
Optional device and FRU installation  
problems .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  871
Performance problems .  .  .  .  .  .  .  .  .  .  87 
Power-on problems .  .  .  .  .  .  .  .  .  .  .  873
Software problems.  .  .  .  .  .  .  .  .  .  .  .  876
Solving undetermined problems .  .  .  .  .  .  .  .  876
Collecting service data .  .  .  .  .  .  .  .  .  .  .  .  877
 hapter 7.  Installing, removing, and 
replacing compute node  
components .  .  .  .  .  .  .  .  .  .  .  .  .  . 879
Installing an optional device .  .  .  .  .  .  .  .  .  .  879
Installation guidelines .  .  .  .  .  .  .  .  .  .  .  .  879
System reliability guidelines .  .  .  .  .  .  .  .  879
Handling static-sensitive devices .  .  .  .  .  .  880
Returning a device or component .  .  .  .  .  .  880
Updating the compute node configuration .  .  880
Removing a compute node from a chassis .  .  .  .  880
Installing a compute node in a chassis .  .  .  .  .  .  881
Removing and replacing Tier 1 customer 
replaceable units (CRUs) .  .  .  .  .  .  .  .  .  .  .  883
Removing the adapter-retention assembly .  .  883
Installing the adapter-retention assembly .  .  .  884
Removing the bezel .  .  .  .  .  .  .  .  .  .  .  885
Installing the bezel .  .  .  .  .  .  .  .  .  .  .  .  886
Removing the CMOS battery .  .  .  .  .  .  .  .  886
Installing the CMOS battery .  .  .  .  .  .  .  .  887
Removing the compute node cover .  .  .  .  .  888
Installing the compute node cover .  .  .  .  .  .  890
Removing a DIMM .  .  .  .  .  .  .  .  .  .  .  .  891
Installing a DIMM  .  .  .  .  .  .  .  .  .  .  .  .  89 
Removing the front handle .  .  .  .  .  .  .  .  .  904
Installing the front handles .  .  .  .  .  .  .  .  .  904
Removing the hard disk drive backplane .  .  .  905
Installing the hard disk drive backplane .  .  .  .  907
Removing a hot-swap hard disk drive .  .  .  .  908
Installing a hot-swap hard disk drive .  .  .  .  .  908
Removing an I/O expansion adapter .  .  .  .  .  909
Installing an I/O expansion adapter .  .  .  .  .  910
Removing the light path diagnostics panel .  .  911
Installing the light path diagnostics panel .  .  .  91 
Removing the USB flash drive .  .  .  .  .  .  .  913
Installing the USB flash drive .  .  .  .  .  .  .  .  914
Removing and replacing Tier   customer 
replaceable units (CRUs) .  .  .  .  .  .  .  .  .  .  .  915
Removing and replacing the base  
assembly .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  915
Removing the chassis bulkhead.  .  .  .  .  .  .  9 3
Installing the chassis bulkhead .  .  .  .  .  .  .  9 4
Removing the hard disk drive cage .  .  .  .  .  9 5
Installing the hard disk drive cage .  .  .  .  .  .  9 5
Removing a fabric connector .  .  .  .  .  .  .  .  9 6
Installing a fabric connector .  .  .  .  .  .  .  .  9 7
Removing a microprocessor and heat sink .  .  9 8
Installing a microprocessor and heat sink .  .  .  93 
Thermal grease .  .  .  .  .  .  .  .  .  .  .  .  .  940
Removing a microprocessor-retention  
assembly .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  941
Installing a microprocessor-retention  
assembly .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  94 
Appendix A.  Getting help and 
technical assistance .  .  .  .  .  .  .  .  .  . 945
Before you call .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  945
Using the documentation .  .  .  .  .  .  .  .  .  .  .  946
Getting help and information from the World Wide  
Web .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  946
How to send DSA data .  .  .  .  .  .  .  .  .  .  .  .  946
Creating a personalized support web page .  .  .  .  946
Software service and support .  .  .  .  .  .  .  .  .  946
Hardware service and support .  .  .  .  .  .  .  .  .  947
Taiwan product service .  .  .  .  .  .  .  .  .  .  .  .  947
Appendix B.  Notices.  .  .  .  .  .  .  .  .  . 949
Trademarks .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  950
Important notes .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  950
Recycling information .  .  .  .  .  .  .  .  .  .  .  .  950
Particulate contamination .  .  .  .  .  .  .  .  .  .  .  951
Telecommunication regulatory statement.  .  .  .  .  951
Electronic emission notices .  .  .  .  .  .  .  .  .  .  95 
Federal Communications Commission (FCC)  
statement .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  95 
Industry Canada Class A emission compliance 
statement .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  95 
Avis de conformité à la réglementation 
d'Industrie Canada.  .  .  .  .  .  .  .  .  .  .  .  95 
Australia and New Zealand Class A  
statement .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  95 
European Union EMC Directive conformance  
statement .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  95 
Germany Class A statement .  .  .  .  .  .  .  .  953
Japanese electromagnetic compatibility  
statements .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  954
Korea Communications Commission (KCC)  
statement .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  954
Russia Electromagnetic Interference (EMI) 
Class A statement .  .  .  .  .  .  .  .  .  .  .  .  954
People's Republic of China Class A electronic 
emission statement .  .  .  .  .  .  .  .  .  .  .  954
Taiwan Class A compliance statement .  .  .  .  954
Taiwan BSMI RoHS declaration .  .  .  .  .  .  .  955
Index .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 957
ii Lenovo Flex System x440 Compute NodeInstallation and Service Guide