting system. . . . . . . . . . 472
B ck up the server configur tion . . . . . . . . 473
Chapter 8. Problem
determination . . . . . . . . . . . . . 475
Event logs . . . . . . . . . . . . . . . . . 475
Troubleshooting by system LEDs nd di gnostics
displ y . . . . . . . . . . . . . . . . . . 476
Drive LEDs . . . . . . . . . . . . . . . 477
Front oper tor p nel LEDs . . . . . . . . . 477
Integr ted di gnostics p nel . . . . . . . . 479
Extern l di gnostics h ndset . . . . . . . . 484
Re r system LEDs . . . . . . . . . . . . 490
XCC system m n gement port LEDs. . . . . 491
Power supply LEDs . . . . . . . . . . . 491
System-bo rd- ssembly LEDs . . . . . . . 493
LEDs on the firmw re nd RoT security
module . . . . . . . . . . . . . . . . 495
Gener l problem determin tion procedures . . . . 496
Resolving suspected power problems . . . . 497
Resolving suspected Ethernet controller
problems . . . . . . . . . . . . . . . 497
Troubleshooting by symptom . . . . . . . . . 499
Intermittent problems. . . . . . . . . . . 499
Keybo rd, mouse, KVM switch or USB-device
problems . . . . . . . . . . . . . . . 500
Memory problems . . . . . . . . . . . . 501
Monitor nd video problems . . . . . . . . 502
Observ ble problems. . . . . . . . . . . 504
Option l-device problems . . . . . . . . . 507
Perform nce problems . . . . . . . . . . 508
Power on nd power off problems. . . . . . 509
Power problems . . . . . . . . . . . . . 510
Seri l-device problems . . . . . . . . . . 511
Softw re problems. . . . . . . . . . . . 511
© Copyright Lenovo 2022, 2023 iii

Stor ge drive problems . . . . . . . . . . 512
Appendix A. Hardware
disassembling for recycle . . . . . . . 515
Dis ssemble the system bo rd ssembly for
recycle . . . . . . . . . . . . . . . . . . 515
Appendix B. Getting help and
technical assistance . . . . . . . . . . 519
Before you c ll . . . . . . . . . . . . . . . 519
Collecting service d t . . . . . . . . . . . . 520
Cont cting Support . . . . . . . . . . . . . 521
Appendix C. Documents and
supports . . . . . . . . . . . . . . . . 523
Documents downlo d . . . . . . . . . . . . 523
Support websites . . . . . . . . . . . . . . 523
Appendix D. Notices. . . . . . . . . . 525
Tr dem rks . . . . . . . . . . . . . . . . 526
Import nt notes . . . . . . . . . . . . . . . 526
Electronic emission notices . . . . . . . . . . 526
T iw n Region BSMI RoHS decl r tion . . . . . 527
T iw n Region import nd export cont ct
inform tion . . . . . . . . . . . . . . . . 527
i ThinkSystem SR665 V3 User Guide

Safety
Before inst lling this product, re d the S fety Inform tion.
Antes de inst l r este produto, lei s Inform ções de Segur nç .
在安装本产品之前，请仔细阅读 S fety Inform tion （安全信息）。
Læs sikkerhedsforskrifterne, før du inst llerer dette produkt.
Lees voord t u dit product inst lleert eerst de veiligheidsvoorschriften.
Ennen kuin senn t tämän tuotteen, lue turv ohjeet kohd st S fety Inform tion.
Av nt d'inst ller ce produit, lisez les consignes de sécurité.
Vor der Inst ll tion dieses Produkts die Sicherheitshinweise lesen.
Prim di inst ll re questo prodotto, leggere le Inform zioni sull Sicurezz .
Les sikkerhetsinform sjonen (S fety Inform tion) før du inst llerer dette produktet.
Antes de inst l r este produto, lei s Inform ções sobre Segur nç .
© Copyright Lenovo 2022, 2023

Antes de inst l r este producto, le l inform ción de segurid d.
Läs säkerhetsinform tionen inn n du inst ller r den här produkten.
Safety inspection checklist
Use the inform tion in this section to identify potenti lly uns fe conditions with your server. As e ch m chine
w s designed nd built, required s fety items were inst lled to protect users nd service technici ns from
injury.
Note: The product is not suit ble for use t visu l displ y workpl ces ccording to §2 of the Workpl ce
Regul tions.
Note: The set-up of the server is m de in the server room only.
CAUTION:
This equipment must be installed or ser iced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. Leno o assumes you are qualified in the
ser icing of equipment and trained in recognizing hazards energy le els in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location.
Important: Electric l grounding of the server is required for oper tor s fety nd correct system function.
Proper grounding of the electric l outlet c n be verified by certified electrici n.
Use the following checklist to verify th t there re no potenti lly uns fe conditions:
1. If you need to power off the server, m ke sure th t the power cord is disconnected.
S002
CAUTION:
i ThinkSystem SR665 V3 User Guide

The power-control button on the de ice and the power switch on the power supply do not turn off
the electrical current supplied to the de ice. The de ice also might ha e more than one power
cord. To remo e all electrical current from the de ice, ensure that all power cords are
disconnected from the power source.
Note: Under cert in circumst nces, powering off the server is not prerequisite. Refer to the
prec utions before conducting ny t sks.
2. Check the power cord.
• M ke sure th t the third-wire ground connector is in good condition. Use meter to me sure third-
wire ground continuity for 0.1 ohm or less between the extern l ground pin nd the fr me ground.
• M ke sure th t the power cord is the correct type.
To view the power cords th t re v il ble for the server:
. Go to:
http://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the m chine type nd model for your server to displ y the configur tor p ge.
d. Click Power ➙ Power Cables to see ll line cords.
• M ke sure th t the insul tion is not fr yed or worn.
3. Check for ny obvious non-Lenovo lter tions. Use good judgment s to the s fety of ny non-Lenovo
lter tions.
4. Check inside the server for ny obvious uns fe conditions, such s met l filings, cont min tion, w ter or
other liquid, or signs of fire or smoke d m ge.
5. Check for worn, fr yed, or pinched c bles.
6. M ke sure th t the power-supply cover f steners (screws or rivets) h ve not been removed or t mpered
with.
© Copyright Lenovo 2022, 2023 ii

iii ThinkSystem SR665 V3 User Guide

Chapter 1. Introduction
The ThinkSystem SR665 V3 server (7D9A nd 7D9B) is 2-socket 2U server th t fe tures the 4th gener tion
EPYCTM processor f mily of AMD®. The server offers bro d selection of drive nd slot configur tions, high
perform nce, nd exp nsion for v rious IT worklo ds. Combining perform nce nd flexibility, the server is
gre t choice for enterprises of ll sizes.
Figure 1. ThinkSystem SR665 V3
Features
Perform nce, e se of use, reli bility, nd exp nsion c p bilities re key consider tions in the design of your
server. These design fe tures m ke it possible for you to customize the system h rdw re to meet your needs
tod y nd provide flexible exp nsion c p bilities for the future.
Your server implements the following fe tures nd technologies:
• Features on Demand
If Fe tures on Dem nd fe ture is integr ted in the server or in n option l device th t is inst lled in the
server, you c n purch se n ctiv tion key to ctiv te the fe ture. For inform tion bout Fe tures on
Dem nd, see:
https://fod.lenovo.com/lkms
• Leno o XClarity Controller (XCC)
The Lenovo XCl rity Controller is the common m n gement controller for Lenovo ThinkSystem server
h rdw re. The Lenovo XCl rity Controller consolid tes multiple m n gement functions in single chip on
the server system bo rd ssembly. Some of the fe tures th t re unique to the Lenovo XCl rity Controller
re enh nced perform nce, higher-resolution remote video, nd exp nded security options.
The server supports Lenovo XCl rity Controller 2 (XCC2). For ddition l inform tion bout Lenovo XCl rity
Controller 2 (XCC2), refer to https://pubs.lenovo.com/lxcc-overview/.
• UEFI-compliant ser er firmware
Lenovo ThinkSystem firmw re is Unified Extensible Firmw re Interf ce (UEFI) compli nt. UEFI repl ces
BIOS nd defines st nd rd interf ce between the oper ting system, pl tform firmw re, nd extern l
devices.
Lenovo ThinkSystem servers re c p ble of booting UEFI-compli nt oper ting systems, BIOS-b sed
oper ting systems, nd BIOS-b sed d pters s well s UEFI-compli nt d pters.
Note: The server does not support Disk Oper ting System (DOS).
• Large system-memory capacity
The server supports up to 24 TruDDR5 du l inline memory modules (DIMMs) with error correcting code
(ECC). For more inform tion bout the specific types nd m ximum mount of memory, see “Technic l
specific tions” on p ge 3.
© Copyright Lenovo 2022, 2023 1

• Large data-storage capacity and hot-swap capability
With the hot-sw p fe ture, you c n dd, remove, or repl ce h rd disk drives without turning off the server.
Stor ge c p city is different depending on server model. See “Technic l specific tions” on p ge 3 for
more inform tion.
• Lightpath Diagnostics
Lightp th Di gnostics provides LEDs to help you di gnose problems. For more inform tion bout the
Lightp th Di gnostics, see “Troubleshooting by system LEDs nd di gnostics displ y” on p ge 476.
• Mobile access to Leno o Ser ice Information website
The server provides QR code on the system service l bel, which is on the cover of the server, th t you
c n sc n using QR code re der nd sc nner with mobile device to get quick ccess to the Lenovo
Service Inform tion website. The Lenovo Service Inform tion website provides ddition l inform tion for
p rts inst ll tion, repl cement videos, nd error codes for server support.
• Acti e Energy Manager
Lenovo XCl rity Energy M n ger is power nd temper ture m n gement solution for d t centers. You
c n monitor nd m n ge the power consumption nd temper ture of Converged, NeXtSc le, System x,
nd ThinkServer servers, nd improve energy efficiency using Lenovo XCl rity Energy M n ger.
• Redundant networking connection
The Lenovo XCl rity Controller provides f ilover c p bility to redund nt Ethernet connection with the
pplic ble pplic tion inst lled. If problem occurs with the prim ry Ethernet connection, ll Ethernet
tr ffic th t is ssoci ted with the prim ry connection is utom tic lly switched to the option l redund nt
Ethernet connection. If the pplic ble device drivers re inst lled, this switching occurs without d t loss
nd without user intervention.
• Redundant cooling
The redund nt cooling by the f ns in the server en bles continued oper tion if one rotor of f n f ils.
• ThinkSystem RAID support
The ThinkSystem RAID d pter provides h rdw re redund nt rr y of independent disks (RAID) support
to cre te configur tions, supporting RAID levels 0, 1, 5, 6, 10, 50, nd 60.
Tech Tips
Lenovo continu lly upd tes the support website with the l test tips nd techniques th t you c n use to solve
issues th t your server might encounter. These Tech Tips ( lso c lled ret in tips or service bulletins) provide
procedures to work round issues or solve problems rel ted to the oper tion of your server.
To find the Tech Tips v il ble for your server:
1. Go to http://d t centersupport.lenovo.com nd n vig te to the support p ge for your server.
2. Click on How To’s from the n vig tion p ne.
3. Click Article Type ➙ Solution from the drop-down menu.
Follow the on-screen instructions to choose the c tegory for the problem th t you re h ving.
Security ad isories
Lenovo is committed to developing products nd services th t dhere to the highest security st nd rds in
order to protect our customers nd their d t . When potenti l vulner bilities re reported, it is the
responsibility of the Lenovo Product Security Incident Response Te m (PSIRT) to investig te nd provide
2ThinkSystem SR665 V3 User Guide

inform tion to our customers so they m y put mitig tion pl ns in pl ce s we work tow rd providing
solutions.
The list of current dvisories is v il ble t the following site:
https://d t centersupport.lenovo.com/product_security/home
Specifications
Summ ry of the fe tures nd specific tions of the server. Depending on the model, some fe tures might not
be v il ble, or some specific tions might not pply. The l test specific tions inform tion is lw ys v il ble
t https://lenovopress.lenovo.com/.
Refer to the below t ble for specific tions c tegories nd the content of e ch c tegory.
Specification
category
Technic l specific tions Mech nic l specific tions Environment l specific tions
Content • Processor
• Memory
• Intern l drives
• Exp nsion slots
• Stor ge controller
• Gr phics processing units
(GPU)
• Integr ted functions nd I/O
connectors
• Network
• System f n
• Power supplies
• Minim l configur tion for
debugging
• Oper ting systems
• Dimension
• Weight
• Acoustic l noise emissions
• Environment
• P rticul te cont min tion
Technical specifications
Summ ry of the technic l specific tions of server. Depending on the model, some fe tures might not be
v il ble, or some specific tions might not pply. The l test specific tions inform tion is lw ys v il ble t
https://lenovopress.lenovo.com/.
Processor
Supports fourth-gener tion AMD® EPYCTM processors, with 5nm process technology.
• Up to two processors with the new LGA 6096 (SP5) socket
• Up to 96 Zen4 cores (192 thre ds) per socket
• Up to 4 xGMI3 links t up to 32 GT/s
• Therm l Design Power (TDP): up to 400 w tts
For list of supported processors, see https://serverproven.lenovo.com/.
Ch pter 1.Introduction 3

Memory
See “Memory module inst ll tion rules nd order” on p ge 51 for det iled inform tion bout memory configur tion nd
setup.
• Slots: 24 du l inline memory module (DIMM) slots (12 ch nnels per processor, 1 DIMM per ch nnel)
• Memory module types:
– TruDDR5 RDIMM: 16 GB (1Rx8), 32 GB (2Rx8), 96 GB (2Rx4)
– TruDDR5 10x4 RDIMM: 32 GB (1Rx4), 64 GB (2Rx4)
– TruDDR5 9x4 RDIMM: 32 GB (1Rx4), 64 GB (2Rx4)
– TruDDR5 3DS RDIMM: 128 GB (4Rx4), 256 GB (8Rx4)
• C p city:
– Minimum: 16 GB (1 x 16 GB RDIMM)
– M ximum: 6 TB (24 x 256 GB 3DS RDIMM)
• Speed: 4800 MT/s
For list of supported memory modules, see https://serverproven.lenovo.com/.
Internal dri es
• Front drive b ys:
– Up to 24 x 2.5-inch hot-sw p SAS/SATA/NVMe drives
– Up to 12 x 3.5-inch hot-sw p SAS/SATA drives
– Up to 4 x 3.5-inch hot-sw p NVMe drives
• Middle drive b ys:
– Up to 8 x 2.5-inch hot-sw p SAS/SATA/NVMe drives
– Up to 4 x 3.5-inch hot-sw p SAS/SATA drives
• Re r drive b ys:
– Up to 8 x 2.5-inch hot-sw p SAS/SATA drives
– Up to 4 x 3.5-inch hot-sw p SAS/SATA drives
– Up to 4 x 2.5-inch hot-sw p NVMe drives
– Up to two 7mm drives
• Up to two intern l M.2 drives
Expansion slots
• Up to 12 PCIe slots
• One OCP module slot
PCIe slot v il bility is b sed on riser selection nd re r drive b y selection. See “Re r view” on p ge 24 nd “PCIe
slots nd PCIe d pters” on p ge 54.
4ThinkSystem SR665 V3 User Guide

Storage controller
• SAS/SATA HBA d pters
– ThinkSystem 4350-8i SAS/SATA 12Gb HBA
– ThinkSystem 4350-16i SAS/SATA 12Gb HBA
– ThinkSystem 440-8i SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb Intern l HBA*
– ThinkSystem 440-8e SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 440-16e SAS/SATA PCIe Gen4 12Gb HBA
• SAS/SATA RAID d pters
– ThinkSystem RAID 5350-8i PCIe 12Gb Ad pter
– ThinkSystem RAID 5350-8i PCIe 12Gb Intern l Ad pter*
– ThinkSystem RAID 9350-8i 2GB Fl sh PCIe 12Gb Ad pter
– ThinkSystem RAID 9350-8i 2GB Fl sh PCIe 12Gb Intern l Ad pter*
– ThinkSystem RAID 9350-16i 4GB Fl sh PCIe 12Gb Ad pter
– ThinkSystem RAID 9350-16i 4GB Fl sh PCIe 12Gb Intern l Ad pter*
– ThinkSystem RAID 540-8i PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 540-16i PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 940-8i 4GB Fl sh PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 940-16i 4GB Fl sh PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 940-16i 8GB Fl sh PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 940-16i 8GB Fl sh PCIe Gen4 12Gb Intern l Ad pter*
– ThinkSystem RAID 940-32i 8GB Fl sh PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 940-8e 4GB Fl sh PCIe Gen4 12Gb Ad pter
• Exp nder: ThinkSystem 48 port 12Gb Intern l Exp nder*
Notes:
• *Custom form f ctor (CFF) d pters th t re supported only for server models with 2.5-inch front drive b ys nd
two processors.
• For more inform tion bout the RAID/HBA d pters, see Lenovo ThinkSystem RAID Ad pter nd HBA Reference.
Graphics processing unit (GPU)
Your server supports the following GPUs:
• Double-wide:
– NVIDIA® A30, A40, A16, A100, H100, RTX A2000, RTX A4500, A6000
– AMD® Instinct MI210
• Single-wide: NVIDIA® A2
For GPU supporting rules, see “GPU configur tions” on p ge 60.
Integrated functions and I/O connectors
• Lenovo XCl rity Controller (XCC), which provides service processor control nd monitoring functions, video
controller, nd remote keybo rd, video, mouse, nd remote drive c p bilities.
– The server supports Lenovo XCl rity Controller 2 (XCC2). For ddition l inform tion bout Lenovo XCl rity
Controller 2 (XCC2), refer to https://pubs.lenovo.com/lxcc-overview/.
• Front connectors:
– One VGA connector (option l)
– One USB 3.2 Gen 1 (5 Gbps) connector
– One USB 2.0 connector with XCC system m n gement function
– One extern l di gnostics connector
– One integr ted di gnostics p nel (option l)
• Re r connectors:
– One VGA connector
– Three USB 3.2 Gen 1 (5 Gbps) connectors
– One XCC system m n gement port
– Two or four Ethernet connectors on the OCP module (option l)
– One seri l port (option l)
Ch pter 1.Introduction 5

Network
• OCP module in the re r or front of the server, which provides two or four Ethernet connectors for network support
Note: If ThinkSystem Redund nt System M n gement Port Ad pter is inst lled on the server, it will not be
displ yed on the PCIe c rd list of system m n gement softw re, such s XCC, LXPM, nd so on.
System fan
• Supported f n types:
– St nd rd f n 6038 (single-rotor, 17000 RPM)
– Perform nce f n 6056 (du l-rotor, 21000 RPM)
• F n redund ncy: N+1 redund ncy, one redund nt f n rotor
– One processor: five hot-sw p system f ns (one redund nt f n rotor)
– Two processors or one processor with middle/re r b y or Riser 3: six hot-sw p system f ns (one redund nt f n
rotor)
Notes:
• Single-rotor hot-sw p f ns c nnot be mixed with du l-rotor hot-sw p f ns.
• The redund nt cooling by the f ns in the server en bles continued oper tion if one rotor of f n f ils.
• When the system is powered off but still plugged in to AC power, f ns 1 nd 2 m y continue to spin t much lower
speed. This is the system design to provide proper cooling.
Power supplies
The server supports up to two hot-sw p power supplies for redund ncy.
Power supply 100–127 V ac 200–240 V ac 240 V dc -48 V dc
750W Pl tinum √ √ √
750W Tit nium √ √
1100W Pl tinum √ √ √
1100W Tit nium √ √
1800W Pl tinum √ √
1800W Tit nium √ √
2400W Pl tinum √ √
2600W Tit nium √ √
1100W -48V DC √
CAUTION:
• 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY.
• Power supply with 240 V dc input cannot support hot plugging power cord function. Before remo ing the
power supply with dc input, please turn off ser er or disconnect dc power sources at the breaker panel or by
turning off the power source. Then, remo e the power cord.
Minimal configuration for debugging
• One processor in socket 1
• One memory module in slot 7
• One power supply unit
• One HDD/SSD drive, one M.2 drive, or one 7mm drive (if OS is needed for debugging)
• Five system f ns
6ThinkSystem SR665 V3 User Guide

Operating systems
Supported nd certified oper ting systems:
• Microsoft Windows Server
• Microsoft Windows
• Red H t Enterprise Linux
• SUSE Linux Enterprise Server
• VMw re ESXi
• C nonic l Ubuntu
References:
• Complete list of v il ble oper ting systems: https://lenovopress.lenovo.com/osig.
• OS deployment instructions, see “Deploy the oper ting system” on p ge 472.
Mechanical specifications
Summ ry of the mech nic l specific tions of server. Depending on the model, some fe tures might not be
v il ble, or some specific tions might not pply. The l test specific tions inform tion is lw ys v il ble t
https://lenovopress.lenovo.com/.
Dimension
• Form f ctor: 2U
• Height: 86.5 mm (3.4 inches)
• Width:
– With r ck l tches: 482.0 mm (19.0 inches)
– Without r ck l tches: 444.6 mm (17.5 inches)
• Depth: 763.7 mm (30.1 inches)
Note: The depth is me sured with r ck l tches inst lled, but without the security bezel inst lled.
Weight
Up to 39 kg (86 lb), depending on the server configur tion
Ch pter 1.Introduction 7

En ironmental specifications
Summ ry of the environment l specific tions of server. Depending on the model, some fe tures might not be
v il ble, or some specific tions might not pply. The l test specific tions inform tion is lw ys v il ble t
https://lenovopress.lenovo.com/.
Acoustical noise emissions
The server h s the following coustic noise emissions decl r tion.
Minimal Typical Storage GPU
Sound power levels (LWAd)
Idling 5.9 Bel 6.5 Bel 7.3 Bel 7.3 Bel
Oper ting 6.5 Bel 8.1 Bel 7.5 Bel 8.7 Bel
Sound pressure level (LpAm)
Idling 41.5 dBA 51 dBA 60.2 dBA 60.2 dBA
Oper ting 48.3 dBA 66.6 dBA 61.3 dBA 71.9 dBA
The decl red sound levels re b sed on the following configur tions, which m y ch nge depending on configur tions
or conditions.
Config. Minimal Typical Storage GPU
Ch ssis
(2U)
Front 8 x 2.5'' Front 16 x 2.5'' Front 12 x 3.5'' + re r 4
x 2.5''
Front 16 x 2.5''
F n 6 x st nd rd f ns 6 x high perform nce
f ns
6 x high perform nce
f ns
6 x high perform nce
f ns
Processor 2 x 240 W 2 x 300 W 2 x 240 W 2 x 300 W
DIMM 12 x 64 GB 24 x 64 GB 12 x 64 GB 24 x 64 GB
Drive 8 x 2.4 TB SAS HDDs 16 x 2.4 TB SAS HDDs Front 12 x 14 TB + re r
4 x 2 TB SAS HDDs 16 x 2.4 TB SAS HDDs
RAID 1 x RAID 940-8i 1 x RAID 940-8i 1 x RAID 940-16i 1 x RAID 940-16i
OCP 1 x Intel E810-DA2 10/25GbE SFP28 2-Port OCP
PSU 2 x 1100 W 2 x 1800 W 2 x 1800 W 2 x 2400 W
GPU None None None 3 x A100
Notes:
• These sound levels were me sured in controlled coustic l environments ccording to procedures specified by
ISO7779 nd re reported in ccord nce with ISO 9296.
• Government regul tions (such s those prescribed by OSHA or Europe n Community Directives) m y govern noise
level exposure in the workpl ce nd m y pply to you nd your server inst ll tion. The ctu l sound pressure levels
in your inst ll tion depend upon v riety of f ctors, including the number of r cks in the inst ll tion; the size,
m teri ls, nd configur tion of the room; the noise levels from other equipment; the room mbient temper ture, nd
employee's loc tion in rel tion to the equipment. Further, compli nce with such government regul tions depends
on v riety of ddition l f ctors, including the dur tion of employees' exposure nd whether employees we r
he ring protection. Lenovo recommends th t you consult with qu lified experts in this field to determine whether
you re in compli nce with the pplic ble regul tions.
8ThinkSystem SR665 V3 User Guide

En ironment
ThinkSystem SR665 V3 complies with ASHRAE Cl ss A2 specific tions with most configur tions, nd depending on
the h rdw re configur tion, lso complies with ASHRAE Cl ss A3 nd Cl ss A4 specific tions. System perform nce
m y be imp cted when the oper ting temper ture is outside ASHRAE A2 specific tion.
Depending on the h rdw re configur tion, SR665 V3 server lso complies with ASHRAE Cl ss H1 specific tion.
System perform nce m y be imp cted when the oper ting temper ture is outside ASHRAE H1 specific tion.
The restrictions to ASHRAE support re s follows:
• The mbient temper ture must be limited to 35°C or lower if the server h s ny of the following components:
– Bro dcom 57416 10GBASE-T 2-port OCP
– Bro dcom 57454 10GBASE-T 4-port OCP
– Network interf ce c rds (NICs) t r te gre ter th n or equ l to 100 GB
– P rts with AOC nd t the r te of 25 GB
• The mbient temper ture must be limited to 30°C or lower if the server h s ny of the following components:
– 24 x 2.5" or 12 x 3.5" front b y with middle or re r b y
– GPU (except front 24 x 2.5" configur tions nd configur tions with Group E processors)
– P rts with AOC nd t r te gre ter th n 25 GB
– 9654(P)/9554(P)/9174F/9754/9734 processor in front 8 x 2.5"/8 x 3.5"/16 x 2.5" st nd rd configur tion.
• The mbient temper ture must be limited to 25°C or lower if the server h s ny of the following components:
– 9274F/9374F/9474F in front 8 x 2.5"/8 x 3.5"/16 x 2.5" st nd rd configur tion
– 9654(P)/9554(P)/9174F/9754/9734 in front 24 x 2.5" configur tion without middle/re r b y
– 9654(P)/9554(P)/9174F/9754/9734 in front 8 x 2.5"/8 x 3.5"/16 x 2.5" + GPU configur tion
– 24 x 2.5" front b y + GPU
– Gen5 7.68 TB or l rger c p city NVMe in configur tion with middle/re r b y
– Group A (240 W < cTDP ≤ 300 W) processor in configur tion with middle/re r b y
For det iled therm l inform tion, see “Therm l rules” on p ge 59.
Note: When the mbient temper ture is gre ter th n the supported m x temper ture (ASHARE A4 45°C), the server
will shut down. The server will not power on g in until the mbient temper ture f lls within the supported temper ture
r nge.
• Air temperature:
– Oper ting
– ASHRAE cl ss H1: 5°C to 25°C (41°F to 77°F)
The m ximum mbient temper ture decre ses by 1°C for every 500 m (1640 ft) incre se in ltitude bove 900
m (2,953 ft)
– ASHRAE cl ss A2: 10°C to 35°C (50°F to 95°F)
The m ximum mbient temper ture decre ses by 1°C for every 300 m (984 ft) incre se in ltitude bove 900
m (2,953 ft)
– ASHRAE cl ss A3: 5°C to 40°C (41°F to 104°F)
The m ximum mbient temper ture decre ses by 1°C for every 175 m (574 ft) incre se in ltitude bove 900
m (2,953 ft)
– ASHRAE cl ss A4: 5°C to 45°C (41°F to 113°F)
The m ximum mbient temper ture decre ses by 1°C for every 125 m (410 ft) incre se in ltitude bove 900
m (2,953 ft)
– Server off: 5°C to 45°C (41°F to 113°F)
– Shipment/stor ge: -40°C to 60°C (-40°F to 140°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relati e Humidity (non-condensing):
– Oper ting
– ASHRAE cl ss H1: 8%–80%; m ximum dew point: 17°C (62.6°F)
– ASHRAE cl ss A2: 8%–80%; m ximum dew point: 21°C (70°F)
– ASHRAE cl ss A3: 8%–85%; m ximum dew point: 24°C (75°F)
– ASHRAE cl ss A4: 8%–90%; m ximum dew point: 24°C (75°F)
Ch pter 1.Introduction 9

En ironment
– Shipment/stor ge: 8% to 90%
Particulate contamination
Attention: Airborne p rticul tes (including met l fl kes or p rticles) nd re ctive g ses cting lone or in
combin tion with other environment l f ctors such s humidity or temper ture might pose risk to the
device th t is described in this document.
Risks th t re posed by the presence of excessive p rticul te levels or concentr tions of h rmful g ses
include d m ge th t might c use the device to m lfunction or ce se functioning ltogether. This
specific tion sets forth limits for p rticul tes nd g ses th t re intended to void such d m ge. The limits
must not be viewed or used s definitive limits, bec use numerous other f ctors, such s temper ture or
moisture content of the ir, c n influence the imp ct of p rticul tes or environment l corrosives nd g seous
cont min nt tr nsfer. In the bsence of specific limits th t re set forth in this document, you must
implement pr ctices th t m int in p rticul te nd g s levels th t re consistent with the protection of hum n
he lth nd s fety. If Lenovo determines th t the levels of p rticul tes or g ses in your environment h ve
c used d m ge to the device, Lenovo m y condition provision of rep ir or repl cement of devices or p rts
on implement tion of ppropri te remedi l me sures to mitig te such environment l cont min tion.
Implement tion of such remedi l me sures is customer responsibility.
10 ThinkSystem SR665 V3 User Guide